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市场调查报告书
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1871906

全球玻璃中介层市场：预测至2032年－按类型、基板厚度、製造流程、应用、最终用户和地区进行分析

Glass Interposers Market Forecasts to 2032 - Global Analysis By Type, Substrate Thickness, Fabrication Process, Application, End User and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3个工作天内

价格

根据 Stratistics MRC 的数据，预计到 2025 年全球玻璃中介层市场规模将达到 1.377 亿美元，到 2032 年将达到 3.5967 亿美元，预测期内复合年增长率为 14.7%。

玻璃中介层是超薄玻璃层，可作为半导体晶片和基板之间的桥樑，提供高密度互连、增强的电绝缘性和优异的散热性能。其优异的平整度和稳定性使其能够在2.5D和3D集成电路中实现细间距布线和多组件集成，从而显着提高现代电子设备的性能、效率和紧凑性。

据美国商务部经济分析局称，受人工智慧和云端基础设施需求的推动，到 2024 年，美国资料中心投资将成长 14%，达到创纪录的 1,080 亿美元。

对高效能运算 (HPC) 和人工智慧的需求

玻璃中介层因其优异的电绝缘性和尺寸精度而备受关注，能够支援高速资料传输。随着人工智慧工作负载的扩展和边缘运算的广泛应用，对紧凑、热稳定的互连的需求呈爆炸式增长。晶片架构和神经形态处理器等新兴技术正在突破封装的极限，而玻璃基板在这些领域展现出明显的优势。 2.5D 和 3D 整合技术的创新正在为资料中心和人工智慧丛集打造更密集、更快速的系统。这一趋势正在推动半导体、汽车电子和通讯等产业的应用。

技术製造挑战

实现高长宽比的可靠玻璃通孔 (TGV) 需要精密的工装和先进的製程控制。异质组件的整合增加了温度控管和机械稳定性的复杂性。产量比率最佳化仍然具有挑战性，尤其是在大基板和多层设计的情况下。中小製造商由于巨额资本投入和专有製造技术的获取管道有限而面临诸多障碍。这些技术限制延缓了商业化进程，并限制了大规模生产的扩充性。

面板级封装（PLP）技术进步

面板级封装 (PLP) 正逐渐成为一种经济高效且可扩展的玻璃中介层製造解决方案。 PLP 支援更大尺寸的基板，从而提高了多晶粒组件的生产效率并减少了材料浪费。扇出型架构和模组化晶片设计的兴起与 PLP 的优势完美契合。随着人工智慧、5G 和汽车应用领域对紧凑型高性能模组的需求不断增长，PLP 为实现成本和产量目标提供了一条切实可行的途径。 OSAT 厂商和基板供应商之间的策略联盟正在加速 PLP 在整个生态系统中的应用。

延迟的认证週期

在部署之前，原始设备製造商 (OEM) 要求对产品进行全面的热循环、机械应力和讯号完整性测试。由于缺乏玻璃基板的标准化通讯协定，检验工作变得更加复杂。在汽车和航太等领域，严格的环境和安全标准导致产品上市时间延长。这些週期的延长阻碍了人工智慧和边缘运算等快速发展领域的创新和应用。如果没有简化的认证框架，商业化流程将持续受到限制。

新冠疫情的感染疾病：

疫情扰乱了全球供应链，导致玻璃中介层组件的生产和交付延迟。封锁和劳动力短缺影响了洁净室的运作和设备的可用性，造成计划延期。然而，这场危机加速了数位转型，推动了对高效能运算基础设施和人工智慧系统的需求。远距办公、远端医疗和虚拟教育促进了半导体消费，间接推动了中介层的应用。后疫情时代的策略强调敏捷製造和数数位双胞胎，以减轻未来可能出现的干扰。

