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亚太地区再分布层材料市场预测至 2030 年 - 区域分析 - 按类型 [聚酰亚胺 (PI)、聚苯并噁唑 (PBO)、苯并环丁烯 (BCB) 等] 和应用
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亚太地区再分布层材料市场预测至 2030 年 - 区域分析 - 按类型 [聚酰亚胺 (PI)、聚苯并噁唑 (PBO)、苯并环丁烯 (BCB) 等] 和应用

Asia Pacific Redistribution Layer Material Market Forecast to 2030 - Regional Analysis - By Type [Polyimide (PI), Polybenzoxazole (PBO), Benzocylobutene (BCB), and Others] and Application
出版日期: | 出版商: The Insight Partners | 英文 119 Pages | 订单完成后即时交付

价格

2022年亚太地区再分布层材料市场估值为1.4381亿美元，预计2030年将达到3.5193亿美元；预计2022年至2030年复合年增长率为11.8%。

汽车和电信业日益增长的需求推动亚太地区再分布层材料市场

亚太地区的再分布层材料市场正在经历显着成长，这主要是由汽车和电信这两个关键产业的需求激增所推动的。

电信业正在迅速发展，特别是随着 5G 技术的部署。 5G网路在全球广泛部署，导致对智慧型手机和其他消费性电子产品的需求增加。例如，2021 年 10 月，AIS 和三星联合推出了语音 5G 无线电服务，可在泰国的 AIS 5G 独立 (SA) 网路上进行语音通话。在越南，三星电子和Viettel宣布将于2021年12月在岘港启动5G商用试验。顿、平福、承天-顺化和岘港。此外，根据Viavi Solutions Inc.的报告，全球已有超过92个国家推出了5G网路。另有23个国家正在进行5G网路预商用试验，32个国家已宣布其5G部署计画。 5G网路的广泛部署导致对智慧型手机和其他消费性电子产品的需求增加。这场革命正在推动高频、高效能设备和系统的发展。这些要求扩展到再分配层中使用的材料，这些材料必须满足严格的规范，以确保无缝连接和讯号完整性。此外，推动小型化是这些产业之间的共同点。这场革命正在推动高频、高效能设备和系统的发展。这些要求扩展到再分配层中使用的材料，这些材料必须满足严格的规范，以确保无缝连接和讯号完整性。此外，推动小型化是这些产业之间的共同点。人们需要更小、更强大的设备，这就需要更薄、更先进的重新分布层材料。这些材料在实现紧凑电子封装内的高密度互连方面发挥关键作用。

汽车产业不断扩大的生产需求推动了市场的成长。根据尤索夫伊萨东南亚研究院介绍，东南亚也是重要的汽车生产基地。东南亚是全球第七大汽车製造中心，2021 年生产350 万辆汽车。 （48 万辆） ）和越南（16万）。此外，根据国际汽车製造商组织（OICA）的资料，北美、南美和中美洲国家2021年商用车和乘用车产量超过1,610万辆，产量增加了10%，到2022年商用车和乘用车产量将超过1770万辆。 2021年7月，马鲁蒂铃木印度有限公司宣布投资24.2亿美元在印度哈里亚纳邦新建製造工厂。该工厂预计每年生产 100 万台。随着汽车越来越依赖先进的电子设备来实现安全、娱乐和自动驾驶功能，对半导体的需求激增。这些汽车晶片需要复杂的封装解决方案，通常采用重新分布层，以实现紧凑的设计和高效的互连。

全球汽车和电信产业的经济成长对整个供应链产生连锁反应。研发、技术和基础设施的投资不断增加，培育了有利于再分布层材料领域创新和发展的环境。这一趋势的特征是产量增加、先进封装技术、小型化要求、该地区的战略供应链地位以及对整个生态系统的正面经济影响。这些因素共同推动了亚太地区再分布层材料市场的发展。

亚太地区再分布层材料市场概况

亚太地区许多发展中国家的製造业正在显着成长。由于多元化的製造业的存在，该地区被认为是全球製造业中心。随着中国发展成为高技能製造中心，印度、韩国、台湾和越南等发展中国家正在吸引一些企业计划将中低技能製造设施迁往邻国，从而降低劳动成本。根据半导体产业协会的研究，全球约 75% 的半导体产能位于东亚。随着该地区製造活动的开始，半导体公司将受益于 25% 至 50% 的成本优势。

