查看购物车
  • Traditional Chinese
  • English
  • Japanese
  • Korean
贴装机的全球市场-各技术，各用途-地区展望，竞争策略，市场区隔预测(～2033年)
市场调查报告书
商品编码
1273233

贴装机的全球市场-各技术，各用途-地区展望，竞争策略，市场区隔预测(～2033年)

Chip Mounter Market Size- By Technology, By Application- Regional Outlook, Competitive Strategies and Segment Forecast to 2033
出版日期: | 出版商: SPER Market Research Pvt. Ltd. | 英文 220 Pages | 商品交期: 最快1-2个工作天内

价格
简介目录

全球贴装机的市场规模在2033年前预计将以5.79％的年复合成长率增长，推定将达到111亿4,000万美元。需要使用小型复杂电子元件的智慧装置和IoT的普及，促进着市场成长。

本报告提供全球贴装机市场的相关调查，提供市场动态，市场分析，企业简介等全面性资讯。

目录

第1章 简介

  • 调查范围
  • 市场区隔分析

第2章 调查手法

  • 调查资料来源
    • 2次资料
    • 1次资料
    • SPER内部资料库
    • KOL的洞察
  • 市场规模的估计
    • Top-Down(由上而下)和Bottom-Up(由下而上)的方法
  • 资料的三角测量

第3章 摘要整理

第4章 市场动态

  • 促进因素，阻碍因素，机会，课题的分析
    • 促进因素
    • 阻碍因素
    • 机会
    • 课题
  • COVID-19全球贴装机对市场的影响

第5章 市场变数与展望

  • SWOT分析
    • 优势
    • 弱点
    • 机会
    • 威胁
  • PESTEL分析
    • 政治形势
    • 经济形势
    • 社会形势
    • 技术性形势
    • 环境的形势
    • 法律上的形势
  • 波特的五力分析
    • 供给企业谈判力
    • 买方议价能力
    • 替代品的威胁
    • 新加入厂商者的威胁
    • 竞争企业间的敌对关係
  • 热图分析

第6章 竞争情形

  • 全球贴装机市场製造地的分布，销售区域，产品类型
  • 全球贴装机市场的合併·收购，伙伴关係，产品销售，及联盟

第7章 全球贴装机市场:各技术(100万美元)

  • 全球贴装机市场金额占有率与预测:各技术(2023年～2033年)
  • 全技术
  • 表面贴装技术
  • 细间距技术

第8章 全球贴装机市场:各用途(100万美元)

  • 全球贴装机市场金额占有率与预测:各用途(2023年～2033年)
  • 家电
  • 医学
  • 汽车
  • 通讯
  • 其他

第9章 全球贴装机市场预测(2019年～2033年)(100万美元)

第10章 全球贴装机市场:各技术(2019年～2033年)(100万美元)

第11章 全球贴装机市场:各用途(2019年～2033年)(100万美元)

第12章 全球贴装机市场:各地区(2019年～2033年)(100万美元)

  • 亚太地区
    • 澳洲
    • 中国
    • 印度
    • 日本
    • 韩国
    • 其他的亚太地区
  • 欧洲
    • 法国
    • 德国
    • 义大利
    • 西班牙
    • 英国
    • 其他的欧洲
  • 中东和非洲
    • 沙乌地阿拉伯王国
    • 阿拉伯联合大公国
    • 其他的中东和非洲
  • 北美
    • 加拿大
    • 墨西哥
    • 美国
  • 南美
    • 阿根廷
    • 巴西
    • 其他的南美

第13章 企业简介

  • ASM Pacific Technology
  • Canon
  • Essemtech
  • Hitachi
  • Juki
  • Nordson
  • Ohashi Engineering
  • Panasonic
  • Samsung
  • Sony

第14章 简称的清单

第15章 参考链接

第16章 结论

第17章 调查范围

简介目录
Product Code: MACH2324

Global Chip Mounter Market Overview

According to SPER Market Research, the Global Chip Mounter Market is estimated to reach USD 11.14 billion by 2033 with a CAGR of 5.79%.