预计在预测期内，玻璃通孔（TGV）中介层细分市场将占据最大的市场份额。

由于其能够支援高密度垂直互连并最大限度地减少讯号损耗，预计在预测期内，玻璃通孔 (TGV) 中介层将占据最大的市场份额。这些基板具有优异的电绝缘性和尺寸稳定性，使其成为高速和高频应用的理想选择。它们与 MEMS、射频模组和光电装置的兼容性增强了其在多个领域的通用性。雷射加工和金属化技术的进步正在提高通孔品质并降低缺陷率。 TGV 中介层具有无与伦比的扩充性，能够满足人工智慧和 5G 领域对紧凑型高效能封装日益增长的需求。

预计在预测期内，汽车产业将实现最高的复合年增长率。

在预测期内，汽车产业预计将保持最高的成长率，这主要得益于车辆的电气化数位化。玻璃中介层支援ADAS、资讯娱乐系统和电动车动力模组所需的高速资料传输和热稳定性。自动驾驶和V2X通讯等新兴趋势需要讯号劣化较小的可靠互连。原始设备製造商（OEM）正在整合人工智慧晶片和感测器阵列，充分利用玻璃基板的优势。安全和排放气体的监管要求正在加速先进电子产品的应用，从而推动对中介层的需求。

占比最大的地区：

亚太地区预计将在预测期内保持最大的市场份额，这得益于其强大的半导体製造生态系统。中国、韩国和台湾等国家和地区正大力投资先进封装和基板技术。区域内的企业正利用其接近性工厂、OSAT（外包半导体封装测试）和材料供应商的地理优势，实现快速原型製作和大量生产。政府为促进晶片自主研发和在地化生产而采取的倡议，正在推动中介层技术的应用。此外，该地区人工智慧、5G和电动车的快速发展也对高性能封装提出了更高的要求。

预计年复合成长率最高的地区：

在预测期内，北美预计将实现最高的复合年增长率，这主要得益于主导地位。美国拥有众多主要的半导体製造商和研究机构，它们正引领下一代中介层架构的研发。联邦政府对国内半导体製造和封装研发的资助正在加速其商业化进程。各公司正在探索将玻璃中介层应用于量子运算、国防电子和先进医疗设备等领域。数位双胞胎、预测分析和智慧工厂的融合正在提升製造的灵活性。

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  • 公司简介
    • 对最多三家其他公司进行全面分析
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  • 区域分类
    • 根据客户兴趣对主要国家进行市场估算、预测和复合年增长率分析（註：基于可行性检查）
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    • 基于产品系列、地域覆盖和策略联盟对主要企业基准化分析

目录

第一章执行摘要

第二章 引言

  • 概述
  • 相关利益者
  • 分析范围
  • 分析方法
  • 分析材料

第三章 市场趋势分析

  • 司机
  • 抑制因素
  • 机会
  • 威胁
  • 应用分析
  • 终端用户分析
  • 新兴市场
  • 新冠疫情的影响

第四章 波特五力分析

  • 供应商的议价能力
  • 买方议价能力
  • 替代产品的威胁
  • 新进入者的威胁
  • 竞争对手之间的竞争

第五章 全球玻璃中介层市场（依类型划分）

  • 玻璃通孔 (TGV) 中介层
  • 玻璃基板中介层
  • 嵌入式玻璃中介层
  • 其他类型

6. 全球玻璃中介层市场（依基板厚度划分）

  • 100微米或更小
  • 100～200µm
  • 200微米或以上

7. 全球玻璃中介层市场依製造流程划分

  • 形成
  • 淬火和电镀
  • 黏合与组装
  • 表面处理

8. 全球玻璃中介层市场（依应用领域划分）

  • 2.5D/3D IC封装
  • MEMS和感测器集成
  • LED构装
  • 光电和光电子学
  • 射频/无线组件
  • 其他用途

9. 全球玻璃中介层市场（依最终用户划分）

  • 家用电器
  • 汽车电子
  • 通讯
  • 航太/国防
  • 工业自动化
  • 医疗设备
  • 其他最终用户

第十章 全球玻璃中介层市场（依地区划分）

  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 义大利
    • 法国
    • 西班牙
    • 其他欧洲
  • 亚太地区
    • 日本
    • 中国
    • 印度
    • 澳洲
    • 纽西兰
    • 韩国
    • 亚太其他地区
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 其他南美洲
  • 中东和非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 卡达
    • 南非
    • 其他中东和非洲地区

