CMP配件市场：研磨垫修整器、过滤器、环、刷子（2024-2025）

CMP製程在半导体製造中非常重要，因为製程整合需要生产薄的、均匀的平面层，以便在半导体晶圆上建构装置结构。随着新装置技术的出现，CMP製程步骤的数量不断增加。新装置技术的特点是更多的层数、新材料、更严格的製程控制要求以及先进封装的新技术。这些製造挑战需要对CMP製程进行新的、持续的最佳化。

本报告调查了CMP配件市场，并讨论了研磨垫修整器、固定环、研磨剂过滤器和PVA刷的市场驱动因素、应用市场占有率以及供应商的预测。

资讯图表

目录

第1章 执行摘要

第2章 范围与研究方法

第3章 半导体产业市场现况与展望

• 全球经济与整个产业的展望
• 以电子产品细分市场划分的晶片销售
• 半导体製造业的成长与扩张
• 政策和贸易趋势及影响
• 半导体材料概述

第4章 CMP配件市场趋势

• CMP配件市场趋势
• 科技驱动因素、关键变革与转型
• 区域趋势

第5章 CMP研磨垫修整器统计与预测

• CMP研磨垫修整器5年获利预测
• CMP研磨垫修整器5年预测（以单位数量）
• 研磨垫修整器市场占有率
• CMP研磨垫修整器併购活动 - 公告和合作伙伴关係
• CMP研磨垫修整器新进入或工厂关闭
• CMP研磨垫修整器价格趋势
• CMP研磨垫修整器市场评估

第6章 CMP POU研磨剂过滤器市场统计与预测

• CMP POU研磨剂过滤器 5年收入预测
• CMP POU研磨剂过滤器市场占有率
• CMP POU研磨剂过滤器併购活动公告及合作伙伴关係
• 分析师评估

第7章 CMP PVA刷供应商市场统计与预测

• CMP PVA刷5年营收预测
• CMP PVA刷5年预测（依数量）
• PVA刷市场整体趋势及市场占有率
• CMP PVA刷价格走势
• 分析师对 CMP PVA刷市场的评级

第8章 CMP夹持环供应商市场统计与预测

• CMP晶圆抛光头固定环5年获利预测
• CMP夹持环5年预测（依单位数量）
• 夹持环市场占有率
• 分析师对 CMP 夹持环市场的评级

第9章 供应商简介

• 3M
• Abrasive Technology
• Ehwa Diamond
• Entegris
• Kinik
• 超过20家其他公司

第10章 附录

This report looks at the market drivers for pad conditioners, retaining rings, slurry filters, and PVA brushes and forecasts by application market shares suppliers. CMP processes are critical to semiconductor manufacturing as process integration requires the fabrication of thin and uniformly flat layers to build up device structures across the semiconductor wafers. The number of CMP process steps continue to increase with each generation of new device technology. New device technology is characterized by more layers new materials tighter process control requirements and new techniques for advanced packaging.These manufacturing challenges require new and continued optimization for CMP processes.

INFOGRAPHICS

TABLE OF CONTENTS

1 EXECUTIVE SUMMARY

• 1.1 CMP ANCILLARIES MARKET OVERVIEW
• 1.2 CMP ANCILLARIES REVENUE TRENDS
• 1.3 MARKET TRENDS IMPACTING CMP ANCILLARIES OUTLOOK
• 1.4 YEAR 2024 IN REVIEW AND FIVE-YEAR FORECAST
  • 1.4.1 CMP PAD CONDITIONERS 5-YEAR REVENUE FORECAST
  • 1.4.2 CMP POU SLURRY FILTER 5-YEAR REVENUE FORECAST
  • 1.4.3 CMP PVA BRUSH 5-YEAR REVENUE FORECAST
  • 1.4.4 CMP RETAINING RING FOR WAFER POLISHING HEADS 5-YEAR REVENUE FORECAST
• 1.5 TECHNOLOGY TRENDS
• 1.6 TOTAL PAD CONDITIONERS MARKET SHARE
• 1.7 CMP POU SLURRY FILTER MARKET SHARE ESTIMATE
• 1.8 TOTAL PVA BRUSH MARKET SHARE
• 1.9 TOTAL RETAINING RING MARKET SHARE
• 1.10 ANALYST ASSESSMENT

