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市场调查报告书
商品编码
1757903

全球晶圆厂设备市场

Wafer Fab Equipment
出版日期: | 出版商: Global Industry Analysts, Inc. | 英文 233 Pages | 商品交期: 最快1-2个工作天内

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简介目录

预计到 2030 年全球晶圆厂设备市场规模将达 744 亿美元

全球晶圆厂设备市场规模预计在2024年为646亿美元，预计到2030年将达到744亿美元，2024年至2030年的复合年增长率为2.4%。本报告分析的细分市场之一—前段製程—预计复合年增长率为1.9%，到分析期结束时规模将达到479亿美元。后段製程细分市场在分析期间的复合年增长率预计为3.4%。

美国市场规模估计为 170 亿美元，中国市场预计复合年增长率为 2.3%

美国晶圆厂设备市场规模预计2024年达到170亿美元。预计到2030年，作为世界第二大经济体的中国市场规模将达到120亿美元，在2024-2030年的分析期内，复合年增长率为2.3%。其他值得关注的区域市场包括日本和加拿大，预计在分析期间内，这两个市场的复合年增长率分别为2.2%和1.9%。在欧洲，预计德国市场的复合年增长率为2.0%。

全球「晶圆厂设备」市场—主要趋势与驱动因素摘要

为什么晶圆厂设备是全球半导体繁荣的核心

随着全球经济数位化，晶圆製造 (fab) 设备已成为生产几乎所有电子设备所需的半导体的核心。从智慧型手机和笔记型电脑到电动车和资料中心，对半导体的需求不仅在成长，而且呈现加速趋势。晶圆製造设备是积体电路 (IC) 製造的基础，包括用于微影术、沉淀、蚀刻、离子布植和清洗等製程的机器。这些精密工具使製造商能够以奈米级的间隔操纵硅晶圆，以提高晶片的性能、效率并使其微型化。 5G、人工智慧 (AI)、物联网 (IoT) 和高效能运算 (HPC) 等技术的爆炸性成长给半导体供应链带来了巨大压力，促使代工厂和集成设备製造商 (IDM) 迅速扩大产能并采用尖端设备。此外，近期全球危机暴露的地缘政治变化和供应脆弱性，促使各国政府大力投资国内晶片生产，尤其是在美国、欧洲和东亚地区，这进一步推动了对先进晶圆厂设备的需求。因此，该行业不仅在成长，而且正在成为现代技术进步的支柱。

技术节点和製程复杂性如何影响设备创新？

人们不断追求更小、更快、更有效率的晶片，这推动着晶圆厂设备技术发生惊人的变革。随着产业向 7 奈米、5 奈米甚至 3 奈米製程节点迈进，半导体製造的复杂性呈指数级增长。尖端製造需要极紫外线 (EUV)微影术系统，该系统能够以无与伦比的精度对极小的特征图形化。 ASML、应用材料、东京电子和泛林集团等公司处于开发下一代沉积、蚀刻和计量工具的前沿，以满足这些节点的独特需求。不断增加的电晶体密度、3D 晶片堆迭和环栅 (GAA) 电晶体架构正在推动设备製造商开发新材料和原子级处理技术。此外，随着可变性变得越来越重要，即时数据分析和人工智慧主导的控制系统正在整合到晶圆厂工具中，以优化产量比率和检测异常。这催生了「智慧晶圆厂」的兴起，设备不再只是硬件，而是一个数位连接、自我修正的生态系统的一部分。随着晶圆厂规模和复杂程度的不断增长，能源效率、污染控制和永续性也成为关键的设计重点——毕竟，最新晶片的复杂程度直接体现在製造晶片所用工具的创新上。

全球晶圆製造基础建设投资集中在哪里？

全球晶圆厂设备投资主要集中在那些在半导体生产领域占据主导地位且致力于技术自给自足的地区。台湾、韩国、中国大陆和日本在晶圆厂建设和设备进口方面处于领先地位。台湾的台积电、韩国的三星和中国大陆的中芯国际正在先进和传统节点製造领域投资数十亿美元，确保各类晶圆厂设备的需求稳定。为因应地缘政治紧张局势和供应链风险，美国已通过《晶片法案》和《科学法案》等立法，启动了一项大规模补贴计划，以振兴国内製造业。英特尔和格芯等美国公司正在积极建造新工厂，这进一步刺激了设备需求。欧洲也正在通过《欧洲晶片法案》等倡议，加强其半导体发展力度，目标是到2030年将其在全球晶片产量中的份额翻倍。此外，东南亚正在崛起成为后端流程和设备服务的战略中心，而印度也积极吸引投资，以期成为未来的半导体製造地。这波投资浪潮反映出全球不仅在生产晶片方面的竞争，而且在控制晶圆级生产资料方面的竞争。

