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市场调查报告书
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1871905

全球强化玻璃基板市场：预测（至2032年）－按基板类型、厚度、应用、最终用户和地区分類的分析

Glass-reinforced Substrate Market Forecasts to 2032 - Global Analysis By Substrate Type, Thickness, Application, End User and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3个工作天内

价格

根据 Stratistics MRC 的一项研究，预计到 2025 年，全球玻璃纤维增强基板市场规模将达到 11.8 亿美元，到 2032 年将达到 17.5 亿美元，预测期内复合年增长率为 5.8%。

玻璃纤维增强基板是一种复合材料，它将玻璃纤维与树脂基体结合，以提高强度、耐久性和耐热性。由于其优异的绝缘性能、稳定性和抗环境因素能力，玻璃纤维增强基材被广泛应用于电子产品，尤其是印刷电路基板，确保在严苛的电子和工业环境中保持可靠性和性能。

优异的电气性能，适用于高频应用

基板能够提升尺寸稳定性和机械强度，从而支援先进印刷电路基板(PCB) 的小型化和多层设计。 5G通讯系统、雷达模组和高频感测器的日益普及进一步推动了对这些材料的需求。嵌入式被动元件和柔性电路整合等新兴趋势也正在促进其应用。製造商正在开发先进的玻璃纤维组合物和树脂体系，以提高 GHz 频率下的性能。对低损耗材料和混合层压板的持续研发正在拓展其在通讯、航太和汽车电子等众多领域的应用。

缺乏成熟的产业流程

玻璃纤维编织图案、树脂相容性和固化参数的差异会影响产品的一致性和产量比率，为大规模生产带来挑战。不同製造商的设备校准和操作流程各不相同，阻碍了互通性以及从多家供应商购买的便利性。对专用蚀刻和层压製程的需求也增加了操作的复杂性。雷射辅助钻孔和精密层压等新兴技术正被用于推动製造标准化。然而，缺乏统一的产业框架和明确的资格标准仍限制着大规模商业化应用。

下一代显示技术的应用

OLED、MicroLED 和量子点显示器等先进显示器技术的日益普及，为玻璃增强基板带来了强劲的成长机会。其优异的热稳定性、透明度和机械强度使其成为高解析度、柔性及曲面显示器的理想选择。超薄玻璃复合材料和混合基板技术的进步，使得透明导电层与柔性电路的整合成为可能。显示器製造商与材料开发商之间的合作，共同优化基板结构，是该领域发展的关键。智慧和穿戴式显示器的发展趋势预计将在未来几年进一步扩大市场渗透率。

与替代基板的竞争

陶瓷具有优异的导热性和机械韧性，而有机层压材料则为家用电子电器提供了柔韧性和成本优势。聚合物基材料（例如聚酰亚胺和液晶聚合物 (LCP)）的持续创新，正在挑战玻璃复合材料在某些高频应用中的优越地位。为了保持竞争力，製造商正致力于研发兼具介电性能和机械耐久性的混合玻璃材料。随着各公司朝着更轻、更有效率的基板方向发展，不同材料类别之间的竞争日益激烈。

新冠疫情的影响：

疫情初期，封锁措施和原料短缺扰乱了玻璃纤维增强基板的生产和供应链。然而，由于医疗设备、资料中心和通讯基础设施对电子元件的需求增加，復苏速度加快。远距办公和数位转型的兴起推动了消费性电子和网路设备对高频印刷电路板的需求。製造商正在实施自动化、预测性维护和数位化品管，以增强业务永续营运。后疫情时代的策略重点是区域分散式製造和永续的材料采购，以减少未来可能出现的干扰。

预计在预测期内，印刷电路基板（PCB）细分市场将占据最大的市场份额。

由于印刷基板(PCB) 在通讯、电脑和汽车电子等领域的广泛应用，预计在预测期内，PCB 细分市场将占据最大的市场份额。玻璃纤维增强基板因其优异的介电稳定性和降低讯号失真的能力，对于高频 PCB 至关重要。基板和高密度基板(HDI) 的普及正在推动其进一步应用。雷射钻孔、嵌入式元件和微孔结构等技术进步正在拓展基板的应用范围。製造商正在整合玻璃纤维复合材料和先进树脂，以优化讯号性能和散热效果。

预计在预测期内，航太和国防领域将实现最高的复合年增长率。

由于对轻质、耐用和高性能材料的需求不断增长，航太和国防领域预计在预测期内将实现最高成长率。玻璃纤维增强基板具有优异的机械稳定性和抗辐射性能，使其成为航空电子设备、雷达和卫星通讯系统的关键材料。先进复合材料在电子封装和控制系统中的应用正在推动该领域的成长。新兴趋势包括使用奈米复合玻璃纤维和混合层压板来提高恶劣环境下的讯号可靠性。国防现代化计画和太空探勘计划进一步促进了材料创新。

