查看购物车
  • Traditional Chinese
  • English
  • Japanese
  • Korean
封面
市场调查报告书
商品编码
1904671

感测器融合积体电路市场预测至2032年：按感测器类型、技术、应用、最终用户和地区分類的全球分析

Sensor Fusion IC Market Forecasts to 2032 - Global Analysis By Sensor Type (Inertial Sensors, Image Sensors, Environmental Sensors, Position Sensors, Pressure Sensors, and Multi-Sensor Modules), Technology, Application, End User, and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 | 商品交期: 2-3个工作天内

价格

根据 Stratistics MRC 的数据，全球感测器融合 IC 市场预计到 2025 年将达到 71 亿美元，到 2032 年将达到 156 亿美元，预测期内复合年增长率为 11.8%。

感测器融合积体电路旨在撷取、处理并智慧整合来自多个感测器（包括加速计、陀螺仪、磁力计和环境感测器）的资料。透过应用嵌入式演算法，这些积体电路能够提供关于运动、方向和环境条件的精确即时资讯。感测器融合积体电路广泛应用于家用电子电器、汽车、工业自动化和物联网生态系统，能够提高系统可靠性、减轻主机处理器的运算负担、优化功耗，并实现导航、手势姿态辨识和预测分析等高阶功能。

对智慧互联设备的需求日益增长

智慧互联设备日益增长的需求是感测器融合积体电路市场的主要驱动力。智慧型手机、穿戴式装置、智慧家庭系统和物联网装置的普及，推动了精准运动感测和情境察觉的需求。在消费者偏好更佳用户体验的驱动下，感测器融合积体电路能够实现手势姿态辨识、导航和活动追踪等功能。它们能够有效率地整合来自多个感测器的数据，从而实现紧凑的设计，并提高整个互联生态系统的能源效率。

设计和整合复杂性高

设计和整合的复杂性是感测器融合积体电路市场的主要阻碍因素。将多个感测器、嵌入式演算法和处理功能整合到单一积体电路中需要先进的设计技术和漫长的开发週期。由于与各种硬体和软体平台的相容性问题，製造商面临着不断增加的研发成本和更短的上市时间挑战。此外，针对不同应用场景的校准要求和效能最佳化进一步增加了整合的复杂性，限制了中小型设备製造商和对成本敏感的应用领域的采用。

自动驾驶和进阶驾驶辅助系统（ADAS）的应用日益普及。

自动驾驶汽车和高级驾驶辅助系统 (ADAS) 的日益普及为感测器融合积体电路 (IC) 市场带来了巨大的成长机会。这些应用依赖于来自摄影机、雷达、光达和惯性感测器的精确数据融合，以实现即时决策。在安全法规和智慧出行需求的推动下，汽车製造商正在加速将感测器融合 IC 整合到汽车平臺中。这一趋势正在推动市场对能够在复杂驾驶环境中可靠运行的、稳健的高性能 IC 的广泛需求。

技术过时的风险

技术快速过时对感测器融合积体电路市场构成重大威胁。感测器技术、人工智慧演算法和处理架构的快速发展会导致现有解决方案迅速过时。为了保持竞争力，企业不得不不断创新并升级产品系列。这缩短了产品生命週期，增加了研发成本。此外，未能跟上新兴标准和性能预期可能会导致市场份额的损失，尤其是在家用电子电器和汽车领域。

新冠疫情的影响：

新冠感染疾病对感测器融合积体电路市场产生了复杂的影响。初期半导体製造和全球供应链的中断影响了生产和交货时间。然而，家用电子电器、远端监控设备和互联医疗解决方案需求的成长支撑了市场的復苏。数位化进程的加速和自动化技术的日益普及进一步推动了对基于感测器的系统的需求。疫情过后，随着半导体供应的稳定，在互联和智慧型设备等长期发展趋势的驱动下，市场恢復了稳定成长。

预计在预测期内，影像感测器细分市场将占据最大的市场份额。

由于影像感测器在智慧型手机、车载摄影机、安防系统、工业视觉等领域有广泛的应用，预计在预测期内，影像感测器细分市场将占据最大的市场份额。影像感测器能够产生高价值数据，这些数据可以透过融合晶片与其他感测器的数据相结合，从而提高精度和情境察觉。高级驾驶辅助系统 (ADAS)、脸部辨识和扩增实境领域对先进成像技术的需求不断增长，进一步巩固了影像感测器在感测器融合晶片市场的主导地位。

