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市场调查报告书
商品编码
1456999

全球晶圆製造设备市场－2024年至2029年预测

Global Wafer Fabrication Equipment Market - Forecasts from 2024 to 2029
出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 121 Pages | 商品交期: 最快1-2个工作天内

价格
简介目录

晶圆製造设备市场预计将从 2022 年的 656.64 亿美元增至 2029 年的 963.95 亿美元，预测期内复合年增长率为 5.64%。

晶圆是一块硅或其他半导体材料，设计成非常薄的磁碟。晶圆製造是使用各种类型的正片方法在给定或每个半导体晶圆上开发光子或某种类型的完整电路的过程。晶圆製造直接用于製造和开发具有指定电气结构的组件。

市场驱动因素：

  • 家电产业需求不断增加

半导体晶圆製造在家用电子电器领域有多种应用，涵盖音讯/视讯设备和各种型态的娱乐产品，如电视、智慧型手机、寻呼机、影印机和汽车零件。典型的製程涉及多个化学步骤来製造半导体装置。

对家用电子电器和设备的需求不断增长极大地推动了製造设备市场的扩张。 2022年，美国行动电话进口数量将达1.78亿支。此外，由于研发投资的增加以及对产品创新的关注，市场正在成长。

  • 半导体技术创新

人工智慧 (AI) 正在跨行业部署，包括研究、医疗保健、高科技和消费性电子产品。为了支援人工智慧积体电路，半导体架构正在快速改进，透过增加功耗和更有效率的记忆体系统，更快地将资料移入和移出记忆体。

除了人工智慧之外，重力波检测器、医疗产业的无电池感测器、行动 CMOS 成像仪和物联网的 MEMS 振动能量收集器等创新都广泛依赖半导体技术。这些新颖的创新正在影响晶圆製造设备市场。

市场限制因素：

  • 庞大的投资

儘管製造设备市场正在成长，但高度具体的原材料要求、最先进的机械要求和巨额投资等挑战对新兴市场参与企业构成了挑战，限制了市场成长。

晶圆製造设备市场依设备类型分为氧化设备、扩散设备、外延反应器、微影製程设备等。

晶圆製造设备市场按设备类型分为氧化设备、扩散设备、外延反应器、微影术设备和其他杂项设备。氧化剂在利用高温和氧气或蒸气在硅片表面形成薄氧化膜方面发挥重要作用。扩散装置负责将掺杂剂原子引入硅片并改变其电导率。

外延反应器有助于在晶圆表面沉积硅晶型层，从而实现电晶体的製造。微影术设备有助于使用光和光敏抗蚀剂材料在晶圆上形成所需的电路布局。 「其他」类别包括各种晶圆製造製程中使用的各种设备。

预计亚太地区将占据晶圆製造设备市场的主要份额。

从地区来看，亚太地区预计将呈现最快的成长速度。这是由于中国、日本和台湾代工厂的发展，以及家用电子电器需求的不断增长。

市场开拓：

  • 2023 年 7 月 - 全球半导体领导者 Analog Devices, Inc. 投资超过 10 亿美元扩建其位于奥勒冈州的半导体晶圆厂。这项资本投资将无尘室空间扩大到约 118,000 平方英尺，并使公司在 180 奈米及以上技术节点运行的产品的内部製造能力几乎翻倍。
  • 2023 年 6 月 - Lam Research Corp. 推出 Coronus DX，号称是世界上第一个倾斜沉淀解决方案，旨在提高晶片製造的产量比率。此创新解决方案经过最佳化，可解决下一代逻辑、3D NAND 和先进封装应用中的关键製造挑战。
  • 2022 年 11 月 - Lam Research Corp. 宣布成功完成从 Gruenwald Equity 和其他投资者手中收购全球湿式半导体设备供应商 SEMSYSCO GmbH。 SEMSYSCO 的整合增强了泛林在先进封装领域的能力，特别是针对高效能运算 (HPC)、人工智慧 (AI) 和其他资料密集型应用的尖端逻辑晶片和基于晶片组的解决方案。