占比最大的地区：

亚太地区预计将在预测期内占据最大的市场份额，这主要得益于其强大的电子製造业生态系统和不断扩大的半导体生产。中国、日本、韩国和台湾等国家和地区在印刷电路基板(PCB) 製造和高频元件组装处于主导地位。政府支持本地基板製造和技术自主的措施正在增强该地区的生产能力。新兴趋势包括开发用于 5G 和物联网基础设施的环保树脂和先进玻璃复合材料。主要企业正在投资自动化、无尘室设施和材料回收，以提高产量比率和永续性。

预计年复合成长率最高的地区：

在预测期内，北美预计将实现最高的复合年增长率，这主要得益于先进电子和国防应用领域的快速技术创新。美国在支援高速资料传输和航太技术的下一代基板的研发方面处于领先地位。关键进展包括将低损耗玻璃复合材料整合到人工智慧计算模组、卫星通讯和电动汽车系统中。该地区致力于增强供应链韧性并将印刷电路板（PCB）生产迁回国内，从而巩固了当地的製造业基础。材料科学公司与原始设备製造商（OEM）之间的合作正在推动混合基板技术的突破。

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    • 基于产品系列、地域覆盖和策略联盟对主要企业基准化分析

目录

第一章执行摘要

第二章 引言

  • 概述
  • 相关利益者
  • 分析范围
  • 分析方法
  • 分析材料

第三章 市场趋势分析

  • 介绍
  • 司机
  • 抑制因素
  • 机会
  • 威胁
  • 应用分析
  • 终端用户分析
  • 新兴市场
  • 新冠疫情的影响

第四章 波特五力分析

  • 供应商的议价能力
  • 买方议价能力
  • 替代产品的威胁
  • 新进入者的威胁
  • 竞争对手之间的竞争

第五章 全球强化玻璃基板市场（依基板类型划分）

  • 玻璃纤维增强聚酰亚胺
  • 玻璃纤维增强氰酸酯
  • 玻璃纤维增强BT树脂
  • 玻璃纤维增强聚四氟乙烯
  • 玻璃纤维增强环氧树脂层压板
  • 其他基板类型

6. 全球强化玻璃基板市场（依厚度划分）

  • 0.1毫米或更小
  • 0.1mm～0.5mm
  • 0.5mm～1mm
  • 1毫米或以上

7. 全球强化玻璃基板市场（依应用领域划分）

  • 印刷电路基板（PCB）
  • IC构装基板
  • 射频和微波组件
  • 汽车电子模组
  • 显示面板
  • 其他用途

第八章 全球强化玻璃基板市场（依最终用户划分）

  • 家用电器
  • 通讯
  • 航太/国防
  • 车
  • 其他最终用户

9. 全球强化玻璃基板市场（依地区划分）

  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 义大利
    • 法国
    • 西班牙
    • 其他欧洲
  • 亚太地区
    • 日本
    • 中国
    • 印度
    • 澳洲
    • 纽西兰
    • 韩国
    • 亚太其他地区
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 其他南美洲
  • 中东和非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 卡达
    • 南非
    • 其他中东和非洲地区

第十章：主要趋势

  • 合约、商业伙伴关係和合资企业
  • 企业合併（M&A）
  • 新产品上市
  • 业务拓展
  • 其他关键策略

第十一章 公司简介

  • AGC Inc.
  • Ibiden Co., Ltd.
  • Corning Incorporated
  • Saint-Gobain
  • Schott AG
  • Taiwan Glass Ind. Corp.
  • Nippon Electric Glass Co., Ltd.
  • Toray Industries, Inc.
  • NEG
  • Toppan Inc.
  • Ohara Inc.
  • LG Chem
  • Plan Optik AG
  • HOYA Corporation
  • Tecnisco Ltd.
Product Code: SMRC32275

According to Stratistics MRC, the Global Glass-reinforced Substrate Market is accounted for $1.18 billion in 2025 and is expected to reach $1.75 billion by 2032 growing at a CAGR of 5.8% during the forecast period. A glass-reinforced substrate is a composite material combining glass fibers with a resin base to improve strength, durability, and heat resistance. It is widely used in electronics, particularly for printed circuit boards, due to its excellent insulation properties, stability, and resistance to environmental factors, ensuring reliability and performance in demanding electronic and industrial environments.