预计在预测期内，基于MEMS的细分市场将呈现最高的复合年增长率。

由于小型化趋势和成本效益，基于微机电系统（MEMS）的细分市场预计将在预测期内实现最高成长率。 MEMS加速计、陀螺仪和磁力计因其尺寸小、功耗低而被广泛应用于家用电子电器、汽车和工业领域。整合MEMS元件的感测器融合积体电路能够实现高性能的运动追踪和方向检测，从而满足日益增长的携带式、电池供电和空间受限智慧型装置的需求。

占比最大的地区：

由于亚太地区拥有强大的半导体製造基础和庞大的消费量电子产品需求，预计该地区将在预测期内占据最大的市场份额。中国、韩国、日本和台湾等国家和地区位置许多主要的电子产品原始设备製造商 (OEM) 和代工厂，推动了感测器融合积体电路 (IC) 的大规模应用。快速的都市化、物联网 (IoT) 的日益普及以及汽车产量的成长，预计将进一步巩固该地区在感测器融合 IC 市场收入方面的主导地位。

年复合成长率最高的地区：

在预测期内，北美预计将呈现最高的复合年增长率，这主要得益于汽车、航太和国防技术的强劲创新。自主系统、机器人和先进医疗设备的广泛应用推动了对先进感测器整合解决方案的需求。大型半导体公司的存在、强劲的研发投入以及对新兴技术的早期应用，进一步促进了美国和加拿大感测器融合积体电路市场的加速成长。

免费客製化服务：

购买此报告的客户可以选择以下免费自订选项之一：

  • 公司概况
    • 对其他市场公司（最多 3 家公司）进行全面分析
    • 主要参与者（最多3家公司）的SWOT分析
  • 区域细分
    • 根据客户要求，提供主要国家的市场估算和预测以及复合年增长率（註：可行性需确认）。
  • 竞争标竿分析
    • 根据主要企业的产品系列、地理覆盖范围和策略联盟进行基准分析

目录

第一章执行摘要

第二章 前言

  • 摘要
  • 相关利益者
  • 调查范围
  • 调查方法
  • 研究材料

第三章 市场趋势分析

  • 司机
  • 抑制因素
  • 机会
  • 威胁
  • 技术分析
  • 应用分析
  • 终端用户分析
  • 新兴市场
  • 新冠疫情的感染疾病

第四章 波特五力分析

  • 供应商的议价能力
  • 买方的议价能力
  • 替代品的威胁
  • 新进入者的威胁
  • 竞争对手之间的竞争

5. 全球感测器融合IC市场（依感测器类型划分）

  • 惯性感测器
  • 影像感测器
  • 环境感测器
  • 位置感测器
  • 压力感测器
  • 多感测器模组

6. 全球感测器融合积体电路市场（依技术划分）

  • 基于MEMS的
  • 基于CMOS的
  • 基于ASIC的
  • 人工智慧积体电路
  • 混合架构
  • 低功耗积体电路

7. 全球感测器融合IC市场（按应用领域划分）

  • 汽车高级驾驶辅助系统（ADAS）
  • 家用电子电器
  • 工业自动化
  • 医疗设备
  • 智慧型穿戴装置
  • 机器人技术

8. 全球感测器融合IC市场（依最终用户划分）

  • 汽车製造商
  • 电子设备製造商
  • 工业公司
  • 医疗相关企业
  • 物联网解决方案供应商
  • 防御领域

9. 全球感测器融合IC市场（按地区划分）

  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 义大利
    • 法国
    • 西班牙
    • 其他欧洲
  • 亚太地区
    • 日本
    • 中国
    • 印度
    • 澳洲
    • 纽西兰
    • 韩国
    • 亚太其他地区
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 其他南美国家
  • 中东和非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 卡达
    • 南非
    • 其他中东和非洲地区

第十章：重大进展

  • 协议、伙伴关係、合作和合资企业
  • 併购
  • 新产品发布
  • 业务拓展
  • 其他关键策略

第十一章 企业概况

  • Bosch Sensortec
  • STMicroelectronics
  • NXP Semiconductors
  • Infineon Technologies
  • Analog Devices
  • Texas Instruments
  • ON Semiconductor
  • TDK InvenSense
  • Renesas Electronics
  • Qualcomm Incorporated
  • Sony Semiconductor Solutions
  • Broadcom Inc.
  • Microchip Technology
  • ROHM Semiconductor
  • Sensirion AG
  • Honeywell International
Product Code: SMRC33064

According to Stratistics MRC, the Global Sensor Fusion IC Market is accounted for $7.1 billion in 2025 and is expected to reach $15.6 billion by 2032 growing at a CAGR of 11.8% during the forecast period. Sensor Fusion ICs are integrated circuits engineered to collect, process, and intelligently combine data from multiple sensors such as accelerometers, gyroscopes, magnetometers, and environmental sensors. By applying embedded algorithms, these ICs deliver accurate, real-time insights on motion, orientation, and context. Widely adopted in consumer electronics, automotive, industrial automation, and IoT ecosystems, sensor fusion ICs enhance system reliability, reduce computational load on host processors, optimize power consumption, and enable advanced functions like navigation, gesture recognition, and predictive analytics.

