溅镀靶材全球市场分析（2023-2024）

Sputter Targets Market Report (a Critical Materials Report) 2023-2024

出版日期: 2023年11月15日 | 出版商:

TECHCET | 英文 228 Pages | 商品交期: 最快1-2个工作天内

价格

简介目录

本报告分析了半导体装置製造中使用的主要金属溅镀靶材和供应链。溅镀靶材在半导体製造中至关重要，因为它们能够沉积各种材料以形成半导体装置、MEMS 和感测器的互连、阻挡层和其他薄膜。

有关溅镀靶材市场最新资讯和报告亮点的特色新闻稿：

世界经济
- 连结半导体产业与全球经济
- 半导体销售额成长率
- 台湾月度销售趋势
晶片销售：以电子领域分类
- 手机
- PC 出货量
- 伺服器/IT市场
半导体製造业的成长与扩张
- 铸造厂扩建公告：概述
- 透过在世界各地扩大铸造厂来加速成长
- 资本支出趋势
- 技术路线图
- 代工投资评估
政策和贸易趋势及影响
半导体材料概述
- 晶片生产进度可能受到材料产能限制
- 缓解物流问题
- TECHCET晶圆投入量预测（至2027年）
- TECHCET材料预测

第四章溅镀靶材市场现况及预测

市场状况：概论（2023）
市场统计与预测
预测方法
- 目标市场预测
- 目标市场规模：按类型划分（2023 年）
- 贵金属目标市场估算
- 溅镀靶材市场：整体预测
- 铜市场预测
- 钽市场预测
- 铝市场预测
- 钛市场预测
- 功率元件（宽频隙元件）中使用的 NiV、Al、Ag、Au、Ti 靶材
- 目标金属预测：依功率元件类型
- 目标金属预测：SiC/Ga功率元件
供应商市场占有率和活动
- 目标供应商最新消息
- 目标公司最新消息
- 钌靶材供应商
对区域趋势/驱动因素的评论
- 区域趋势和挑战
- 溅镀靶材生产领域：区域趋势
- 按地区划分的市场规模和趋势
金属目标成本结构
EHS/永续性、监管和物流问题
併购活动和伙伴关係
工厂关闭 - 无
新进入者 - 无
风险和取消
TECHCET分析师的目标供应商和市场评估

第五章下游供应链

铜（Cu）金属：原料
- 铜金属：原料供应链
- 铜金属：市场需求
- 车辆铜需求量
- LME铜金属价格
钽（TA）：原料
- TA 金属：矿山供应趋势
- TA 金属：全球需求
- TA Metals：封闭市场经济趋势
铝（Al）金属：铝土矿和氧化铝开采
- 铝金属：精炼
- 铝金属：全球需求
- LME金属铝价格
钛(Ti)金属: 钛精矿
- 钛精矿价格
- 钛金属：拉丝材需求
- 金属钛：海绵产量及产能
- 金属钛：海绵产量及产能
- 钛金属市场趋势：俄罗斯/乌克兰衝突
- 金属钛：半导体用海绵钛
- 金属钛：中国海绵钛生产活动
钨（W）金属开采
- W金属-世界需求
- W供应链与中国
- 钨金属：高纯度钨粉供应商
- W金属价格
钴（Co）金属开采
- 钴金属需求
- 钴金属价格
钼（Mo）金属开采
- Mo的供应链概括
- 钼的用途
贵金属：矿金（Au）
- 贵金属：银（Ag）开采
- 贵金属消耗：依用途
- 贵金属供需趋势
- 贵金属价格
- 贵金属价格
- 高纯度锰（Mn）
下游供应链：中断
供应链下游：併购活动
下游供应链：EHS 与物流问题
下游供应链：TECHCET 分析师评估
- 溅镀靶材市场：虚拟市场评估

第六章技术推动因素/实质变化/转变

300mm 目标细分市场驱动器/设备
- 200mm 目标区隔市场驱动因素
- 逻辑：通用製程流程逻辑 PVD 10 NM 或更少
- 通用製程流程：进阶 DRAM
新兴技术/市场趋势：大学和供应商研发（未来 5-7 年内）
- 电源轨
- 特殊（STT MRAM、FE RAM等）记忆体PVD材料
- 压电材料：PZT

第七章供应商简介

FURUYA METAL CO.
GO ELEMENT
GRIKIN
HONEYWELL
HUIZHOU TOP METAL MATERIAL (TOPM)
超过 15 家其他公司

第8章附录

简介目录

This report covers the sputtering targets and supply-chain for key metals used in semiconductor device fabrication. The report contains data and analysis from TECHCET's data base and Sr. Analyst experience, as well as that developed from primary and secondary market research. Sputtering targets are critical in semiconductor manufacturing as sputtering allows the deposition of different materials to form interconnects, barriers layers, and other films for semiconductor devices, MEMS, and sensors.