此外，亚太地区各国政府正努力改善半导体製造投资计画。他们提供退税、资金和补贴等，吸引製造业企业在各自国家设厂。此外，一些政府也采取了「中国製造2025」和「印度製造」等措施来推动製造业的成长。然而，作为最大的製造业中心的中国，由于人口老化的加剧，劳动成本正在上升。这导致製造公司投资于东南亚的公司。基础设施的改善、国内消费的成长以及成本的降低是吸引製造业企业的几个因素。

亚太地区的消费电子製造业在全球处于领先地位，预计将支持该地区的亚太再分布层材料市场。此外，该地区许多国家也越来越多地采用智慧城市、自动驾驶汽车和物联网等数位应用，以期成为全球强国。

亚太地区的半导体製造业是全球最大的。晶片製造原材料的容易取得、政府对製造业的激励措施以及亚太地区廉价的劳动力是推动半导体製造业发展的几个因素。 RDL 材料直接出售给半导体製造商，因为封装是半导体製造流程不可或缺的一部分。消费性电子产品（尤其是智慧型手机）的日益普及是推动半导体产业收入的主要因素。此外，由于人工智慧和物联网在多个业务领域的快速采用，预计亚太地区资料中心的部署在未来几年将会成长。随着亚太地区各国 5G 部署的增加，网路基础设施的成长正在加强。所有这些因素都在增加对感测器和其他半导体设备的需求。

工业革命改变了澳洲的生产方式，提高了整个地区的生产力并增加了经济利润。因此，智慧工厂的兴起、价值链升级、资料分析和互联机器是需要半导体的一些应用。此外，不断增长的自动化、3D 列印和物联网以及新兴业务正在加速澳洲智慧工厂的采用。该国的电信业对其国内生产毛额的贡献巨大。电信营运商正在寻求持续创新来实施 5G 网路等先进技术，预计这将对 RDL 材料的使用产生积极影响。

中国和印度人口众多，包括这些国家不断扩大的中产阶级人口，以及成熟的製造业推动了半导体产业的发展。中国是全球最大的乘用车生产国；日本、印度和韩国也是该地区主要的汽车製造国。日本、中国和韩国自动驾驶汽车和智慧基础设施的发展将进一步推动对可靠的半导体电子设备的需求。越南、柬埔寨和菲律宾等国家计划提高半导体产量，进而为亚太地区再分布层材料市场创造收入做出贡献。这一因素正在推动该地区汽车行业半导体应用的成长。此外，该地区的消费电子製造业在全球处于领先地位。因此，这些产业不断增长的製造活动预计将增加对半导体的需求，进而推动整个亚太地区的再分布层材料市场。

图表：亚太地区再分配层材料市场收入及 2030 年预测（百万美元）

亚太地区再分布层材料市场细分

亚太地区再分布层材料市场根据类型、应用和国家/地区进行细分。

根据类型，亚太地区再分布层材料市场分为聚酰亚胺（PI）、聚苯并噁唑（PBO）、苯并环丁烯（BCB）等。 2022 年，聚酰亚胺 (PI) 领域占据最大份额。

依冷却液类型，亚太地区再分布层材料市场分为扇出晶圆级封装（FOWLP）及2.5D/3D IC封装。 2.5D/3D IC封装领域在2022年占据更大份额。

依国家/地区划分，亚太地区再分布层材料市场分为中国大陆、台湾地区、日本、韩国和亚太地区其他地区。 2022年，台湾在亚太再分布层材料市场占据主导地位。

SK Hynix Inc、三星电子有限公司、英飞凌科技股份公司、杜邦de Nemours Inc、FUJIFILM Holdings Corp、Amkor Technology Inc、ASE Technology Holding Co Ltd、NXP Semiconductors NV、JCET Group Co Ltd 和Shin-Etsu Chemical Co Ltd等亚太地区再分布层材料市场的领导公司之一。

目录

第 1 章：简介

第 2 章：执行摘要

  • 重要见解
  • 市场吸引力
    • 市场吸引力

第 3 章：研究方法

  • 覆盖范围
  • 二次研究
  • 初步研究

第 4 章：亚太地区再分配层材料市场格局

  • 概述
  • 波特五力分析
    • 供应商的议价能力
    • 买家的议价能力
    • 新进入者的威胁
    • 竞争激烈程度
    • 替代品的威胁
  • 生态系分析
    • 原物料供应商
    • 製造商
    • 最终用途
    • 价值链供应商名单
      • 价值链原料供应商名录
      • 价值链製造商名单