目录

第一章 简介

  • 市场概况
  • 市场定义
  • 调查范围
  • 市场区隔
  • 货币
  • 先决条件
  • 基准年和预测年时间表
  • 相关人员的主要利益

第二章调查方法

  • 研究设计
  • 调查过程

第三章执行摘要

  • 主要发现
  • 分析师观点

第四章市场动态

  • 市场驱动因素
  • 市场限制因素
  • 波特五力分析
  • 产业价值链分析
  • 分析师观点

第五章全球晶圆製造设备市场：依设备类型

  • 介绍
  • 氧化系统
  • 扩散系统
  • 外延反应器
  • 微影製程设备
  • 其他的

第六章全球晶圆製造设备市场：依规模划分

  • 介绍
  • 50mm～100mm
  • 100mm～200mm
  • 200mm～300mm
  • 300mm～450mm

第七章全球晶圆製造设备市场：按地区

  • 介绍
  • 美洲
  • 欧洲 中东/非洲
  • 亚太地区

第八章竞争环境及分析

  • 主要企业及策略分析
  • 市场占有率分析
  • 合併、收购、协议和合作
  • 竞争对手仪表板

第九章 公司简介

  • LAM RESEARCH CORPORATION
  • SCREEN Semiconductor Solutions Co., Ltd
  • Tokyo Electron Limited
  • Pacifica Partners Inc
  • Hitachi High-Technologies Corporation
  • KLA-Tencor Corporation
简介目录
Product Code: KSI061611346

Wafer Fabrication Equipment Market is projected to grow at a CAGR of 5.64% during the forecast period to reach US$96.395 billion by 2029, from US$65.664 billion in 2022.

A wafer is a piece of silicon or other semiconductor material, designed in the form of a very thin disc. Wafer fabrication is a process that has been developed using various types of affirmative methods to develop photonic or several types of fully electrical circuits on the given or respective semiconductor wafers. Wafer fabrication is directly used to build and develop components with the given electrical structures.

Market Drivers:

  • Growing demand from the consumer electronics industry-

Semiconductor wafer fabrication finds diverse applications in the consumer electronics sector, spanning audio/video devices and various forms of entertainment products, including televisions, smartphones, pagers, copiers, and automotive components. The typical process involves multiple chemical steps to create semiconductor devices.

The escalating demand for consumer electronics and devices is significantly driving the expansion of the fabrication equipment market. In 2022, U.S. imports of cellular phones reached 178 million units. Additionally, the market is experiencing growth due to increased investments in research and development as well as a focus on product innovation.

  • Innovation in semiconductor technology-

Artificial Intelligence (AI) has been rolled out across industry verticals like research, healthcare, high-tech, and consumer electronics. To support AI-integrated circuits, improvements in semiconductor architectures have been urged to speed the movement of data in and out of memory with increased power and more efficient memory systems.

Apart from AI, other innovations in the form of gravitational wave detectors, battery-free sensors for the medical industry, mobile CMOS imagers, MEMS Vibrational Energy Harvesters for IoT, etc., rely on semiconductor technologies extensively. These novel innovations are factoring into the market for wafer fabrication equipment.

Market Restraint:

  • Huge investments-

Although the fabrication equipment market is witnessing growth, factors such as the requirement of very specific raw materials, state-of-the-art machinery requirements, and huge investments bring challenges to emerging market players, thus restricting the growth of the market.

The global wafer fabrication equipment market is segmented by equipment type into oxidation systems, diffusion systems, epitaxial reactors, photolithography equipment, and others.

The global wafer fabrication equipment market is categorized by equipment type, including oxidation systems, diffusion systems, epitaxial reactors, photolithography equipment, and other miscellaneous equipment. Oxidation systems play a crucial role in generating a thin oxide layer on the silicon wafer surface, achieved through high temperatures and the introduction of oxygen or steam. Diffusion systems are responsible for incorporating dopant atoms into the silicon wafer, thereby modifying its electrical conductivity.

