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欧洲再分布层材料市场预测至 2030 年 - 区域分析 - 按类型 [聚酰亚胺 (PI)、聚苯并噁唑 (PBO)、苯并环丁烯 (BCB) 等] 和应用
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1494363

欧洲再分布层材料市场预测至 2030 年 - 区域分析 - 按类型 [聚酰亚胺 (PI)、聚苯并噁唑 (PBO)、苯并环丁烯 (BCB) 等] 和应用

Europe Redistribution Layer Material Market Forecast to 2030 - Regional Analysis - By Type [Polyimide (PI), Polybenzoxazole (PBO), Benzocylobutene (BCB), and Others] and Application
出版日期: | 出版商: The Insight Partners | 英文 108 Pages | 订单完成后即时交付

价格

2022年欧洲再分布层材料市场估值为1,562万美元，预计2030年将达3,445万美元；预计2022年至2030年复合年增长率为10.4%。

封装技术的进步推动欧洲再分布层材料市场

为了寻求降低成本，半导体产业一直致力于开发创新解决方案。领先的半导体厂商目前考虑的一种方法是从晶圆和条带尺寸迁移到专用于 IC 组装的大尺寸面板。效率和规模经济是这条道路的附加价值。将扇出封装製造从晶圆、扇出晶圆级封装 (FOWLP) 转移到大规模面板、扇出面板级封装 (FOPLP)，可能是更广泛采用的解决方案。随着消费性电子产品、汽车系统和工业设备变得更加紧凑和复杂，对先进半导体封装技术的需求不断增长。重新分布层是此过程不可或缺的一部分，它可以实现更小的外形尺寸、增加功能并提高效能。全球製造商都准备好透过生产和供应必要的材料来利用这一趋势。

包装产业的进步，特别是 2.5D 和 3D 包装技术的采用，有望成为欧洲再分布层材料市场的重要推动力。 2.5D和3D封装技术显着提高了晶片密度和功能。透过将多个半导体晶片彼此堆迭或并列堆迭，这些技术可以实现更坚固、更紧凑的电子设备。重新分布层对于在这些堆迭或相邻晶片之间建立互连至关重要，从而确保高效的资料传输和电气连接。

这些封装技术在提高效能和能源效率方面具有显着的优势。透过 2.5D 和 3D 封装，更短的互连长度和更少的讯号路径有助于更快的资料处理和更低的功耗。因此，对能够保持讯号完整性和热管理的重新分布层材料的需求变得更加重要。此外，汽车产业正在采用 2.5D 和 3D 封装，以实现先进驾驶辅助系统 (ADAS) 和自动驾驶技术的整合。这些应用依赖紧密整合的高性能半导体封装，需要可靠的再分布层材料。

全球製造商正在开发新的包装技术。例如，2021年5月，三星电子推出了I-Cube4，用于人工智慧、5G、云端和大型资料中心的高效能运算（HPC）、快速通信，并透过异质整合提高逻辑和记忆体之间的功率效率。此外，2023年9月，ASIC设计服务和IP供应商智原科技宣布推出2.5D/3D高级封装服务。 2.5D封装技术用于实现最高效能，针对HPC，如AI加速器、图形处理单元和网路处理器。封装技术的此类进步预计将促进欧洲再分布层材料市场的成长。

欧洲再分配层材料市场概况

欧洲拥有广泛的主要製造业，如航空航太、机械设备、汽车、造船和军用车辆。欧盟的汽车工业被认为是关键产业，因为它对该地区的 GDP 做出了重大贡献。欧盟是全球领先的机动车辆生产国，BMW、福斯等许多优质汽车製造商都总部设在该地区。该地区的汽车製造业每年生产约 1,920 万辆轿车、货车、巴士和卡车。大约 300 个汽车组装和製造工厂分布在该地区约 26 个国家。根据欧洲汽车製造商协会 (ACEA) 的数据，全球 21% 的汽车是由宝马、大众、奥迪和阿斯顿马丁等公司在欧盟生产的。德国占据该地区汽车市场的最大份额，即 30%。由于自动驾驶和先进驾驶辅助系统的出现，汽车製造商迅速倾向于采用汽车电子，导致对汽车电子整合的需求不断增加。这项因素推动了对半导体材料（包括再分布层材料）的需求。

