中国的半导体产业:晶圆设备的观点的概况

晶圆製造使用各种半导体设备，分为10多种，包括光刻设备、蚀刻设备、薄膜沉积设备（PVD/CVD/ALD）。这些类别根据不同的工作原理和加工材料进一步划分。製造这些装置需要融合光学、物理、化学等多种科学技术，技术壁垒高，製造难度高。这些机器的另一个特点是价值高、研发投入大。

中国从事晶圆製造设备开发的企业包括华创科技、超微科技、SMEE、Piotech、华清科技等。本报告讨论了中国半导体产业的发展，重点介绍了薄膜沉积、蚀刻和光刻的主要设备。

TRI 致力于广泛的主题，包括半导体、电信、物联网、汽车系统、人工智慧、新兴技术的应用以及主要区域市场（美国、欧洲、日本、韩国、中国、台湾）的最新趋势等） 。这是一家研究公司。成立于1996年，2015年併入集邦咨询旗下。TRI的服务因对新兴科技产业和区域发展趋势的准确理解而受到各类组织的高度评价。

本报告提供了 TRI 对中国半导体产业的看法。

目录

第1章 薄膜沉淀设备

第2章 蚀刻设备

第3章 光刻设备

第4章 TRI的见解

Wafer manufacturing involves the use of various semiconductor equipment that can be categorized into more than ten types, such as photolithography machines, etching equipment, and thin-film deposition equipment (PVD/CVD/ALD). These categories can be further divided based on different working principles or processed materials. The production of these machines involves the integration of diverse scientific techniques, including optics, physics, and chemistry, posing high technical barriers and manufacturing difficulties. These machines are also characterized by their significant worth and high investment in research and development.

Chinese companies engaged in the development of wafer manufacturing equipment mainly include NAURA Tech., Advanced Micro, SMEE, Piotech, Hwatsing Tech., etc. This report primarily discusses the development of China's semiconductor industry, emphasizing key equipment used in thin-film deposition, etching, and photolithography.

TABLE OF CONTENTS

1. Thin Film Deposition Equipment

2. Etching Equipment

3. Photolithography Equipment

4. TRI's View