底部填充材市场:市场规模及预测(2024年～2025年)

该报告调查了全球底部填充材料市场，并提供了详细的市场信息，例如市场规模、底部填充材料数量和到 2028 年的收入预测、市场占有率、影响行业的供应链以及技术趋势。

目录

执行摘要

第一章简介

第 2 章底部填充材料

• 毛细管底部填充
• 模压底部填充胶
• 非导电膏
• 非导电薄膜
• 技术趋势
• 唇片和 WLP 的底部填充材料市场
• 封装底部填充胶
• 底部填充胶供应商

This report:

• Provides detailed market analysis including market size, forecasts, and market share of the global underfill materials market.
• Covered information includes revenues & units, and a regional market analysis
• Forecasts for underfill materials and revenues out to 2028
• Information for supply-chain managers, procurement teams, marketing managers, and financial analysts
• Includes supply-chain, market, and technical trends information impacting the underfill materials industry.

TABLE OF CONTENTS

EXECUTIVE SUMMARY

1. INTRODUCTION

• 1.1. Methodology
• 1.2. Assumptions
• 1.3. Report Organization

7. UNDERFILL MATERIALS

• 7.1. Capillary Underfill
• 7.2. Molded Underfill
• 7.3. Non-conductive Paste
• 7.4. Non-conductive Film
• 7.5. Technology Trends
• 7.6. Underfill Material Market for lip Chip and WLPs
• 7.7. Package Underfill
• 7.8. Underfill Suppliers