Market Dynamics:

Driver:

Superior electrical properties for high-frequency applications

The substrates offer enhanced dimensional stability and mechanical strength, supporting miniaturization and multilayer designs in advanced printed circuit boards (PCBs). The growing use of 5G communication systems, radar modules, and high-frequency sensors is amplifying demand for these materials. Emerging trends such as embedded passive components and flexible circuit integration are also boosting adoption. Manufacturers are developing advanced glass-fiber compositions and resin systems to improve performance at GHz frequencies. Continuous R&D in low-loss materials and hybrid laminates is expanding their utility across telecom, aerospace, and automotive electronics.

Restraint:

Lack of established industry process

Variations in glass weave patterns, resin compatibility, and curing parameters affect consistency and yield, posing challenges for mass production. Equipment calibration and handling procedures differ across manufacturers, hindering interoperability and cross-supplier sourcing. The need for specialized etching and lamination processes increases operational complexity. Emerging technologies such as laser-assisted drilling and precision lamination are being explored to standardize fabrication. However, without a unified industry framework or clear qualification standards, large-scale commercialization remains constrained.

Opportunity:

Adoption in next-generation display tech

The growing adoption of advanced display technologies, including OLED, MicroLED, and quantum-dot displays, presents a strong growth opportunity for glass-reinforced substrates. Their superior thermal stability, transparency, and mechanical strength make them ideal for high-resolution, flexible, and curved displays. Advancements in ultra-thin glass composites and hybrid substrates are enabling integration with transparent conductors and flexible circuits. Key developments include collaborations between display manufacturers and material innovators to optimize substrate architecture. The trend toward smart and wearable displays is expected to further expand market penetration in the coming years.

Threat:

Competition from alternative substrate materials

Ceramics offer superior thermal conductivity and mechanical robustness, while organic laminates provide flexibility and cost advantages for consumer electronics. Continuous innovation in polymer-based materials, such as polyimide and liquid crystal polymers (LCPs), is challenging the dominance of glass composites in certain high-frequency applications. To maintain competitiveness, manufacturers are focusing on hybrid glass materials that combine dielectric performance with mechanical resilience. The ongoing shift toward lightweight and thermally efficient substrates is intensifying rivalry among material classes.

Covid-19 Impact:

The pandemic initially disrupted production and supply chains of glass-reinforced substrates due to lockdowns and raw material shortages. However, recovery was accelerated by rising demand for electronic components in medical devices, data centers, and communication infrastructure. The surge in remote working and digital transformation boosted consumption of high-frequency PCBs in consumer and networking electronics. Manufacturers adopted automation, predictive maintenance, and digital quality control to enhance operational resilience. Post-pandemic strategies focus on regionalized manufacturing and sustainable material sourcing to reduce future disruptions.

The printed circuit boards (PCBs) segment is expected to be the largest during the forecast period

The printed circuit boards (PCBs) segment is expected to account for the largest market share during the forecast period, owing to its extensive use in communication, computing, and automotive electronics. Glass-reinforced substrates are essential for high-frequency PCBs due to their superior dielectric stability and reduced signal distortion. The shift toward multilayer and high-density interconnect (HDI) boards is further driving adoption. Technological advancements such as laser drilling, embedded components, and microvia structures are enhancing substrate utilization. Manufacturers are integrating glass-fiber composites with advanced resins to optimize signal performance and heat dissipation.

The aerospace & defense segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the aerospace & defense segment is predicted to witness the highest growth rate, due to the increasing demand for lightweight, durable, and high-performance materials. Glass-reinforced substrates offer excellent mechanical stability and radiation resistance, essential for avionics, radar, and satellite communication systems. The adoption of advanced composites in electronic packaging and control systems is boosting segment growth. Emerging trends include the use of nanocomposite glass fibers and hybrid laminates for enhanced signal reliability under extreme conditions. Defense modernization programs and space exploration projects are further accelerating material innovation.

Region with largest share:

During the forecast period, the Asia Pacific region is expected to hold the largest market share, due to its strong electronics manufacturing ecosystem and expanding semiconductor production. Countries like China, Japan, South Korea, and Taiwan are leading in PCB fabrication and high-frequency component assembly. Government initiatives supporting local substrate manufacturing and technological self-reliance are enhancing regional capacity. Emerging trends include the development of eco-friendly resins and advanced glass composites for 5G and IoT infrastructure. Major players are investing in automation, cleanroom facilities, and material recycling to improve yield and sustainability.