第 5 章：亚太地区再分布层材料市场 - 主要市场动态

  • 市场驱动因素
    • 越来越关注基于人工智慧的设备和工具
    • 汽车和电信业的需求不断增长
  • 市场限制
    • 原物料价格波动
  • 市场机会
    • 物联网和互联设备在各行业的普及
  • 未来的趋势
    • 封装技术的进步
  • 影响分析

第 6 章：再分配层材料市场 - 亚太市场分析

  • 亚太地区再分布层材料市场容量
  • 亚太地区再分配层材料市场收入
  • 亚太地区再分布层材料市场预测与分析

第 7 章：亚太地区再分布层材料市场分析 - 类型

  • 聚酰亚胺 (PI)
    • 概述
    • 聚酰亚胺 (PI) 市场容量、收入和 2030 年预测
    • 聚酰亚胺 (PI) 市场、收入和 2030 年预测
  • 聚苯并噁唑 (PBO)
    • 概述
    • 聚苯并噁唑 (PBO) 市场容量、收入和 2030 年预测
    • 聚苯并噁唑 (PBO) 市场、收入和 2030 年预测
  • 苯并环丁烯 (BCB)
    • 概述
    • 苯环丁烯 (BCB) 市场量、收入和 2030 年预测
    • 苯环丁烯 (BCB) 市场、收入和 2030 年预测
  • 其他的
    • 概述
    • 其他市场容量、收入和 2030 年预测
    • 其他市场、收入和 2030 年预测

第 8 章：亚太地区再分布层材料市场分析 - 应用

  • 扇出晶圆级封装 (FOWLP)
    • 概述
    • 扇出晶圆级封装 (FOWLP) 市场、收入和 2030 年预测
  • 2 5D/3D IC 封装
    • 概述
    • 2 5D/3D IC封装市场收入及2030年预测
    • 高频宽记忆体 (HBM)
      • 高频宽记忆体 (HBM) 市场收入及 2030 年预测
    • 多晶片集成
      • 多晶片整合市场收入及 2030 年预测
    • 层迭封装 (FOPOP)
      • 层迭封装 (FOPOP) 市场收入及 2030 年预测
    • 其他的
      • 其他市场收入及 2030 年预测

第 9 章：亚太地区再分布层材料市场 - 国家分析

  • 中国
  • 台湾
  • 日本
  • 韩国
  • 亚太地区其他地区

第 10 章：竞争格局

  • 关键参与者的热图分析
  • 公司定位与专注

第 11 章：产业格局

  • 概述
  • 市场主动性
  • 新产品开发
  • 併购

第 12 章：公司简介

  • SK Hynix Inc
  • Samsung Electronics Co Ltd
  • Infineon Technologies AG
  • DuPont de Nemours Inc
  • FUJIFILM Holdings Corp
  • Amkor Technology Inc
  • ASE Technology Holding Co Ltd
  • NXP Semiconductors NV
  • JCET Group Co Ltd
  • Shin-Etsu Chemical Co Ltd

第 13 章：附录

Product Code: TIPRE00026108

The Asia Pacific redistribution layer material market was valued at US$ 143.81 million in 2022 and is expected to reach US$ 351.93 million by 2030; it is estimated to grow at a CAGR of 11.8% from 2022 to 2030.

Increasing Demand from Automotive and Telecommunication Industries Drive Asia Pacific Redistribution Layer Material Market

The Asia Pacific redistribution layer material market is experiencing significant growth, driven primarily by the surging demand from two key industries: automotive and telecommunication.