This report comes with 3 Quarterly Updates featuring updated market information and forecasting from the report analyst.

1. EXECUTIVE SUMMARY

1.1. TARGET BUSINESS-MARKET OVERVIEW
1.2. TARGET MARKET TRENDS IMPACTING 2023 OUTLOOK
1.3. TECHNOLOGY TRENDS
1.4. TARGET MARKET FORECAST
1.5. COMPETITIVE LANDSCAPE
1.6. EHS ISSUES/CONCERNS
1.7. TARGET MARKET ASSESSMENT

2. SCOPE, PURPOSE AND METHODOLOGY

2.1. SCOPE
2.2. PURPOSE
2.3. METHODOLOGY
2.4. OVERVIEW OF OTHER TECHCET CMR™ REPORTS

3. SEMICONDUCTOR INDUSTRY MARKET STATUS & OUTLOOK

3.1. WORLDWIDE ECONOMY AND OUTLOOK
- 3.1.1. SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY
- 3.1.2. TAIWAN OUTSOURCE MANUFACTURER MONTHLY SALES TRENDS
- 3.1.3. SEMICONDUCTOR SALES GROWTH
3.2. CHIPS SALES BY ELECTRONIC GOODS SEGMENT
- 3.2.1. SMARTPHONES
- 3.2.2. PC UNIT SHIPMENTS
- 3.2.3. SERVERS / IT MARKET
3.3. SEMICONDUCTOR FABRICATION GROWTH & EXPANSION
- 3.3.1. FAB EXPANSION ANNOUNCEMENT SUMMARY
- 3.3.2. WW FAB EXPANSION DRIVING GROWTH
- 3.3.3. EQUIPMENT SPENDING TRENDS
- 3.3.4. TECHNOLOGY ROADMAPS
- 3.3.5. FAB INVESTMENT ASSESSMENT
3.4. POLICY & TRADE TRENDS AND IMPACT
3.5. SEMICONDUCTOR MATERIALS OVERVIEW
- 3.5.1. COULD MATERIALS CAPACITY LIMIT CHIP PRODUCTION SCHEDULES?
- 3.5.2. LOGISTICS ISSUES EASED DOWN
- 3.5.3. TECHCET WAFER STARTS FORECAST THROUGH 2027
- 3.5.4. TECHCET'S MATERIAL FORECAST

4. SPUTTERING TARGET MARKET LANDSCAPE AND FORECAST

4.1. CY2023 MARKET LANDSCAPE HIGHLIGHTS
4.2. MARKET STATISTICS & FORECASTS
4.3. FORECAST METHODOLOGY
- 4.3.1. TARGET MARKET FORECAST
- 4.3.2. 2023 TARGET MARKET SIZE BY TYPE
- 4.3.3. ESTIMATE FOR PRECIOUS METAL TARGET MARKET
- 4.3.4. TOTAL SPUTTERING TARGET MARKET FORECAST
- 4.3.5. COPPER MARKET FORECAST
- 4.3.6. TANTALUM MARKET FORECAST
- 4.3.7. ALUMINUM MARKET FORECAST
- 4.3.8. TITANIUM MARKET FORECAST
- 4.3.9. NIV, AL, AG, AU, TI TARGETS USED IN POWER DEVICES-WIDE BAND GAP DEVICES
- 4.3.10. TARGET METAL FORECAST BY POWER DEVICE TYPE
- 4.3.11. TARGET METAL FORECAST FOR SIC AND GAN POWER DEVICES
4.4. SUPPLIER MARKET SHARE AND ACTIVITY
- 4.4.1. TARGET SUPPLIER UPDATES-1 OF 3
- 4.4.2. TARGET COMPANY UPDATES-2 OF 3
- 4.4.3. RUTHENIUM TARGET SUPPLIERS
4.5. COMMENT ON REGIONAL TRENDS/DRIVERS
- 4.5.1. REGIONAL TRENDS AND ISSUES
- 4.5.2. SPUTTERING TARGET PRODUCTION LOCATIONS-REGIONAL TRENDS
- 4.5.3. REGIONAL MARKET SIZE AND TRENDS
4.6. METAL TARGET COST STRUCTURE
4.7. EHS/SUSTAINABILITY, REGULATIONS, AND LOGISTIC ISSUES
4.8. M&A ACTIVITY AND PARTNERSHIPS
4.9. PLANT CLOSURES-NONE
4.10. NEW ENTRANTS-NONE
4.11. RISKS & DISCONTINUATIONS
4.12. TECHCET ANALYST ASSESSMENT OF TARGET SUPPLIERS AND MARKET