有几个因素正在推动晶圆厂设备市场的成长…

晶圆厂设备市场的成长受到与半导体技术进步、区域产能扩张和不断变化的最终用户需求相关的多种因素的驱动。最大的驱动力之一是向先进节点（5nm 及以下）的发展，这需要高度专业化的微影术、沉积和蚀刻设备来处理更精细的几何形状和复杂的电晶体结构。人工智慧、5G、边缘运算和自主系统的普及正在推动对高效能、低功耗晶片的需求，扩大尖端设备的潜在市场。同时，在汽车、工业和物联网领域需求的推动下，传统节点的製造依然强劲，这也确保了成熟製程工具的成长。主要在美国、欧盟、韩国和中国的区域投资激励措施正在刺激工厂建设并推动跨技术节点设备的大量购买。此外，向小型晶片架构和异质整合整合的转变正在刺激对先进封装设备和特定製程创新的需求。透过人工智慧、机器学习和巨量资料的集成，晶圆厂营运中的硬体和软体融合也为设备供应商创造了新的价值炼和服务机会。晶圆厂设备是半导体生态系的重要支柱，随着全球硅片需求的持续飙升，其规模也持续扩张。

部分

製造流程（前段製程、后段製程）、节点尺寸（7nm及以下、10nm、14nm、22nm、65nm及以上）、最终用途（代工厂、记忆体、集成设备製造商、其他最终用途）

调查企业范例（共44家企业）

  • Advantest Corporation
  • Applied Materials, Inc.
  • ASM International NV
  • ASML Holding NV
  • Brooks Automation, Inc.
  • Canon Inc.
  • Dainippon Screen Mfg. Co., Ltd.
  • Ebara Corporation
  • EV Group（EVG）
  • Hitachi High-Tech Corporation
  • KLA Corporation
  • Lam Research Corporation
  • Nikon Corporation
  • Plasma-Therm LLC
  • Rudolph Technologies, Inc.
  • SUSS MicroTec SE
  • Teradyne, Inc.
  • Tokyo Electron Limited（TEL）
  • ULVAC, Inc.
  • Veeco Instruments Inc.

人工智慧集成

我们正在利用可操作的专家内容和人工智慧工具来改变市场和竞争情报。

Global 特定产业SLM 的典型规范，而是建立了一个从全球专家收集的内容库，其中包括视讯录影、部落格、搜寻引擎研究以及大量的公司、产品/服务和市场数据。

关税影响係数

全球产业分析师根据公司总部所在国家、製造地、进出口状况（成品和原始OEM）预测其竞争态势的变化。这种复杂且多面向的市场动态预计将以多种方式影响竞争对手，包括销货成本成本 (COGS) 上升、盈利下降、供应链重组以及其他微观和宏观市场动态。

目录

第一章调查方法

第二章执行摘要

  • 市场概览
  • 主要企业
  • 市场趋势和驱动因素
  • 全球市场展望

第三章市场分析

  • 美国
  • 加拿大
  • 日本
  • 中国
  • 欧洲
  • 法国
  • 德国
  • 义大利
  • 英国
  • 其他欧洲国家
  • 亚太地区
  • 其他地区

第四章 比赛

简介目录
Product Code: MCP35992

Global Wafer Fab Equipment Market to Reach US$74.4 Billion by 2030

The global market for Wafer Fab Equipment estimated at US$64.6 Billion in the year 2024, is expected to reach US$74.4 Billion by 2030, growing at a CAGR of 2.4% over the analysis period 2024-2030. Front-End-of-Line Processing, one of the segments analyzed in the report, is expected to record a 1.9% CAGR and reach US$47.9 Billion by the end of the analysis period. Growth in the Back-End-of-Line Processing segment is estimated at 3.4% CAGR over the analysis period.

The U.S. Market is Estimated at US$17.0 Billion While China is Forecast to Grow at 2.3% CAGR

The Wafer Fab Equipment market in the U.S. is estimated at US$17.0 Billion in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$12.0 Billion by the year 2030 trailing a CAGR of 2.3% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 2.2% and 1.9% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 2.0% CAGR.

