查看购物车
  • Traditional Chinese
  • English
  • Japanese
  • Korean
封面
市场调查报告书
商品编码
1904595

印刷基板(PCB) 和先进封装化学品市场预测至 2032 年：按化学品类型、封装类型、製程、技术、最终用户和地区分類的全球分析

PCB & Advanced Packaging Chemicals Market Forecasts to 2032 - Global Analysis By Chemical Type, Packaging Type, Process, Technology, End User, and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 | 商品交期: 2-3个工作天内

价格

根据 Stratistics MRC 的一项研究，全球印刷电路基板(PCB) 和先进封装化学品市场预计在 2025 年达到 332 亿美元，预计到 2032 年将达到 510 亿美元，在预测期内以 6.3% 的复合年增长率增长。

印刷基板(PCB) 和先进封装化学品是印刷电路基板和半导体封装製造过程中不可或缺的材料。这些材料包括光阻剂、蚀刻剂、电镀化学品、阻焊剂、底部填充剂和封装。这些化学品能够实现电子设备的微型化、高密度互连和可靠性能。扇出型晶圆级封装和 3D 堆迭等先进封装解决方案依赖精确的化学配方来实现黏合、绝缘和温度控管。这些特性确保了电气完整性、机械稳定性和抵御环境应力的能力。

高密度电子设备的微型化

市场的主要驱动力是高密度电子设备的微型化，而微型化又源自于消费者对更小、更快、更有效率的电子产品和运算系统的需求。先进的半导体和封装技术需要精确的化学解决方案才能满足性能和可靠性标准。穿戴式装置、物联网和高效能运算的日益普及正在加速对创新化学材料的需求。这些因素共同推动了专用PCB和封装化学品在多个高科技产业的开发和应用。

严格的半导体级品质标准

市场成长受到半导体级品质标准的严格限制，这些标准对化学纯度、均匀性和性能提出了严格的要求。遵守这些标准会增加製造的复杂性和营运成本。即使品质上出现轻微偏差，也可能导致产品故障和装置可靠性降低。此外，认证和检验过程耗时资源彙整。这些监管和技术障碍减缓了市场普及速度，并给希望进入高度专业化的PCB和封装化学品市场的中小型供应商带来了挑战。

人工智慧处理器先进封装

由于高效散热、高速互连和小尺寸封装的需求，人工智慧处理器先进封装领域蕴藏着巨大的机会。人工智慧、机器学习和资料中心应用的兴起，催生了对尖端封装解决方案的需求。化学品製造商和半导体公司的合作，推动了创新材料的研发。人们对3D封装、晶片组和异构整合的日益关注，进一步拓展了市场潜力。这些趋势为印刷电路基板（PCB）和先进封装化学品领域的收入成长和技术进步提供了重要途径。

化学品供应链中断

化学品供应链中断对市场构成威胁，可能影响生产计画和原料供应。对特殊原料的依赖以及地缘政治不稳定可能导致成本上升和供应受限。价格波动和运输延误进一步加剧了营运风险。此外，替代材料和新型化学品的竞争可能导致市场占有率下降。这些因素共同作用，为製造商和终端用户带来不确定性，威胁市场稳定，因此需要製定稳健的供应链策略，以降低印刷电路板和包装化学品市场潜在的中断风险​​。

新冠疫情的感染疾病

新冠疫情扰乱了印刷电路基板(PCB) 和先进封装化学品的全球供应链、生产营运和物流。生产停摆影响了半导体製造，并导致关键材料的交付延迟。然而，远距办公、资料中心和消费性电子产品需求的成长加速了高密度、高效能封装解决方案的普及。各国政府和产业相关人员已实施了供应链多元化和在地化生产等復苏措施。整体而言，儘管短期内遭遇挫折，但疫情凸显了电子製造业中韧性化学品供应链的重要性。

预计在预测期内，光阻剂细分市场将占据最大的市场份额。

由于光刻製程对半导体和印刷基板製造至关重要，光阻剂预计将在预测期内占据最大的市场份额。光阻剂具有高精度、高解析度和化学稳定性等优点，是晶圆和基板上精细微影术製作的关键材料。对小型化装置和高密度电路日益增长的需求进一步推动了光阻的应用。光阻抗蚀剂的不断改进，包括深紫外线 (DUV) 和极紫外线 (EUV) 版本，正在不断提升其性能。这些因素巩固了光阻在印刷电路基板(PCB) 和先进封装化学品市场的领先地位。

