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市场调查报告书
商品编码
1869525

玻璃中介层市场：现况分析与预测（2025-2033）

Glass Interposers Market: Current Analysis and Forecast (2025-2033)
出版日期: | 出版商: UnivDatos Market Insights Pvt Ltd | 英文 138 Pages | 商品交期: 最快1-2个工作天内

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简介目录

预计在预测期（2025-2033 年）内，玻璃中介层市场将以约 11.2% 的复合年增长率成长。这一显着成长主要得益于市场对高性能、高能源效率和小型化半导体装置日益增长的需求。包括高效能运算 (HPC)、人工智慧 (AI) 和 5G 通讯在内的先进应用需要高互连密度、最小讯号损耗和卓越的散热管理——而这些特性只有玻璃中介层才能提供，而传统的有机基板则无法满足这些需求。此外，处理器、GPU 和 AI 加速器正透过采用 2.5D 和 3D 封装以及玻璃通孔 (TGV) 技术进一步提升其性能和可靠性。这些因素共同推动了市场成长。

依晶圆尺寸划分，市场分为 200 毫米、300 毫米和 300 毫米以上三个类别。其中，300mm晶圆市占率最大，这得益于其更高的晶圆良率、成本效益以及在包括记忆体、逻辑电路和先进处理器在内的各种半导体製造应用中的通用性。然而，随着产业领导者专注于下一代製造技术以满足人工智慧、物联网和5G设备的需求，预计300mm+晶圆市场将实现强劲成长。这有望降低晶片成本并提高生产效率。

依封装类型，市场可分为2.5D封装、3D封装及麵板级封装。其中，2.5D封装凭藉其在性能、成本和设计复杂性方面的平衡，占最大的市场占有率。目前，它已被广泛应用于高效能运算、GPU、网路和资料中心系统。然而，受人工智慧、智慧型手机和物联网领域对紧凑、节能和高效能设备的需求不断增长的推动，预计3D封装将实现最快成长。

依终端用户产业划分，市场可分为消费性电子、通讯、汽车、国防和航空航太等产业。目前，消费性电子产业占最大的市场占有率，这主要得益于智慧型手机、笔记型电脑、穿戴式装置和其他智慧型装置的巨大需求。这些设备需要先进的半导体解决方案来处理、储存和通讯。然而，由于电动车的日益普及、自动驾驶系统的发展以及高级驾驶辅助系统 (ADAS) 的进步，预计汽车产业将成为未来成长最快的产业。由于每辆车半导体使用量的增加以及政府推动电动车普及的压力，汽车行业的需求预计将显着增长。

为了更深入了解玻璃中介层的需求，我们基于北美（美国、加拿大和北美其他地区）、欧洲（德国、英国、法国、西班牙、义大利和欧洲其他地区）、亚太地区（中国、日本、印度和亚太其他地区）以及世界其他地区的全球市场应用情况进行了分析。 亚太地区占最大的市场占有率。这一优势得益于中国大陆、台湾、韩国和日本等地拥有主要的半导体製造基地。然而，在高效能运算、人工智慧加速器和 5G 网路广泛应用的推动下，北美市场预计也将显着成长。

市面上主要的公司包括 AGC Inc.，Corning Incorporated，Dai Nippon Printing Co.，Ltd.，PLANOPTIK AG，Samtec，Inc.，SCHOTT，3DGS，NSG Group，TOPPAN Inc.，and Nippon Electric Glass Co.，Ltd. 等。

目录

第一章：市场概况

  • 市场定义
  • 主要目标
  • 利害关係人
  • 局限性

第二章：研究方法或假设

  • 研究过程
  • 研究方法
  • 受访者公司简介

第三章：摘要整理

  • 行业概览
  • 依区隔市场预测
    • 市场成长强度
  • 依地区预测

第四章：市场动态

  • 推动因素
  • 机遇
  • 阻碍因素
  • 趋势
  • PESTEL 分析
  • 需求面分析
  • 供给面分析
    • 併购
    • 合作与投资情景
    • 产业洞察：重点新创企业及其独特策略

