智慧型手机品牌半导体晶片自主开发分析

Analysis of In-house Development of Semiconductor Chips by Smartphone Brands

出版日期: 2023年10月23日 | 出版商:

TrendForce | 英文 13 Pages | 商品交期: 最快1-2个工作天内

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简介目录

随着全球半导体产业日益专业化，积体电路（IC）设计公司主要负责智慧型手机应用处理器（AP）和系统单晶片（SoC）的设计和开发。然而，随着苹果成功发表自研晶片，各智慧型手机品牌也开始采取同样的策略。

对于智慧型手机品牌来说，内部开发半导体元件需要大量的初始投资。此外，SoC 由各种模组和架构组成，例如影像讯号处理器 (ISP) 和数据机。晶片设计人员面临的挑战是透过优化这些模组和架构之间的资源分配来实现效能和功耗之间的最佳平衡。整体而言，对于没有足够经验和技术专长的智慧型手机品牌来说，内部开发半导体元件是一项复杂的任务。儘管如此，在各种动机的推动下，智慧型手机品牌仍然希望追求这一目标。

本报告调查了智慧型手机品牌半导体晶片的内部开发情况，提供了内部开发的驱动力、各公司的趋势、风险和挑战以及对IC设计行业的未来影响。

With the global semiconductor industry increasingly adopting specialization, the design and development of application processor (AP) and system on a chip (SoC) for smartphones are primarily undertaken by integrated circuit (IC) design companies. However, in the wake of Apple's successful release of in-house developed chips, various smartphone brands have started to adopt the same strategy.

For smartphone brands, developing semiconductor components in-house requires a significant initial investment. Additionally, a SoC consists of various modules and architectures, such as image signal processors (ISP) and modems. Chip designers are tested to see if they can achieve the best balance between performance and power consumption by optimizing the allocation of resources between these modules and architectures. Overall, developing semiconductor components in-house is a complex task for smartphone brands without sufficient prior experience and technological expertise. Nevertheless, driven by various motivations, smartphone brands still want to pursue this goal.