A chip mounter, also known as a pick-and-place machine, is an electronic device used in the manufacturing of printed circuit boards (PCBs) to place surface-mount devices (SMDs) onto the board. The chip mounter market is a segment of the electronics manufacturing industry and has experienced significant growth in recent years due to the increasing demand for smaller, more powerful electronic devices. The chip mounter market is driven by a variety of factors, including the proliferation of smart devices and the Internet of Things (IoT), which require the use of smaller and more complex electronic components.

What challenges does the Global Chip Mounter Market face?

While the global chip mounter market has experienced significant growth in recent years, it is not without its challenges. One of the main challenges is the increasing complexity of electronic components, which has led to a need for more advanced and precise chip mounters. This has made it difficult for smaller companies to compete in the market, as they may not have the resources to invest in the latest technology.

Scope of the Report

Report Metric Details:

  • Market size available for years: 2019-2033
  • Base year considered: 2022
  • Forecast period: 2023-2033
  • Segments covered: By Technology, By Application.
  • Regions covered: Asia-Pacific, Europe, Middle East and Africa, North America, Latin America
  • Companies Covered: ASM Pacific Technology, Canon, Essemtech, Hitachi, Juki, Nordson, Ohashi Engineering, Panasonic, Samsung, Sony

Global Chip Mounter Market Segmentation:

  • By Technology: Based on the Technology, Global Chip Mounter Market is segmented as; Hole Technology, Surface Mount Technology, Fine Pitch Technology.
  • By Application: Based on the Application, Global Chip Mounter Market is segmented as; Consumer Electronics, Medical, Automotive, Telecommunication, Others.
  • By Region: This report also provides the data for key regional segments of Asia-Pacific, Europe, Middle East and Africa, North America, Latin America.

Table of Contents

1. Introduction

  • 1.1. Scope of the report
  • 1.2. Market segment analysis

2. Research Methodology

  • 2.1. Research data source
    • 2.1.1. Secondary Data
    • 2.1.2. Primary Data
    • 2.1.3. SPER's internal database
    • 2.1.4. Premium insight from KOL's
  • 2.2. Market size estimation
    • 2.2.1. Top-down and Bottom-up approach
  • 2.3. Data triangulation

3. Executive Summary

4. Market Dynamics

  • 4.1. Driver, Restraint, Opportunity and Challenges analysis
    • 4.1.1. Drivers
    • 4.1.2. Restraints
    • 4.1.3. Opportunities
    • 4.1.4. Challenges
  • 4.2. COVID-19 Impacts of the Global Chip Mounter Market

5. Market variable and outlook

  • 5.1. SWOT Analysis
    • 5.1.1. Strengths
    • 5.1.2. Weaknesses
    • 5.1.3. Opportunities
    • 5.1.4. Threats
  • 5.2. PESTEL Analysis
    • 5.2.1. Political Landscape
    • 5.2.2. Economic Landscape
    • 5.2.3. Social Landscape
    • 5.2.4. Technological Landscape
    • 5.2.5. Environmental Landscape
    • 5.2.6. Legal Landscape
  • 5.3. PORTER's Five Forces
    • 5.3.1. Bargaining power of suppliers
    • 5.3.2. Bargaining power of buyers
    • 5.3.3. Threat of Substitute
    • 5.3.4. Threat of new entrant
    • 5.3.5. Competitive rivalry
  • 5.4. Heat Map Analysis

6. Competitive Landscape

  • 6.1. Global Chip Mounter Market Manufacturing Base Distribution, Sales Area, Product Type
  • 6.2. Mergers & Acquisitions, Partnerships, Product Launch, and Collaboration in Global Chip Mounter Market

7. Global Chip Mounter Market, By Technology (USD Million)

  • 7.1. Global Chip Mounter Market Value Share and Forecast, By Technology, 2023-2033
  • 7.2. Hole Technology
  • 7.3. Surface Mount Technology
  • 7.4. Fine Pitch Technology

