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封面
市场调查报告书
商品编码
1881596

晶圆製造市场－全球产业规模、份额、趋势、机会和预测，按规模、製造流程、最终用户、地区和竞争格局划分，2020-2030年预测

Wafer Fabrication Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Size, By Fabrication Process, By End-User, By Region, By Competition, 2020-2030F
出版日期: | 出版商: TechSci Research | 英文 180 Pages | 商品交期: 2-3个工作天内

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简介目录

2024年全球晶圆製造市场规模为748.3亿美元，预计2030年将以6.2%的复合年增长率成长至1,073.6亿美元。晶圆製造是指在半导体晶圆上製造集成电路的复杂多步骤工艺，这些集成电路是电子设备的基础组件。市场成长的主要驱动力是人工智慧、5G连接和自动驾驶汽车等新兴应用领域对先进半导体元件日益增长的需求。

市场概览
预测期 2026-2030
2024年市场规模 748.3亿美元
2030年市场规模 1073.6亿美元
2025-2030年复合年增长率 6.2%
成长最快的细分市场 65奈米
最大的市场 亚太地区

主要市场驱动因素

主要市场挑战

主要市场趋势

目录

第一章：产品概述

第二章：研究方法

第三章：执行概要

第四章：客户之声

第五章：全球晶圆製造市场展望

  • 市场规模及预测
    • 按价值
  • 市占率及预测
    • 依尺寸（65 nm、45 nm、32 nm、22 nm、14 nm、10 nm、7 nm）
    • 依製造工艺（后端加工、前端加工）
    • 按最终用户（整合设备製造商、代工厂、记忆体）划分
    • 按地区
    • 按公司（2024 年）
  • 市场地图

第六章：北美晶圆製造市场展望

  • 市场规模及预测
  • 市占率及预测
  • 北美洲：国家分析
    • 美国
    • 加拿大
    • 墨西哥

第七章：欧洲晶圆製造市场展望

  • 市场规模及预测
  • 市占率及预测
  • 欧洲：国家分析
    • 德国
    • 法国
    • 英国
    • 义大利
    • 西班牙

第八章：亚太地区晶圆製造市场展望

  • 市场规模及预测
  • 市占率及预测
  • 亚太地区：国家分析
    • 中国
    • 印度
    • 日本
    • 韩国
    • 澳洲

第九章：中东和非洲晶圆製造市场展望

  • 市场规模及预测
  • 市占率及预测
  • 中东和非洲：国家分析
    • 沙乌地阿拉伯
    • 阿联酋
    • 南非

第十章：南美洲晶圆製造市场展望

  • 市场规模及预测
  • 市占率及预测
  • 南美洲：国家分析
    • 巴西
    • 哥伦比亚
    • 阿根廷

第十一章：市场动态

  • 司机
  • 挑战

第十二章：市场趋势与发展

  • 併购（如有）
  • 产品发布（如有）
  • 最新进展

第十三章：全球晶圆製造市场：SWOT分析

第十四章：波特五力分析

  • 产业竞争
  • 新进入者的潜力
  • 供应商议价能力
  • 顾客的力量
  • 替代产品的威胁

第十五章：竞争格局

  • Taiwan Semiconductor Manufacturing Company Limited
  • Samsung Electronics Co., Ltd.
  • Intel Corporation
  • GlobalFoundries Inc.
  • United Microelectronics Corporation
  • SK Hynix Inc.
  • Micron Technology, Inc.
  • Semiconductor Manufacturing International Corporation
  • STMicroelectronics International NV
  • NXP Semiconductors NV

第十六章：策略建议

第17章调查会社について・免责事项

简介目录
Product Code: 22164

The Global Wafer Fabrication Market, valued at USD 74.83 Billion in 2024, is projected to experience a CAGR of 6.2% to reach USD 107.36 Billion by 2030. Wafer fabrication involves the complex multi-step process of manufacturing integrated circuits on semiconductor wafers, forming the foundational components of electronic devices. The market's growth is primarily driven by the expanding demand for advanced semiconductor devices across emerging applications such as artificial intelligence, 5G connectivity, and autonomous vehicles.

Market Overview
Forecast Period2026-2030
Market Size 2024USD 74.83 Billion
Market Size 2030USD 107.36 Billion
CAGR 2025-20306.2%
Fastest Growing Segment65 nm
Largest MarketAsia Pacific

Key Market Drivers

The burgeoning landscape of emerging advanced technologies and the relentless pursuit of semiconductor manufacturing process advancements stand as pivotal drivers propelling the global wafer fabrication market. The escalating demand for specialized chips catering to artificial intelligence, 5G connectivity, and autonomous vehicles significantly influences wafer fabrication volumes and complexity. For instance, according to SEMI, September 2024, Global Semiconductor Industry Plans to Invest $400 Billion in 300mm Fab Equipment Over Next Three Years, SEMI Reports, 300mm fab equipment spending is projected to grow by 24% to US$123.2 billion in 2025, driven by the increasing demand for artificial intelligence chips used in data centers and edge devices.