Global "Wafer Fab Equipment" Market - Key Trends & Drivers Summarized

Why Is Wafer Fab Equipment at the Core of the Global Semiconductor Boom?

As the global economy becomes increasingly digitized, wafer fabrication (fab) equipment has taken center stage in the production of semiconductors that power virtually every electronic device in existence. From smartphones and laptops to electric vehicles and data centers, the demand for semiconductors is not only rising-it’s accelerating. Wafer fab equipment, which includes machinery used for processes such as photolithography, deposition, etching, ion implantation, and cleaning, is foundational to the manufacture of integrated circuits (ICs). These precision tools enable manufacturers to manipulate silicon wafers at the nanometer scale, ensuring the performance, efficiency, and miniaturization of chips. The explosion of technologies like 5G, artificial intelligence (AI), Internet of Things (IoT), and high-performance computing (HPC) has put enormous pressure on semiconductor supply chains, pushing foundries and integrated device manufacturers (IDMs) to rapidly expand capacity and adopt cutting-edge equipment. Moreover, geopolitical shifts and supply vulnerabilities exposed by recent global crises have led to substantial government investments in domestic chip production-particularly in the U.S., Europe, and East Asia-further boosting demand for advanced fab equipment. As a result, this segment is not just growing-it’s becoming the backbone of modern technological progress.

How Are Technology Nodes and Process Complexity Influencing Equipment Innovation?

The relentless march toward smaller, faster, and more efficient chips is driving an extraordinary evolution in wafer fab equipment technology. As the industry moves below the 7nm, 5nm, and even 3nm process nodes, the complexity of semiconductor manufacturing has grown exponentially. Leading-edge fabrication now requires extreme ultraviolet (EUV) lithography systems capable of patterning minuscule features with unparalleled precision. Companies like ASML, Applied Materials, Tokyo Electron, and Lam Research are at the forefront of developing next-gen tools for deposition, etching, and metrology that can meet the unique demands of these nodes. Increasing transistor density, 3D chip stacking, and gate-all-around (GAA) transistor architecture are pushing equipment makers to develop new materials and atomic-level processing techniques. Additionally, as variability becomes more critical, real-time data analytics and AI-driven control systems are being integrated into fab tools to optimize yield and detect anomalies. This has given rise to “smart fabs” where equipment is no longer just hardware, but part of a digitally connected, self-correcting ecosystem. Energy efficiency, contamination control, and sustainability are also becoming key design priorities as fabs grow in size and complexity. In essence, the sophistication of modern chips is directly mirrored by the innovation in the tools used to produce them.

Where Is the Global Investment in Wafer Fabrication Infrastructure Concentrated?

Global investment in wafer fab equipment is largely concentrated in regions that dominate semiconductor production and are investing in technological self-sufficiency. East Asia remains the powerhouse of the semiconductor world, with Taiwan, South Korea, China, and Japan leading the way in fab construction and equipment imports. Taiwan’s TSMC, South Korea’s Samsung, and China’s SMIC are making multi-billion-dollar investments in both advanced and legacy node manufacturing, ensuring a steady demand pipeline for all categories of fab equipment. The United States, in response to geopolitical tensions and supply chain risks, has initiated substantial subsidies through legislation such as the CHIPS and Science Act to spur domestic manufacturing. Intel, GlobalFoundries, and other U.S.-based players are constructing new facilities with aggressive timelines, further bolstering equipment demand. Europe, too, is ramping up its semiconductor ambitions through initiatives like the European Chips Act, aiming to double its share of global chip production by 2030. Additionally, Southeast Asia is emerging as a strategic hub for backend processes and equipment servicing, while India is actively courting investments to become a future semiconductor manufacturing base. This wave of investment reflects a global race not just to produce chips-but to control the means of production at the wafer level.