The telecommunication sector is evolving rapidly, particularly with the deployment of 5G technology. There is a widespread rollout of 5G networks in across the globe, which has led to an increased demand for smartphones and other consumer electronics products. For instance, in October 2021, AIS and Samsung jointly launched a voice-over 5G radio service enabling voice calls on AIS's 5G standalone (SA) network in Thailand. In Vietnam, Samsung Electronics and Viettel announced the 5G commercial trials launched in Da Nang in December 2021. Viettel is piloting 5G services in 11 provinces and cities, namely, Ho Chi Minh City, Hanoi, Bac Ninh, Vinh Phuc, Bac Giang, Dong Nai, Ba Ria-Vung Tau, Binh Phuoc, Thua Thien-Hue, and Da Nang. In addition, according to Viavi Solutions Inc.'s report, over 92 countries across the world have launched 5G networks. A further 23 countries have underway pre-commercial 5G network trials, and 32 nations have announced their 5G rollout plans. The widespread rollout of 5G networks has led to an increased demand for smartphones and other consumer electronics products. This revolution is driving the development of high-frequency, high-performance devices and systems. These requirements extend to the material used in redistribution layers, which must meet stringent specifications to ensure seamless connectivity and signal integrity. In addition, the push for miniaturization is a common thread between these industries. This revolution is driving the development of high-frequency, high-performance devices and systems. These requirements extend to the material used in redistribution layers, which must meet stringent specifications to ensure seamless connectivity and signal integrity. In addition, the push for miniaturization is a common thread between these industries. Smaller, more powerful devices are in demand, necessitating thinner and more advanced redistribution layer materials. These materials play a critical role in enabling high-density interconnections within compact electronic packages.

The ever-expanding production needs of the automotive industry propel the growth of the market. According to the ISEAS-Yusof Ishak Institute, Southeast Asia is also an important automobile production base. Southeast Asia is the seventh largest automotive manufacturing hub worldwide, producing 3.5 million vehicles in 2021. Within the region, Thailand is the largest car producer, producing over 1.6 million motor vehicles in 2021, followed by Indonesia (1.1 million), Malaysia (0.48 million), and Vietnam (0.16 million). In addition, as per the data of the Organisation Internationale des Constructeurs d'Automobiles (OICA), countries in North America, South America, and Central America recorded production of over 16.1 million commercial & passenger cars in 2021, and the production has grown by 10% and registered over 17.7 million commercial & passenger car production in 2022. Numerous companies operating in the automotive market are investing heavily in automobile manufacturing to increase production and sales. In July 2021, Maruti Suzuki India Ltd. announced an investment worth US$ 2.42 billion in a new manufacturing facility in Haryana, India. The facility is expected to manufacture 1 million units annually. As vehicles become increasingly reliant on advanced electronics for safety, entertainment, and autonomous capabilities, the demand for semiconductors has soared. These automotive chips require intricate packaging solutions, often employing redistribution layers, to enable compact design and efficient interconnections.

The economic growth of the automotive and telecommunications sectors across the globe has a ripple effect on the entire supply chain. Investments in research and development, technology, and infrastructure are increasing, fostering an environment conducive to innovation and development in the field of redistribution layer materials. This trend is characterized by increased production, advanced packaging technologies, miniaturization requirements, the region's strategic supply chain position, and a positive economic impact on the entire ecosystem. These factors collectively propel the Asia Pacific redistribution layer material market.

Asia Pacific Redistribution Layer Material Market Overview

Many developing countries in Asia Pacific are witnessing significant growth in their manufacturing sectors. The region is considered a global manufacturing hub owing to the presence of diverse manufacturing industries. With China's evolution into a high-skilled manufacturing hub, developing countries such as India, South Korea, Taiwan, and Vietnam are attracting several businesses that plan to relocate their low to medium-skilled manufacturing facilities to neighboring countries, which results in reduced labor costs. As per the study by the Semiconductor Industry Association, ~75% of global semiconductor capacity is based in East Asia. Semiconductor companies will benefit from a cost advantage of 25% to 50% with the start of manufacturing activities in the region.

Further, governments of various countries in Asia Pacific are working to improve investment plans regarding semiconductor manufacturing. They are offering tax rebates, funds, and subsidies, among others, to attract manufacturing companies to set up plants in their respective countries. Further, several governments have taken initiatives such as Made in China 2025 and Make in India to propel the growth of the manufacturing sector. However, China, which is the largest manufacturing hub, is experiencing a rise in the country's labor cost owing to the rise in the aging population of the country. This has resulted in manufacturing companies investing in companies based in Southeast Asia. The improving infrastructure, rising domestic consumption, and reducing costs are a few factors attracting manufacturing companies.

The consumer electronics manufacturing industry in Asia Pacific is leading globally, which is anticipated to support the Asia Pacific redistribution layer material market across the region. Additionally, many countries across the region are increasingly adopting digital applications such as smart cities, autonomous vehicles, and IoT in a bid to become global powers.