8. Global Chip Mounter Market, By Application (USD Million)

  • 8.1. Global Chip Mounter Market Value Share and Forecast, By Application, 2023-2033
  • 8.2. Consumer Electronics
  • 8.3. Medical
  • 8.4. Automotive
  • 8.5. Telecommunication
  • 8.6. Others

9. Global Chip Mounter Market Forecast, 2019-2033 (USD Million)

  • 9.1. Global Chip Mounter Market Size and Market Share

10. Global Chip Mounter Market, By Technology, 2019-2033 (USD Million)

  • 10.1. Global Chip Mounter Market Size and Market Share By Technology (2019-2026)
  • 10.2. Global Chip Mounter Market Size and Market Share By Technology (2027-2033)

11. Global Chip Mounter Market, By Application, 2019-2033 (USD Million)

  • 11.1. Global Chip Mounter Market Size and Market Share By Application (2019-2026)
  • 11.2. Global Chip Mounter Market Size and Market Share By Application (2027-2033)

12. Global Chip Mounter Market, By Region, 2019-2033 (USD Million)

  • 12.1. Global Chip Mounter Market Size and Market Share By Region (2019-2026)
  • 12.2. Global Chip Mounter Market Size and Market Share By Region (2027-2033)
  • 12.3. Asia-Pacific
    • 12.3.1. Australia
    • 12.3.2. China
    • 12.3.3. India
    • 12.3.4. Japan
    • 12.3.5. South Korea
    • 12.3.6. Rest of Asia-Pacific
  • 12.4. Europe
    • 12.4.1. France
    • 12.4.2. Germany
    • 12.4.3. Italy
    • 12.4.4. Spain
    • 12.4.5. United Kingdom
    • 12.4.6. Rest of Europe
  • 12.5. Middle East and Africa
    • 12.5.1. Kingdom of Saudi Arabia
    • 12.5.2. United Arab Emirates
    • 12.5.3. Rest of Middle East & Africa
  • 12.6. North America
    • 12.6.1. Canada
    • 12.6.2. Mexico
    • 12.6.3. United States
  • 12.7. Latin America
    • 12.7.1. Argentina
    • 12.7.2. Brazil
    • 12.7.3. Rest of Latin America

13. Company Profile

  • 13.1. ASM Pacific Technology
    • 13.1.1. Company details
    • 13.1.2. Financial outlook
    • 13.1.3. Product summary
    • 13.1.4. Recent developments
  • 13.2. Canon
    • 13.2.1. Company details
    • 13.2.2. Financial outlook
    • 13.2.3. Product summary
    • 13.2.4. Recent developments
  • 13.3. Essemtech
    • 13.3.1. Company details
    • 13.3.2. Financial outlook
    • 13.3.3. Product summary
    • 13.3.4. Recent developments
  • 13.4. Hitachi
    • 13.4.1. Company details
    • 13.4.2. Financial outlook
    • 13.4.3. Product summary
    • 13.4.4. Recent developments
  • 13.5. Juki
    • 13.5.1. Company details
    • 13.5.2. Financial outlook
    • 13.5.3. Product summary
    • 13.5.4. Recent developments
  • 13.6. Nordson
    • 13.6.1. Company details
    • 13.6.2. Financial outlook
    • 13.6.3. Product summary
    • 13.6.4. Recent developments
  • 13.7. Ohashi Engineering
    • 13.7.1. Company details
    • 13.7.2. Financial outlook
    • 13.7.3. Product summary
    • 13.7.4. Recent developments
  • 13.8. Panasonic
    • 13.8.1. Company details
    • 13.8.2. Financial outlook
    • 13.8.3. Product summary
    • 13.8.4. Recent developments
  • 13.9. Samsung
    • 13.9.1. Company details
    • 13.9.2. Financial outlook
    • 13.9.3. Product summary
    • 13.9.4. Recent developments
  • 13.10. Sony
    • 13.10.1. Company details
    • 13.10.2. Financial outlook
    • 13.10.3. Product summary
    • 13.10.4. Recent developments

14. List of Abbreviations

15. Reference Links

16. Conclusion

17. Research Scope