第五章：定价分析

  • 价格分析区域
  • 影响定价的因素

第六章：2023-2033年全球玻璃中介层市场营收

第七章：以晶圆尺寸划分的市场洞察

  • 200毫米
  • 300毫米
  • 300毫米以上

第八章：以封装方式划分的市场洞察

  • 2.5D封装
  • 3D封装
  • 面板级封装

第九章：依最终用途产业划分的市场洞察

  • 消费性电子
  • 电信
  • 汽车
  • 国防与航空航太
  • 其他

第十章：依…划分的市场洞察区域

  • 北美洲
    • 美国
    • 加拿大
    • 北美洲其他地区
  • 欧洲
    • 德国
    • 英国
    • 法国
    • 义大利
    • 西班牙
    • 欧洲其他地区
  • 亚太地区
    • 中国
    • 日本
    • 印度
    • 亚太地区其他地区
  • 世界其他地区

第十一章：价值链分析

  • 利润率分析
  • 市场参与者列表

第十二章：竞争格局

  • 竞争概览
  • 竞争市场定位分析
  • 波特五力分析

第十三章 公司简介

  • AGC Inc.
    • Company Overview
    • Key Financials
    • SWOT Analysis
    • Product Portfolio
    • Recent Developments
  • Corning Incorporated
  • Dai Nippon Printing Co., Ltd.
  • PLANOPTIK AG
  • Samtec, Inc.
  • SCHOTT
  • 3DGS
  • NSG Group
  • TOPPAN Inc.
  • Nippon Electric Glass Co., Ltd.

第十四章 缩写与前提条件

第十五章 附件

简介目录
Product Code: UMSE213457

A glass interposer is an important component used in the area of microelectronics, serving as a bridging platform between the silicon chip and the substrate or printed circuit board (PCB) to which the chip is mounted. Glass interposer offers several features, such as higher performance due to their superior electrical properties and enhanced thermal management capabilities compared to traditional organic substrates. Additionally, the glass interposer has 3D integration technology, facilitating more complex and higher-functioning devices.

The Glass Interposers market is set to show a growth rate of about 11.2% during the forecast period (2025-2033F). The glass interposers market is experiencing significant growth due to the rising demand for high-performance, energy-efficient, and miniaturized semiconductor devices. High-performance computing (HPC), artificial intelligence (AI), and 5G communications, as well as other advanced applications, require high interconnect density, minimal signal loss, and excellent thermal management capabilities, which only glass interposers can provide compared to traditional organic substrates. Additionally, processors, GPUs, and AI accelerators are further enhanced by the use of 2.5D and 3D packaging, as well as through-glass via (TGV) technology, which improves their performance and reliability. These factors are driving the growth of this market.

Based on the wafer size category, the market is categorised into 200 mm, 300 mm, and above 300 mm. Among these, the 300 mm wafer segment holds the maximum market share since it provides better yield per wafer, cost-effectiveness, and is commonly used in semiconductor fabrication in various applications such as memory, logic, and advanced processors. However, the above 300 mm wafer segment is projected to experience robust growth in the future as the industry leaders focus on next-generation fabrication technology to satisfy the demand of AI, IoT, and 5G-enabled devices, which is likely to decrease the cost per chip and boost productivity.

Based on the packaging category, the market is categorized into 2.5D packaging, 3D packaging, and panel-level packaging. Among these, 2.5D packaging has the largest market share because it balances between performance, cost, and design complexity, and is now commonly used in high-performance computing, GPUs, networking, and data center systems. However, 3D packaging is expected to witness the fastest growth, driven by the increasing demand for compact, energy-efficient, and high-performance devices in AI, smartphones, and IoT.

Based on the end-use industry category, the market is segmented into consumer electronics, telecommunications, automotive, defense & aerospace, and others. Among these, consumer electronics currently hold the maximum market share due to the enormous demand for smartphones, laptops, wearables, and other smart devices that need sophisticated semiconductor solutions to process, store, and communicate. However, the automotive industry is predicted to be the most rapidly expanding field in the future due to the increase in the implementation of electric cars, the development of autonomous driving systems, and high-tech driver-assistance systems (ADAS). The rise in semiconductor per vehicle, and government pressure to adopt EVs, will drive automotive industry demand substantially.