预计在预测期内，表面黏着技术（SMT）细分市场将呈现最高的复合年增长率。

预计在预测期内，表面黏着技术(SMT) 领域将实现最高成长率，这主要得益于自动化组装、紧凑型设计和高速电子产品需求的不断增长。 SMT 化学品能够实现元件贴装所需的精确可靠的焊接、助焊和黏合製程。家电、汽车电子和工业自动化领域需求的成长将推动该领域的发展。 SMT 材料的技术进步，包括无铅和环保材料的出现，将提升其性能。因此，该领域已成为印刷电路基板(PCB) 和先进封装化学品领域内的一个高成长领域。

比最大的地区

由于半导体製造、印刷基板製造和电子组装基地集中在中国、日本、韩国和台湾地区，预计亚太地区将在预测期内占据最大的市场份额。家用电器、物联网设备和工业自动化的日益普及正在推动对化学品的需求。完善的供应链和研发投入正在增强该地区的竞争力。政府支持半导体和电子产品生产的倡议进一步巩固了亚太地区的市场领导地位，使其成为印刷电路基板(PCB) 和先进封装化学品领域的关键区域。

复合年均成长率最高的地区

在预测期内，由于人工智慧处理器、高效能运算和先进电子设备的日益普及，北美地区预计将实现最高的复合年增长率。对半导体研发、封装创新和本地化学品生产的投资将推动市场成长。科技公司、化学品製造商和研究机构之间的紧密合作将为创新封装解决方案提供支援。资料中心、电动车和航太电子产品需求的成长将进一步推动市场扩张。这些因素使北美成为印刷电路基板(PCB) 和先进封装化学品领域快速成长且潜力巨大的市场。

免费客製化服务

购买此报告的客户可享有以下免费自订选项之一：

  • 公司概况
    • 最多三家新增市场参与企业进行全面分析
    • 主要企业SWOT分析（最多3家公司）
  • 区域细分
    • 根据客户要求，对主要国家进行市场估算和预测，并计算复合年增长率（註：可行性需确认）。
  • 竞争标竿分析
    • 从产品系列、地域覆盖范围和策略联盟等方面对主要参与企业进行基准分析

目录

第一章执行摘要

第二章 前言

  • 摘要
  • 相关利益者
  • 调查范围
  • 调查方法
  • 研究材料

第三章 市场趋势分析

  • 司机
  • 抑制因素
  • 机会
  • 威胁
  • 技术分析
  • 终端用户分析
  • 新兴市场
  • 新冠疫情的感染疾病

第四章 波特五力分析

  • 供应商的议价能力
  • 买方的议价能力
  • 替代品的威胁
  • 新进入者的威胁
  • 竞争对手之间的竞争

5. 全球印刷电路基板(PCB) 与先进封装化学品市场（依化学品类型划分）

  • 光阻剂
  • 电镀化学品
  • 蚀刻化学品
  • 阻焊剂化学品
  • 清洁和剥离化学品
  • 介电和绝缘材料

6. 全球印刷电路基板(PCB) 与先进封装化学品市场（依封装类型划分）

  • 表面黏着技术（SMT）
  • 通孔技术
  • 覆晶构装
  • 晶片级封装（CSP）
  • 系统级封装（SiP）
  • 3D IC封装

7. 全球印刷电路基板(PCB) 与先进封装化学品市场（依製程划分）

  • 成像和图形化
  • 电镀/沉积
  • 蚀刻清洗
  • 表面处理
  • 封装/保护

8. 全球印刷电路基板(PCB) 与先进封装化学品市场（依技术划分）

  • 传统包装
  • 先进包装
  • 扇出包装
  • 异质集成

9. 全球印刷电路基板(PCB) 和先进封装化学品市场（依最终用户划分）

  • 电子製造服务 (EMS)
  • 半导体晶圆代工厂
  • OEM
  • OEM
  • 航太/国防
  • 医疗设备製造商

10. 全球印刷电路基板(PCB) 和先进封装化学品市场（按地区划分）

  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 义大利
    • 法国
    • 西班牙
    • 其他欧洲
  • 亚太地区
    • 日本
    • 中国
    • 印度
    • 澳洲
    • 纽西兰
    • 韩国
    • 亚太其他地区
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 其他南美国家
  • 中东和非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 卡达
    • 南非
    • 其他中东和非洲地区