The Growth in the Wafer Fab Equipment Market Is Driven by Several Factors…

The growth in the wafer fab equipment market is driven by several factors linked to semiconductor technology advancements, regional capacity expansion, and evolving end-user requirements. One of the foremost drivers is the push toward advanced nodes (5nm and below), which necessitate highly specialized lithography, deposition, and etch equipment to handle smaller geometries and complex transistor structures. The proliferation of AI, 5G, edge computing, and autonomous systems is fueling the need for high-performance, low-power chips-thereby expanding the addressable market for leading-edge equipment. In parallel, legacy node manufacturing remains robust due to demand from automotive, industrial, and IoT sectors, ensuring growth in mature process tools as well. Regional investment incentives, particularly from the U.S., EU, South Korea, and China, are stimulating fab construction and driving bulk purchases of equipment across technology nodes. Additionally, the move toward chiplet architectures and heterogeneous integration is spurring demand for advanced packaging equipment and process-specific innovation. The convergence of hardware and software in fab operations-through the integration of AI, machine learning, and big data-has also created new value chains and service opportunities for equipment vendors. As the global appetite for silicon continues to surge, wafer fab equipment remains an essential and expanding pillar of the semiconductor ecosystem.

SCOPE OF STUDY:

The report analyzes the Wafer Fab Equipment market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Fabrication Process (Front-End-of-Line Processing, Back-End-of-Line Processing); Node Size (7 Nm & Below, 10 Nm, 14 Nm, 22 Nm, 65 Nm & Above); End-Use (Foundry, Memory, Integrated Device Manufacturer, Other End-Uses)

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; and Rest of Europe); Asia-Pacific; Rest of World.

Select Competitors (Total 44 Featured) -

  • Advantest Corporation
  • Applied Materials, Inc.
  • ASM International N.V.
  • ASML Holding N.V.
  • Brooks Automation, Inc.
  • Canon Inc.
  • Dainippon Screen Mfg. Co., Ltd.
  • Ebara Corporation
  • EV Group (EVG)
  • Hitachi High-Tech Corporation
  • KLA Corporation
  • Lam Research Corporation
  • Nikon Corporation
  • Plasma-Therm LLC
  • Rudolph Technologies, Inc.
  • SUSS MicroTec SE
  • Teradyne, Inc.
  • Tokyo Electron Limited (TEL)
  • ULVAC, Inc.
  • Veeco Instruments Inc.

AI INTEGRATIONS

We're transforming market and competitive intelligence with validated expert content and AI tools.

Instead of following the general norm of querying LLMs and Industry-specific SLMs, we built repositories of content curated from domain experts worldwide including video transcripts, blogs, search engines research, and massive amounts of enterprise, product/service, and market data.