The semiconductor manufacturing industry in Asia Pacific is the largest in the world. Ease of availability of raw materials for chip manufacturing, government incentives for the manufacturing sector, and inexpensive labor presence in APAC are a few factors driving the semiconductor manufacturing industries. RDL materials are directly sold to the semiconductor manufacturers as packaging is integral to semiconductor manufacturing processes. The growing penetration of consumer electronics, especially smartphones, is a major factor driving the revenues for the semiconductor industry. Also, owing to the rapid adoption of artificial intelligence and IoT in multiple business sectors, data center deployments in APAC are anticipated to grow in the coming years. The growth of network infrastructures is being strengthened with the rise in 5G deployments in various countries of APAC. All these factors are boosting the demand for sensors and other semiconductor-based devices.

The Industrial Revolution has transformed production in Australia, enabling improved productivity and increasing economic profit across the region. Thus, a rise in smart factories, value chain upgradation, data analytics, and connected machines are a few applications that require semiconductors. Furthermore, growing automation, 3D printing, and IoT, as well as emerging businesses, are accelerating the adoption of smart factories in Australia. The country's telecommunication industry contributes heavily to its GDP. The telco operators are seeking continued innovation for the implementation of advanced technologies such as 5G networks, which are projected to positively impact the use of RDL materials.

The large populations of China and India, including the expanding middle-class population in these countries, and well-established manufacturing sectors drive the semiconductor sector. China is the largest producer of passenger cars in the world; Japan, India, and South Korea are also major vehicle manufacturing countries in the region. The development of autonomous vehicles and smart infrastructure in Japan, China, and South Korea will further boost the demand for reliable semiconductor-based electronics devices. Countries such as Vietnam, Cambodia, and the Philippines plan to boost the production of semiconductors, thereby contributing to the revenue generation for the Asia Pacific redistribution layer material market. This factor is propelling the growth of semiconductor applications in the automotive sector in the region. Moreover, the region leads the consumer electronics manufacturing industry across the globe. Thus, the growing manufacturing activities in these industries is anticipated to boost the demand for semiconductors, which, in turn, is fueling the Asia Pacific redistribution layer material market across the region.

Exhibit: Asia Pacific Redistribution Layer Material Market Revenue and Forecast to 2030 (US$ Million)

Asia Pacific Redistribution Layer Material Market Segmentation

The Asia Pacific redistribution layer material market is segmented based on type, application, and country.

Based on type, the Asia Pacific redistribution layer material market is segmented into polyimide (PI), polybenzoxazole (PBO), benzocylobutene (BCB), and others. The polyimide (PI) segment held the largest share in 2022.

By cooling fluid type, the Asia Pacific redistribution layer material market is segmented into fan-out wafer level packaging (FOWLP) and 2.5D/3D IC packaging. The 2.5D/3D IC packaging segment held a larger share in 2022. The 2.5D/3D IC packaging is further subsegmented into high bandwidth memory (HBM), multi-chip integration, package on package (FOPOP), and others.

Based on country, the Asia Pacific redistribution layer material market is segmented into China, Taiwan, Japan, South Korea, and the Rest of Asia Pacific. Taiwan dominated the Asia Pacific redistribution layer material market in 2022.

SK Hynix Inc, Samsung Electronics Co Ltd, Infineon Technologies AG, DuPont de Nemours Inc, FUJIFILM Holdings Corp, Amkor Technology Inc, ASE Technology Holding Co Ltd, NXP Semiconductors NV, JCET Group Co Ltd, and Shin-Etsu Chemical Co Ltd are some of the leading companies operating in the Asia Pacific redistribution layer material market.

Table Of Contents

1. Introduction

  • 1.1 The Insight Partners Research Report Guidance
  • 1.2 Market Segmentation

2. Executive Summary

  • 2.1 Key Insights
  • 2.2 Market Attractiveness
    • 2.2.1 Market Attractiveness

3. Research Methodology

  • 3.1 Coverage
  • 3.2 Secondary Research
  • 3.3 Primary Research

4. Asia Pacific Redistribution Layer Material Market Landscape

  • 4.1 Overview
  • 4.2 Porter's Five Forces Analysis
    • 4.2.1 Bargaining Power of Suppliers
    • 4.2.2 Bargaining Power of Buyers
    • 4.2.3 Threat of New Entrants
    • 4.2.4 Intensity of Competitive Rivalry
    • 4.2.5 Threat of Substitutes
  • 4.3 Ecosystem Analysis
    • 4.3.1 Raw Material Suppliers
    • 4.3.2 Manufacturers
    • 4.3.3 End Use
    • 4.3.4 List of Vendors in the Value Chain
      • 4.3.4.1 List of Raw Material Suppliers in Value Chain
      • 4.3.4.2 List of Manufacturers in Value Chain