第十一章 重大进展

  • 协议、伙伴关係、合作和合资企业
  • 併购
  • 新产品发布
  • 业务拓展
  • 其他关键策略

第十二章 企业概况

  • DuPont de Nemours, Inc.
  • BASF SE
  • Dow Inc.
  • Atotech（MKS Instruments）
  • MacDermid Alpha Electronics Solutions
  • Entegris, Inc.
  • JCU Corporation
  • Hitachi Chemical（Showa Denko）
  • Rohm and Haas Electronic Materials
  • Mitsubishi Chemical Group
  • Shin-Etsu Chemical Co., Ltd.
  • JSR Corporation
  • TOKYO OHKA KOGYO CO., LTD.
  • AGC Inc.
  • Merck KGaA
  • Sumitomo Bakelite Co., Ltd.
  • Henkel AG & Co. KGaA
  • Kanto Chemical Co., Inc.
Product Code: SMRC33061

According to Stratistics MRC, the Global PCB & Advanced Packaging Chemicals Market is accounted for $33.2 billion in 2025 and is expected to reach $51.0 billion by 2032 growing at a CAGR of 6.3% during the forecast period. PCB & Advanced Packaging Chemicals are materials essential for fabricating printed circuit boards and semiconductor packaging. They include photoresists, etchants, plating chemicals, solder masks, underfills, and encapsulants. These chemicals enable miniaturization, high-density interconnects, and reliable performance in electronics. Advanced packaging solutions, such as fan-out wafer-level and 3D stacking, rely on precise chemical formulations for adhesion, insulation, and thermal management. They ensure electrical integrity, mechanical stability, and protection against environmental stresses.

Market Dynamics:

Driver:

Miniaturization of high-density electronic devices

The market is primarily driven by the miniaturization of high-density electronic devices, fueled by the demand for smaller, faster, and more efficient consumer electronics and computing systems. Advanced semiconductor and packaging technologies require precise chemical solutions to meet performance and reliability standards. Increasing adoption of wearable devices, IoT, and high-performance computing accelerates the need for innovative chemical materials. These factors collectively propel the development and integration of specialized PCB and packaging chemicals across multiple high-tech industries.

Restraint:

Stringent semiconductor-grade quality standards

Market growth is restrained by stringent semiconductor-grade quality standards, which impose rigorous requirements on chemical purity, consistency, and performance. Compliance with these standards increases manufacturing complexity and operational costs. Any deviation in quality can result in product failure or reduced device reliability. Furthermore, certification and testing processes are time-consuming and resource-intensive. These regulatory and technical barriers slow adoption rates and pose challenges for smaller suppliers seeking entry into the highly specialized PCB and packaging chemicals market.

Opportunity:

Advanced packaging for AI processors

Opportunities exist in advanced packaging for AI processors, driven by the need for efficient heat dissipation, high-speed interconnects, and miniaturized form factors. Increasing AI, machine learning, and data center applications create demand for cutting-edge packaging solutions. Collaborations between chemical manufacturers and semiconductor companies enable innovative materials development. Growing interest in 3D packaging, chiplets, and heterogeneous integration further expands the market potential. These trends offer significant avenues for revenue growth and technological advancement within the PCB and advanced packaging chemicals sector.

Threat:

Supply chain disruptions in chemicals

The market faces threats from supply chain disruptions in chemicals, which can affect production schedules and material availability. Dependence on specialized raw materials and geopolitical instability can increase costs and limit access. Fluctuating prices and transportation delays exacerbate operational risks. Additionally, competition from alternative materials or new chemical innovations could reduce market share. These factors collectively create uncertainty for manufacturers and end users, challenging market stability and necessitating robust supply chain strategies to mitigate potential disruptions in the PCB and packaging chemicals market.

Covid-19 Impact:

The Covid-19 pandemic disrupted global supply chains, manufacturing operations, and logistics for PCB and advanced packaging chemicals. Production halts affected semiconductor fabrication and delayed deliveries of critical materials. However, rising demand for remote work, data centers, and consumer electronics accelerated the adoption of high-density and high-performance packaging solutions. Governments and industry players implemented recovery measures, such as supply chain diversification and localized production. Overall, while short-term setbacks occurred, the pandemic highlighted the critical importance of resilient chemical supply chains for electronics manufacturing.

