全球ALD/高K金属前驱体市场分析（2023-2024）

ALD / High K Metal Precursors Market Report (a Critical Materials Report) 2023-2024

出版日期: 2023年11月17日 | 出版商:

TECHCET | 英文 276 Pages | 商品交期: 最快1-2个工作天内

价格

简介目录图表

本报告分析了全球与无机气体和液体 CVD/ALD 前驱体（金属、金属氧化物、高 k、电介质和 SOD 材料）相关的市场和技术趋势。在过去的二十年中，针对半导体产业特有的 ALD 和 CVD 前驱体发表了许多研究论文和专利。该报告还讨论了新前体的开发途径和路线图，以及当前的环境、健康和安全 (EHS) 以及将这些材料投入大批量生产 (HVM) 的监管障碍。为所有类型的前体提供预测，特别是先进的前端绝缘和绝缘，包括 higi-K、金属电极、互连金属化、牺牲层、低 k 电介质、硬掩模、心轴和蚀刻停止层。导电材料。这些製程领域与先进逻辑（sub-45nm、28nm至10/7nm节点、未来5nm和3nm节点）、先进DRAM和3DNAND易失性和非挥发性记忆体相关的高成长潜力正在引起关注。

ALD/High-K 市场最新资讯和分析：概述 - 特色新闻稿：

世界经济
- 连结半导体产业与全球经济
- 半导体销售额成长率
- 台湾月度销售趋势
- 2023年高度不确定性－半导体收入成长预计将放缓至负值
晶片销售趋势：按电子设备细分市场
- 手机
- PC 出货量
- 伺服器/IT市场
半导体製造业的成长与扩张
- 铸造厂扩建公告：概述
- 透过在世界各地扩大铸造厂来加速成长
- 资本支出趋势
- 技术路线图
- 代工投资评估
政策和贸易趋势及影响
半导体材料概述
- 晶片生产进度可能受到材料产能限制
- 减少物流问题
- 晶圆市场趋势预测（至2027年）
- 材料市场预测

第四章前驱体市场走势

市场趋势
- 市场趋势：推出晶圆数量
- 市场趋势：引入晶圆数量（逻辑）
- 市场趋势：引入晶圆数量（DRAM）
- 市场趋势：引入晶圆数量（NAND）
供给能力、需求和投资
- WF6 的需求驱动因素
- WF6的市场需求
- WF6市场需求：MO ALD IP应用
- WF6的市场需求
供给能力、需求和投资
- 供应能力、需求和投资：铪和锆
金属前驱物：区域趋势
- 区域趋势：金属前驱
- 市场趋势与驱动因素：按地区
CVD/ALD设备市场
- WFE 预测：所有类型
- WFE预测：堆迭、蚀刻/清洁、光刻、计量等。
技术驱动因素/材料变化与转变：依设备类型
- 过去10年整体趋势：从PVD/LPCVD到PECVD/ALD
- 高阶逻辑节点HVM的估计
- DRAM节点HVM估计
- 3D NAND 节点 HVM 估计
- 按设备细分市场划分的机会：概述
半导体製程和材料的趋势
- 按元件类型划分的蚀刻製程：原子层蚀刻
- 区域选择性沉积
- 定向自组装 (DSA) 和 EUV
- 直接自组装 (DSA) 和 EUV
- 2D TDM（过渡金属二硫化物）
- EUV 干抗蚀剂
- EUV抗蚀剂下层
- 其他用途：光学
EHS 和物流问题：锆和铪
- EHS 和物流问题：锆和铪
- EHS 与物流问题：钛
- EHS 与物流问题：钨
- EHS 与物流问题：钨
- EHS 与物流问题：钴
- EHS 与物流问题：Ruthenium
- 半导体製造产生的温室气体
- EUV 和能源
- 评估原子层沉积 (ALD) 製程的环境影响以及减少影响的途径
标准套件/阀门类型变更
市场评价

