玻璃基板的突破:CoWoS和CPO革新的推动因素

由于玻璃通孔（TGV）技术的最新突破，玻璃基板已成为先进半导体封装领域极具前景的解决方案。玻璃基板有望推动CoWoS、CPO和FOPLP技术的创新。凭藉卓越的高频性能、低热膨胀係数（CTE）和优异的尺寸稳定性，玻璃基板显着提升了I/O密度和讯号完整性。这使得它们特别适用于大型中介层、多层堆迭和高频射频应用。随着英特尔、三星和台积电等领先公司积极投资玻璃基板的开发和应用，TGV技术的广泛应用将显着加速尖端封装技术的进步。

信息图形

主要的焦点

• 受TGV技术突破的推动，玻璃基板已成为先进半导体封装的关键新兴材料。
• 它们具有卓越的高频性能、低热膨胀和优异的尺寸稳定性，从而提高了I/O密度和讯号完整性。
• 它们是大型中介层、多层堆迭和高频射频应用的理想选择。
• 产业领导者正在投资玻璃基板开发，加速TGV技术和尖端封装创新的普及。

目录

第一章：全球封装趋势及基板材料市场概览

第二章：玻璃基板推动下一波 3D 整合浪潮，在成本和效能上课题 TSV

第三章：玻璃基板辅助 CoWoS、CPO 与 FOPLP，释出全新市场潜力

第四章：TRI 的观点

Glass substrates are emerging as a highly promising solution in advanced semiconductor packaging with recent breakthroughs in Through-Glass Via (TGV) technology. They are poised to drive innovation in CoWoS, CPO, and FOPLP technologies. Leveraging superior high-frequency performance, low coefficient of thermal expansion (CTE), and excellent dimensional stability, glass substrates significantly enhance I/O density and signal integrity. This makes them particularly well-suited for large interposers, multi-layer stacking, and high-frequency RF applications. As major players such as Intel, Samsung and TSMC actively invest in the development and adoption of glass substrates, the widespread application of TGV technology is set to profoundly accelerate the advancement of cutting-edge packaging technologies.

INFOGRAPHICS

Key Highlights:

• Glass substrates, driven by breakthroughs in TGV technology, are key emerging materials for advanced semiconductor packaging.
• They offer superior high-frequency performance, low thermal expansion, and excellent dimensional stability, boosting I/O density and signal integrity.
• Ideally suited for large interposers, multilayer stacking, and high-frequency RF scenarios.
• Major industry players are investing in glass substrate development, accelerating TGV technology adoption and cutting-edge packaging innovation.

Table of Contents

1. Global Packaging Trends and Substrate Material Market Overview

• Table 1: Materials, Technologies, and Key Specifications of FC-BGA and FC-CSP
• Figure 1: Five Key Performance Differences in IC Packaging Substrate Materials
• Figure 2: Packaging Architectures Using Silicon, Organic, and Glass Materials
• Table 2: Progress of Substrate and Materials Suppliers in Glass Substrate Development (as of 1H25)

2. Glass Substrates Drive the Next Wave of 3D Integration, Challenging TSV in Cost and Performance

• Table 3: Cost-Effectiveness Comparison of TGV Fabrication Techniques
• Figure 3: Glass Substrates Can Be Applied at Scale in 2.5D/3D Packaging Types

3. Glass Substrates Empower CoWoS, CPO, and FOPLP, Unlocking New Market Potential

4. TRI's View