The photoresists segment is expected to be the largest during the forecast period

The photoresists segment is expected to account for the largest market share during the forecast period, resulting from widespread usage in photolithography processes essential for semiconductor and PCB fabrication. High precision, resolution, and chemical stability make photoresists critical for producing fine patterns on wafers and substrates. Rising demand for miniaturized devices and high-density circuits further strengthens adoption. Continuous advancements in resist formulations, including deep ultraviolet (DUV) and extreme ultraviolet (EUV) variants, enhance performance. These factors reinforce the segment's dominant position within the PCB and advanced packaging chemicals market.

The surface mount technology (SMT) segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the surface mount technology (SMT) segment is predicted to witness the highest growth rate, propelled by growing adoption of automated assembly, compact designs, and high-speed electronics. SMT chemicals facilitate soldering, fluxing, and adhesion processes for precise, reliable component placement. Increasing demand from consumer electronics, automotive electronics, and industrial automation drives segment growth. Technological advancements in SMT materials, including lead-free and environmentally friendly options, enhance performance. Consequently, this segment emerges as a high-growth area within PCB and advanced packaging chemicals.

Region with largest share:

During the forecast period, the Asia Pacific region is expected to hold the largest market share, attributed to the concentration of semiconductor fabrication, PCB manufacturing, and electronics assembly hubs in China, Japan, South Korea, and Taiwan. High adoption of consumer electronics, IoT devices, and industrial automation fuels chemical demand. Well-established supply chains and investments in R&D enhance regional capabilities. Government initiatives supporting semiconductor and electronics production further consolidate Asia Pacific's market leadership, making it the dominant region for PCB and advanced packaging chemicals.

Region with highest CAGR:

Over the forecast period, the North America region is anticipated to exhibit the highest CAGR associated with growing adoption of AI processors, high-performance computing, and advanced electronics. Investments in semiconductor R&D, packaging innovations, and localized chemical production accelerate market growth. Strong collaboration between technology firms, chemical manufacturers, and research institutions supports innovative packaging solutions. Rising demand for data centers, electric vehicles, and aerospace electronics further drives expansion. These factors position North America as a rapidly growing market with significant potential in PCB and advanced packaging chemicals.

Key players in the market

Some of the key players in PCB & Advanced Packaging Chemicals Market include DuPont de Nemours, Inc., BASF SE, Dow Inc., Atotech (MKS Instruments), MacDermid Alpha Electronics Solutions, Entegris, Inc., JCU Corporation, Hitachi Chemical (Showa Denko), Rohm and Haas Electronic Materials, Mitsubishi Chemical Group, Shin-Etsu Chemical Co., Ltd., JSR Corporation, TOKYO OHKA KOGYO CO., LTD., AGC Inc., Merck KGaA, Sumitomo Bakelite Co., Ltd., Henkel AG & Co. KGaA, and Kanto Chemical Co., Inc.

Key Developments:

In November 2025, Rohm and Haas Electronic Materials unveiled advanced photoresists and etchants for semiconductor packaging. The company emphasized precision, durability, and sustainability, reinforcing its leadership in advanced packaging chemicals.

In October 2025, Hitachi Chemical (Showa Denko) launched new encapsulants and dielectric materials for advanced packaging. The company emphasized durability, sustainability, and innovation, strengthening its role in PCB and semiconductor chemicals.

In February 2025, JSR Corporation unveiled new photoresists and lithography materials for advanced packaging. The company emphasized precision, durability, and sustainability, strengthening its role in PCB and semiconductor chemicals.

Chemical Types Covered:

  • Photoresists
  • Electroplating Chemicals
  • Etching Chemicals
  • Solder Mask Chemicals
  • Cleaning & Stripping Chemicals
  • Dielectric & Insulating Materials

Packaging Types Covered:

  • Surface Mount Technology (SMT)
  • Through-Hole Technology
  • Flip Chip Packaging
  • Chip Scale Packaging (CSP)
  • System-in-Package (SiP)
  • 3D IC Packaging

Processes Covered:

  • Imaging & Patterning
  • Plating & Deposition
  • Etching & Cleaning
  • Surface Finishing
  • Encapsulation & Protection

Technologies Covered:

  • Conventional Packaging
  • Advanced Packaging
  • Fan-Out Packaging
  • Heterogeneous Integration

End Users Covered:

  • Electronics Manufacturing Services (EMS)
  • Semiconductor Foundries
  • Original Equipment Manufacturers (OEMs)
  • Automotive Manufacturers
  • Aerospace & Defense
  • Healthcare Device Manufacturers