中国比亚迪汽车有限公司宣布计画于2021年在欧洲建立电池生产工厂。此外，由于拥有多家电子设备製造商，匈牙利和捷克共和国是半导体的主要出口市场之一。随着欧洲对电子设备的需求不断增长，半导体封装技术的采用也不断增加。欧盟委员会的《欧洲 5G 行动计画》是欧盟私人和公共投资 5G 基础设施的蓝图。该蓝图列举了确保所有欧盟成员国采取同步措施，在 2020 年底前向所有公民提供 5G 服务的措施。此外，製造商正在致力于推出大型晶片的高效封装专案。例如，在德国，Fraunhofer IZM 正在领导一个项目，改进扇出面板级封装技术，以更高的效率封装更大的晶片。此外，作为先进封装的一部分，扇出解决方案可能对提高装置性能和频宽至关重要。这项因素正在鼓励半导体厂商、研发组织和晶片製造商推动扇出封装解决方案的开发。预计所有上述因素将在预测期内支持欧洲再分布层材料市场的成长。

欧洲再分配层材料市场收入及 2030 年预测（百万美元）

欧洲再分配层材料市场细分

欧洲再分布层材料市场根据类型、应用和国家进行细分。

根据类型，欧洲再分布层材料市场分为聚酰亚胺（PI）、聚苯并噁唑（PBO）、苯并环丁烯（BCB）等。 2022 年，聚酰亚胺 (PI) 领域占据最大份额。

依应用划分，欧洲再分布层材料市场分为扇出晶圆级封装（FOWLP）及2.5D/3D IC封装。 2.5D/3D IC 封装领域在 2022 年占据最大份额。

根据国家/地区，欧洲再分配层材料市场分为德国、奥地利、义大利和欧洲其他地区。 2022年，德国主导欧洲再分布层材料市场。

SK Hynix Inc、三星电子有限公司、英飞凌科技股份公司、杜邦de Nemours Inc、FUJIFILM Holdings Corp、Amkor Technology Inc、ASE Technology Holding Co Ltd、NXP Semiconductors NV、JCET Group Co Ltd 和Shin-Etsu Chemical Co Ltd等欧洲再分布层材料市场的领导公司之一。

目录

第 1 章：简介

第 2 章：执行摘要

  • 重要见解
  • 市场吸引力
    • 市场吸引力

第 3 章：研究方法

  • 覆盖范围
  • 二次研究
  • 初步研究

第 4 章：欧洲再分配层材料市场格局

  • 概述
  • 波特五力分析
    • 供应商的议价能力
    • 买家的议价能力
    • 新进入者的威胁
    • 竞争激烈程度
    • 替代品的威胁
  • 生态系分析
    • 原物料供应商
    • 製造商
    • 最终用途

第 5 章：欧洲再分配层材料市场 - 主要市场动态

  • 市场驱动因素
    • 越来越关注基于人工智慧的设备和工具
    • 汽车和电信业的需求不断增长
  • 市场限制
    • 原物料价格波动
  • 市场机会
    • 物联网和互联设备在各行业的激增
  • 未来的趋势
    • 封装技术的进步
  • 影响分析

第 6 章：再分配层材料市场 - 欧洲市场分析

  • 欧洲再分配层材料市场容量
  • 欧洲再分配层材料市场收入
  • 欧洲再分布层材料市场预测与分析

第 7 章：欧洲再分配层材料市场分析 - 类型

  • 聚酰亚胺 (PI)
    • 概述
    • 聚酰亚胺 (PI) 市场容量、收入和 2030 年预测
    • 聚酰亚胺 (PI) 市场、收入和 2030 年预测
  • 聚苯并噁唑 (PBO)
    • 概述
    • 聚苯并噁唑 (PBO) 市场容量、收入和 2030 年预测
    • 聚苯并噁唑 (PBO) 市场、收入和 2030 年预测
  • 苯环丁烯 (BCB)
    • 概述
    • 苯环丁烯 (BCB) 市场量、收入和 2030 年预测
    • 苯环丁烯 (BCB) 市场、收入和 2030 年预测
  • 其他的
    • 概述
    • 其他市场容量、收入和 2030 年预测
    • 其他市场容量、收入和 2030 年预测