第五章市场统计与预测：按细分市场

前驱体市场表现及预测（5年）
- CVD/ALD 金属和高 K 前驱体收入（2021-2027 年）
- 供需预测：WF6（至 2023 年）
- 市场评价：金属和高k
併购 (M&A) 活动
- 併购活动 - MERCK & MECARO
新工厂
供应商工厂关闭 - 未报告
新加入者 - 干阻联盟
价格趋势
- 价格趋势：铪

第六章下层材料供应链

下游供应链：概述
- 下游供应链：颠覆与中国
后勤
下游供应链的新进入者 - 未报告
下游供应链工厂最新资讯（新）-无报告
下游供应链：TechCET 分析师评估

第七章供应商简介

ADEKA CORPORATION
AIR LIQUIDE (MAKER, PURIFIER, SUPPLIER)
AZMAX CO., LTD.
CITY CHEMICAL LLC
DNF CO., LTD.
其他20多家企业

简介目录图表

This report provides market and technical trend information on inorganic gases and liquid CVD/ALD precursors (metal, metal oxide, high K, dielectric and SOD materials). For the last 20 years, there have been many research papers and patents published regarding ALD and CVD precursors specifically for the semiconductor industry. This report includes detail on the development path and roadmaps for new precursors and any current EHS and regulatory hurdles for these materials to enter into high volume manufacturing (HVM). Forecasts are provided on precursors of all types, with a focus is on the leading-edge front end of the line insulating and conductive materials, including high K, metal electrode, interconnect metallization, sacrificial layers, low-k dielectrics, hard masks, mandrel, and etch stop layers. These process areas are of interest because of the high growth potential associated with leading-edge logic <45 nm, 28 nm to 10/7 nm nodes, and the future 5 & 3 nm nodes, as well as advanced DRAM and 3DNAND volatile and non-volatile memories.

This report comes with 3 Quarterly Updates featuring updated market information and forecasting from the report analyst.

1. Executive Summary

1.1. REGIONAL TRENDS-METAL PRECURSORS
1.2. REGIONAL TRENDS-TOTAL PRECURSOR MARKET
1.3. PRECURSOR MARKET-HISTORICAL AND 5-YEAR FORECAST
1.4. CVD/ALD METAL & HIGH-K PRECURSOR REVENUE 2021 TO 2027
1.5. ASSESSMENT-METAL & HIGH-K
1.6. SUPPLY-DEMAND FORECAST-WF6 (UNTIL 2023)
1.7. CVD AND ALD EQUIPMENT MARKET
1.8. ANALYST ASSESSMENT-HI K & METAL PRECURSORS
- 1.8.2. ANALYST ASSESSMENT

2. Scope, Purpose, and Methodology

2.1. SCOPE
2.2. PURPOSE
2.3. METHODOLOGY
2.4. OVERVIEW OF OTHER TECHCET CMR™ REPORTS

3. Semiconductor Industry Market Status & Outlook

3.1. WORLDWIDE ECONOMY
- 3.1.1. SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY
- 3.1.2. SEMICONDUCTOR SALES GROWTH
- 3.1.3. TAIWAN MONTHLY SALES TRENDS
- 3.1.4. UNCERTAINTY ABOUNDS ESPECIALLY FOR 2023 -SLOWER TO NEGATIVE SEMICONDUCTOR REVENUE GROWTH EXPECTED
3.2. CHIPS SALES BY ELECTRONIC GOODS SEGMENT
- 3.2.1. SMARTPHONES
- 3.2.2. PC UNIT SHIPMENTS
- 3.2.3. SERVERS / IT MARKET
3.3. SEMICONDUCTOR FABRICATION GROWTH & EXPANSION
- 3.3.1. FAB EXPANSION ANNOUNCEMENT SUMMARY
- 3.3.2. WW FAB EXPANSION DRIVING GROWTH
- 3.3.3. EQUIPMENT SPENDING TRENDS
- 3.3.4. TECHNOLOGY ROADMAPS
- 3.3.5. FAB INVESTMENT ASSESSMENT
3.4. POLICY & TRADE TRENDS AND IMPACT
3.5. SEMICONDUCTOR MATERIALS OVERVIEW
- 3.5.1. COULD MATERIALS CAPACITY LIMIT CHIP PRODUCTION SCHEDULES?
- 3.5.2. LOGISTICS ISSUES EASED DOWN
- 3.5.3. TECHCET WAFER STARTS FORECAST THROUGH 2027
- 3.5.4. TECHCET'S MATERIAL FORECAST