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2024, 2025, 2026, 2028, and 2032
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Technology Analysis
  • 3.7 End User Analysis
  • 3.8 Emerging Markets
  • 3.9 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global PCB & Advanced Packaging Chemicals Market, By Chemical Type

  • 5.1 Introduction
  • 5.2 Photoresists
  • 5.3 Electroplating Chemicals
  • 5.4 Etching Chemicals
  • 5.5 Solder Mask Chemicals
  • 5.6 Cleaning & Stripping Chemicals
  • 5.7 Dielectric & Insulating Materials

6 Global PCB & Advanced Packaging Chemicals Market, By Packaging Type

  • 6.1 Introduction
  • 6.2 Surface Mount Technology (SMT)
  • 6.3 Through-Hole Technology
  • 6.4 Flip Chip Packaging
  • 6.5 Chip Scale Packaging (CSP)
  • 6.6 System-in-Package (SiP)
  • 6.7 3D IC Packaging

7 Global PCB & Advanced Packaging Chemicals Market, By Process

  • 7.1 Introduction
  • 7.2 Imaging & Patterning
  • 7.3 Plating & Deposition
  • 7.4 Etching & Cleaning
  • 7.5 Surface Finishing
  • 7.6 Encapsulation & Protection

8 Global PCB & Advanced Packaging Chemicals Market, By Technology

  • 8.1 Introduction
  • 8.2 Conventional Packaging
  • 8.3 Advanced Packaging
  • 8.4 Fan-Out Packaging
  • 8.5 Heterogeneous Integration

9 Global PCB & Advanced Packaging Chemicals Market, By End User

  • 9.1 Introduction
  • 9.2 Electronics Manufacturing Services (EMS)
  • 9.3 Semiconductor Foundries
  • 9.4 Original Equipment Manufacturers (OEMs)
  • 9.5 Automotive Manufacturers
  • 9.6 Aerospace & Defense
  • 9.7 Healthcare Device Manufacturers

10 Global PCB & Advanced Packaging Chemicals Market, By Geography

  • 10.1 Introduction
  • 10.2 North America
    • 10.2.1 US
    • 10.2.2 Canada
    • 10.2.3 Mexico
  • 10.3 Europe
    • 10.3.1 Germany
    • 10.3.2 UK
    • 10.3.3 Italy
    • 10.3.4 France
    • 10.3.5 Spain
    • 10.3.6 Rest of Europe
  • 10.4 Asia Pacific
    • 10.4.1 Japan
    • 10.4.2 China
    • 10.4.3 India
    • 10.4.4 Australia
    • 10.4.5 New Zealand
    • 10.4.6 South Korea
    • 10.4.7 Rest of Asia Pacific
  • 10.5 South America
    • 10.5.1 Argentina
    • 10.5.2 Brazil
    • 10.5.3 Chile
    • 10.5.4 Rest of South America
  • 10.6 Middle East & Africa
    • 10.6.1 Saudi Arabia
    • 10.6.2 UAE
    • 10.6.3 Qatar
    • 10.6.4 South Africa
    • 10.6.5 Rest of Middle East & Africa

11 Key Developments

  • 11.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 11.2 Acquisitions & Mergers
  • 11.3 New Product Launch
  • 11.4 Expansions
  • 11.5 Other Key Strategies

12 Company Profiling

  • 12.1 DuPont de Nemours, Inc.
  • 12.2 BASF SE
  • 12.3 Dow Inc.
  • 12.4 Atotech (MKS Instruments)
  • 12.5 MacDermid Alpha Electronics Solutions
  • 12.6 Entegris, Inc.
  • 12.7 JCU Corporation
  • 12.8 Hitachi Chemical (Showa Denko)
  • 12.9 Rohm and Haas Electronic Materials
  • 12.10 Mitsubishi Chemical Group
  • 12.11 Shin-Etsu Chemical Co., Ltd.
  • 12.12 JSR Corporation
  • 12.13 TOKYO OHKA KOGYO CO., LTD.
  • 12.14 AGC Inc.
  • 12.15 Merck KGaA
  • 12.16 Sumitomo Bakelite Co., Ltd.
  • 12.17 Henkel AG & Co. KGaA
  • 12.18 Kanto Chemical Co., Inc.