Market Dynamics:

Driver:

Rising demand for smart, connected devices

Rising demand for smart, connected devices is a primary driver for the sensor fusion IC market. Proliferation of smartphones, wearables, smart home systems, and IoT-enabled devices is increasing the need for accurate motion sensing and contextual awareness. Fueled by consumer preference for enhanced user experience, sensor fusion ICs enable features such as gesture recognition, navigation, and activity tracking. Their ability to combine data from multiple sensors efficiently supports compact designs and improved power efficiency across connected ecosystems.

Restraint:

High design and integration complexity

High design and integration complexity acts as a key restraint for the sensor fusion IC market. Integrating multiple sensors, embedded algorithms, and processing capabilities into a single IC requires advanced design expertise and longer development cycles. Spurred by compatibility issues with diverse hardware and software platforms, manufacturers face increased R&D costs and time-to-market challenges. Additionally, calibration requirements and performance optimization across varying use cases further complicate integration, limiting adoption among smaller device manufacturers and cost-sensitive applications.

Opportunity:

Expanding autonomous and ADAS adoption

Expanding adoption of autonomous vehicles and advanced driver assistance systems (ADAS) presents a significant growth opportunity for the sensor fusion IC market. These applications rely on precise data integration from cameras, radar, LiDAR, and inertial sensors to enable real-time decision-making. Motivated by safety regulations and demand for intelligent mobility, automotive OEMs are increasingly integrating sensor fusion ICs into vehicle platforms. This trend drives high-volume demand for robust, high-performance ICs capable of operating reliably in complex driving environments.

Threat:

Rapid technological obsolescence risk

Rapid technological obsolescence poses a notable threat to the sensor fusion IC market. Fast-paced advancements in sensor technologies, AI algorithms, and processing architectures can quickly render existing solutions outdated. Companies face constant pressure to innovate and upgrade product portfolios to remain competitive. This accelerates product life cycles and increases R&D expenditure. Additionally, failure to keep pace with emerging standards and performance expectations may lead to loss of market share, particularly in consumer electronics and automotive segments.

Covid-19 Impact:

The COVID-19 pandemic had a mixed impact on the sensor fusion IC market. Initial disruptions in semiconductor manufacturing and global supply chains affected production and delivery timelines. However, increased demand for consumer electronics, remote monitoring devices, and connected healthcare solutions supported market recovery. Accelerated digitalization and rising adoption of automation technologies further boosted demand for sensor-enabled systems. As semiconductor supply stabilized post-pandemic, the market resumed steady growth driven by long-term trends in connectivity and smart devices.

The image sensors segment is expected to be the largest during the forecast period

The image sensors segment is expected to account for the largest market share during the forecast period, owing to their widespread use in smartphones, automotive cameras, security systems, and industrial vision applications. Image sensors generate high-value data that, when combined with other sensors through fusion ICs, enhance accuracy and situational awareness. Growing demand for advanced imaging in ADAS, facial recognition, and augmented reality further strengthens this segment's dominance within the sensor fusion IC market.

The MEMS-based segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the MEMS-based segment is predicted to witness the highest growth rate, reinforced by miniaturization trends and cost efficiency. MEMS accelerometers, gyroscopes, and magnetometers are widely adopted in consumer electronics, automotive, and industrial applications due to their compact size and low power consumption. Sensor fusion ICs integrating MEMS devices enable high-performance motion tracking and orientation sensing, supporting increasing demand for portable, battery-powered, and space-constrained smart devices.

Region with largest share:

During the forecast period, the Asia Pacific region is expected to hold the largest market share, ascribed to its strong semiconductor manufacturing base and high consumption of consumer electronics. Countries such as China, South Korea, Japan, and Taiwan host major electronics OEMs and foundries, driving large-scale adoption of sensor fusion ICs. Rapid urbanization, growing IoT deployment, and expanding automotive production further reinforce the region's leadership in sensor fusion IC market revenues.