第十一章：主要趋势

  • 合约、商业伙伴关係和合资企业
  • 企业合併（M&A）
  • 新产品上市
  • 业务拓展
  • 其他关键策略

第十二章：公司简介

  • Corning Incorporated
  • Toppan Printing Co., Ltd.
  • AGC Inc.
  • Ushio Inc.
  • SCHOTT AG
  • Taiwan Glass Industry Corporation
  • Nippon Electric Glass Co., Ltd.
  • Triton Microtechnologies, Inc.
  • HOYA Corporation
  • Kiso Koma Micro Technology Co., Ltd.
  • Plan Optik AG
  • Ibiden Co., Ltd.
  • 3D Glass Solutions, Inc.
  • Dai Nippon Printing Co., Ltd.
  • Samtec Inc.
Product Code: SMRC32276

According to Stratistics MRC, the Global Glass Interposers Market is accounted for $137.70 million in 2025 and is expected to reach $359.67 million by 2032 growing at a CAGR of 14.7% during the forecast period. Glass interposers are ultra-thin glass layers serving as bridges between semiconductor chips and substrates. They provide dense interconnections, enhanced electrical insulation, and superior heat dissipation. Due to their excellent flatness and stability, glass interposers enable fine-pitch wiring and integration of multiple components in 2.5D and 3D integrated circuits, significantly boosting performance, efficiency, and compactness in modern electronic devices.

According to the U.S. Department of Commerce Bureau of Economic Analysis, data center investments in the U.S. grew by 14% in 2024, reaching a record USD 108 billion, driven by demand for AI and cloud infrastructure.

Market Dynamics:

Driver:

Demand for high-performance computing (HPC) & AI

Glass interposers are gaining traction due to their excellent electrical insulation and dimensional precision, which support high-speed data transfer. As AI workloads scale and edge computing expands, the demand for compact, thermally stable interconnects is surging. Emerging technologies like chiplet architectures and neuromorphic processors are pushing packaging boundaries, where glass substrates offer distinct advantages. Innovations in 2.5D and 3D integration are enabling denser, faster systems for data centers and AI clusters. This trend is driving adoption across sectors such as semiconductors, automotive electronics, and telecommunications.

Restraint:

Technical manufacturing challenges

Achieving reliable through-glass vias (TGVs) with high aspect ratios demands precision tooling and advanced process control. The integration of heterogeneous components adds complexity to thermal management and mechanical stability. Yield optimization remains difficult, especially for large-format substrates and multilayer designs. Smaller manufacturers face barriers due to high capital investment and limited access to proprietary fabrication technologies. These technical constraints slow down commercialization and limit scalability for volume production.

Opportunity:

Advancements in panel-level packaging (PLP)

Panel-level packaging is emerging as a cost-effective and scalable solution for glass interposer production. By enabling larger substrate formats, PLP improves throughput and reduces material waste across multiple die assemblies. The rise of fan-out architectures and modular chiplet designs aligns well with PLP's capabilities. As demand grows for compact, high-performance modules in AI, 5G, and automotive applications, PLP offers a viable path to meet cost and volume targets. Strategic partnerships between OSATs and substrate suppliers are accelerating PLP deployment across the ecosystem.

Threat:

Slow qualification cycles

OEMs require comprehensive testing for thermal cycling, mechanical stress, and signal integrity before deployment. The absence of standardized protocols for glass substrates adds complexity to validation efforts. Sectors like automotive and aerospace impose rigorous environmental and safety benchmarks that delay time-to-market. These prolonged cycles hinder rapid innovation and slow adoption in fast-moving domains like AI and edge computing. Without streamlined qualification frameworks, the pace of commercialization remains constrained.