5. SUB-TIER SUPPLY-CHAINS

5.1. COPPER (CU) METAL-RAW MATERIAL
- 5.1.1. CU METAL- RAW MATERIAL SUPPLY CHAIN
- 5.1.2. CU METAL-MARKET DEMAND
- 5.1.3. CU DEMAND IN VEHICLES
- 5.1.4. LME CU METAL PRICING
5.2. TANTALUM (TA)-RAW MATERIAL
- 5.2.1. TA METAL-MINING SUPPLY CHAIN TRENDS
- 5.2.2. TA METAL-GLOBAL DEMAND
- 5.2.3. TA METAL-CLOSED MARKET ECONOMICS
5.3. ALUMINUM (AL) METAL-BAUXITE AND ALUMINA MINING
- 5.3.1. AL METAL-SMELTING
- 5.3.2. AL METAL-GLOBAL DEMAND
- 5.3.3. LME AL METAL PRICING
5.4. TITANIUM (TI) METAL- TI MINERAL CONCENTRATE
- 5.4.1. TI MINERAL CONCENTRATE PRICING
- 5.4.2. TI METAL-MILL PRODUCT DEMAND
- 5.4.3. TI METAL-SPONGE PRODUCTION AND CAPACITY
- 5.4.4. TI METAL-SPONGE PRODUCTION AND CAPACITY
- 5.4.5. TI METAL MARKET TRENDS-RUSSIA/UKRAINE CONFLICT
- 5.4.6. TI METAL-TI SPONGE FOR SEMICONDUCTOR
- 5.4.7. TI METAL- TI SPONGE PRODUCTION ACTIVITY IN CHINA
5.5. TUNGSTEN (W) METAL-MINING
- 5.5.1. W METAL-GLOBAL DEMAND
- 5.5.2. W SUPPLY CHAIN AND CHINA
- 5.5.3. W METAL-HIGH PURITY W POWDER SUPPLIERS
- 5.5.4. W METAL PRICING
5.6. COBALT (CO) METAL-MINING
- 5.6.1. CO METAL-DEMAND
- 5.6.2. CO METAL PRICING
5.7. MOLYBDENUM (MO) METAL-MINING
- 5.7.1. GENERALIZATION OF MO SUPPLY CHAIN
- 5.7.2. MO APPLICATIONS
5.8. PRECIOUS METALS-GOLD (AU) MINING PRODUCTION
- 5.8.1. PRECIOUS METALS-SILVER (AG) MINING
- 5.8.2. PRECIOUS METALS CONSUMPTION BY APPLICATIONS
- 5.8.3. PRECIOUS METAL SUPPLY/DEMAND TRENDS
- 5.8.4. PRECIOUS METAL PRICING
- 5.8.5. PRECIOUS METAL PRICING
- 5.8.6. HIGH-PURITY MANGANESE (MN)
5.9. SUB-TIER SUPPLY-CHAIN: DISRUPTIONS
5.10. SUB-TIER SUPPLY-CHAIN M&A ACTIVITY
5.11. SUB-TIER SUPPLY-CHAIN EHS AND LOGISTICS ISSUES
5.12. SUB-TIER SUPPLY-CHAIN TECHCET ANALYST ASSESSMENT
- 5.12.1. SPUTTER TARGETS SUB-TIER MARKET ASSESSMENT

