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市场调查报告书
商品编码
1494357
北美再分布层材料市场预测至 2030 年 - 区域分析 - 按类型 [聚酰亚胺 (PI)、聚苯并噁唑 (PBO)、苯并环丁烯 (BCB) 等] 和应用North America Redistribution Layer Material Market Forecast to 2030 - Regional Analysis - By Type [Polyimide (PI), Polybenzoxazole (PBO), Benzocylobutene (BCB), and Others] and Application |
2022年北美再分布层材料市场估值为2,234万美元,预计2030年将达5,886万美元;预计2022年至2030年复合年增长率为12.9%。
对基于人工智慧的设备和工具的日益关注推动北美再分布层材料市场
对基于人工智慧的设备和工具不断增长的需求正在显着影响北美再分布层材料市场。对更先进的人工智慧功能的追求需要开发更紧凑、更密集整合的硬体组件。再分布层 (RDL) 材料是实现半导体封装小型化的基础,这对于适应日益复杂的人工智慧设备至关重要。随着人工智慧系统变得越来越复杂,对更小、更有效率组件的需求也在增长。此外,人工智慧应用程式以其对高效能运算的巨大需求而闻名,这本身就会产生大量热量。高效的热管理对于确保人工智慧硬体的可靠性和使用寿命至关重要。 RDL材料透过增强导热性和散热性能发挥至关重要的作用。随着人工智慧设备变得更加强大和热密集型,对能够有效解决这些热挑战的先进 RDL 材料的需求不断增加。
可扩展性也是人工智慧领域的关键考虑因素。随着人工智慧技术在各行业的普及,有效扩大硬体生产规模的能力至关重要。 RDL 材料简化了附加组件或晶片的集成,简化了製造流程并实现了快速可扩展性。随着基于人工智慧的工具和设备在金融、医疗保健和製造领域变得越来越重要,这一点尤其有价值。
人工智慧系统非常复杂,通常涉及多个晶片、感测器和处理器,它们必须无缝通讯才能即时处理和分析资料。对人工智慧硬体中改善连接性和讯号完整性的需求不断增长。 RDL 材料对于促进高速资料传输和确保人工智慧系统中的各个组件协调工作至关重要。随着人工智慧应用跨越从医疗保健到自动驾驶汽车等不同行业,对能够保持牢固连接的 RDL 材料的需求变得更加明显。此外,人工智慧领域的特点是快速演变和客製化。不同产业对人工智慧硬体解决方案有独特的要求,需要设计和配置的弹性。 RDL 材料使製造商能够客製化半导体封装以满足这些特定需求。这种客製化能力推动了 RDL 材料的采用,使人工智慧设备製造商能够创建针对各种应用进行最佳化的专用硬体。全球经济的快速成长和产业发展也推动了人工智慧技术的投资增加。这种成长包括智慧城市、自动驾驶汽车和工业 4.0 计画的发展,所有这些都依赖于基于人工智慧的工具和设备。随着这些措施的势头增强,对作为半导体封装基础元件的 RDL 材料的需求也随之增长。因此,对基于人工智慧的设备和工具不断增长的需求正在促进北美再分布层材料市场的成长。
北美洲再分布层材料市场概况
北美拥有大量 IT 服务供应商、金融业和政府机构。快速的技术发展和配套的政府法规使北美成为资料中心最有前途的市场。美国有超过 2,500 个资料中心和 2,200 家服务供应商。随着客户对高品质产品和服务的需求不断增加、IT产业不断发展以及资料中心数量不断增加,许多公司不断创新和开发新产品,以便为客户提供最佳服务。
製造业在北美经济成长中发挥着至关重要的作用。已开发国家拥有高效率的基础设施,使製造公司能够探索科学、技术和商业的极限。此外,美国製造业位居世界第二,製造商占经济总产出的12%。此外,由于多种有利因素,包括新技术的采用提高了生产力;预计未来几年美国製造业将快速成长;天然气价格下降;以及新兴市场的高劳动成本。北美各行业的原始设备製造商正在扩大自动化规模,以与中国和日本等全球製造中心竞争。这导致了先进半导体的快速发展。
此外,由于政府吸引外国直接投资的倡议,以及靠近美国以及北美自由贸易协定实现成本竞争力的能力,墨西哥的製造业正在经历显着增长。此外,墨西哥的汽车工业正在经历范式转变,许多大型汽车公司在该国建造工厂。最近在该国开设工厂的一些公司包括起亚汽车、梅赛德斯-奔驰、日产、奥迪和通用汽车等。
北美的一些主要製造业包括航空航太、汽车、电信和电子等。此外,由于经济状况良好,北美地区个人消费能力较高,导致智慧型手机、平板电脑、笔记型电脑、个人电脑、穿戴式装置和其他消费性电子设备的销售量呈指数级增长。消费性电子产业是半导体产品的另一个主要使用者。所有这些行业都高度依赖半导体产业的有效绩效。 2020 年 9 月,美国资本设备公司 KLA 透过引进新工具改进了其先进封装的系统产品组合。新工具包括 Kronos 1190 晶圆级封装检测系统、ICOS T3/T7 系列和 ICOS F160XP。新系统允许最终用户在封装阶段即兴製造半导体装置。同样,2021 年 5 月,英特尔宣布计划投资 35 亿美元用于先进半导体封装技术的製造。
所有上述因素预计将支持 2022-2030 年北美再分布层材料市场的成长。
北美再分配层材料市场收入及 2030 年预测(百万美元)
北美再分布层材料市场细分
北美再分布层材料市场根据类型、应用和国家进行细分。
依类型,北美再分布层材料市场分为聚酰亚胺(PI)、聚苯并噁唑(PBO)、苯并环丁烯(BCB)等。 2022 年,聚酰亚胺 (PI) 领域占据最大份额。
依应用划分,北美再分布层材料市场分为扇出晶圆级封装(FOWLP)及2.5D/3D IC封装。 2.5D/3D IC封装领域在2022年占据更大份额。
依国家划分,北美再分布层材料市场分为美国、加拿大和墨西哥。 2022年,美国主导北美再分布层材料市场。
SK Hynix Inc、Samsung Electronics Co Ltd、Infineon Technologies AG、DuPont de Nemours Inc、FUJIFILM Holdings Corp、Amkor Technology Inc、ASE Technology Holding Co Ltd、NXP Semiconductors NV、JCET Group Co Ltd 和 Shin-Etsu Chemical Co Ltd 等北美再分布层材料市场的领导公司之一。
The North America redistribution layer material market was valued at US$ 22.34 million in 2022 and is expected to reach US$ 58.86 million by 2030; it is estimated to grow at a CAGR of 12.9% from 2022 to 2030.
Growing Focus on AI-based Equipment and Tools Drive North America Redistribution Layer Material Market