Key Market Challenges

A substantial challenge impeding the growth of the global wafer fabrication market is the significant capital expenditure required for establishing and upgrading advanced manufacturing facilities. Developing and maintaining state-of-the-art fabs necessitates immense financial outlays, encompassing the cost of land, construction, and specialized equipment. This high barrier to entry and expansion restricts the number of new market entrants and limits the pace at which existing manufacturers can increase capacity or transition to smaller process nodes, which are crucial for producing advanced semiconductor devices.

Key Market Trends

Heterogeneous Integration and 3D Packaging Expansion addresses the limitations of traditional 2D scaling by combining diverse functional blocks, such as logic, memory, and sensors, into a single, more compact, and higher-performing package. This approach enables enhanced functionality and performance-per-watt in advanced semiconductor devices crucial for high-performance computing, artificial intelligence, and mobile applications.

Key Market Players

  • Taiwan Semiconductor Manufacturing Company Limited
  • Samsung Electronics Co., Ltd.
  • Intel Corporation
  • GlobalFoundries Inc.
  • United Microelectronics Corporation
  • SK Hynix Inc.
  • Micron Technology, Inc.
  • Semiconductor Manufacturing International Corporation
  • STMicroelectronics International N.V.
  • NXP Semiconductors N.V.

Report Scope:

In this report, the Global Wafer Fabrication Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Wafer Fabrication Market, By Size:

  • 65 nm
  • 45 nm
  • 32nm
  • 22 nm
  • 14 nm
  • 10 nm
  • 7nm

Wafer Fabrication Market, By Fabrication Process:

  • The Back End of Line Processing
  • The Front End of Line Processing

Wafer Fabrication Market, By End-User:

  • Integrated Device Manufacturer
  • Foundry
  • Memory

Wafer Fabrication Market, By Region:

  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • France
    • United Kingdom
    • Italy
    • Germany
    • Spain
  • Asia Pacific
    • China
    • India
    • Japan
    • Australia
    • South Korea
  • South America
    • Brazil
    • Argentina
    • Colombia
  • Middle East & Africa
    • South Africa
    • Saudi Arabia
    • UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies presents in the Global Wafer Fabrication Market.

Available Customizations:

Global Wafer Fabrication Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

  • Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

  • 1.1. Market Definition
  • 1.2. Scope of the Market
    • 1.2.1. Markets Covered
    • 1.2.2. Years Considered for Study
    • 1.2.3. Key Market Segmentations

2. Research Methodology

  • 2.1. Objective of the Study
  • 2.2. Baseline Methodology
  • 2.3. Key Industry Partners
  • 2.4. Major Association and Secondary Sources
  • 2.5. Forecasting Methodology
  • 2.6. Data Triangulation & Validation
  • 2.7. Assumptions and Limitations

3. Executive Summary

  • 3.1. Overview of the Market
  • 3.2. Overview of Key Market Segmentations
  • 3.3. Overview of Key Market Players
  • 3.4. Overview of Key Regions/Countries
  • 3.5. Overview of Market Drivers, Challenges, Trends

4. Voice of Customer

5. Global Wafer Fabrication Market Outlook

  • 5.1. Market Size & Forecast
    • 5.1.1. By Value
  • 5.2. Market Share & Forecast
    • 5.2.1. By Size (65 nm, 45 nm, 32nm, 22 nm, 14 nm, 10 nm, 7nm)
    • 5.2.2. By Fabrication Process (The Back End of Line Processing, The Front End of Line Processing)
    • 5.2.3. By End-User (Integrated Device Manufacturer, Foundry, Memory)
    • 5.2.4. By Region
    • 5.2.5. By Company (2024)
  • 5.3. Market Map