Epitaxial reactors facilitate the deposition of a single-crystal silicon layer on the wafer surface, enabling the creation of transistors. Photolithography equipment is instrumental in shaping the desired circuit layout onto the wafer using light and a photosensitive resist material. The "Others" category encompasses a diverse array of equipment utilized in various wafer fabrication processes.

APAC is anticipated to hold a significant share of the wafer fabrication equipment market.

By geography, the Asia-Pacific region is poised to show the fastest growth rate in the market. This is attributed to the development of foundries in China, Japan, and Taiwan and the increasing demand for consumer electronics.

Market Developments:

  • July 2023- Analog Devices, Inc., a prominent global semiconductor leader, celebrated its investment of over $1 billion to expand its semiconductor wafer fab in Beaverton, Oregon. The facility investment expanded cleanroom space to approximately 118,000 sq-ft and nearly doubled internal manufacturing capacity for products operating on the 180-nanometer technology node and above.
  • June 2023- Lam Research Corp. introduced Coronus DX, hailed as the world's first bevel deposition solution, aimed at enhancing yield in chip production. This innovative solution was optimized to tackle crucial manufacturing challenges in next-generation logic, 3D NAND, and advanced packaging applications.
  • November 2022- Lam Research Corp. announced the successful completion of the acquisition of SEMSYSCO GmbH, a worldwide supplier of wet processing semiconductor equipment, from Gruenwald Equity and other investors. Through the integration of SEMSYSCO, Lam enhanced its capabilities in advanced packaging, particularly for cutting-edge logic chips and chipset-based solutions catering to high-performance computing (HPC), artificial intelligence (AI), and other data-intensive applications.

Market Segmentation:

By Equipment Type

  • Oxidation Systems
  • Diffusion Systems
  • Epitaxial Reactors
  • Photolithography Equipment
  • Others

By Size

  • 50 mm-100 mm
  • 100 mm-200 mm
  • 200 mm-300 mm
  • 300 mm-450 mm

By Geography

  • Americas
  • USA
  • Others
  • Europe Middle East and Africa
  • Germany
  • France
  • Israel
  • Others
  • Asia Pacific
  • China
  • Japan
  • South Korea
  • Taiwan
  • Others

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. Market Overview
  • 1.2. Market Definition
  • 1.3. Scope of the Study
  • 1.4. Market Segmentation
  • 1.5. Currency
  • 1.6. Assumptions
  • 1.7. Base, and Forecast Years Timeline
  • 1.8. Key benefits to the stakeholder

2. RESEARCH METHODOLOGY

  • 2.1. Research Design
  • 2.2. Research Process

3. EXECUTIVE SUMMARY

  • 3.1. Key Findings
  • 3.2. Analyst View

4. MARKET DYNAMICS

  • 4.1. Market Drivers
  • 4.2. Market Restraints
  • 4.3. Porter's Five Forces Analysis
    • 4.3.1. Bargaining Power of Suppliers
    • 4.3.2. Bargaining Power of Buyers
    • 4.3.3. Threat of New Entrants
    • 4.3.4. Threat of Substitutes
    • 4.3.5. Competitive Rivalry in the Industry
  • 4.4. Industry Value Chain Analysis
  • 4.5. Analyst View

5. GLOBAL WAFER FABRICATION EQUIPMENT MARKET BY EQUIPMENT TYPE

  • 5.1. Introduction
  • 5.2. Oxidation Systems
    • 5.2.1. Market opportunities and trends
    • 5.2.2. Growth prospects
    • 5.2.3. Geographic lucrativeness
  • 5.3. Diffusion Systems
    • 5.3.1. Market opportunities and trends
    • 5.3.2. Growth prospects
    • 5.3.3. Geographic lucrativeness
  • 5.4. Epitaxial Reactors
    • 5.4.1. Market opportunities and trends
    • 5.4.2. Growth prospects
    • 5.4.3. Geographic lucrativeness
  • 5.5. Photolithography Equipment
    • 5.5.1. Market opportunities and trends
    • 5.5.2. Growth prospects
    • 5.5.3. Geographic lucrativeness
  • 5.6. Others
    • 5.6.1. Market opportunities and trends
    • 5.6.2. Growth prospects
    • 5.6.3. Geographic lucrativeness