第 8 章：欧洲再分配层材料市场分析 - 应用

  • 扇出晶圆级封装 (FOWLP)
    • 概述
    • 扇出晶圆级封装 (FOWLP) 市场、收入和 2030 年预测
  • 2 5D/3D IC 封装
    • 概述
    • 2 5D/3D IC封装市场收入及2030年预测
    • 高频宽记忆体 (HBM)
      • 高频宽记忆体 (HBM) 市场收入及 2030 年预测
    • 多晶片集成
      • 多晶片整合市场收入及 2030 年预测
    • 层迭封装 (FOPOP)
      • 层迭封装 (FOPOP) 市场收入及 2030 年预测
    • 其他的
      • 其他市场收入及 2030 年预测

第 9 章：欧洲再分配层材料市场 - 国家分析

    • 欧洲再分配层材料市场收入、预测和分析 - 按国家/地区
      • 按国家/地区分類的再分配层材料市场细分
      • 德国再分配层材料市场容量与 2030 年预测
      • 德国再分配层材料市场收入及 2030 年预测
      • 奥地利再分配层材料市场容量与 2030 年预测
      • 奥地利再分配层材料市场收入与 2030 年预测
      • 义大利再分配层材料市场容量与 2030 年预测
      • 义大利再分配层材料市场收入及2030年预测
      • 欧洲其他地区再分配层材料市场容量和 2030 年预测
      • 欧洲其他地区再分配层材料市场收入与 2030 年预测

第 10 章：竞争格局

  • 关键参与者的热图分析
  • 公司定位与专注

第 11 章：产业格局

  • 概述
  • 市场主动性
  • 新产品开发
  • 併购

第 12 章：公司简介

  • SK Hynix Inc
  • Samsung Electronics Co Ltd
  • Infineon Technologies AG
  • DuPont de Nemours Inc
  • FUJIFILM Holdings Corp
  • Amkor Technology Inc
  • ASE Technology Holding Co Ltd
  • NXP Semiconductors NV
  • JCET Group Co Ltd
  • Shin-Etsu Chemical Co Ltd

第 13 章：附录

Product Code: TIPRE00026109

The Europe redistribution layer material market was valued at US$ 15.62 million in 2022 and is expected to reach US$ 34.45 million by 2030; it is estimated to grow at a CAGR of 10.4% from 2022 to 2030.

Advancements in the Packaging Technology Drive Europe Redistribution Layer Material Market

In the quest for cost reduction, the semiconductor industry has always been involved in developing innovative solutions. One approach currently considered by the leading semiconductor players is the migration from wafer and strip size to large-size panels dedicated to IC assembly. Efficiency and economies of scale are the added value of this path. Moving fan-out package manufacturing from a wafer, Fan-Out Wafer Level Packaging (FOWLP) to a large-scale panel, Fan-Out Panel Level Packaging (FOPLP), could be the solution for a wider adoption. As consumer electronics, automotive systems, and industrial devices become more compact and complex, there is a growing need for advanced semiconductor packaging technologies. Redistribution layers are integral to this process, it enables the creasing of smaller form factors, increases functionality and improves performance. Manufacturers in across the globe are positioned to capitalize on this trend by producing and supplying the necessary materials.

Advancements in the packaging industries, specifically the adoption of 2.5D and 3D packaging technologies, are poised to be significant drivers of the Europe redistribution layer material market. 2.5D and 3D packaging technologies significantly increase chip density and functionality. By stacking multiple semiconductors die on each other or side by side, these technologies allow for more robust and compact electronic devices. Redistribution layers are essential for creating interconnections between these stacked or adjacent dies, ensuring efficient data transfer and electrical connectivity.

These packaging technologies offer notable advantages in terms of improved performance and energy efficiency. With 2.5D and 3D packaging, shorter interconnect lengths and reduced signal paths contribute to faster data processing and lower power consumption. As a result, demand for redistribution layer materials capable of maintaining signal integrity and thermal management becomes even more crucial. Furthermore, the automotive industry is embracing 2.5D and 3D packaging to enable the integration of advanced driver-assistance systems (ADAS) and autonomous driving technologies. These applications rely on tightly integrated, high-performance semiconductor packages that demand reliable redistribution layer materials.