6. North America Wafer Fabrication Market Outlook

  • 6.1. Market Size & Forecast
    • 6.1.1. By Value
  • 6.2. Market Share & Forecast
    • 6.2.1. By Size
    • 6.2.2. By Fabrication Process
    • 6.2.3. By End-User
    • 6.2.4. By Country
  • 6.3. North America: Country Analysis
    • 6.3.1. United States Wafer Fabrication Market Outlook
      • 6.3.1.1. Market Size & Forecast
        • 6.3.1.1.1. By Value
      • 6.3.1.2. Market Share & Forecast
        • 6.3.1.2.1. By Size
        • 6.3.1.2.2. By Fabrication Process
        • 6.3.1.2.3. By End-User
    • 6.3.2. Canada Wafer Fabrication Market Outlook
      • 6.3.2.1. Market Size & Forecast
        • 6.3.2.1.1. By Value
      • 6.3.2.2. Market Share & Forecast
        • 6.3.2.2.1. By Size
        • 6.3.2.2.2. By Fabrication Process
        • 6.3.2.2.3. By End-User
    • 6.3.3. Mexico Wafer Fabrication Market Outlook
      • 6.3.3.1. Market Size & Forecast
        • 6.3.3.1.1. By Value
      • 6.3.3.2. Market Share & Forecast
        • 6.3.3.2.1. By Size
        • 6.3.3.2.2. By Fabrication Process
        • 6.3.3.2.3. By End-User

7. Europe Wafer Fabrication Market Outlook

  • 7.1. Market Size & Forecast
    • 7.1.1. By Value
  • 7.2. Market Share & Forecast
    • 7.2.1. By Size
    • 7.2.2. By Fabrication Process
    • 7.2.3. By End-User
    • 7.2.4. By Country
  • 7.3. Europe: Country Analysis
    • 7.3.1. Germany Wafer Fabrication Market Outlook
      • 7.3.1.1. Market Size & Forecast
        • 7.3.1.1.1. By Value
      • 7.3.1.2. Market Share & Forecast
        • 7.3.1.2.1. By Size
        • 7.3.1.2.2. By Fabrication Process
        • 7.3.1.2.3. By End-User
    • 7.3.2. France Wafer Fabrication Market Outlook
      • 7.3.2.1. Market Size & Forecast
        • 7.3.2.1.1. By Value
      • 7.3.2.2. Market Share & Forecast
        • 7.3.2.2.1. By Size
        • 7.3.2.2.2. By Fabrication Process
        • 7.3.2.2.3. By End-User
    • 7.3.3. United Kingdom Wafer Fabrication Market Outlook
      • 7.3.3.1. Market Size & Forecast
        • 7.3.3.1.1. By Value
      • 7.3.3.2. Market Share & Forecast
        • 7.3.3.2.1. By Size
        • 7.3.3.2.2. By Fabrication Process
        • 7.3.3.2.3. By End-User
    • 7.3.4. Italy Wafer Fabrication Market Outlook
      • 7.3.4.1. Market Size & Forecast
        • 7.3.4.1.1. By Value
      • 7.3.4.2. Market Share & Forecast
        • 7.3.4.2.1. By Size
        • 7.3.4.2.2. By Fabrication Process
        • 7.3.4.2.3. By End-User
    • 7.3.5. Spain Wafer Fabrication Market Outlook
      • 7.3.5.1. Market Size & Forecast
        • 7.3.5.1.1. By Value
      • 7.3.5.2. Market Share & Forecast
        • 7.3.5.2.1. By Size
        • 7.3.5.2.2. By Fabrication Process
        • 7.3.5.2.3. By End-User

8. Asia Pacific Wafer Fabrication Market Outlook

  • 8.1. Market Size & Forecast
    • 8.1.1. By Value
  • 8.2. Market Share & Forecast
    • 8.2.1. By Size
    • 8.2.2. By Fabrication Process
    • 8.2.3. By End-User
    • 8.2.4. By Country
  • 8.3. Asia Pacific: Country Analysis
    • 8.3.1. China Wafer Fabrication Market Outlook
      • 8.3.1.1. Market Size & Forecast
        • 8.3.1.1.1. By Value
      • 8.3.1.2. Market Share & Forecast
        • 8.3.1.2.1. By Size
        • 8.3.1.2.2. By Fabrication Process
        • 8.3.1.2.3. By End-User
    • 8.3.2. India Wafer Fabrication Market Outlook
      • 8.3.2.1. Market Size & Forecast
        • 8.3.2.1.1. By Value
      • 8.3.2.2. Market Share & Forecast
        • 8.3.2.2.1. By Size
        • 8.3.2.2.2. By Fabrication Process
        • 8.3.2.2.3. By End-User
    • 8.3.3. Japan Wafer Fabrication Market Outlook
      • 8.3.3.1. Market Size & Forecast
        • 8.3.3.1.1. By Value
      • 8.3.3.2. Market Share & Forecast
        • 8.3.3.2.1. By Size
        • 8.3.3.2.2. By Fabrication Process
        • 8.3.3.2.3. By End-User
    • 8.3.4. South Korea Wafer Fabrication Market Outlook
      • 8.3.4.1. Market Size & Forecast
        • 8.3.4.1.1. By Value
      • 8.3.4.2. Market Share & Forecast
        • 8.3.4.2.1. By Size
        • 8.3.4.2.2. By Fabrication Process
        • 8.3.4.2.3. By End-User
    • 8.3.5. Australia Wafer Fabrication Market Outlook
      • 8.3.5.1. Market Size & Forecast
        • 8.3.5.1.1. By Value
      • 8.3.5.2. Market Share & Forecast
        • 8.3.5.2.1. By Size
        • 8.3.5.2.2. By Fabrication Process
        • 8.3.5.2.3. By End-User