6. TECHNICAL DRIVERS/MATERIAL CHANGES AND TRANSITIONS

6.1. 300 MM TARGET MARKET SEGMENT DRIVERS DEVICES
- 6.1.1. 200 MM TARGET MARKET SEGMENT DRIVERS
- 6.1.2. LOGIC-GENERAL PROCESS FLOW LOGIC PVD 10 NM & BELOW
- 6.1.3. GENERAL PROCESS FLOW ADVANCED DRAM
6.2. NEW DEVELOPMENTS IN THE TECHNOLOGY OR MARKETS: UNIVERSITY AND SUPPLIER R&D IN 5-7 YEARS
- 6.2.1. POWER RAIL
- 6.2.2. SPECIALTY (STT MRAM, FE RAM, OTHER) MEMORY PVD MATERIALS
- 6.2.3. PIEZOELECTRIC MATERIALS-PZT

7. SUPPLIER PROFILES

FURUYA METAL CO.
GO ELEMENT
GRIKIN
HONEYWELL
HUIZHOU TOP METAL MATERIAL (TOPM)
...and 15+ more

8. APPENDICES

TABLE OF FIGURES

FIGURE 1: TOTAL SPUTTERING TARGET MARKET REVENUES
FIGURE 2: SEMICONDUCTOR TARGET MARKET FORECAST
FIGURE 3: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY CHAIN (2022)
FIGURE 4: 3-MONTH AVERAGE MONTHLY SALES FROM TAIWAN (TSMC, UMC, VIS, ASE GLOBAL, CHIPMOS, KYEC)
FIGURE 5: WORLDWIDE SEMICONDUCTOR SALES
FIGURE 6: 2022 SEMICONDUCTOR CHIP APPLICATIONS
FIGURE 7: MOBILE PHONE SHIPMENTS WW ESTIMATES
FIGURE 8: WORLDWIDE PC AND TABLET FORECAST
FIGURE 9: ELECTRIFICATION TREND BY WORLD REGION
FIGURE 10: SEMICONDUCTOR AUTOMOTIVE PRODUCTION
FIGURE 11: TSMC PHOENIX INVESTMENT ESTIMATED WILL BE US $40B
FIGURE 12: CHIP EXPANSIONS 2022-2027 US $366B
FIGURE 13: SEMICONDUCTOR CHIP MANUFACTURING REGIONS OF THE WORLD
FIGURE 14: GLOBAL TOTAL EQUIPMENT SPENDING BY SEGMENT (US$ B)
FIGURE 15: OVERVIEW OF ADVANCED LOGIC DEVICE TECHNOLOGY ROADMAP
FIGURE 16: INTEL OHIO PLANT SITE FEB. 2023 AND ARTIST RENDERING (ON BOTTOM)
FIGURE 17: EUROPE CHIP EXPANSION UPSIDE
FIGURE 18: PORT OF LA
FIGURE 19: TECHCET WAFER START FORECAST BY NODE
FIGURE 20: GLOBAL SEMICONDUCTOR MATERIALS OUTLOOK
FIGURE 21: SPUTTERING TARGET MARKET FORECAST
FIGURE 22: ESTIMATED 2023 SPUTTERING TARGET MARKET SIZE BY MATERIAL SEGMENT (IN US$ MILLIONS)
FIGURE 23: PRECIOUS METAL TARGET FORECAST (AFTER PRECIOUS METAL VALUE PASS THROUGH)
FIGURE 24: TOTAL METAL TARGET FORECAST (AFTER PRECIOUS METAL VALUE PASS THROUGH
FIGURE 25: SPUTTERING TARGET MARKET FORECAST
FIGURE 26: ESTIMATE OF 2022 CU TARGET SALE BY TYPE
FIGURE 27: ESTIMATE CU AND TA TARGETS SALES BY LOGIC NODE
FIGURE 28: TA SPUTTERING TARGET MARKET FORECAST
FIGURE 29: AL SPUTTERING TARGET MARKET FORECAST
FIGURE 30: TI SPUTTERING TARGET MARKET FORECAST
FIGURE 31: 2022 POWER DEVICE TARGET MARKET SIZE
FIGURE 32: 2027 FORECASTED POWER DEVICE MARKET SIZE
FIGURE 33: 2022 TARGET MARKET SIZE FOR SIC AND GAN POWER DEVICES
FIGURE 34: 2027 FORECASTED TARGET MARKET SIZE FOR SIC AND GAN POWER DEVICES
FIGURE 35: EST. 2022 SUPPLIER MARKET SHARE(EXCLUDING PRECIOUS METALS)
FIGURE 36: 2022 REGIONAL SHARE (AS A % OF TOTAL TARGET DEMAND BY USD)
FIGURE 37: 2021 EST. GLOBAL CU MINE PRODUCTION 21 MILLION MT
FIGURE 38: 2022 EST. GLOBAL REFINED CU CONSUMPTION 25 MILLION MT
FIGURE 39: ESTIMATE COPPER CONSUMPTION BY VEHICLE TYPE (KG PER VEHICLE)
FIGURE 40: LME CU PRICE CHART
FIGURE 41: 2022 EST. TANTALUM MINE PRODUCTION 2000 MT
FIGURE 42: 2021 TANTALUM APPLICATION (~2,200 T)
FIGURE 43: EST. WORLD BAUXITE MINING PRODUCTION 2022 380 MILLION MT
FIGURE 44: EST. WORLD ALUMINUM SMELTING PRODUCTION 2022 69 MILLION MT
FIGURE 45: EST. 2022 GLOBAL AL DEMAND 96 MILLION MT
FIGURE 46: LME AL PRICE CHART
FIGURE 47: EST. GLOBAL TI CONCENTRATE MINING PRODUCTION -2022 9,500 MILLION MT
FIGURE 48: TI MINERAL CONCENTRATE PRICING
FIGURE 49: EST. GLOBAL 2020 TI MILL PRODUCT OUTPUT, ~175,000 MT
FIGURE 50: EST. GLOBAL TI SPONGE PRODUCTION-2022 260,000 THOUSAND MT
FIGURE 51: EST. GLOBAL TI SPONGE CAPACITY-2022 350,000 THOUSAND MT
FIGURE 52: EST. 2022 W MINE PRODUCTION 84,000 T
FIGURE 53: W PRICE CHART
FIGURE 54: EST. 2022 CO MINE PRODUCTION 190,000 MT
FIGURE 55: EST. 2020 GLOBAL CO DEMAND 175,000 MT
FIGURE 56: LME CO METAL PRICE CHART
FIGURE 57: EST. 2021 MOLYBDENUM MINING PRODUCTION, 300,000 METRIC TONS
FIGURE 58: GENERALIZATION OF MO SUPPLY CHAIN
FIGURE 59: EST 2020 MOLYBDENUM USE BY APPLICATION
FIGURE 60: 2022 AU MINING PRODUCTION 3,100 MT
FIGURE 61: 2022 AG MINING PRODUCTION ~26,000 MT
FIGURE 62: GOLD METAL PRICE CHARTS
FIGURE 63: SILVER METAL PRICE CHARTS
FIGURE 64: PALLADIUM METAL PRICE CHARTS
FIGURE 65: PLATINUM METAL PRICE CHARTS
FIGURE 66: 3DNAND
FIGURE 67: BURIED POWER RAIL STRUCTURE
FIGURE 68: MRAM DEVICE STRUCTURE
FIGURE 69: CHALCOGENIDE MEMORY ROADMAP (SK HYNIX)

