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市场调查报告书
商品编码
1889200
全球人工智慧晶片组市场:预测至 2032 年—按组件、功能、部署方式、技术、公司类型、最终用户和地区进行分析AI Chipset Market Forecasts to 2032 - Global Analysis By Component, Function, Deployment, Technology, Enterprise Type, End User and By Geography |
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根据 Stratistics MRC 的一项研究,预计到 2025 年,全球人工智慧晶片组市场价值将达到 973.5 亿美元,到 2032 年将达到 6411.4 亿美元,在预测期内的复合年增长率为 30.9%。
人工智慧晶片组是专为提升人工智慧(包括深度学习、神经网路处理和大规模数据分析)运作效能而设计的半导体元件。它们利用GPU、TPU和NPU等架构,以更快的速度和更高的能源效率处理并行运算任务。这些晶片组支援各种设备的人工智慧功能,从行动装置和智慧型装置到云端伺服器和自主系统,从而实现即时洞察、增强运算能力并高效执行高级人工智慧演算法。
根据工业生产指数(IIP)数据,由于新冠疫情封锁导致製造业生产进程放缓,2020 年 7 月製造业产出下降了 11.1%。
增加资料中心投资
企业正在扩展其云端基础设施,以支援机器学习、分析和生成式人工智慧工作负载。这种扩展需要能够处理大规模并行运算的高效能处理器。人工智慧晶片组正在被集成,以优化能源效率并加速各种应用中的推理任务。超大规模资料中心供应商的策略性投资也在推动冷却系统和硬体优化方面的创新。这些发展正使资料中心成为全球人工智慧晶片组部署的基础。
开发和设计的高度复杂性
开发兼顾速度、效率和扩充性的架构需要大量的研发投入。晶片组与多样化硬体生态系统的整合复杂性也构成了另一道障碍。快速的技术迭代缩短了产品寿命,并给工程团队和生产流程带来了巨大压力。儘管企业正在采用模组化设计和模拟工具来降低风险,但准入门槛依然很高。在这种环境下,中小企业很难与老牌半导体巨头竞争。
客製化人工智慧晶片组的兴起
客製化处理器正被设计用于加速深度学习、自然语言处理和边缘人工智慧应用。与通用GPU和CPU相比,这些晶片组可提供更最佳化的效能。半导体公司与云端服务供应商之间的合作,正在推动针对特定产业的共同开发架构。面向医疗保健、汽车和机器人等领域的专用加速器正成为新兴趋势。这波客製化浪潮正在重新定义竞争差异化,并拓展人工智慧硬体创新的范围。
模型压缩技术的快速发展
能够减小模型规模和运算需求的演算法降低了对高效能处理器的依赖。诸如剪枝、量化和知识蒸馏等技术使得在低成本硬体上高效部署成为可能。这一趋势可能导致市场需求从高阶晶片组转向轻量级架构。厂商正透过将支援压缩的设计纳入产品蓝图来应对这一趋势。然而,软体优化领域的创新步伐持续对以硬体为中心的成长策略构成挑战。
疫情重塑了各行业人工智慧晶片组应用的优先顺序。供应链中断导致生产计画延误,硬体部署放缓。同时,对人工智慧驱动的医疗诊断和远端协作工具的需求激增。远端医疗、预测分析和自动化物流等领域加速了晶片组投资。各公司采用分散式测试和模拟模型来维持研发动能。
预计在预测期内,影像处理处理器(GPU)细分市场将占据最大的市场份额。
预计在预测期内,影像处理(GPU) 细分市场将占据最大的市场份额。 GPU 因其处理平行处理任务的能力而广受认可,而平行处理任务对于深度学习至关重要。 GPU 在训练和推理工作负载方面的多功能性使其成为人工智慧开发中不可或缺的一部分。记忆体频宽和能源效率的提升进一步巩固了 GPU 的地位。其主要应用领域包括自动驾驶汽车、医学影像处理和自然语言处理。
在预测期内,医疗保健产业的复合年增长率将最高。
预计在预测期内,医疗保健产业将实现最高成长率,这主要得益于对基于人工智慧的诊断、药物研发和病患监测的需求不断增长。晶片组能够实现医学影像和基因组数据的即时分析。与穿戴式装置的整合正在拓展其在预防医学和个人化医疗领域的应用范围。半导体公司与医疗保健机构之间的合作正在加速创新。
预计北美将在预测期内占据最大的市场份额,这得益于该地区在云端基础设施和人工智慧研究方面的大力投资。领先的科技公司和大学正在推动晶片组创新。政府支持的人工智慧和半导体製造倡议进一步加强了生态系统。汽车、医疗保健和金融等行业的应用正在推动市场需求。
预计中东和非洲地区在预测期内将实现最高的复合年增长率。各国政府正大力投资智慧城市计划和数位转型计画。能源管理、安全和医疗保健领域对人工智慧日益增长的需求正在推动这一领域的扩张。与全球科技公司的合作正将先进的晶片组解决方案引入当地市场。新兴新创Start-Ups正在利用人工智慧硬体开发金融科技和物流应用。这种充满活力的环境使该地区成为人工智慧晶片组应用的快速成长前线。
According to Stratistics MRC, the Global AI Chipset Market is accounted for $97.35 billion in 2025 and is expected to reach $641.14 billion by 2032 growing at a CAGR of 30.9% during the forecast period. An AI chipset refers to a purpose-built semiconductor component that boosts the performance of artificial intelligence operations, such as deep learning, neural network processing, and high-volume data analysis. Using architectures like GPUs, TPUs, and NPUs, it handles parallel computing tasks with greater speed and energy efficiency. These chipsets support AI functions in devices ranging from mobiles and smart gadgets to cloud servers and autonomous systems, enabling real-time insights, enhanced computational power, and more efficient execution of advanced AI algorithms.