9. Middle East & Africa Wafer Fabrication Market Outlook

  • 9.1. Market Size & Forecast
    • 9.1.1. By Value
  • 9.2. Market Share & Forecast
    • 9.2.1. By Size
    • 9.2.2. By Fabrication Process
    • 9.2.3. By End-User
    • 9.2.4. By Country
  • 9.3. Middle East & Africa: Country Analysis
    • 9.3.1. Saudi Arabia Wafer Fabrication Market Outlook
      • 9.3.1.1. Market Size & Forecast
        • 9.3.1.1.1. By Value
      • 9.3.1.2. Market Share & Forecast
        • 9.3.1.2.1. By Size
        • 9.3.1.2.2. By Fabrication Process
        • 9.3.1.2.3. By End-User
    • 9.3.2. UAE Wafer Fabrication Market Outlook
      • 9.3.2.1. Market Size & Forecast
        • 9.3.2.1.1. By Value
      • 9.3.2.2. Market Share & Forecast
        • 9.3.2.2.1. By Size
        • 9.3.2.2.2. By Fabrication Process
        • 9.3.2.2.3. By End-User
    • 9.3.3. South Africa Wafer Fabrication Market Outlook
      • 9.3.3.1. Market Size & Forecast
        • 9.3.3.1.1. By Value
      • 9.3.3.2. Market Share & Forecast
        • 9.3.3.2.1. By Size
        • 9.3.3.2.2. By Fabrication Process
        • 9.3.3.2.3. By End-User

10. South America Wafer Fabrication Market Outlook

  • 10.1. Market Size & Forecast
    • 10.1.1. By Value
  • 10.2. Market Share & Forecast
    • 10.2.1. By Size
    • 10.2.2. By Fabrication Process
    • 10.2.3. By End-User
    • 10.2.4. By Country
  • 10.3. South America: Country Analysis
    • 10.3.1. Brazil Wafer Fabrication Market Outlook
      • 10.3.1.1. Market Size & Forecast
        • 10.3.1.1.1. By Value
      • 10.3.1.2. Market Share & Forecast
        • 10.3.1.2.1. By Size
        • 10.3.1.2.2. By Fabrication Process
        • 10.3.1.2.3. By End-User
    • 10.3.2. Colombia Wafer Fabrication Market Outlook
      • 10.3.2.1. Market Size & Forecast
        • 10.3.2.1.1. By Value
      • 10.3.2.2. Market Share & Forecast
        • 10.3.2.2.1. By Size
        • 10.3.2.2.2. By Fabrication Process
        • 10.3.2.2.3. By End-User
    • 10.3.3. Argentina Wafer Fabrication Market Outlook
      • 10.3.3.1. Market Size & Forecast
        • 10.3.3.1.1. By Value
      • 10.3.3.2. Market Share & Forecast
        • 10.3.3.2.1. By Size
        • 10.3.3.2.2. By Fabrication Process
        • 10.3.3.2.3. By End-User

11. Market Dynamics

  • 11.1. Drivers
  • 11.2. Challenges

12. Market Trends & Developments

  • 12.1. Merger & Acquisition (If Any)
  • 12.2. Product Launches (If Any)
  • 12.3. Recent Developments

13. Global Wafer Fabrication Market: SWOT Analysis

14. Porter's Five Forces Analysis

  • 14.1. Competition in the Industry
  • 14.2. Potential of New Entrants
  • 14.3. Power of Suppliers
  • 14.4. Power of Customers
  • 14.5. Threat of Substitute Products

15. Competitive Landscape

  • 15.1. Taiwan Semiconductor Manufacturing Company Limited
    • 15.1.1. Business Overview
    • 15.1.2. Products & Services
    • 15.1.3. Recent Developments
    • 15.1.4. Key Personnel
    • 15.1.5. SWOT Analysis
  • 15.2. Samsung Electronics Co., Ltd.
  • 15.3. Intel Corporation
  • 15.4. GlobalFoundries Inc.
  • 15.5. United Microelectronics Corporation
  • 15.6. SK Hynix Inc.
  • 15.7. Micron Technology, Inc.
  • 15.8. Semiconductor Manufacturing International Corporation
  • 15.9. STMicroelectronics International N.V.
  • 15.10. NXP Semiconductors N.V.

16. Strategic Recommendations

17. About Us & Disclaimer