4. Precursor Market Trends

4.1. MARKET TRENDS
- 4.1.1. MARKET TRENDS-WAFER STARTS
- 4.1.2. MARKET TRENDS-WAFER STARTS LOGIC
- 4.1.3. MARKET TRENDS-WAFER STARTS DRAM
- 4.1.4. MARKET TRENDS-WAFER STARTS NAND
4.2. SUPPLY CAPACITY AND DEMAND, INVESTMENTS
- 4.2.1. WF6 DEMAND DRIVERS
- 4.2.2. WF6 MARKET DEMAND
- 4.2.4. WF6 MARKET DEMAND-MO ALD IP FILING
- 4.2.5. WF6 MARKET DEMAND
4.3. SUPPLY CAPACITY AND DEMAND, INVESTMENTS
- 4.3.1. SUPPLY CAPACITY AND DEMAND, INVESTMENTS: HAFNIUM
& ZIRCONIUM
4.4. REGIONAL TRENDS-METAL PRECURSORS
- 4.4.1. REGIONAL TRENDS-METAL PRECURSORS
- 4.4.2. REGIONAL TRENDS AND DRIVERS
4.5. CVD AND ALD EQUIPMENT MARKET
- 4.5.1. WFE FORECAST: ALL TYPES
- 4.5.2. WFE FORECAST: DEPOSITION, ETCH & CLEAN, LITHOGRAPHY, METROLOGY ETC.
4.6. TECHNICAL DRIVERS /MATERIAL CHANGES AND TRANSITIONS BY DEVICE TYPE
- 4.6.1. GENERAL TREND LAST DECADE GOING FROM PVD & LPCVD TO PECVD & ALD
- 4.6.2. ADVANCED LOGIC NODE HVM ESTIMATE
- 4.6.3. DRAM NODE HVM ESTIMATE
- 4.6.4. 3D NAND NODE HVM ESTIMATE
- 4.6.5. SUMMARY OF OPPORTUNITIES BY DEVICE SEGMENT
4.7. SEMICONDUCTOR PROCESS & MATERIALS TRENDS
- 4.7.1. ETCH PROCESS BY DEVICE TYPE-ATOMIC LAYER ETCHING ALE
- 4.7.2. AREA SELECTIVE DEPOSITION
- 4.7.3. DIRECTED SELF ASSEMBLY (DSA) AND EUV
- 4.7.4. DIRECT SELF ASSEMBLY (DSA) AND EUV
- 4.7.5. 2D TRANSITION METAL DICHALCOGENIDES (TMD)
- 4.7.6. DRY RESIST FOR EUV
- 4.7.7. UNDERLAYERS FOR EUV RESIST
- 4.7.8. OTHER APPLICATIONS-CHAMBER COATINGS BY ALD (Y2O3)
- 4.7.9. OTHER APPLICATIONS-OPTICS
4.8. EHS AND LOGISTIC ISSUES-ZIRCONIUM AND HAFNIUM
- 4.8.1. EHS AND LOGISTIC ISSUES-ZIRCONIUM AND HAFNIUM
- 4.8.2. EHS AND LOGISTIC ISSUES-TITANIUM
- 4.8.3. EHS AND LOGISTIC ISSUES-TUNGSTEN
- 4.8.4. EHS AND LOGISTIC ISSUES-TUNGSTEN
- 4.8.5. EHS AND LOGISTIC ISSUES-COBALT
- 4.8.6. EHS AND LOGISTIC ISSUES-RUTHENIUM
- 4.8.7. GREEN HOUSE GASES FROM SEMICONDUCTOR PRODUCTION
- 4.8.8. EUV AND ENERGY
- 4.8.9. ASSESSING THE ENVIRONMENTAL IMPACT OF ATOMIC LAYER DEPOSITION (ALD) PROCESSES AND PATHWAYS TO LOWER IT
4.9. CHANGES IN STANDARD PACKAGING/VALVE TYPES
4.10. MARKET ASSESSMENT