2 SCOPE AND METHODOLOGY

• 2.1 SCOPE
• 2.2 PURPOSE & METHODOLOGY
• 2.3 OVERVIEW OF OTHER TECHCET CMRTM OFFERINGS

3 SEMICONDUCTOR INDUSTRY MARKET STATUS & OUTLOOK

• 3.1 WORLDWIDE ECONOMY AND OVERALL INDUSTRY OUTLOOK
  • 3.1.1 SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY
  • 3.1.2 SEMICONDUCTOR SALES GROWTH
  • 3.1.3 TAIWAN OUTSOURCE MANUFACTURER MONTHLY SALES TRENDS
• 3.2 CHIPS SALES BY ELECTRONIC GOODS SEGMENT
  • 3.2.1 ELECTRONICS OUTLOOK
  • 3.2.2 AUTOMOTIVE INDUSTRY OUTLOOK
  • 3.2.3 SMARTPHONE OUTLOOK
  • 3.2.4 PC OUTLOOK
  • 3.2.5 SERVERS / IT MARKET
• 3.3 SEMICONDUCTOR FABRICATION GROWTH & EXPANSION
  • 3.3.1 IN THE MIDST OF HUGE INVESTMENT IN CHIP EXPANSIONS
  • 3.3.2 NEW FABS IN THE US
  • 3.3.3 WW FAB EXPANSION DRIVING GROWTH
  • 3.3.4 EQUIPMENT SPENDING TRENDS
  • 3.3.5 ADVANCED LOGIC TECHNOLOGY ROADMAPS
  • 3.3.6 FAB INVESTMENT ASSESSMENT
• 3.4 POLICY & TRADE TRENDS AND IMPACT
• 3.5 SEMICONDUCTOR MATERIALS OVERVIEW
  • 3.5.1 TECHCET WAFER STARTS FORECAST THROUGH 2028
  • 3.5.2 TECHCET MATERIALS MARKET FORECAST THROUGH 2028

4 CMP ANCILLARIES MARKET TRENDS

• 4.1 CMP ANCILLARIES MARKET TRENDS
• 4.2 TECHNOLOGY DRIVERS, MATERIAL CHANGES AND TRANSITIONS
  • 4.2.1 TECHNOLOGY TRENDS
  • 4.2.2 TECHNICAL DRIVERS / MATERIAL CHANGES AND TRANSITIONS - MEMORY
  • 4.2.3 TECHNOLOGY DRIVERS AND MATERIAL ALTERNATIVES
  • 4.2.4 CMP FOR TSV
  • 4.2.4 TECHNICAL TRENDS IN ADVANCED PACKAGING
  • 4.2.5 CMP FOR GAA BACKSIDE POWER
  • 4.2.6 CMP OF SILICON CARBIDE
• 4.3 REGIONAL TRENDS

5 CMP PAD CONDITIONING DISKS STATISTICS & FORECASTS

• 5.1 CMP PAD CONDITIONERS 5-YEAR REVENUE FORECAST
  • 5.1.1 CMP PAD CONDITIONER TYPE 5-YEAR FORECAST
• 5.2 CMP PAD CONDITIONERS 5-YEAR FORECAST BY UNITS
• 5.3 TOTAL PAD CONDITIONERS MARKET SHARE
• 5.4 CMP PAD CONDITIONERS M&A ACTIVITY- ANNOUNCEMENTS AND PARTNERSHIPS
• 5.5 CMP PAD CONDITIONERS NEW ENTRANTS OR PLANT CLOSURES
• 5.6 CMP PAD CONDITIONERS PRICING TRENDS
• 5.7 TECHCET ANALYST ASSESSMENT OF CMP PAD CONDITIONERS MARKET