List of Tables

  • Table 1 Global PCB & Advanced Packaging Chemicals Market Outlook, By Region (2024-2032) ($MN)
  • Table 2 Global PCB & Advanced Packaging Chemicals Market Outlook, By Chemical Type (2024-2032) ($MN)
  • Table 3 Global PCB & Advanced Packaging Chemicals Market Outlook, By Photoresists (2024-2032) ($MN)
  • Table 4 Global PCB & Advanced Packaging Chemicals Market Outlook, By Electroplating Chemicals (2024-2032) ($MN)
  • Table 5 Global PCB & Advanced Packaging Chemicals Market Outlook, By Etching Chemicals (2024-2032) ($MN)
  • Table 6 Global PCB & Advanced Packaging Chemicals Market Outlook, By Solder Mask Chemicals (2024-2032) ($MN)
  • Table 7 Global PCB & Advanced Packaging Chemicals Market Outlook, By Cleaning & Stripping Chemicals (2024-2032) ($MN)
  • Table 8 Global PCB & Advanced Packaging Chemicals Market Outlook, By Dielectric & Insulating Materials (2024-2032) ($MN)
  • Table 9 Global PCB & Advanced Packaging Chemicals Market Outlook, By Packaging Type (2024-2032) ($MN)
  • Table 10 Global PCB & Advanced Packaging Chemicals Market Outlook, By Surface Mount Technology (SMT) (2024-2032) ($MN)
  • Table 11 Global PCB & Advanced Packaging Chemicals Market Outlook, By Through-Hole Technology (2024-2032) ($MN)
  • Table 12 Global PCB & Advanced Packaging Chemicals Market Outlook, By Flip Chip Packaging (2024-2032) ($MN)
  • Table 13 Global PCB & Advanced Packaging Chemicals Market Outlook, By Chip Scale Packaging (CSP) (2024-2032) ($MN)
  • Table 14 Global PCB & Advanced Packaging Chemicals Market Outlook, By System-in-Package (SiP) (2024-2032) ($MN)
  • Table 15 Global PCB & Advanced Packaging Chemicals Market Outlook, By 3D IC Packaging (2024-2032) ($MN)
  • Table 16 Global PCB & Advanced Packaging Chemicals Market Outlook, By Process (2024-2032) ($MN)
  • Table 17 Global PCB & Advanced Packaging Chemicals Market Outlook, By Imaging & Patterning (2024-2032) ($MN)
  • Table 18 Global PCB & Advanced Packaging Chemicals Market Outlook, By Plating & Deposition (2024-2032) ($MN)
  • Table 19 Global PCB & Advanced Packaging Chemicals Market Outlook, By Etching & Cleaning (2024-2032) ($MN)
  • Table 20 Global PCB & Advanced Packaging Chemicals Market Outlook, By Surface Finishing (2024-2032) ($MN)
  • Table 21 Global PCB & Advanced Packaging Chemicals Market Outlook, By Encapsulation & Protection (2024-2032) ($MN)
  • Table 22 Global PCB & Advanced Packaging Chemicals Market Outlook, By Technology (2024-2032) ($MN)
  • Table 23 Global PCB & Advanced Packaging Chemicals Market Outlook, By Conventional Packaging (2024-2032) ($MN)
  • Table 24 Global PCB & Advanced Packaging Chemicals Market Outlook, By Advanced Packaging (2024-2032) ($MN)
  • Table 25 Global PCB & Advanced Packaging Chemicals Market Outlook, By Fan-Out Packaging (2024-2032) ($MN)
  • Table 26 Global PCB & Advanced Packaging Chemicals Market Outlook, By Heterogeneous Integration (2024-2032) ($MN)
  • Table 27 Global PCB & Advanced Packaging Chemicals Market Outlook, By End User (2024-2032) ($MN)
  • Table 28 Global PCB & Advanced Packaging Chemicals Market Outlook, By Electronics Manufacturing Services (EMS) (2024-2032) ($MN)
  • Table 29 Global PCB & Advanced Packaging Chemicals Market Outlook, By Semiconductor Foundries (2024-2032) ($MN)
  • Table 30 Global PCB & Advanced Packaging Chemicals Market Outlook, By Original Equipment Manufacturers (OEMs) (2024-2032) ($MN)
  • Table 31 Global PCB & Advanced Packaging Chemicals Market Outlook, By Automotive Manufacturers (2024-2032) ($MN)
  • Table 32 Global PCB & Advanced Packaging Chemicals Market Outlook, By Aerospace & Defense (2024-2032) ($MN)
  • Table 33 Global PCB & Advanced Packaging Chemicals Market Outlook, By Healthcare Device Manufacturers (2024-2032) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.