5. Asia Pacific Redistribution Layer Material Market - Key Market Dynamics

  • 5.1 Market Drivers
    • 5.1.1 Growing Focus on AI-based Equipment and Tools
    • 5.1.2 Increasing Demand from Automotive and Telecommunication Industries
  • 5.2 Market Restraints
    • 5.2.1 Fluctuation in Raw Material Prices
  • 5.3 Market Opportunities
    • 5.3.1 Proliferation of IoT and Connected Devices Across Industry Verticals
  • 5.4 Future Trends
    • 5.4.1 Advancements in the Packaging Technology
  • 5.5 Impact Analysis

6. Redistribution Layer Material Market - Asia Pacific Market Analysis

  • 6.1 Asia Pacific Redistribution Layer Material Market Volume (Tons)
  • 6.2 Asia Pacific Redistribution Layer Material Market Revenue (US$ Million)
  • 6.3 Asia Pacific Redistribution Layer Material Market Forecast and Analysis

7. Asia Pacific Redistribution Layer Material Market Analysis - Type

  • 7.1 Polyimide (PI)
    • 7.1.1 Overview
    • 7.1.2 Polyimide (PI) Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)
    • 7.1.3 Polyimide (PI) Market, Revenue and Forecast to 2030 (US$ Million)
  • 7.2 Polybenzoxazole (PBO)
    • 7.2.1 Overview
    • 7.2.2 Polybenzoxazole (PBO) Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)
    • 7.2.3 Polybenzoxazole (PBO) Market, Revenue and Forecast to 2030 (US$ Million)
  • 7.3 Benzocylobutene (BCB)
    • 7.3.1 Overview
    • 7.3.2 Benzocylobutene (BCB) Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)
    • 7.3.3 Benzocylobutene (BCB) Market, Revenue and Forecast to 2030 (US$ Million)
  • 7.4 Others
    • 7.4.1 Overview
    • 7.4.2 Others Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)
    • 7.4.3 Others Market, Revenue and Forecast to 2030 (US$ Million)

8. Asia Pacific Redistribution Layer Material Market Analysis - Application

  • 8.1 Fan-Out Wafer Level Packaging (FOWLP)
    • 8.1.1 Overview
    • 8.1.2 Fan-Out Wafer Level Packaging (FOWLP) Market, Revenue, and Forecast to 2030 (US$ Million)
  • 8.2 2 5D/3D IC Packaging
    • 8.2.1 Overview
    • 8.2.2 2 5D/3D IC Packaging Market Revenue, and Forecast to 2030 (US$ Million)
    • 8.2.3 High Bandwidth Memory (HBM)
      • 8.2.3.1 High Bandwidth Memory (HBM) Market Revenue and Forecast to 2030 (US$ Million)
    • 8.2.4 Multi-Chip Integration
      • 8.2.4.1 Multi-Chip Integration Market Revenue and Forecast to 2030 (US$ Million)
    • 8.2.5 Package on Package (FOPOP)
      • 8.2.5.1 Package on Package (FOPOP) Market Revenue and Forecast to 2030 (US$ Million)
    • 8.2.6 Others
      • 8.2.6.1 Others Market Revenue and Forecast to 2030 (US$ Million)