5. Segment Market Statistics & Forecasts

5.1. PRECURSOR MARKET-HISTORICAL AND 5-YEAR FORECAST
- 5.1.1. CVD/ALD METAL & HIGH-K PRECURSOR REVENUE 2021 TO 2027
- 5.1.2. SUPPLY-DEMAND FORECAST-WF6 (UNTIL 2023)
- 5.1.3. ASSESSMENT-METAL & HIGH-K
5.2. M&A ACTIVITIES
- 5.2.1. M&A ACTIVITIES-MERCK & MECARO
5.3. NEW PLANTS
- 5.3.1. NEW PLANTS
- 5.3.2. NEW PLANTS
- 5.3.3. NEW PLANTS
- 5.3.4. NEW PLANTS
5.4. SUPPLIER PLANT CLOSURES-NONE REPORTED
5.5. NEW ENTRANTS-DRY RESIST CONSORTIUM
5.6. PRICING TRENDS
- 5.6.1. PRICING TRENDS-HAFNIUM

6. Sub Tier Material Supply Chain

6.1. SUB-TIER SUPPLY-CHAIN: INTRODUCTION
- 6.1.1. SUB-TIER SUPPLY-CHAIN: DISRUPTIONS & CHINA
6.2. LOGISTICS
6.3. SUB-TIER SUPPLY-CHAIN "NEW" ENTRANTS-NONE REPORTED
6.4. SUB-TIER SUPPLY-CHAIN PLANTS UPDATES-NEW-NONE REPORTED
6.5. SUB-TIER SUPPLY-CHAIN TECHCET ANALYST ASSESSMENT

7. Supplier profiles

ADEKA CORPORATION
AIR LIQUIDE (MAKER, PURIFIER, SUPPLIER)
AZMAX CO., LTD.
CITY CHEMICAL LLC
DNF CO., LTD.
...and 20+ more