TABLES

TABLE 1: CHINA'S INTERESTS IN MINING AND REFINING THAT RELATE TO SEMICONDUCTOR SPUTTER TARGET METALS
TABLE 2: GLOBAL GDP AND SEMICONDUCTOR REVENUES*
TABLE 3: IMF ECONOMIC OUTLOOK*
TABLE 4: DATA CENTER SYSTEMS AND COMMUNICATION SERVICES MARKET SPENDING 2022
TABLE 5: WIDE BAND GAP (WBG) SEGMENT REVENUES AND CAGRS
TABLE 6: ESTIMATED NUMBER OF TARGETS BY POWER DEVICE TYPE 2022 (# OF 200 MM TARGETS, WITH SIC EXPRESSED AS 150MM)
TABLE 7: RUTHENIUM TARGET SUPPLIERS
TABLE 8: SPUTTERING TARGET SUPPLIER MANUFACTURING LOCATIONS
TABLE 9: REGIONAL SPUTTERING MARKETS
TABLE 10: ESTIMATED TARGET COST STRUCTURE (FOR REFERENCE ONLY)
TABLE 11: PRECIOUS METAL CONSUMPTION BY APPLICATION
TABLE 12: LOGIC PVD APPLICATIONS
TABLE 13: 3DNAND PVD APPLICATIONS
TABLE 14: DRAM PVD APPLICATIONS
TABLE 15: PHASE CHANGE MATERIAL TARGET SUPPLIERS
TABLE 16: MRAM TARGET SUPPLIERS