9. Asia Pacific Redistribution Layer Material Market - Country Analysis

  • 9.1 Overview
    • 9.1.1 Asia Pacific Redistribution Layer Material Market Revenue and Forecasts and Analysis - By Countries
      • 9.1.1.1 Redistribution Layer Material Market Breakdown by Country
      • 9.1.1.2 China Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
      • 9.1.1.3 China Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
        • 9.1.1.3.1 China Redistribution Layer Material Market Breakdown by Type
        • 9.1.1.3.2 China Redistribution Layer Material Market Breakdown by Type
        • 9.1.1.3.3 China Redistribution Layer Material Market Breakdown by Application
      • 9.1.1.4 Taiwan Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
      • 9.1.1.5 Taiwan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
        • 9.1.1.5.1 Taiwan Redistribution Layer Material Market Breakdown by Type
        • 9.1.1.5.2 Taiwan Redistribution Layer Material Market Breakdown by Type
        • 9.1.1.5.3 Taiwan Redistribution Layer Material Market Breakdown by Application
      • 9.1.1.6 Japan Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
      • 9.1.1.7 Japan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
        • 9.1.1.7.1 Japan Redistribution Layer Material Market Breakdown by Type
        • 9.1.1.7.2 Japan Redistribution Layer Material Market Breakdown by Type
        • 9.1.1.7.3 Japan Redistribution Layer Material Market Breakdown by Application
      • 9.1.1.8 South Korea Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
      • 9.1.1.9 South Korea Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
        • 9.1.1.9.1 South Korea Redistribution Layer Material Market Breakdown by Type
        • 9.1.1.9.2 South Korea Redistribution Layer Material Market Breakdown by Type
        • 9.1.1.9.3 South Korea Redistribution Layer Material Market Breakdown by Application
      • 9.1.1.10 Rest of Asia Pacific Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
      • 9.1.1.11 Rest of Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
        • 9.1.1.11.1 Rest of Asia Pacific Redistribution Layer Material Market Breakdown by Type
        • 9.1.1.11.2 Rest of Asia Pacific Redistribution Layer Material Market Breakdown by Type
        • 9.1.1.11.3 Rest of Asia Pacific Redistribution Layer Material Market Breakdown by Application

10. Competitive Landscape

  • 11.1 Heat Map Analysis by Key Players
  • 11.2 Company Positioning & Concentration

11. Industry Landscape

  • 12.1 Overview
  • 12.2 Market Initiative
  • 12.3 New Product Development
  • 12.4 Merger and Acquisition

12. Company Profiles

  • 12.1 SK Hynix Inc
    • 13.1.1 Key Facts
    • 13.1.2 Business Description
    • 13.1.3 Products and Services
    • 13.1.4 Financial Overview
    • 13.1.5 SWOT Analysis
    • 13.1.6 Key Developments
  • 12.2 Samsung Electronics Co Ltd
    • 13.2.1 Key Facts
    • 13.2.2 Business Description
    • 13.2.3 Products and Services
    • 13.2.4 Financial Overview
    • 13.2.5 SWOT Analysis
    • 13.2.6 Key Developments
  • 12.3 Infineon Technologies AG
    • 13.3.1 Key Facts
    • 13.3.2 Business Description
    • 13.3.3 Products and Services
    • 13.3.4 Financial Overview
    • 13.3.5 SWOT Analysis
    • 13.3.6 Key Developments
  • 12.4 DuPont de Nemours Inc
    • 13.4.1 Key Facts
    • 13.4.2 Business Description
    • 13.4.3 Products and Services
    • 13.4.4 Financial Overview
    • 13.4.5 SWOT Analysis
    • 13.4.6 Key Developments
  • 12.5 FUJIFILM Holdings Corp
    • 13.5.1 Key Facts
    • 13.5.2 Business Description
    • 13.5.3 Products and Services
    • 13.5.4 Financial Overview
    • 13.5.5 SWOT Analysis
    • 13.5.6 Key Developments
  • 12.6 Amkor Technology Inc
    • 13.6.1 Key Facts
    • 13.6.2 Business Description
    • 13.6.3 Products and Services
    • 13.6.4 Financial Overview
    • 13.6.5 SWOT Analysis
    • 13.6.6 Key Developments
  • 12.7 ASE Technology Holding Co Ltd
    • 13.7.1 Key Facts
    • 13.7.2 Business Description
    • 13.7.3 Products and Services
    • 13.7.4 Financial Overview
    • 13.7.5 SWOT Analysis
    • 13.7.6 Key Developments
  • 12.8 NXP Semiconductors NV
    • 13.8.1 Key Facts
    • 13.8.2 Business Description
    • 13.8.3 Products and Services
    • 13.8.4 Financial Overview
    • 13.8.5 SWOT Analysis
    • 13.8.6 Key Developments
  • 12.9 JCET Group Co Ltd
    • 13.9.1 Key Facts
    • 13.9.2 Business Description
    • 13.9.3 Products and Services
    • 13.9.4 Financial Overview
    • 13.9.5 SWOT Analysis
    • 13.9.6 Key Developments
  • 12.10 Shin-Etsu Chemical Co Ltd
    • 13.10.1 Key Facts
    • 13.10.2 Business Description
    • 13.10.3 Products and Services
    • 13.10.4 Financial Overview
    • 13.10.5 SWOT Analysis
    • 13.10.6 Key Developments