Covid-19 Impact:

The pandemic disrupted global supply chains, delaying production and delivery of glass interposer components. Lockdowns and labor shortages affected cleanroom operations and equipment availability, leading to project delays. However, the crisis accelerated digital transformation, boosting demand for HPC infrastructure and AI-enabled systems. Remote work, telehealth, and virtual education drove semiconductor consumption, indirectly supporting interposer adoption. Post-pandemic strategies now emphasize agile manufacturing and digital twins to mitigate future disruptions.

The through-glass via (TGV) interposers segment is expected to be the largest during the forecast period

The through-glass via (TGV) interposers segment is expected to account for the largest market share during the forecast period, due to their ability to support high-density vertical interconnects with minimal signal loss. These substrates offer superior electrical isolation and dimensional stability, making them ideal for high-speed and high-frequency applications. Their compatibility with MEMS, RF modules, and optoelectronics enhances their versatility across multiple domains. Technological advancements in laser drilling and metallization are improving via quality and reducing defect rates. As demand rises for compact, high-performance packages in AI and 5G, TGV interposers offer unmatched scalability.

The automotive segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the automotive segment is predicted to witness the highest growth rate, driven by the electrification and digitalization of vehicles. Glass interposers support high-speed data transmission and thermal stability required for ADAS, infotainment, and EV power modules. Emerging trends like autonomous driving and V2X communication demand robust interconnects with low signal degradation. OEMs are integrating AI chips and sensor arrays that benefit from glass-based substrates. Regulatory mandates for safety and emissions are accelerating the deployment of advanced electronics, boosting interposer demand.

Region with largest share:

During the forecast period, the Asia Pacific region is expected to hold the largest market share, supported by its robust semiconductor manufacturing ecosystem. Countries like China, South Korea, and Taiwan are investing heavily in advanced packaging and substrate technologies. Regional players benefit from proximity to foundries, OSATs, and material suppliers, enabling faster prototyping and scale-up. Government initiatives promoting chip sovereignty and local production are driving interposer adoption. The region is also witnessing rapid uptake of AI, 5G, and electric vehicles, all of which require high-performance packaging.

Region with highest CAGR:

Over the forecast period, the North America region is anticipated to exhibit the highest CAGR, driven by its leadership in AI, HPC, and semiconductor innovation. The U.S. is home to major chipmakers and research institutions pioneering next-gen interposer architectures. Federal funding for domestic chip production and packaging R&D is accelerating commercialization. Companies are exploring glass interposers for quantum computing, defense electronics, and advanced medical devices. Integration of digital twins, predictive analytics, and smart factories is enhancing manufacturing agility.

Key players in the market

Some of the key players in Glass Interposers Market include Corning Inc., Toppan Pr, AGC Inc., Ushio Inc., SCHOTT A, Taiwan Gl, Nippon El, Triton Mic, HOYA Corp, Kiso Koma, Plan Optik, Ibiden Co., 3D Glass S, Dai Nippo, and Samtec In.

Key Developments:

In June 2025, TOPPAN Security announced that it has entered into a definitive agreement to acquire dzcard Group, a prominent provider of smart card solutions and personalization services across Asia and Africa. This strategic acquisition immediately positions the TOPPAN Group as the clear leader in the Asian payment card market.

In June 2024, Corning Incorporated announced the launch of Corning(R) Gorilla(R) Glass 7i, a new cover glass engineered to deliver improved durability for intermediate and value-segment mobile devices. Gorilla Glass 7i broadens Corning's renowned tough cover glass portfolio, offering better drop and scratch performance compared to competitive lithium aluminosilicate glasses from other manufacturers.