Manufacturers across the globe are developing new packaging technologies. For instance, in May 2021, Samsung Electronics launched I-Cube4, for High-Performance Computing (HPC) to AI, 5G, cloud, and large data center, fast communication, and improving power efficiency between logic & memory through heterogeneous integration. In addition, in September 2023, Faraday Technology Corporation, an ASIC design service, and IP provider, announced the launch of its 2.5D/3D advanced package service. The 2.5D package technology is used for achieving the highest performance, targeting HPC such as AI accelerator, graph processing unit, and networking processor. Such advancements in packaging technology are expected to bolster the Europe redistribution layer material market growth.

Europe Redistribution Layer Material Market Overview

Europe has a wide presence of major manufacturing industries such as aerospace, machinery & equipment, automotive, shipbuilding, and military vehicles. The automotive industry of the EU is considered to be a crucial industry as it significantly contributes to the region's GDP. EU is the leading producer of motor vehicles across the globe, and many premium automotive manufacturers such as BMW, Volkswagen are based in the region. In the region, the vehicle manufacturing sector produces ~19.2 million cars, vans, buses, and trucks per year. Approximately 300 vehicle assembly and manufacturing facilities are located in ~26 countries across the region. According to the European Automobile Manufacturers' Association (ACEA), 21% of the cars across the world are manufactured in the EU by companies such as BMW, Volkswagen, Audi, and Aston Martin. Germany holds the largest share of the automotive market in the region, i.e., 30%. The rapid inclination of automotive manufacturers to include automotive electronics due to the emergence of autonomous driving and advanced driver-assist systems has resulted in increased demand for electronic integrations in automobiles. This factor propels the demand for semiconductor materials, including redistribution layer materials.

BYD Auto Co., Ltd, China, announced its plan in 2021 to establish a battery production plant in Europe. Furthermore, Hungary and the Czech Republic are among the key export markets for semiconductors owing to the presence of several electronic equipment manufacturers. With the growing demand for electronic equipment in Europe, the adoption of semiconductor packaging technology is also increasing. The 5G for Europe Action Plan of the EC is a blueprint for private as well as public investment in 5G infrastructure in the EU. The blueprint enumerates measures to ensure a synchronized approach among all EU Member States to make 5G available to all citizens by the end of 2020. This plan has propelled the Europe redistribution layer material market growth across Europe. Additionally, manufacturers are working on projects to launch highly efficient packaging of larger chips. For instance, in Germany, Fraunhofer IZM is leading a project to improve Fan-Out Panel Level Packaging technology for packaging larger chips with higher efficiency. Also, as a part of advanced packaging, the fan-out solutions are likely to become critical for boosting device performance and bandwidth. This factor is encouraging semiconductor players, R&D organizations, and chipmakers to promote the development of fan-out packaging solutions. All the above mentioned factors are anticipated to support the growth of the Europe redistribution layer material market during the forecast period.

Europe Redistribution Layer Material Market Revenue and Forecast to 2030 (US$ Million)

Europe Redistribution Layer Material Market Segmentation

The Europe redistribution layer material market is segmented based on type, application, and country.

Based on type, the Europe redistribution layer material market is segmented into polyimide (PI), polybenzoxazole (PBO), benzocylobutene (BCB), and others. The polyimide (PI) segment held the largest share in 2022.

By application, the Europe redistribution layer material market is segmented into fan-out wafer level packaging (FOWLP) and 2.5D/3D IC packaging. The 2.5D/3D IC packaging segment held the largest share in 2022. The 2.5D/3D IC packaging is further subsegmented into high bandwidth memory (HBM), multi-chip integration, package on package (FOPOP), and others.

Based on country, the Europe redistribution layer material market is segmented into Germany, Austria, Italy, and the Rest of Europe. Germany dominated the Europe redistribution layer material market in 2022.

SK Hynix Inc, Samsung Electronics Co Ltd, Infineon Technologies AG, DuPont de Nemours Inc, FUJIFILM Holdings Corp, Amkor Technology Inc, ASE Technology Holding Co Ltd, NXP Semiconductors NV, JCET Group Co Ltd, and Shin-Etsu Chemical Co Ltd are some of the leading companies operating in the Europe redistribution layer material market.