For a better understanding of the demand of Glass Interposers, the market is analyzed based on its worldwide adoption in countries such as North America (U.S., Canada, and the Rest of North America), Europe (Germany, U.K., France, Spain, Italy, Rest of Europe), Asia-Pacific (China, Japan, India, and the Rest of Asia-Pacific), and Rest of World. Among these, the Asia-Pacific region holds the largest market share. This dominance is driven by the presence of major semiconductor manufacturing hubs in China, Taiwan, South Korea, and Japan. However, the North America region is expected to witness significant growth due to the rising adoption of high-performance computing, AI accelerators, and 5G networks.

Some major players running in the market include AGC Inc., Corning Incorporated, Dai Nippon Printing Co., Ltd., PLANOPTIK AG, Samtec, Inc., SCHOTT, 3DGS, NSG Group, TOPPAN Inc., and Nippon Electric Glass Co., Ltd.

TABLE OF CONTENTS

1.Market Introduction

  • 1.1. Market Definitions
  • 1.2. Main Objective
  • 1.3. Stakeholders
  • 1.4. Limitation

2.Research Methodology or Assumption

  • 2.1. Research Process of the Global Glass Interposers Market
  • 2.2. Research Methodology of the Global Glass Interposers Market
  • 2.3. Respondent Profile

3.Executive Summary

  • 3.1. Industry Synopsis
  • 3.2. Segmental Outlook
    • 3.2.1. Market Growth Intensity
  • 3.3. Regional Outlook

4.Market Dynamics

  • 4.1. Drivers
  • 4.2. Opportunity
  • 4.3. Restraints
  • 4.4. Trends
  • 4.5. PESTEL Analysis
  • 4.6. Demand Side Analysis
  • 4.7. Supply Side Analysis
    • 4.7.1. Merger & Acquisition
    • 4.7.2. Collaboration & Investment Scenario
    • 4.7.3. Industry Insights: Leading Startups and Their Unique Strategies

5.Pricing Analysis

  • 5.1. Regional Pricing Analysis
  • 5.2. Price Influencing Factors

6.Global Glass Interposers Market Revenue (USD Mn), 2023-2033F

7.Market Insights By Wafer Size

  • 7.1. 200 mm
  • 7.2. 300 mm
  • 7.3. Above 300 mm

8.Market Insights By Packaging

  • 8.1. 2.5D Packaging
  • 8.2. 3D Packaging
  • 8.3. Panel-Level Packaging

9.Market Insights By End-Use Industry

  • 9.1. Consumer Electronics
  • 9.2. Telecommunications
  • 9.3. Automotive
  • 9.4. Defense & Aerospace
  • 9.5. Others

10.Market Insights By Region

  • 10.1. North America
    • 10.1.1. U.S.
    • 10.1.2. Canada
    • 10.1.3. Rest of North America
  • 10.2. Europe
    • 10.2.1. Germany
    • 10.2.2. U.K.
    • 10.2.3. France
    • 10.2.4. Italy
    • 10.2.5. Spain
    • 10.2.6. Rest of Europe
  • 10.3. Asia-Pacific
    • 10.3.1. China
    • 10.3.2. Japan
    • 10.3.3. India
    • 10.3.4. Rest of Asia-Pacific
  • 10.4. Rest of World

11.Value Chain Analysis

  • 11.1. Marginal Analysis
  • 11.2. List of Market Participants

12.Competitive Landscape

  • 12.1. Competition Dashboard
  • 12.2. Competitor Market Positioning Analysis
  • 12.3. Porter Five Forces Analysis

13.Company Profiles

  • 13.1. AGC Inc.
    • 13.1.1. Company Overview
    • 13.1.2. Key Financials
    • 13.1.3. SWOT Analysis
    • 13.1.4. Product Portfolio
    • 13.1.5. Recent Developments
  • 13.2. Corning Incorporated
  • 13.3. Dai Nippon Printing Co., Ltd.
  • 13.4. PLANOPTIK AG
  • 13.5. Samtec, Inc.
  • 13.6. SCHOTT
  • 13.7. 3DGS
  • 13.8. NSG Group
  • 13.9. TOPPAN Inc.
  • 13.10. Nippon Electric Glass Co., Ltd.

14.Acronyms & Assumption

15.Annexure