Types Covered:

  • Through-Glass Via (TGV) Interposers
  • Glass Substrate Interposers
  • Embedded Glass Interposers
  • Other Types

Substrate Thicknesses Covered:

  • Below 100 µm
  • 100-200 µm
  • Above 200 µm

Fabrication Processes Covered:

  • Via Formation
  • Metallization and Plating
  • Bonding and Assembly
  • Surface Finishing

Applications Covered:

  • 2.5D and 3D IC Packaging
  • MEMS and Sensor Integration
  • LED Packaging
  • Photonics and Optoelectronics
  • RF and Wireless Components
  • Other Applications

End Users Covered:

  • Consumer Electronics
  • Automotive Electronics
  • Telecommunications
  • Aerospace & Defense
  • Industrial Automation
  • Medical Devices
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2024, 2025, 2026, 2028, and 2032
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Application Analysis
  • 3.7 End User Analysis
  • 3.8 Emerging Markets
  • 3.9 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Glass Interposers Market, By Type

  • 5.1 Introduction
  • 5.2 Through-Glass Via (TGV) Interposers
  • 5.3 Glass Substrate Interposers
  • 5.4 Embedded Glass Interposers
  • 5.5 Other Types

6 Global Glass Interposers Market, By Substrate Thickness

  • 6.1 Introduction
  • 6.2 Below 100 µm
  • 6.3 100-200 µm
  • 6.4 Above 200 µm

7 Global Glass Interposers Market, By Fabrication Process

  • 7.1 Introduction
  • 7.2 Via Formation
  • 7.3 Metallization and Plating
  • 7.4 Bonding and Assembly
  • 7.5 Surface Finishing

8 Global Glass Interposers Market, By Application

  • 8.1 Introduction
  • 8.2 2.5D and 3D IC Packaging
  • 8.3 MEMS and Sensor Integration
  • 8.4 LED Packaging
  • 8.5 Photonics and Optoelectronics
  • 8.6 RF and Wireless Components
  • 8.7 Other Applications

9 Global Glass Interposers Market, By End User

  • 9.1 Introduction
  • 9.2 Consumer Electronics
  • 9.3 Automotive Electronics
  • 9.4 Telecommunications
  • 9.5 Aerospace & Defense
  • 9.6 Industrial Automation
  • 9.7 Medical Devices
  • 9.8 Other End Users

10 Global Glass Interposers Market, By Geography

  • 10.1 Introduction
  • 10.2 North America
    • 10.2.1 US
    • 10.2.2 Canada
    • 10.2.3 Mexico
  • 10.3 Europe
    • 10.3.1 Germany
    • 10.3.2 UK
    • 10.3.3 Italy
    • 10.3.4 France
    • 10.3.5 Spain
    • 10.3.6 Rest of Europe
  • 10.4 Asia Pacific
    • 10.4.1 Japan
    • 10.4.2 China
    • 10.4.3 India
    • 10.4.4 Australia
    • 10.4.5 New Zealand
    • 10.4.6 South Korea
    • 10.4.7 Rest of Asia Pacific
  • 10.5 South America
    • 10.5.1 Argentina
    • 10.5.2 Brazil
    • 10.5.3 Chile
    • 10.5.4 Rest of South America
  • 10.6 Middle East & Africa
    • 10.6.1 Saudi Arabia
    • 10.6.2 UAE
    • 10.6.3 Qatar
    • 10.6.4 South Africa
    • 10.6.5 Rest of Middle East & Africa

11 Key Developments

  • 11.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 11.2 Acquisitions & Mergers
  • 11.3 New Product Launch
  • 11.4 Expansions
  • 11.5 Other Key Strategies

12 Company Profiling

  • 12.1 Corning Incorporated
  • 12.2 Toppan Printing Co., Ltd.
  • 12.3 AGC Inc.
  • 12.4 Ushio Inc.
  • 12.5 SCHOTT AG
  • 12.6 Taiwan Glass Industry Corporation
  • 12.7 Nippon Electric Glass Co., Ltd.
  • 12.8 Triton Microtechnologies, Inc.
  • 12.9 HOYA Corporation
  • 12.10 Kiso Koma Micro Technology Co., Ltd.
  • 12.11 Plan Optik AG
  • 12.12 Ibiden Co., Ltd.
  • 12.13 3D Glass Solutions, Inc.
  • 12.14 Dai Nippon Printing Co., Ltd.
  • 12.15 Samtec Inc.