TARIFF IMPACT FACTOR

Our new release incorporates impact of tariffs on geographical markets as we predict a shift in competitiveness of companies based on HQ country, manufacturing base, exports and imports (finished goods and OEM). This intricate and multifaceted market reality will impact competitors by increasing the Cost of Goods Sold (COGS), reducing profitability, reconfiguring supply chains, amongst other micro and macro market dynamics.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Influencer Market Insights
    • World Market Trajectories
    • Tariff Impact on Global Supply Chain Patterns
    • Wafer Fab Equipment - Global Key Competitors Percentage Market Share in 2025 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2025 (E)
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • Escalating Demand for Advanced Semiconductor Nodes Propels Growth in Wafer Fab Equipment
    • Rise of AI, HPC, and Data Center Markets Expands Demand for Cutting-Edge Fabrication Tools
    • Miniaturization of Devices Strengthens Business Case for EUV Lithography Systems
    • Increasing Chip Complexity and Layer Count Spur Adoption of Advanced Etching and Deposition Equipment
    • Surge in Electric Vehicle Production Generates Demand for Power Semiconductor Manufacturing
    • Technological Innovations in Process Control Tools Sustain Equipment Market Momentum
    • Expansion of 3D Packaging and Heterogeneous Integration Throws Spotlight on Backend Fab Equipment
    • Supply Chain Resilience Efforts Create Opportunities for Localized Equipment Production
    • Rising Importance of Yield Optimization Drives Adoption of AI-Powered Monitoring Systems
    • Continued Foundry Competition Spurs Capex in Cutting-Edge Tooling
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Wafer Fab Equipment Market Analysis of Annual Sales in US$ Million for Years 2015 through 2030
    • TABLE 2: World Recent Past, Current & Future Analysis for Wafer Fab Equipment by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 3: World Historic Review for Wafer Fab Equipment by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 4: World 15-Year Perspective for Wafer Fab Equipment by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2015, 2025 & 2030
    • TABLE 5: World Recent Past, Current & Future Analysis for Front-End-of-Line Processing by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 6: World Historic Review for Front-End-of-Line Processing by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 7: World 15-Year Perspective for Front-End-of-Line Processing by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 8: World Recent Past, Current & Future Analysis for Back-End-of-Line Processing by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 9: World Historic Review for Back-End-of-Line Processing by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 10: World 15-Year Perspective for Back-End-of-Line Processing by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 11: World Recent Past, Current & Future Analysis for Integrated Device Manufacturer by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 12: World Historic Review for Integrated Device Manufacturer by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 13: World 15-Year Perspective for Integrated Device Manufacturer by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 14: World Recent Past, Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 15: World Historic Review for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 16: World 15-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 17: World Recent Past, Current & Future Analysis for Foundry by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 18: World Historic Review for Foundry by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 19: World 15-Year Perspective for Foundry by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 20: World Recent Past, Current & Future Analysis for Memory by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 21: World Historic Review for Memory by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 22: World 15-Year Perspective for Memory by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 23: World Recent Past, Current & Future Analysis for 7 Nm & Below by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 24: World Historic Review for 7 Nm & Below by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 25: World 15-Year Perspective for 7 Nm & Below by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 26: World Recent Past, Current & Future Analysis for 10 Nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 27: World Historic Review for 10 Nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 28: World 15-Year Perspective for 10 Nm by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 29: World Recent Past, Current & Future Analysis for 14 Nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 30: World Historic Review for 14 Nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 31: World 15-Year Perspective for 14 Nm by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 32: World Recent Past, Current & Future Analysis for 22 Nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 33: World Historic Review for 22 Nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 34: World 15-Year Perspective for 22 Nm by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 35: World Recent Past, Current & Future Analysis for 65 Nm & Above by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 36: World Historic Review for 65 Nm & Above by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 37: World 15-Year Perspective for 65 Nm & Above by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • Wafer Fab Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2025 (E)
    • TABLE 38: USA Recent Past, Current & Future Analysis for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 39: USA Historic Review for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 40: USA 15-Year Perspective for Wafer Fab Equipment by Fabrication Process - Percentage Breakdown of Value Sales for Front-End-of-Line Processing and Back-End-of-Line Processing for the Years 2015, 2025 & 2030
    • TABLE 41: USA Recent Past, Current & Future Analysis for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 42: USA Historic Review for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 43: USA 15-Year Perspective for Wafer Fab Equipment by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer, Other End-Uses, Foundry and Memory for the Years 2015, 2025 & 2030
    • TABLE 44: USA Recent Past, Current & Future Analysis for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 45: USA Historic Review for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 46: USA 15-Year Perspective for Wafer Fab Equipment by Node Size - Percentage Breakdown of Value Sales for 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above for the Years 2015, 2025 & 2030
  • CANADA