6 CMP POU* SLURRY FILTER MARKET STATISTICS & FORECASTS

• 6.1 CMP POU SLURRY FILTER 5-YEAR REVENUE FORECAST
  • 6.1.1 CMP POU SLURRY FILTERS 5-YEAR FORECAST FORECAST BY UNITS
• 6.2 CMP POU SLURRY FILTER MARKET SHARE ESTIMATE
• 6.3 CMP POU SLURRY FILTER M&A ACTIVITY ANNOUNCEMENTS AND PARTNERSHIPS
• 6.4 TECHCET ANALYST ASSESSMENT

7 CMP PVA BRUSH SUPPLIER MARKET STATISTICS & FORECASTS

• 7.1 CMP PVA BRUSH 5-YEAR REVENUE FORECAST
• 7.2 CMP PVA BRUSH 5-YEAR FORECAST BY UNITS
• 7.3 TOTAL PVA BRUSH MARKET DYAMICS AND MARKET SHARE
• 7.4 CMP PVA BRUSH PRICING TRENDS
• 7.5 TECHCET ANALYST ASSESSMENT OF CMP PVA BRUSH MARKET

8 CMP RETAINING RING SUPPLIER MARKET STATISTICS & FORECASTS

• 8.1 CMP RETAINING RING FOR WAFER POLISHING HEADS 5-YEAR REVENUE FORECAST
• 8.2 CMP RETAINING RING 5-YEAR FORECAST BY UNITS
• 8.3 TOTAL RETAINING RING MARKET SHARE
• 8.4 TECHCET ANALYST ASSESSMENT OF CMP RETAINING RING MARKET