According to the index of industrial production (IIP) data, in 2020, the manufacturing sector production registered a decline of 11.1% in July, as covid-19 lockdown slows down the manufacturing process.
Rise in data center investment
Enterprises are scaling their cloud infrastructure to support workloads in machine learning, analytics, and generative AI. This expansion requires high-performance processors capable of handling massive parallel computations. AI chipsets are being integrated to optimize energy efficiency and accelerate inference tasks across diverse applications. Strategic investments by hyperscale providers are also driving innovation in cooling systems and hardware optimization. Collectively, these developments are positioning data centers as the backbone of AI chipset adoption worldwide.
High development and design complexity
Developing architectures that balance speed, efficiency, and scalability requires significant R&D expenditure. Complexities in integrating chipsets with diverse hardware ecosystems add further hurdles. Rapid technological cycles often shorten product relevance, straining engineering teams and manufacturing pipelines. Companies are adopting modular design and simulation tools to mitigate risks, but the barrier to entry remains high. This environment makes it difficult for smaller players to compete with established semiconductor giants.
Emergence of custom AI chipsets
Custom processors are being designed to accelerate deep learning, natural language processing, and edge AI applications. These chipsets offer optimized performance compared to general-purpose GPUs or CPUs. Partnerships between semiconductor firms and cloud providers are enabling co-developed architectures for specific industries. Emerging trends include domain-specific accelerators for healthcare, automotive, and robotics. This wave of customization is redefining competitive differentiation and expanding the scope of AI hardware innovation.
Rapid advancements in model compression
Algorithms that reduce model size and computational requirements can lessen reliance on high-end processors. Techniques such as pruning, quantization, and knowledge distillation are enabling efficient deployment on lower-cost hardware. This trend may shift demand toward lightweight architectures rather than premium chipsets. Vendors are responding by integrating compression-aware designs into their product roadmaps. However, the pace of innovation in software optimization continues to challenge hardware-centric growth strategies.
The pandemic reshaped priorities in AI chipset deployment across industries. Supply chain disruptions delayed production schedules and slowed hardware rollouts. At the same time, demand for AI-driven healthcare diagnostics and remote collaboration tools surged. Chipset investments accelerated in areas such as telemedicine, predictive analytics, and automated logistics. Companies adopted decentralized testing and simulation models to maintain development momentum.
The graphics processing unit (GPU) segment is expected to be the largest during the forecast period
The graphics processing unit (GPU) segment is expected to account for the largest market share during the forecast period. GPUs are widely recognized for their ability to handle parallel processing tasks essential for deep learning. Their versatility across training and inference workloads makes them indispensable in AI development. Advances in memory bandwidth and energy efficiency are further strengthening their role. Key applications include autonomous vehicles, healthcare imaging, and natural language processing.
The healthcare segment is expected to have the highest CAGR during the forecast period
Over the forecast period, the healthcare segment is predicted to witness the highest growth rate, due to rising demand for AI-driven diagnostics, drug discovery, and patient monitoring is fueling growth. Chipsets are enabling real-time analysis of medical imaging and genomic data. Integration with wearable devices is expanding applications in preventive care and personalized medicine. Partnerships between semiconductor firms and healthcare providers are accelerating innovation.
During the forecast period, the North America region is expected to hold the largest market share, due to the region benefits from strong investments in cloud infrastructure and AI research. Leading technology companies and universities are driving chipset innovation. Government-backed initiatives in AI and semiconductor manufacturing further strengthen the ecosystem. Adoption across industries such as automotive, healthcare, and finance is accelerating demand.
Over the forecast period, the Middle East & Africa region is anticipated to exhibit the highest CAGR. Governments are investing heavily in smart city projects and digital transformation initiatives. Rising demand for AI in energy management, security, and healthcare is fueling expansion. Partnerships with global technology firms are bringing advanced chipset solutions to local markets. Emerging startups are leveraging AI hardware for fintech and logistics applications. This dynamic environment positions the region as a high-growth frontier for AI chipset deployment.
Key players in the market
Some of the key players in AI Chipset Market include NVIDIA, Groq, Advanced, Cerebras Systems, Intel Corp, Huawei, Google, IBM, Amazon, Broadcom, Microsoft, TSMC, Qualcomm, Samsung Electronics, and Apple Inc.
In November 2025, IBM and the University of Dayton announced an agreement for the joint research and development of next-generation semiconductor technologies and materials. The collaboration aims to advance critical technologies for the age of AI including AI hardware, advanced packaging, and photonics.
In November 2025, Cisco, in collaboration with Intel, has announced a first-of-its-kind integrated platform for distributed AI workloads. Powered by Intel(R) Xeon(R) 6 system-on-chip (SoC), the solution brings compute, networking, storage and security closer to data generated at the edge for real-time AI inferencing and agentic workloads.
Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.