Region with highest CAGR:

Over the forecast period, the North America region is anticipated to exhibit the highest CAGR associated with strong innovation in automotive, aerospace, and defense technologies. High adoption of autonomous systems, robotics, and advanced healthcare devices drives demand for sophisticated sensor fusion solutions. The presence of leading semiconductor companies, robust R&D investment, and early adoption of emerging technologies further support accelerated growth of the sensor fusion IC market across the United States and Canada.

Key players in the market

Some of the key players in Sensor Fusion IC Market include Bosch Sensortec, STMicroelectronics, NXP Semiconductors, Infineon Technologies, Analog Devices, Texas Instruments, ON Semiconductor, TDK InvenSense, Renesas Electronics, Qualcomm Incorporated, Sony Semiconductor Solutions, Broadcom Inc., Microchip Technology, ROHM Semiconductor, Sensirion AG and Honeywell International.

Key Developments:

In Sep 2025, Bosch Sensortec introduced an advanced AI-enabled sensor fusion platform, integrating MEMS inertial sensors with embedded intelligence to deliver enhanced motion tracking and context awareness for smartphones, wearables, and AR/VR devices, while reducing power consumption and host processor load.

In Aug 2025, STMicroelectronics unveiled a next-generation sensor fusion IC family combining inertial and environmental sensors with edge AI capabilities, targeting automotive ADAS, industrial automation, and smart consumer electronics requiring high accuracy and low latency.

In Jul 2025, NXP Semiconductors announced an upgraded automotive-grade sensor fusion solution, optimized for autonomous driving and vehicle dynamics control, enabling real-time data fusion from radar, cameras, and inertial sensors to enhance safety and situational awareness.

Sensor Types Covered:

  • Inertial Sensors
  • Image Sensors
  • Environmental Sensors
  • Position Sensors
  • Pressure Sensors
  • Multi-Sensor Modules

Technologies Covered:

  • MEMS-Based
  • CMOS-Based
  • ASIC-Based
  • AI-Enabled ICs
  • Hybrid Architectures
  • Low-Power ICs

Applications Covered:

  • Automotive ADAS
  • Consumer Electronics
  • Industrial Automation
  • Healthcare Devices
  • Smart Wearables
  • Robotics

End Users Covered:

  • Automotive OEMs
  • Electronics Manufacturers
  • Industrial Enterprises
  • Healthcare Companies
  • IoT Solution Providers
  • Defense Sector

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2024, 2025, 2026, 2028, and 2032
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Technology Analysis
  • 3.7 Application Analysis
  • 3.8 End User Analysis
  • 3.9 Emerging Markets
  • 3.10 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Sensor Fusion IC Market, By Sensor Type

  • 5.1 Introduction
  • 5.2 Inertial Sensors
  • 5.3 Image Sensors
  • 5.4 Environmental Sensors
  • 5.5 Position Sensors
  • 5.6 Pressure Sensors
  • 5.7 Multi-Sensor Modules

6 Global Sensor Fusion IC Market, By Technology

  • 6.1 Introduction
  • 6.2 MEMS-Based
  • 6.3 CMOS-Based
  • 6.4 ASIC-Based
  • 6.5 AI-Enabled ICs
  • 6.6 Hybrid Architectures
  • 6.7 Low-Power ICs

7 Global Sensor Fusion IC Market, By Application

  • 7.1 Introduction
  • 7.2 Automotive ADAS
  • 7.3 Consumer Electronics
  • 7.4 Industrial Automation
  • 7.5 Healthcare Devices
  • 7.6 Smart Wearables
  • 7.7 Robotics

8 Global Sensor Fusion IC Market, By End User

  • 8.1 Introduction
  • 8.2 Automotive OEMs
  • 8.3 Electronics Manufacturers
  • 8.4 Industrial Enterprises
  • 8.5 Healthcare Companies
  • 8.6 IoT Solution Providers
  • 8.7 Defense Sector

9 Global Sensor Fusion IC Market, By Geography

  • 9.1 Introduction
  • 9.2 North America
    • 9.2.1 US
    • 9.2.2 Canada
    • 9.2.3 Mexico
  • 9.3 Europe
    • 9.3.1 Germany
    • 9.3.2 UK
    • 9.3.3 Italy
    • 9.3.4 France
    • 9.3.5 Spain
    • 9.3.6 Rest of Europe
  • 9.4 Asia Pacific
    • 9.4.1 Japan
    • 9.4.2 China
    • 9.4.3 India
    • 9.4.4 Australia
    • 9.4.5 New Zealand
    • 9.4.6 South Korea
    • 9.4.7 Rest of Asia Pacific
  • 9.5 South America
    • 9.5.1 Argentina
    • 9.5.2 Brazil
    • 9.5.3 Chile
    • 9.5.4 Rest of South America
  • 9.6 Middle East & Africa
    • 9.6.1 Saudi Arabia
    • 9.6.2 UAE
    • 9.6.3 Qatar
    • 9.6.4 South Africa
    • 9.6.5 Rest of Middle East & Africa