简介目录图表

LIST OF FIGURES

FIGURE 1: METAL PRECURSORS MARKET SHARES 2022
FIGURE 2: TOTAL PRECURSOR MARKETS REGIONAL 2022
FIGURE 3: TOTAL PRECURSOR MARKET, M USD
FIGURE 4: CVD/ALD METAL & HIGH-K PRECURSORS 2021 TO 2027
FIGURE 5: WF6 SUPPLY VS. DEMAND THROUGH 2027
FIGURE 6: CVD AND ALD TOTAL EQUIPMENT MARKET 2022 USD 17-18 BILLION
FIGURE 7: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY CHAIN (2022)
FIGURE 8: WORLDWIDE SEMICONDUCTOR SALES
FIGURE 9: TECHCET'S TAIWAN SEMICONDUCTOR INDUSTRY I NDEX (TTSI)*
FIGURE 10: 2023 SEMICONDUCTOR INDUSTRY REVENUE GROWTH FORECASTS
FIGURE 11: 2022 SEMICONDUCTOR CHIP APPLICATIONS
FIGURE 12: MOBILE PHONE SHIPMENTS WW ESTIMATES
FIGURE 13: WORLDWIDE PC AND TABLET FORECAST
FIGURE 14: ELECTRIFICATION TREND BY WORLD REGION
FIGURE 15: SEMICONDUCTOR AUTOMOTIVE PRODUCTION
FIGURE 16: TSMC PHOENIX INVESTMENT ESTIMATED WILL BE US $40 B
FIGURE 17: CHIP EXPANSIONS 2022-2027 US$366 B
FIGURE 18: SEMICONDUCTOR CHIP MANUFACTURING REGIONS OF THE WORLD
FIGURE 19: GLOBAL TOTAL EQUIPMENT SPENDING BY SEGMENT (US$ B)
FIGURE 20: OVERVIEW OF ADVANCED LOGIC DEVICE TECHNOLOGY ROADMAP
FIGURE 21: INTEL OHIO PLANT SITE FEB. 2023 AND ARTIST RENDERING (ON BOTTOM)
FIGURE 22: EUROPE CHIP EXPANSION UPSIDE
FIGURE 23: PORT OF LA
FIGURE 24: TECHCET WAFER START FORECAST BY NODE SEGMENTS**
FIGURE 25: GLOBAL SEMICONDUCTOR MATERIALS OUTLOOK
FIGURE 26: FORECASTS--WAFER STARTS 2021 TO 2027
FIGURE 27: FORECASTS--WAFER STARTS LOGIC 300 MM
FIGURE 28: FORECASTS--WAFER STARTS DRAM 300 MM
FIGURE 29: FORECASTS--WAFER STARTS NAND 300 MM
FIGURE 30: 3DNAND MARKET SHARE 2022
FIGURE 31: 3DNAND STRUCTURE
FIGURE 32: MO PRECURSORS
FIGURE 33: PATENT FAMILIES FILED FOR MOLYBDENUM ALD IN THE MEMORY SPACE
FIGURE 34: WAFER START FORECAST SHOWING TWO TIMING SCENARIOS WHERE MO COULD BE INTRODUCED
FIGURE 35: ZIRCONIUM METAL DEMAND 2021 1.6 MILLION TONNES
FIGURE 36: HAFNIUM METAL DEMAND 2021 78 TONNES
FIGURE 37: METAL PRECURSORS MARKET SHARES 2022
FIGURE 38: CVD AND ALD TOTAL EQUIPMENT MARKET 2022 USD 17-18 BILLION
FIGURE 39: SEMI 2022 SEMICONDUCTOR EQUIPMENT FORECAST
FIGURE 40: 2022 TECHINSIGHTS WFE SPENDING (TOP) AND 2022 GARTNER WFE SPENDING PER NODE (BOTTOM)
FIGURE 41: 3D DEVICE ARCHITECTURES
FIGURE 42: LOGIC TECHNOLOGY NODE ROADMAP FOR LEADING IDMS
FIGURE 43: SAMSUNG START 3 NM PILOT RAMP USING GAA-FET TECHNOLOGY JUNE 2022
FIGURE 44: IMEC 2022 LOGIC ROADMAP
FIGURE 45: SCALING AND LITHOGRAPHY TRENDS--A HIGH COST IN CAPITAL EXPENDITURE, ENERGY AND EMISSIONS
FIGURE 46: APPLIED MATERIALS CENTURA PATTERN SHAPING CLUSTER
FIGURE 47: DRAM TECHNOLOGY ROADMAP FOR LEADING IDMS
FIGURE 48: IP FILING IN THE FIELD OF 3DRAM IS ACCELERATING
FIGURE 49: NAND TECHNOLOGY ROADMAP FOR LEADING IDMS
FIGURE 50: PATHWAYS FOR CONTINUED 3D NAND SCALING
FIGURE 51: 3DNAND STACK TRENDS FROM <100L TO 4 STACKS
FIGURE 52: MEMORY STACK CHALLENGES FOR V-NAND
FIGURE 53A: FINFET TO GAA TRANSISTOR DIAGRAMS SHOWING SELECTIVE ETCHING IS NEEDED TO ADDRESS DEVICE COMPLEXITY
FIGURE 53B: ALE PROCESS CYCLE
FIGURE 54: PERIOD TABLE INDICATING CANDIDATES FOR ALE (ISOTROPIC ETCHING)
FIGURE 55: APPLICATION OF ALE (ISOTROPIC ETCH)
FIGURE 56: ALD AND ALE COMBO PROCESS
FIGURE 57: PLASMA AND THERMAL ALE PROCESSES
FIGURE 58: LAM ALE PROCESS
FIGURE 59: ALD / ALE PROCESS ROADMAP
FIGURE 60: ALE PATENT ACTIVITY BY COMPANY THROUGH 2022
FIGURE 61: AREA SELECTIVE SIN DEPOSITION BY ALD (AVS ASD2022)
FIGURE 62: DSA AND EUS PROCESSES
FIGURE 63: RESIST RECTIFICATION WITH DSA
FIGURE 64: TEM AND ARTIST RENDERING OF MONOLAYER CHANNEL FORMATION
FIGURE 65: EUV LITHOGRAPHY ENABLING GATE STRUCTURES AND PITCH SCALING
FIGURE 66: DRY RESIST FOR EUV SEM IMAGE
FIGURE 67: SPIN ON CARBON (SOC) DIELECTRIC FOR EUV METAL OXIDE RESISTS PATTERNS AFTER LITHO
FIGURE 68: UNDERLAYER (DIELECTRIC) HARDMASKS TRENDS FOR NIGH NA EUV
FIGURE 69: SPIN ON PRIMER (SOC) VS. HMDS PRIMER
FIGURE 70: Y2O3 ALD VS. SPRAY COATINGS
FIGURE 71: GREENHOUSE GAS CONTRIBUTIONS OF CHIP FAB MATERIALS AND EQUIPMENT
FIGURE 72: ENVIRONMENTAL IMPACT (GWP) OF VARIOUS PROCESSES AND GASES
FIGURE 73: CO2EQ OUTPUT FROM ETCH GASES (SOURCE: IMEC)
FIGURE 74: TOTAL EMISSIONS AND ENERGY USE PROJECTION PER LOGIC NODE
FIGURE 75: ENVIRONMENTAL IMPACT OF ALD
FIGURE 76: SEGMENTATION OF THE AMPOULE FLEET 2020
FIGURE 77: TOTAL PRECURSOR MARKET, M USD
FIGURE 78: CVD/ALD METAL & HIGH-K PRECURSORS 2021 TO 2027
FIGURE 79: WF6 SUPPLY VS. DEMAND THROUGH 2027
FIGURE 80: WHAT IS EUV DRY RESIST?
FIGURE 81: HAFNIUM METAL SPOT PRICING
FIGURE 82: TYPICAL NON-HALIDE LIGANDS USED FOR ALD PRECURSORS
FIGURE 83: EXAMPLES OF PRECURSORS SUPPLIED BY SHIP
FIGURE 84: OCEAN CONTAINER PRICE INDEX-JULY '20 TO MARCH '23