List of Tables

  • Table 1 Global Glass Interposers Market Outlook, By Region (2024-2032) ($MN)
  • Table 2 Global Glass Interposers Market Outlook, By Type (2024-2032) ($MN)
  • Table 3 Global Glass Interposers Market Outlook, By Through-Glass Via (TGV) Interposers (2024-2032) ($MN)
  • Table 4 Global Glass Interposers Market Outlook, By Glass Substrate Interposers (2024-2032) ($MN)
  • Table 5 Global Glass Interposers Market Outlook, By Embedded Glass Interposers (2024-2032) ($MN)
  • Table 6 Global Glass Interposers Market Outlook, By Other Types (2024-2032) ($MN)
  • Table 7 Global Glass Interposers Market Outlook, By Substrate Thickness (2024-2032) ($MN)
  • Table 8 Global Glass Interposers Market Outlook, By Below 100 µm (2024-2032) ($MN)
  • Table 9 Global Glass Interposers Market Outlook, By 100-200 µm (2024-2032) ($MN)
  • Table 10 Global Glass Interposers Market Outlook, By Above 200 µm (2024-2032) ($MN)
  • Table 11 Global Glass Interposers Market Outlook, By Fabrication Process (2024-2032) ($MN)
  • Table 12 Global Glass Interposers Market Outlook, By Via Formation (2024-2032) ($MN)
  • Table 13 Global Glass Interposers Market Outlook, By Metallization and Plating (2024-2032) ($MN)
  • Table 14 Global Glass Interposers Market Outlook, By Bonding and Assembly (2024-2032) ($MN)
  • Table 15 Global Glass Interposers Market Outlook, By Surface Finishing (2024-2032) ($MN)
  • Table 16 Global Glass Interposers Market Outlook, By Application (2024-2032) ($MN)
  • Table 17 Global Glass Interposers Market Outlook, By 2.5D and 3D IC Packaging (2024-2032) ($MN)
  • Table 18 Global Glass Interposers Market Outlook, By MEMS and Sensor Integration (2024-2032) ($MN)
  • Table 19 Global Glass Interposers Market Outlook, By LED Packaging (2024-2032) ($MN)
  • Table 20 Global Glass Interposers Market Outlook, By Photonics and Optoelectronics (2024-2032) ($MN)
  • Table 21 Global Glass Interposers Market Outlook, By RF and Wireless Components (2024-2032) ($MN)
  • Table 22 Global Glass Interposers Market Outlook, By Other Applications (2024-2032) ($MN)
  • Table 23 Global Glass Interposers Market Outlook, By End User (2024-2032) ($MN)
  • Table 24 Global Glass Interposers Market Outlook, By Consumer Electronics (2024-2032) ($MN)
  • Table 25 Global Glass Interposers Market Outlook, By Automotive Electronics (2024-2032) ($MN)
  • Table 26 Global Glass Interposers Market Outlook, By Telecommunications (2024-2032) ($MN)
  • Table 27 Global Glass Interposers Market Outlook, By Aerospace & Defense (2024-2032) ($MN)
  • Table 28 Global Glass Interposers Market Outlook, By Industrial Automation (2024-2032) ($MN)
  • Table 29 Global Glass Interposers Market Outlook, By Medical Devices (2024-2032) ($MN)
  • Table 30 Global Glass Interposers Market Outlook, By Other End Users (2024-2032) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.