Table Of Contents

1. Introduction

  • 1.1 The Insight Partners Research Report Guidance
  • 1.2 Market Segmentation

2. Executive Summary

  • 2.1 Key Insights
  • 2.2 Market Attractiveness
    • 2.2.1 Market Attractiveness

3. Research Methodology

  • 3.1 Coverage
  • 3.2 Secondary Research
  • 3.3 Primary Research

4. Europe Redistribution Layer Material Market Landscape

  • 4.1 Overview
  • 4.2 Porter's Five Forces Analysis
    • 4.2.1 Bargaining Power of Suppliers
    • 4.2.2 Bargaining Power of Buyers
    • 4.2.3 Threat of New Entrants
    • 4.2.4 Intensity of Competitive Rivalry
    • 4.2.5 Threat of Substitutes
  • 4.3 Ecosystem Analysis
    • 4.3.1 Raw Material Suppliers
    • 4.3.2 Manufacturers
    • 4.3.3 End Use

5. Europe Redistribution Layer Material Market - Key Market Dynamics

  • 5.1 Market Drivers
    • 5.1.1 Growing Focus on AI-based Equipment and Tools
    • 5.1.2 Increasing Demand from Automotive and Telecommunication Industries
  • 5.2 Market Restraints
    • 5.2.1 Fluctuation in Raw Material Prices
  • 5.3 Market Opportunities
    • 5.3.1 Proliferation of IoT and Connected Devices Across Industry Verticals
  • 5.4 Future Trends
    • 5.4.1 Advancements in the Packaging Technology
  • 5.5 Impact Analysis

6. Redistribution Layer Material Market - Europe Market Analysis

  • 6.1 Europe Redistribution Layer Material Market Volume (Tons)
  • 6.2 Europe Redistribution Layer Material Market Revenue (US$ Million)
  • 6.3 Europe Redistribution Layer Material Market Forecast and Analysis

7. Europe Redistribution Layer Material Market Analysis - Type

  • 7.1 Polyimide (PI)
    • 7.1.1 Overview
    • 7.1.2 Polyimide (PI) Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)
    • 7.1.3 Polyimide (PI) Market, Revenue and Forecast to 2030 (US$ Million)
  • 7.2 Polybenzoxazole (PBO)
    • 7.2.1 Overview
    • 7.2.2 Polybenzoxazole (PBO) Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)
    • 7.2.3 Polybenzoxazole (PBO) Market, Revenue and Forecast to 2030 (Tons) (US$ Million)
  • 7.3 Benzocylobutene (BCB)
    • 7.3.1 Overview
    • 7.3.2 Benzocylobutene (BCB) Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)
    • 7.3.3 Benzocylobutene (BCB) Market, Revenue and Forecast to 2030 (Tons) (US$ Million)
  • 7.4 Others
    • 7.4.1 Overview
    • 7.4.2 Others Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)
    • 7.4.3 Others Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)

8. Europe Redistribution Layer Material Market Analysis - Application

  • 8.1 Fan-Out Wafer Level Packaging (FOWLP)
    • 8.1.1 Overview
    • 8.1.2 Fan-Out Wafer Level Packaging (FOWLP) Market, Revenue, and Forecast to 2030 (US$ Million)
  • 8.2 2 5D/3D IC Packaging
    • 8.2.1 Overview
    • 8.2.2 2 5D/3D IC Packaging Market Revenue, and Forecast to 2030 (US$ Million)
    • 8.2.3 High Bandwidth Memory (HBM)
      • 8.2.3.1 High Bandwidth Memory (HBM) Market Revenue and Forecast to 2030 (US$ Million)
    • 8.2.4 Multi-Chip Integration
      • 8.2.4.1 Multi-Chip Integration Market Revenue and Forecast to 2030 (US$ Million)
    • 8.2.5 Package on Package (FOPOP)
      • 8.2.5.1 Package on Package (FOPOP) Market Revenue and Forecast to 2030 (US$ Million)
    • 8.2.6 Others
      • 8.2.6.1 Others Market Revenue and Forecast to 2030 (US$ Million)