Region with highest CAGR:

Over the forecast period, the North America region is anticipated to exhibit the highest CAGR, driven by rapid innovation in advanced electronics and defense applications. The U.S. leads in R&D for next-generation substrates supporting high-speed data transfer and aerospace technologies. Key developments include integration of low-loss glass composites in AI computing modules, satellite communication, and electric vehicle systems. The region's focus on supply chain resilience and onshoring of PCB production is strengthening local manufacturing. Collaborations between material science firms and OEMs are fostering breakthroughs in hybrid substrate technologies.

Key players in the market

Some of the key players in Glass-reinforced Substrate Market include AGC Inc., Ibiden Co., Corning Inc., Saint-Gobain, Schott AG, Taiwan Gl, Nippon Ele, Toray Indu, NEG, Toppan Inc., Ohara Inc., LG Chem, Plan Optik, HOYA Corp., and Tecnisco.

Key Developments:

In October 2025, Saint-Gobain has signed a definitive agreement with the Brazilian group GG10, owner of the G-Haus brand, for the sale of Tumelero, a retail chain specializing in construction materials, with a strong presence in southern Brazil. Tumelero is currently operating 16 stores and 1 logistic center in Rio Grande do Sul, employs around 580 people and generated revenues of around €40 million in 2024.

In June 2024, Corning Incorporated announced the launch of Corning(R) Gorilla(R) Glass 7i, a new cover glass engineered to deliver improved durability for intermediate and value-segment mobile devices. Gorilla Glass 7i broadens Corning's renowned tough cover glass portfolio, offering better drop and scratch performance compared to competitive lithium aluminosilicate glasses from other manufacturers.

Substrate Types Covered:

  • Glass-reinforced Polyimide
  • Glass-reinforced Cyanate Ester
  • Glass-reinforced BT Resin
  • Glass-reinforced PTFE
  • Glass-reinforced Epoxy Laminates
  • Other Substrate Types

Thicknesses Covered:

  • <= 0.1 mm
  • 0.1 mm - 0.5 mm
  • 0.5 mm - 1 mm
  • Above 1 mm

Applications Covered:

  • Printed Circuit Boards (PCBs)
  • IC Packaging Substrates
  • RF & Microwave Components
  • Automotive Electronic Modules
  • Display Panels
  • Other Applications

End Users Covered:

  • Consumer Electronics
  • Telecommunications
  • Aerospace & Defense
  • Automotive
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2024, 2025, 2026, 2028, and 2032
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Application Analysis
  • 3.7 End User Analysis
  • 3.8 Emerging Markets
  • 3.9 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Glass-reinforced Substrate Market, By Substrate Type

  • 5.1 Introduction
  • 5.2 Glass-reinforced Polyimide
  • 5.3 Glass-reinforced Cyanate Ester
  • 5.4 Glass-reinforced BT Resin
  • 5.5 Glass-reinforced PTFE
  • 5.6 Glass-reinforced Epoxy Laminates
  • 5.7 Other Substrate Types

6 Global Glass-reinforced Substrate Market, By Thickness

  • 6.1 Introduction
  • 6.2 <= 0.1 mm
  • 6.3 0.1 mm - 0.5 mm
  • 6.4 0.5 mm - 1 mm
  • 6.5 Above 1 mm

7 Global Glass-reinforced Substrate Market, By Application

  • 7.1 Introduction
  • 7.2 Printed Circuit Boards (PCBs)
  • 7.3 IC Packaging Substrates
  • 7.4 RF & Microwave Components
  • 7.5 Automotive Electronic Modules
  • 7.6 Display Panels
  • 7.7 Other Applications

8 Global Glass-reinforced Substrate Market, By End User

  • 8.1 Introduction
  • 8.2 Consumer Electronics
  • 8.3 Telecommunications
  • 8.4 Aerospace & Defense
  • 8.5 Automotive
  • 8.6 Other End Users

9 Global Glass-reinforced Substrate Market, By Geography

  • 9.1 Introduction
  • 9.2 North America
    • 9.2.1 US
    • 9.2.2 Canada
    • 9.2.3 Mexico
  • 9.3 Europe
    • 9.3.1 Germany
    • 9.3.2 UK
    • 9.3.3 Italy
    • 9.3.4 France
    • 9.3.5 Spain
    • 9.3.6 Rest of Europe
  • 9.4 Asia Pacific
    • 9.4.1 Japan
    • 9.4.2 China
    • 9.4.3 India
    • 9.4.4 Australia
    • 9.4.5 New Zealand
    • 9.4.6 South Korea
    • 9.4.7 Rest of Asia Pacific
  • 9.5 South America
    • 9.5.1 Argentina
    • 9.5.2 Brazil
    • 9.5.3 Chile
    • 9.5.4 Rest of South America
  • 9.6 Middle East & Africa
    • 9.6.1 Saudi Arabia
    • 9.6.2 UAE
    • 9.6.3 Qatar
    • 9.6.4 South Africa
    • 9.6.5 Rest of Middle East & Africa