    • TABLE 47: Canada Recent Past, Current & Future Analysis for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 48: Canada Historic Review for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 49: Canada 15-Year Perspective for Wafer Fab Equipment by Fabrication Process - Percentage Breakdown of Value Sales for Front-End-of-Line Processing and Back-End-of-Line Processing for the Years 2015, 2025 & 2030
    • TABLE 50: Canada Recent Past, Current & Future Analysis for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 51: Canada Historic Review for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 52: Canada 15-Year Perspective for Wafer Fab Equipment by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer, Other End-Uses, Foundry and Memory for the Years 2015, 2025 & 2030
    • TABLE 53: Canada Recent Past, Current & Future Analysis for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 54: Canada Historic Review for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 55: Canada 15-Year Perspective for Wafer Fab Equipment by Node Size - Percentage Breakdown of Value Sales for 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above for the Years 2015, 2025 & 2030
  • JAPAN
    • Wafer Fab Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2025 (E)
    • TABLE 56: Japan Recent Past, Current & Future Analysis for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 57: Japan Historic Review for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 58: Japan 15-Year Perspective for Wafer Fab Equipment by Fabrication Process - Percentage Breakdown of Value Sales for Front-End-of-Line Processing and Back-End-of-Line Processing for the Years 2015, 2025 & 2030
    • TABLE 59: Japan Recent Past, Current & Future Analysis for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 60: Japan Historic Review for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 61: Japan 15-Year Perspective for Wafer Fab Equipment by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer, Other End-Uses, Foundry and Memory for the Years 2015, 2025 & 2030
    • TABLE 62: Japan Recent Past, Current & Future Analysis for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 63: Japan Historic Review for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 64: Japan 15-Year Perspective for Wafer Fab Equipment by Node Size - Percentage Breakdown of Value Sales for 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above for the Years 2015, 2025 & 2030
  • CHINA
    • Wafer Fab Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2025 (E)
    • TABLE 65: China Recent Past, Current & Future Analysis for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 66: China Historic Review for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 67: China 15-Year Perspective for Wafer Fab Equipment by Fabrication Process - Percentage Breakdown of Value Sales for Front-End-of-Line Processing and Back-End-of-Line Processing for the Years 2015, 2025 & 2030
    • TABLE 68: China Recent Past, Current & Future Analysis for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 69: China Historic Review for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 70: China 15-Year Perspective for Wafer Fab Equipment by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer, Other End-Uses, Foundry and Memory for the Years 2015, 2025 & 2030
    • TABLE 71: China Recent Past, Current & Future Analysis for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 72: China Historic Review for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 73: China 15-Year Perspective for Wafer Fab Equipment by Node Size - Percentage Breakdown of Value Sales for 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above for the Years 2015, 2025 & 2030
  • EUROPE
    • Wafer Fab Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2025 (E)
    • TABLE 74: Europe Recent Past, Current & Future Analysis for Wafer Fab Equipment by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 75: Europe Historic Review for Wafer Fab Equipment by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 76: Europe 15-Year Perspective for Wafer Fab Equipment by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2015, 2025 & 2030
    • TABLE 77: Europe Recent Past, Current & Future Analysis for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 78: Europe Historic Review for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 79: Europe 15-Year Perspective for Wafer Fab Equipment by Fabrication Process - Percentage Breakdown of Value Sales for Front-End-of-Line Processing and Back-End-of-Line Processing for the Years 2015, 2025 & 2030
    • TABLE 80: Europe Recent Past, Current & Future Analysis for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 81: Europe Historic Review for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 82: Europe 15-Year Perspective for Wafer Fab Equipment by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer, Other End-Uses, Foundry and Memory for the Years 2015, 2025 & 2030
    • TABLE 83: Europe Recent Past, Current & Future Analysis for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 84: Europe Historic Review for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 85: Europe 15-Year Perspective for Wafer Fab Equipment by Node Size - Percentage Breakdown of Value Sales for 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above for the Years 2015, 2025 & 2030
  • FRANCE
    • Wafer Fab Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2025 (E)
    • TABLE 86: France Recent Past, Current & Future Analysis for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 87: France Historic Review for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 88: France 15-Year Perspective for Wafer Fab Equipment by Fabrication Process - Percentage Breakdown of Value Sales for Front-End-of-Line Processing and Back-End-of-Line Processing for the Years 2015, 2025 & 2030
    • TABLE 89: France Recent Past, Current & Future Analysis for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 90: France Historic Review for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 91: France 15-Year Perspective for Wafer Fab Equipment by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer, Other End-Uses, Foundry and Memory for the Years 2015, 2025 & 2030
    • TABLE 92: France Recent Past, Current & Future Analysis for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 93: France Historic Review for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 94: France 15-Year Perspective for Wafer Fab Equipment by Node Size - Percentage Breakdown of Value Sales for 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above for the Years 2015, 2025 & 2030
  • GERMANY
    • Wafer Fab Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2025 (E)
    • TABLE 95: Germany Recent Past, Current & Future Analysis for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 96: Germany Historic Review for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 97: Germany 15-Year Perspective for Wafer Fab Equipment by Fabrication Process - Percentage Breakdown of Value Sales for Front-End-of-Line Processing and Back-End-of-Line Processing for the Years 2015, 2025 & 2030