The growing demand for AI-based equipment and tools is significantly impacting the North America redistribution layer material market. The quest for more advanced AI capabilities necessitates the development of more compact and densely integrated hardware components. Redistribution layer (RDL) materials are fundamental in enabling the miniaturization of semiconductor packages, which is essential to accommodate the increasing complexity of AI devices. As AI systems become more sophisticated, the demand for smaller and more efficient components grows. In addition, AI applications are known for their voracious appetite for high-performance computing, which inherently generates substantial heat. Efficient thermal management is paramount to ensure the reliability and longevity of AI hardware. RDL materials play a crucial role by enhancing thermal conductivity and heat dissipation properties. As AI equipment becomes more powerful and heat-intensive, the demand for advanced RDL materials that can effectively address these thermal challenges escalates.
Scalability is also a critical consideration in the AI realm. As AI technology proliferates across industries, the ability to scale up hardware production efficiently is paramount. RDL materials simplify the integration of additional components or chips, streamlining the manufacturing process and enabling rapid scalability. This is especially valuable as AI-based tools and equipment become increasingly essential in finance, healthcare, and manufacturing sectors.
AI systems are intricate and typically involve multiple chips, sensors, and processors that must communicate seamlessly to process and analyze data in real-time. The demand for improved connectivity and signal integrity within AI hardware is ever-increasing. RDL materials are pivotal in facilitating high-speed data transmission and ensuring that various components in AI systems work harmoniously. As AI applications span diverse industries, from healthcare to autonomous vehicles, the need for RDL materials capable of maintaining robust connections becomes even more apparent. Moreover, the AI landscape is characterized by rapid evolution and customization. Different industries have unique requirements for AI hardware solutions, necessitating flexibility in design and configuration. RDL materials enable manufacturers to tailor semiconductor packages to meet these specific demands. This customization capability drives the adoption of RDL materials, empowering AI equipment manufacturers to create specialized hardware optimized for various applications. The rapid economic growth and industrial development across the globe also drive increased investment in AI technology. This growth includes the development of smart cities, autonomous vehicles, and industry 4.0 initiatives, all of which rely on AI-based tools and equipment. As these initiatives gain momentum, the demand for RDL materials as a foundation element in semiconductor packaging grows in tandem. Thus, the escalating demand for AI-based equipment and tools is fostering the growth of the North America redistribution layer material market.