10 Key Developments

  • 10.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 10.2 Acquisitions & Mergers
  • 10.3 New Product Launch
  • 10.4 Expansions
  • 10.5 Other Key Strategies

11 Company Profiling

  • 11.1 AGC Inc.
  • 11.2 Ibiden Co., Ltd.
  • 11.3 Corning Incorporated
  • 11.4 Saint-Gobain
  • 11.5 Schott AG
  • 11.6 Taiwan Glass Ind. Corp.
  • 11.7 Nippon Electric Glass Co., Ltd.
  • 11.8 Toray Industries, Inc.
  • 11.9 NEG
  • 11.10 Toppan Inc.
  • 11.11 Ohara Inc.
  • 11.12 LG Chem
  • 11.13 Plan Optik AG
  • 11.14 HOYA Corporation
  • 11.15 Tecnisco Ltd.

List of Tables

  • Table 1 Global Glass-reinforced Substrate Market Outlook, By Region (2024-2032) ($MN)
  • Table 2 Global Glass-reinforced Substrate Market Outlook, By Substrate Type (2024-2032) ($MN)
  • Table 3 Global Glass-reinforced Substrate Market Outlook, By Glass-reinforced Polyimide (2024-2032) ($MN)
  • Table 4 Global Glass-reinforced Substrate Market Outlook, By Glass-reinforced Cyanate Ester (2024-2032) ($MN)
  • Table 5 Global Glass-reinforced Substrate Market Outlook, By Glass-reinforced BT Resin (2024-2032) ($MN)
  • Table 6 Global Glass-reinforced Substrate Market Outlook, By Glass-reinforced PTFE (2024-2032) ($MN)
  • Table 7 Global Glass-reinforced Substrate Market Outlook, By Glass-reinforced Epoxy Laminates (2024-2032) ($MN)
  • Table 8 Global Glass-reinforced Substrate Market Outlook, By Other Substrate Types (2024-2032) ($MN)
  • Table 9 Global Glass-reinforced Substrate Market Outlook, By Thickness (2024-2032) ($MN)
  • Table 10 Global Glass-reinforced Substrate Market Outlook, By <= 0.1 mm (2024-2032) ($MN)
  • Table 11 Global Glass-reinforced Substrate Market Outlook, By 0.1 mm - 0.5 mm (2024-2032) ($MN)
  • Table 12 Global Glass-reinforced Substrate Market Outlook, By 0.5 mm - 1 mm (2024-2032) ($MN)
  • Table 13 Global Glass-reinforced Substrate Market Outlook, By Above 1 mm (2024-2032) ($MN)
  • Table 14 Global Glass-reinforced Substrate Market Outlook, By Application (2024-2032) ($MN)
  • Table 15 Global Glass-reinforced Substrate Market Outlook, By Printed Circuit Boards (PCBs) (2024-2032) ($MN)
  • Table 16 Global Glass-reinforced Substrate Market Outlook, By IC Packaging Substrates (2024-2032) ($MN)
  • Table 17 Global Glass-reinforced Substrate Market Outlook, By RF & Microwave Components (2024-2032) ($MN)
  • Table 18 Global Glass-reinforced Substrate Market Outlook, By Automotive Electronic Modules (2024-2032) ($MN)
  • Table 19 Global Glass-reinforced Substrate Market Outlook, By Display Panels (2024-2032) ($MN)
  • Table 20 Global Glass-reinforced Substrate Market Outlook, By Other Applications (2024-2032) ($MN)
  • Table 21 Global Glass-reinforced Substrate Market Outlook, By End User (2024-2032) ($MN)
  • Table 22 Global Glass-reinforced Substrate Market Outlook, By Consumer Electronics (2024-2032) ($MN)
  • Table 23 Global Glass-reinforced Substrate Market Outlook, By Telecommunications (2024-2032) ($MN)
  • Table 24 Global Glass-reinforced Substrate Market Outlook, By Aerospace & Defense (2024-2032) ($MN)
  • Table 25 Global Glass-reinforced Substrate Market Outlook, By Automotive (2024-2032) ($MN)
  • Table 26 Global Glass-reinforced Substrate Market Outlook, By Other End Users (2024-2032) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.