9 SUPPLIER PROFILES

• 3M
• Abrasive Technology
• Ehwa Diamond
• Entegris
• Kinik
• ...AND 20+ MORE

10 APPENDIX

• APPENDIX A: CMP ANCILLARIES OVERVIEW
• APPENDIX B: TECHCET WAFER START MODELING METHODOLOGY

FIGURES

• FIGURE 1.1: FORECAST PERCENT OF CMP WAFER PASSES PER YEAR
• FIGURE 1.2: TOTAL CMP ANCILLARIES REVENUES ($M USD)
• FIGURE 1.3: CMP STEPS FOR ADVANCED DEVICES
• FIGURE 1.4: 2024 CMP ANCILLARIES TRENDS/ LESSONS
• FIGURE 1.5: CMP PAD CONDITIONERS REVENUE BY WAFER SIZE
• FIGURE 1.6: CMP POU SLURRY FILTERS REVENUE BY SLURRY TYPE
• FIGURE 1.7: CMP PVA BRUSH REVENUES BY APPLICATION
• FIGURE 1.8: CMP RETAINING RING REVENUE ($M USD) BY WAFER SIZE
• FIGURE 1.9: CMOS TECHNOLOGY ROADMAP
• FIGURE 1.10: PAD CONDITIONERS SUPPLIER MARKET SHARES IN 2023
• FIGURE 1.11: 2023 POU SLURRY FILTER MARKET SHARE
• FIGURE 1.12: PVA BRUSH SUPPLIER MARKET SHARES IN 2023
• FIGURE 1.13: RETAINING RING SUPPLIER MARKET SHARES IN 2023
• FIGURE 3.1: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY CHAIN (2023)
• FIGURE 3.2: WORLDWIDE SEMICONDUCTOR SALES
• FIGURE 3.3: TECHCET'S TAIWAN SEMICONDUCTOR INDUSTRY INDEX (TTSII) IN 000'S OF NTD
• FIGURE 3.4: 2023 SEMICONDUCTOR CHIP APPLICATIONS
• FIGURE 3.5: GLOBAL LIGHT VEHICLE UNIT SALES (IN MILLIONS OF UNITS)
• FIGURE 3.6: ELECTRIFICATION TREND BY WORLD REGION
• FIGURE 3.7: AUTOMOTIVE SEMICONDUCTOR PRODUCTION
• FIGURE 3.8: MOBILE PHONE SHIPMENTS, WW ESTIMATES
• FIGURE 3.9: WORLDWIDE PC AND TABLET FORECAST
• FIGURE 3.10: TSMC PHOENIX CAMPUS WITH THE 2ND FAB VISIBLE IN THE BACKGROUND
• FIGURE 3.11: ESTIMATED GLOBAL FAB SPENDING 2023-2028
• FIGURE 3.12: FAB EXPANSIONS WITHIN THE US
• FIGURE 3.13: SEMICONDUCTOR CHIP MANUFACTURING REGIONS OF THE WORLD
• FIGURE 3.14: GLOBAL TOTAL EQUIPMENT SPENDING (US$ M) AND Y-O-Y CHANGE
• FIGURE 3.15: ADVANCED LOGIC DEVICE TECHNOLOGY ROADMAP OVERVIEW
• FIGURE 3.16: DRAM TECHNOLOGY ROADMAP OVERVIEW
• FIGURE 3.17: 3D NAND TECHNOLOGY ROADMAP OVERVIEW
• FIGURE 3.18: INTEL OHIO PLANT SITE AS OF FEB. 2024
• FIGURE 3.19: TECHCET WAFER START FORECAST BY NODE SEGMENTS
• FIGURE 3.20: TECHCET WORLDWIDE MATERIALS FORECAST ($M USD)
• FIGURE 4.1: CMP ANCILLARIES REVENUE FOR 2024
• FIGURE 4.2: COMPARISON OF METALS RESISTIVITIES BY DIMENSION
• FIGURE 4.3: 14NM VS. 7NM METALLIZATION TECHNIQUES
• FIGURE 4.4: CMOS TECHNOLOGY ROADMAP
• FIGURE 4.5: CMP STEPS FOR LOGIC NODES
• FIGURE 4.6: CMOS TECHNOLOGY ROADMAP
• FIGURE 4.7: NUMBER OF CMP STEPS FOR MEMORY TECHNOLOGY NODES
• FIGURE 4.8: STACKING FOR 3D NAND`
• FIGURE 4.9: COMPARISON OF METALS RESISTIVITIES BY DIMENSION
• FIGURE 4.10: ADV LOGIC TRANSITION TO BACKSIDE POWER
• FIGURE 4.11: CMP OPPORTUNITIES IN ADVANCED PACKAGING
• FIGURE 4.12: KEY TRENDS IN ADVANCED PACKAGING
• FIGURE 4.13: CMP OPPORTUNITIES IN ADVANCED PACKAGING
• FIGURE 4.14: SILICON CARBIDE-BASED POWER DEVICE
• FIGURE 4.15: ANCILLARIES % REVENUES 2024 REGIONAL HQ
• FIGURE 5.1: CMP PAD CONDITIONERS REVENUE BY WAFER SIZE
• FIGURE 5.2: % REVENUE INCREASE OF PRECISION CVD DIAMOND STONES WITH COMPLEXITY OF CMP APPLICATION FOR GAA AND 3D NAND/3D DRAM
• FIGURE 5.3: FORECASTED PAD CONDITIONERS VOLUME DEMAND
• FIGURE 5.4: PAD CONDITIONERS SUPPLIER MARKET SHARES IN 2023
• FIGURE 6.1: CMP POU SLURRY FILTERS REVENUE BY SLURRY TYPE
• FIGURE 6.2: CMP POU SLURRY FILTERS UNITS BY SLURRY TYPE
• FIGURE 6.3: 2023 POU SLURRY FILTER MARKET SHARE
• FIGURE 7.1: CMP PVA BRUSH REVENUES BY APPLICATION
• FIGURE 7.2: FORECASTED PVA BRUSH UNITS DEMAND
• FIGURE 7.3: PVA BRUSH SUPPLIER MARKET SHARES IN 2023
• FIGURE 8.1: CMP RETAINING RING REVENUE ($M USD) BY WAFER SIZE
• FIGURE 8.2: FORECASTED RETAINING RING UNITS DEMAND
• FIGURE 8.3: RETAINING RING SUPPLIER MARKET SHARES IN 2023
• FIGURE 10.1: CMP FOR IC MANUFACTURING PROCESS

TABLES

• TABLE 3.1: GLOBAL GDP AND SEMICONDUCTOR REVENUES
• TABLE 3.2: BATTERY ELECTRIC VEHICLE (BEV) REGIONAL TRENDS
• TABLE 3.3: DATA CENTER SYSTEMS AND COMMUNICATION
• SERVICES MARKET SPENDING 2023