6. GLOBAL WAFER FABRICATION EQUIPMENT MARKET BY SIZE

  • 6.1. Introduction
  • 6.2. 50 mm-100 mm
    • 6.2.1. Market opportunities and trends
    • 6.2.2. Growth prospects
    • 6.2.3. Geographic lucrativeness
  • 6.3. 100 mm-200 mm
    • 6.3.1. Market opportunities and trends
    • 6.3.2. Growth prospects
    • 6.3.3. Geographic lucrativeness
  • 6.4. 200 mm-300 mm
    • 6.4.1. Market opportunities and trends
    • 6.4.2. Growth prospects
    • 6.4.3. Geographic lucrativeness
  • 6.5. 300 mm-450 mm
    • 6.5.1. Market opportunities and trends
    • 6.5.2. Growth prospects
    • 6.5.3. Geographic lucrativeness

7. GLOBAL WAFER FABRICATION EQUIPMENT MARKET BY GEOGRAPHY

  • 7.1. Introduction
  • 7.2. Americas
    • 7.2.1. By Equipment Type
    • 7.2.2. By Size
    • 7.2.3. By Country
      • 7.2.3.1. United States
        • 7.2.3.1.1. Market Trends and Opportunities
        • 7.2.3.1.2. Growth Prospects
      • 7.2.3.2. Others
        • 7.2.3.2.1. Market Trends and Opportunities
        • 7.2.3.2.2. Growth Prospects
  • 7.3. Europe Middle East and Africa
    • 7.3.1. By Equipment Type
    • 7.3.2. By Size
    • 7.3.3. By Country
      • 7.3.3.1. Germany
        • 7.3.3.1.1. Market Trends and Opportunities
        • 7.3.3.1.2. Growth Prospects
      • 7.3.3.2. France
        • 7.3.3.2.1. Market Trends and Opportunities
        • 7.3.3.2.2. Growth Prospects
      • 7.3.3.3. Israel
        • 7.3.3.3.1. Market Trends and Opportunities
        • 7.3.3.3.2. Growth Prospects
      • 7.3.3.4. Others
        • 7.3.3.4.1. Market Trends and Opportunities
        • 7.3.3.4.2. Growth Prospects
  • 7.4. Asia Pacific
    • 7.4.1. By Equipment Type
    • 7.4.2. By Size
    • 7.4.3. By Country
      • 7.4.3.1. China
        • 7.4.3.1.1. Market Trends and Opportunities
        • 7.4.3.1.2. Growth Prospects
      • 7.4.3.2. Japan
        • 7.4.3.2.1. Market Trends and Opportunities
        • 7.4.3.2.2. Growth Prospects
      • 7.4.3.3. South Korea
        • 7.4.3.3.1. Market Trends and Opportunities
        • 7.4.3.3.2. Growth Prospects
      • 7.4.3.4. Taiwan
        • 7.4.3.4.1. Market Trends and Opportunities
        • 7.4.3.4.2. Growth Prospects
      • 7.4.3.5. Others
        • 7.4.3.5.1. Market Trends and Opportunities
        • 7.4.3.5.2. Growth Prospects

8. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 8.1. Major Players and Strategy Analysis
  • 8.2. Market Share Analysis
  • 8.3. Mergers, Acquisition, Agreements, and Collaborations
  • 8.4. Competitive Dashboard

9. COMPANY PROFILES

  • 9.1. LAM RESEARCH CORPORATION
  • 9.2. SCREEN Semiconductor Solutions Co., Ltd
  • 9.3. Tokyo Electron Limited
  • 9.4. Pacifica Partners Inc
  • 9.5. Hitachi High-Technologies Corporation
  • 9.6. KLA-Tencor Corporation