9. Europe Redistribution Layer Material Market - Country Analysis

    • 9.1.1 Europe Redistribution Layer Material Market Revenue and Forecasts and Analysis - By Countries
      • 9.1.1.1 Redistribution Layer Material Market Breakdown by Country
      • 9.1.1.2 Germany Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
      • 9.1.1.3 Germany Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
        • 9.1.1.3.1 Germany Redistribution Layer Material Market Breakdown by Type
        • 9.1.1.3.2 Germany Redistribution Layer Material Market Breakdown by Type
        • 9.1.1.3.3 Germany Redistribution Layer Material Market Breakdown by Application
      • 9.1.1.4 Austria Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
      • 9.1.1.5 Austria Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
        • 9.1.1.5.1 Austria Redistribution Layer Material Market Breakdown by Type
        • 9.1.1.5.2 Austria Redistribution Layer Material Market Breakdown by Type
        • 9.1.1.5.3 Austria Redistribution Layer Material Market Breakdown by Application
      • 9.1.1.6 Italy Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
      • 9.1.1.7 Italy Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
        • 9.1.1.7.1 Italy Redistribution Layer Material Market Breakdown by Type
        • 9.1.1.7.2 Italy Redistribution Layer Material Market Breakdown by Type
        • 9.1.1.7.3 Italy Redistribution Layer Material Market Breakdown by Application
      • 9.1.1.8 Rest of Europe Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
      • 9.1.1.9 Rest of Europe Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
        • 9.1.1.9.1 Rest of Europe Redistribution Layer Material Market Breakdown by Type
        • 9.1.1.9.2 Rest of Europe Redistribution Layer Material Market Breakdown by Type
        • 9.1.1.9.3 Rest of Europe Redistribution Layer Material Market Breakdown by Application

10. Competitive Landscape

  • 10.1 Heat Map Analysis by Key Players
  • 10.2 Company Positioning & Concentration

11. Industry Landscape

  • 11.1 Overview
  • 11.2 Market Initiative
  • 11.3 New Product Development
  • 11.4 Merger and Acquisition

12. Company Profiles

  • 12.1 SK Hynix Inc
    • 12.1.1 Key Facts
    • 12.1.2 Business Description
    • 12.1.3 Products and Services
    • 12.1.4 Financial Overview
    • 12.1.5 SWOT Analysis
    • 12.1.6 Key Developments
  • 12.2 Samsung Electronics Co Ltd
    • 12.2.1 Key Facts
    • 12.2.2 Business Description
    • 12.2.3 Products and Services
    • 12.2.4 Financial Overview
    • 12.2.5 SWOT Analysis
    • 12.2.6 Key Developments
  • 12.3 Infineon Technologies AG
    • 12.3.1 Key Facts
    • 12.3.2 Business Description
    • 12.3.3 Products and Services
    • 12.3.4 Financial Overview
    • 12.3.5 SWOT Analysis
    • 12.3.6 Key Developments
  • 12.4 DuPont de Nemours Inc
    • 12.4.1 Key Facts
    • 12.4.2 Business Description
    • 12.4.3 Products and Services
    • 12.4.4 Financial Overview
    • 12.4.5 SWOT Analysis
    • 12.4.6 Key Developments
  • 12.5 FUJIFILM Holdings Corp
    • 12.5.1 Key Facts
    • 12.5.2 Business Description
    • 12.5.3 Products and Services
    • 12.5.4 Financial Overview
    • 12.5.5 SWOT Analysis
    • 12.5.6 Key Developments
  • 12.6 Amkor Technology Inc
    • 12.6.1 Key Facts
    • 12.6.2 Business Description
    • 12.6.3 Products and Services
    • 12.6.4 Financial Overview
    • 12.6.5 SWOT Analysis
    • 12.6.6 Key Developments
  • 12.7 ASE Technology Holding Co Ltd
    • 12.7.1 Key Facts
    • 12.7.2 Business Description
    • 12.7.3 Products and Services
    • 12.7.4 Financial Overview
    • 12.7.5 SWOT Analysis
    • 12.7.6 Key Developments
  • 12.8 NXP Semiconductors NV
    • 12.8.1 Key Facts
    • 12.8.2 Business Description
    • 12.8.3 Products and Services
    • 12.8.4 Financial Overview
    • 12.8.5 SWOT Analysis
    • 12.8.6 Key Developments
  • 12.9 JCET Group Co Ltd
    • 12.9.1 Key Facts
    • 12.9.2 Business Description
    • 12.9.3 Products and Services
    • 12.9.4 Financial Overview
    • 12.9.5 SWOT Analysis
    • 12.9.6 Key Developments
  • 12.10 Shin-Etsu Chemical Co Ltd
    • 12.10.1 Key Facts
    • 12.10.2 Business Description
    • 12.10.3 Products and Services
    • 12.10.4 Financial Overview
    • 12.10.5 SWOT Analysis
    • 12.10.6 Key Developments