North America Redistribution Layer Material Market Overview
North America has a wide presence of IT service providers, financial industries, and government agencies. The rapid pace of technological development and supporting government regulations made North America the most promising market for data centers. There are more than 2,500 data centers and 2,200 service providers in the US. With the increasing demand from customer for high-quality products and services, growing IT sector, and rising number of data centers, many companies are constantly innovating and developing new products to provide the best possible services to their customers.
The manufacturing industry plays a vital role in the growth of the North American economy. The availability of efficient infrastructure in developed nations has enabled manufacturing companies to explore the limits of science, technology, and commerce. Further, the US manufacturing sector is the second largest in the world, and manufacturers of the country hold 12% of total output in the economy. Moreover, the US manufacturing industry is expected to grow rapidly in the coming years due to several favorable factors, including increased productivity owing to the adoption of new technologies; decreased gas prices; and high labor costs in emerging markets. OEMs across all industries in North America are scaling up automation to compete with global manufacturing hubs such as China and Japan. This has led to the rapid developments in advanced semiconductors.
Also, the manufacturing industry in Mexico is witnessing significant growth due to government initiatives for attracting FDIs, as well as its proximity to the US and ability to achieve cost-competitiveness due to NAFTA. Moreover, the automotive industry in Mexico is experiencing a paradigm shift, with many huge automobile companies constructing their plants in the country. A few of the companies that recently opened their plants in the country include Kia Motors, Mercedes-Benz, Nissan, Audi, and General Motors, among others.
A few of the major manufacturing industries in North America include aerospace, automotive, telecommunications, and electronics, among others. Further, owing to a favorable economy, the spending capacities of individuals in North America are high, which has led to the exponential sales of smartphones, tablets, laptops, personal computers, wearables, and other consumer electronics devices. The consumer electronics industry is another major user of semiconductor-based products. All these industries are highly dependent on the semiconductor industry for effective performance. In September 2020, KLA, the US-based capital equipment company, improved its systems portfolio for advanced packaging by introducing new tools. The new tools consist of a Kronos 1190 wafer-level packaging inspection system, ICOS T3/T7 Series, and ICOS F160XP. The new systems allow the end users to improvise semiconductor device fabrication at a packaging stage. Similarly, in May 2021, Intel announced its plan to invest US$ 3.5 billion in the fabrication of advanced semiconductor packaging technologies.
All the above mentioned factors are anticipated to support the growth of the North America redistribution layer material market during 2022-2030.
North America Redistribution Layer Material Market Revenue and Forecast to 2030 (US$ Million)
North America Redistribution Layer Material Market Segmentation
The North America redistribution layer material market is segmented based on type, application, and country.
Based on type, the North America redistribution layer material market is segmented into polyimide (PI), polybenzoxazole (PBO), benzocylobutene (BCB), and others. The polyimide (PI) segment held the largest share in 2022.
By application, the North America redistribution layer material market is segmented into fan-out wafer level packaging (FOWLP) and 2.5D/3D IC packaging. The 2.5D/3D IC packaging segment held a larger share in 2022. The 2.5D/3D IC packaging is further subsegmented into high bandwidth memory (HBM), multi-chip integration, package on package (FOPOP), and others.
Based on country, the North America redistribution layer material market is segmented into US, Canada, and Mexico. The US dominated the North America redistribution layer material market in 2022.
SK Hynix Inc, Samsung Electronics Co Ltd, Infineon Technologies AG, DuPont de Nemours Inc, FUJIFILM Holdings Corp, Amkor Technology Inc, ASE Technology Holding Co Ltd, NXP Semiconductors NV, JCET Group Co Ltd, and Shin-Etsu Chemical Co Ltd are some of the leading companies operating in the North America redistribution layer material market.