    • TABLE 98: Germany Recent Past, Current & Future Analysis for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 99: Germany Historic Review for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 100: Germany 15-Year Perspective for Wafer Fab Equipment by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer, Other End-Uses, Foundry and Memory for the Years 2015, 2025 & 2030
    • TABLE 101: Germany Recent Past, Current & Future Analysis for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 102: Germany Historic Review for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 103: Germany 15-Year Perspective for Wafer Fab Equipment by Node Size - Percentage Breakdown of Value Sales for 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above for the Years 2015, 2025 & 2030
  • ITALY
    • TABLE 104: Italy Recent Past, Current & Future Analysis for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 105: Italy Historic Review for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 106: Italy 15-Year Perspective for Wafer Fab Equipment by Fabrication Process - Percentage Breakdown of Value Sales for Front-End-of-Line Processing and Back-End-of-Line Processing for the Years 2015, 2025 & 2030
    • TABLE 107: Italy Recent Past, Current & Future Analysis for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 108: Italy Historic Review for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 109: Italy 15-Year Perspective for Wafer Fab Equipment by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer, Other End-Uses, Foundry and Memory for the Years 2015, 2025 & 2030
    • TABLE 110: Italy Recent Past, Current & Future Analysis for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 111: Italy Historic Review for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 112: Italy 15-Year Perspective for Wafer Fab Equipment by Node Size - Percentage Breakdown of Value Sales for 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above for the Years 2015, 2025 & 2030
  • UNITED KINGDOM
    • Wafer Fab Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2025 (E)
    • TABLE 113: UK Recent Past, Current & Future Analysis for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 114: UK Historic Review for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 115: UK 15-Year Perspective for Wafer Fab Equipment by Fabrication Process - Percentage Breakdown of Value Sales for Front-End-of-Line Processing and Back-End-of-Line Processing for the Years 2015, 2025 & 2030
    • TABLE 116: UK Recent Past, Current & Future Analysis for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 117: UK Historic Review for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 118: UK 15-Year Perspective for Wafer Fab Equipment by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer, Other End-Uses, Foundry and Memory for the Years 2015, 2025 & 2030
    • TABLE 119: UK Recent Past, Current & Future Analysis for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 120: UK Historic Review for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 121: UK 15-Year Perspective for Wafer Fab Equipment by Node Size - Percentage Breakdown of Value Sales for 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above for the Years 2015, 2025 & 2030
  • REST OF EUROPE
    • TABLE 122: Rest of Europe Recent Past, Current & Future Analysis for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 123: Rest of Europe Historic Review for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 124: Rest of Europe 15-Year Perspective for Wafer Fab Equipment by Fabrication Process - Percentage Breakdown of Value Sales for Front-End-of-Line Processing and Back-End-of-Line Processing for the Years 2015, 2025 & 2030
    • TABLE 125: Rest of Europe Recent Past, Current & Future Analysis for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 126: Rest of Europe Historic Review for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 127: Rest of Europe 15-Year Perspective for Wafer Fab Equipment by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer, Other End-Uses, Foundry and Memory for the Years 2015, 2025 & 2030
    • TABLE 128: Rest of Europe Recent Past, Current & Future Analysis for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 129: Rest of Europe Historic Review for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 130: Rest of Europe 15-Year Perspective for Wafer Fab Equipment by Node Size - Percentage Breakdown of Value Sales for 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above for the Years 2015, 2025 & 2030
  • ASIA-PACIFIC
    • Wafer Fab Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2025 (E)
    • TABLE 131: Asia-Pacific Recent Past, Current & Future Analysis for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 132: Asia-Pacific Historic Review for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 133: Asia-Pacific 15-Year Perspective for Wafer Fab Equipment by Fabrication Process - Percentage Breakdown of Value Sales for Front-End-of-Line Processing and Back-End-of-Line Processing for the Years 2015, 2025 & 2030
    • TABLE 134: Asia-Pacific Recent Past, Current & Future Analysis for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 135: Asia-Pacific Historic Review for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 136: Asia-Pacific 15-Year Perspective for Wafer Fab Equipment by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer, Other End-Uses, Foundry and Memory for the Years 2015, 2025 & 2030
    • TABLE 137: Asia-Pacific Recent Past, Current & Future Analysis for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 138: Asia-Pacific Historic Review for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 139: Asia-Pacific 15-Year Perspective for Wafer Fab Equipment by Node Size - Percentage Breakdown of Value Sales for 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above for the Years 2015, 2025 & 2030
  • REST OF WORLD
    • TABLE 140: Rest of World Recent Past, Current & Future Analysis for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 141: Rest of World Historic Review for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 142: Rest of World 15-Year Perspective for Wafer Fab Equipment by Fabrication Process - Percentage Breakdown of Value Sales for Front-End-of-Line Processing and Back-End-of-Line Processing for the Years 2015, 2025 & 2030
    • TABLE 143: Rest of World Recent Past, Current & Future Analysis for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 144: Rest of World Historic Review for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 145: Rest of World 15-Year Perspective for Wafer Fab Equipment by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer, Other End-Uses, Foundry and Memory for the Years 2015, 2025 & 2030
    • TABLE 146: Rest of World Recent Past, Current & Future Analysis for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 147: Rest of World Historic Review for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 148: Rest of World 15-Year Perspective for Wafer Fab Equipment by Node Size - Percentage Breakdown of Value Sales for 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above for the Years 2015, 2025 & 2030

IV. COMPETITION