10 Key Developments

  • 10.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 10.2 Acquisitions & Mergers
  • 10.3 New Product Launch
  • 10.4 Expansions
  • 10.5 Other Key Strategies

11 Company Profiling

  • 11.1 Bosch Sensortec
  • 11.2 STMicroelectronics
  • 11.3 NXP Semiconductors
  • 11.4 Infineon Technologies
  • 11.5 Analog Devices
  • 11.6 Texas Instruments
  • 11.7 ON Semiconductor
  • 11.8 TDK InvenSense
  • 11.9 Renesas Electronics
  • 11.10 Qualcomm Incorporated
  • 11.11 Sony Semiconductor Solutions
  • 11.12 Broadcom Inc.
  • 11.13 Microchip Technology
  • 11.14 ROHM Semiconductor
  • 11.15 Sensirion AG
  • 11.16 Honeywell International

List of Tables

  • Table 1 Global Sensor Fusion IC Market Outlook, By Region (2024-2032) ($MN)
  • Table 2 Global Sensor Fusion IC Market Outlook, By Sensor Type (2024-2032) ($MN)
  • Table 3 Global Sensor Fusion IC Market Outlook, By Inertial Sensors (2024-2032) ($MN)
  • Table 4 Global Sensor Fusion IC Market Outlook, By Image Sensors (2024-2032) ($MN)
  • Table 5 Global Sensor Fusion IC Market Outlook, By Environmental Sensors (2024-2032) ($MN)
  • Table 6 Global Sensor Fusion IC Market Outlook, By Position Sensors (2024-2032) ($MN)
  • Table 7 Global Sensor Fusion IC Market Outlook, By Pressure Sensors (2024-2032) ($MN)
  • Table 8 Global Sensor Fusion IC Market Outlook, By Multi-Sensor Modules (2024-2032) ($MN)
  • Table 9 Global Sensor Fusion IC Market Outlook, By Technology (2024-2032) ($MN)
  • Table 10 Global Sensor Fusion IC Market Outlook, By MEMS-Based (2024-2032) ($MN)
  • Table 11 Global Sensor Fusion IC Market Outlook, By CMOS-Based (2024-2032) ($MN)
  • Table 12 Global Sensor Fusion IC Market Outlook, By ASIC-Based (2024-2032) ($MN)
  • Table 13 Global Sensor Fusion IC Market Outlook, By AI-Enabled ICs (2024-2032) ($MN)
  • Table 14 Global Sensor Fusion IC Market Outlook, By Hybrid Architectures (2024-2032) ($MN)
  • Table 15 Global Sensor Fusion IC Market Outlook, By Low-Power ICs (2024-2032) ($MN)
  • Table 16 Global Sensor Fusion IC Market Outlook, By Application (2024-2032) ($MN)
  • Table 17 Global Sensor Fusion IC Market Outlook, By Automotive ADAS (2024-2032) ($MN)
  • Table 18 Global Sensor Fusion IC Market Outlook, By Consumer Electronics (2024-2032) ($MN)
  • Table 19 Global Sensor Fusion IC Market Outlook, By Industrial Automation (2024-2032) ($MN)
  • Table 20 Global Sensor Fusion IC Market Outlook, By Healthcare Devices (2024-2032) ($MN)
  • Table 21 Global Sensor Fusion IC Market Outlook, By Smart Wearables (2024-2032) ($MN)
  • Table 22 Global Sensor Fusion IC Market Outlook, By Robotics (2024-2032) ($MN)
  • Table 23 Global Sensor Fusion IC Market Outlook, By End User (2024-2032) ($MN)
  • Table 24 Global Sensor Fusion IC Market Outlook, By Automotive OEMs (2024-2032) ($MN)
  • Table 25 Global Sensor Fusion IC Market Outlook, By Electronics Manufacturers (2024-2032) ($MN)
  • Table 26 Global Sensor Fusion IC Market Outlook, By Industrial Enterprises (2024-2032) ($MN)
  • Table 27 Global Sensor Fusion IC Market Outlook, By Healthcare Companies (2024-2032) ($MN)
  • Table 28 Global Sensor Fusion IC Market Outlook, By IoT Solution Providers (2024-2032) ($MN)
  • Table 29 Global Sensor Fusion IC Market Outlook, By Defense Sector (2024-2032) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.