LIST OF TABLES

TABLE 1: DIELECTRIC PRECURSOR REVENUES BY REGION (US$ M)
TABLE 2: TOTAL PRECURSOR MARKETS BY REGION (US$ M)
TABLE 3: 2017 TO 2027 5-YEAR CAGRS
TABLE 4: GLOBAL GDP AND SEMICONDUCTOR REVENUES*
TABLE 5: IMF ECONOMIC OUTLOOK*
TABLE 6: DATA CENTER SYSTEMS AND COMMUNICATION SERVICES MARKET SPENDING 2022
TABLE 7: PRECURSOR USAGE OF LEADING IDMS
TABLE 8: DIELECTRIC PRECURSOR MARKET SIZE BY REGION
TABLE 9: TOTAL PRECURSOR MARKET SIZE BY REGION
TABLE 10: REGIONAL PRECURSOR MARKETS
TABLE 12: OVERVIEW OF DEPOSITION PROCESSES BY DEVICE TYPE AND MATERIAL FOR LOGIC DEVICES
TABLE 13: OVERVIEW OF DEPOSITION PROCESSES BY DEVICE TYPE AND MATERIAL FOR DRAM
TABLE 14: OVERVIEW OF DEPOSITION PROCESSES BY DEVICE TYPE AND MATERIAL FOR 3DNAND
TABLE 15: GAS TRENDS AND OPPORTUNITIES BY DEVICE TYPE
TABLE 16: OVERVIEW OF DEPOSITION PROCESSES BY DEVICE TYPE AND MATERIAL
TABLE 17: PRECURSOR 5-YEAR CAGR COMPARISON
TABLE 18: ZIRCONIUM MINING PRODUCTION AND RESERVES
TABLE 19: WORLDWIDE TUNGSTEN PRODUCTION AND RESERVES
TABLE 20: ZIRCONIUM MINING