13. Appendix

List Of Tables

  • Table 1. Europe Redistribution Layer Material Market Segmentation
  • Table 2. Europe Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)
  • Table 3. Europe Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million)
  • Table 4. Europe Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - Type
  • Table 5. Europe Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) - Type
  • Table 6. Europe Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) - Application
  • Table 7. Germany Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - By Type
  • Table 8. Germany Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) - By Type
  • Table 9. Germany Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) - By Application
  • Table 10. Austria Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - By Type
  • Table 11. Austria Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) - By Type
  • Table 12. Austria Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) - By Application
  • Table 13. Italy Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - By Type
  • Table 14. Italy Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) - By Type
  • Table 15. Italy Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) - By Application
  • Table 16. Rest of Europe Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - By Type
  • Table 17. Rest of Europe Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) - By Type
  • Table 18. Rest of Europe Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million) - By Application
  • Table 19. Company Positioning & Concentration

List Of Figures

  • Figure 1. Europe Redistribution Layer Material Market Segmentation, By Country
  • Figure 2. Porter's Five Forces Analysis
  • Figure 3. Ecosystem: Europe Redistribution Layer Material Market
  • Figure 4. Market Dynamics: Europe Redistribution Layer Material Market
  • Figure 5. Europe Redistribution Layer Material Market Impact Analysis of Drivers and Restraints
  • Figure 6. Europe Redistribution Layer Material Market Volume (Tons), 2020 - 2030
  • Figure 7. Europe Redistribution Layer Material Market Revenue (US$ Million), 2020 - 2030
  • Figure 8. Europe Redistribution Layer Material Market Share (%) - Type, 2022 and 2030
  • Figure 9. Polyimide (PI) Market Volume and Forecasts To 2030 (Tons)
  • Figure 10. Polyimide (PI) Market Revenue and Forecasts To 2030 (US$ Million)
  • Figure 11. Polybenzoxazole (PBO) Market Volume and Forecasts To 2030 (Tons)
  • Figure 12. Polybenzoxazole (PBO) Market Revenue and Forecasts To 2030 (US$ Million)
  • Figure 13. Benzocylobutene (BCB) Market Volume and Forecasts To 2030 (Tons)
  • Figure 14. Benzocylobutene (BCB) Market Revenue and Forecasts To 2030 (US$ Million)
  • Figure 15. Others Market Volume and Forecasts To 2030 (Tons)
  • Figure 16. Others Market Revenue and Forecasts To 2030 (US$ Million)
  • Figure 17. Europe Redistribution Layer Material Market Share (%) - Application, 2022 and 2030
  • Figure 18. Fan-Out Wafer Level Packaging (FOWLP) Market Revenue and Forecasts To 2030 (US$ Million)
  • Figure 19. 2 5D/3D IC Packaging Market Revenue and Forecasts To 2030 (US$ Million)
  • Figure 20. High Bandwidth Memory (HBM) Market Revenue and Forecasts To 2030 (US$ Million)
  • Figure 21. Multi-Chip Integration Market Revenue and Forecasts To 2030 (US$ Million)
  • Figure 22. Package on Package (FOPOP) Market Revenue and Forecasts To 2030 (US$ Million)
  • Figure 23. Others Market Revenue and Forecasts To 2030 (US$ Million)
  • Figure 24. Europe Redistribution Layer Material Market by Key Countries - Revenue (2022) (US$ Million)
  • Figure 25. Redistribution Layer Material Market Breakdown by Key Countries, 2022 and 2030 (%)
  • Figure 26. Germany Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)
  • Figure 27. Germany Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million)
  • Figure 28. Austria Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)
  • Figure 29. Austria Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million)
  • Figure 30. Italy Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)
  • Figure 31. Italy Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million)
  • Figure 32. Rest of Europe Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)
  • Figure 33. Rest of Europe Redistribution Layer Material Market Revenue and Forecasts To 2030 (US$ Million)
  • Figure 34. Heat Map Analysis by Key Players