13. Appendix

List Of Tables

  • Table 1. Asia Pacific Redistribution Layer Material Market Segmentation
  • Table 2. Asia Pacific Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)
  • Table 3. Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
  • Table 4. Asia Pacific Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - Type
  • Table 5. Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - Type
  • Table 6. Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - Application
  • Table 7. China Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - By Type
  • Table 8. China Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Type
  • Table 9. China Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Application
  • Table 10. Taiwan Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - By Type
  • Table 11. Taiwan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Type
  • Table 12. Taiwan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Application
  • Table 13. Japan Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - By Type
  • Table 14. Japan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Type
  • Table 15. Japan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Application
  • Table 16. South Korea Redistribution Layer Material Market Revenue and Forecasts To 2030 (Kilo Ton) - By Type
  • Table 17. South Korea Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Type
  • Table 18. South Korea Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Application
  • Table 19. Rest of Asia Pacific Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - By Type
  • Table 20. Rest of Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Type
  • Table 21. Rest of Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Application
  • Table 22. Company Positioning & Concentration

List Of Figures

  • Figure 1. Asia Pacific Redistribution Layer Material Market Segmentation, By Country
  • Figure 2. Porter's Five Forces Analysis
  • Figure 3. Ecosystem: Asia Pacific Redistribution Layer Material Market
  • Figure 4. Market Dynamics: Asia Pacific Redistribution Layer Material Market
  • Figure 5. Asia Pacific Redistribution Layer Material Market Impact Analysis of Drivers and Restraints
  • Figure 6. Asia Pacific Redistribution Layer Material Market Volume (Tons), 2020 - 2030
  • Figure 7. Asia Pacific Redistribution Layer Material Market Revenue (US$ Million), 2020 - 2030
  • Figure 8. Asia Pacific Redistribution Layer Material Market Share (%) - Type, 2022 and 2030
  • Figure 9. Polyimide (PI) Market Volume and Forecasts To 2030 (Tons)
  • Figure 10. Polyimide (PI) Market Revenue and Forecasts to 2030 (US$ Million)
  • Figure 11. Polybenzoxazole (PBO) Market Volume and Forecasts To 2030 (Tons)
  • Figure 12. Polybenzoxazole (PBO) Market Revenue and Forecasts to 2030 (US$ Million)
  • Figure 13. Benzocylobutene (BCB) Market Volume and Forecasts To 2030 (Tons)
  • Figure 14. Benzocylobutene (BCB) Market Revenue and Forecasts to 2030 (US$ Million)
  • Figure 15. Others Market Volume and Forecasts To 2030 (Tons)
  • Figure 16. Others Market Revenue and Forecasts to 2030 (US$ Million)
  • Figure 17. Asia Pacific Redistribution Layer Material Market Share (%) - Application, 2022 and 2030
  • Figure 18. Fan-Out Wafer Level Packaging (FOWLP) Market Revenue and Forecasts to 2030 (US$ Million)
  • Figure 19. 2 5D/3D IC Packaging Market Revenue and Forecasts to 2030 (US$ Million)
  • Figure 20. High Bandwidth Memory (HBM) Market Revenue and Forecasts to 2030 (US$ Million)
  • Figure 21. Multi-Chip Integration Market Revenue and Forecasts to 2030 (US$ Million)
  • Figure 22. Package on Package (FOPOP) Market Revenue and Forecasts to 2030 (US$ Million)
  • Figure 23. Others Market Revenue and Forecasts to 2030 (US$ Million)
  • Figure 24. Asia Pacific Redistribution Layer Material Market Breakdown by Key Countries, (2022) (US$ Million)
  • Figure 25. Redistribution Layer Material Market Breakdown by Key Countries, 2022 and 2030 (%)
  • Figure 26. China Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)
  • Figure 27. China Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
  • Figure 28. Taiwan Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)
  • Figure 29. Taiwan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
  • Figure 30. Japan Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)
  • Figure 31. Japan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
  • Figure 32. South Korea Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)
  • Figure 33. South Korea Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
  • Figure 34. Rest of Asia Pacific Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)
  • Figure 35. Rest of Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
  • Figure 36. Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)
  • Figure 37. Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
  • Figure 38. Redistribution Layer Material Market Breakdown by Type (2022 and 2030)
  • Figure 39. Heat Map Analysis by Key Players