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市场调查报告书
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1387302

WFE（半导体前端製造设备）市场报告：到 2030 年的趋势、预测和竞争分析

Wafer Fab Equipment Market Report: Trends, Forecast and Competitive Analysis to 2030
出版日期: | 出版商: Lucintel | 英文 150 Pages | 商品交期: 3个工作天内

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简介目录

WFE（半导体前端製造设备）的趋势与预测

预计到 2030 年，全球 WFE 市场预计将达到 714.6 亿美元，2024 年至 2030 年年复合成长率为 3.0%。该市场的主要驱动力是消费性电子产品需求的成长、半导体和通讯业技术的不断发展，以及智慧家庭和自动驾驶汽车等连网设备的使用增加。全球WFE市场前景广阔，代工、记忆体、集成设备製造商市场商机无限。

WFE 市场洞察

Lucintel 预测，在预测期内，前端将成为更大的细分市场，因为它构成了晶圆上的基本电路，并包括光刻、沉淀、蚀刻和离子布植设备等多种设备，预计将继续发展。

由于半导体和消费性电子产业的成长，以及台湾、日本和中国大陆等国家强大的半导体产品（包括电路、分立元件）供应链，预计亚太地区在预测期内将出现最高成长和逻辑电路。我是。

本报告回答了 11 个关键问题：

  • Q.1. 细分市场中最有前途和高成长的机会是什么？
  • Q.2. 未来哪个细分市场成长较快？为什么？
  • Q.3.您认为哪些地区未来会出现更快的成长？为什么？
  • Q.4. 影响市场动态的主要因素有哪些？市场的主要挑战和业务风险是什么？
  • Q.5. 这个市场的商业风险和竞争威胁是什么？
  • Q.6.这个市场有哪些新趋势？为什么？
  • Q.7.市场客户需求有何改变？
  • Q.8. 该市场有哪些新发展以及哪些公司处于领先地位？
  • Q.9.这个市场的主要企业有哪些？主要企业采取哪些策略配合措施来发展业务？
  • Q.10. 该市场上的竞争产品有哪些？由于材料或产品替代而导致市场占有率下降的威胁有多大？
  • Q.11.过去年度发生了哪些併购事件，对产业产生了哪些影响？

目录

第1章执行摘要

第2章全球 WFE 市场：市场动态

  • 简介、背景、分类
  • 供应链
  • 产业驱动因素与挑战

第3章2018-2030年市场趋势及预测分析

  • 宏观经济趋势（2018-2023）与预测（2024-2030）
  • 全球WFE市场趋势（2018-2023）与预测（2024-2030）
  • 按製造流程分類的全球 WFE 市场
    • 预处理
    • 后製处理
  • 按节点规模分類的全球 WFE 市场
    • 7nm以下
    • 10nm
    • 14nm
    • 22nm
    • 65nm以上
  • 按最终用途分類的全球 WFE 市场
    • 铸造厂
    • 记忆
    • 集成设备製造商
    • 其他的

第4章2018-2030年分地区市场趋势及预测分析

  • 按地区分類的全球 WFE 市场
  • 北美WFE市场
  • 欧洲WFE市场
  • 亚太地区 WFE 市场
  • 其他地区WFE市场

第5章竞争分析

  • 产品系列分析
  • 营运整合
  • 波特五力分析

第6章成长机会与策略分析

  • 成长机会分析
    • 按製造流程的全球 WFE 市场成长机会
    • 按节点规模分類的全球 WFE 市场成长机会
    • 按最终用途分類的全球 WFE 市场成长机会
    • 按地区分類的全球 WFE 市场成长机会
  • 全球WFE市场新趋势
  • 战略分析
    • 新产品开发
    • 扩大全球 WFE 市场产能
    • 全球WFE市场的合併、收购与合资企业
    • 认证和许可

第7章主要企业概况

  • Applied Materials
  • Taiwan Semiconductor Manufacturing Company Limited
  • Nikon
  • Lam Research
  • KLA-Tencor
  • Tokyo Electron Limited
  • Motorola Solutions
  • Hitachi Kokusai Electronic
  • ASML
  • Dainippon Screen Manufacturing
简介目录

Wafer Fab Equipment Trends and Forecast

The future of the global wafer fab equipment market looks promising with opportunities in the foundry, memory, and integrated device manufacturer markets. The global wafer fab equipment market is expected to reach an estimated $71.46 billion by 2030 with a CAGR of 3.0% from 2024 to 2030. The major drivers for this market are growing demand for consumer electronics, rising technological development with semiconductor and telecom industry, as well as, increasing usage of internet connected devices such as, smart home and autonomous vehicles.

A more than 150-page report is developed to help in your business decisions.

Wafer Fab Equipment by Segment

The study includes a forecast for the global wafer fab equipment by fabrication process, node size, end use, and region.

Wafer Fab Equipment Market by Fabrication Process [Shipment Analysis by Value from 2018 to 2030]:

  • Front-End-of-Line Processing
  • Back-End-of-Line Processing

Wafer Fab Equipment Market by Node Size [Shipment Analysis by Value from 2018 to 2030]:

  • 7 nm and Below
  • 10 nm
  • 14 nm
  • 22 nm
  • 65 nm and Above

Wafer Fab Equipment Market by End Use [Shipment Analysis by Value from 2018 to 2030]:

  • Foundry
  • Memory
  • Integrated Device Manufacturer
  • Others

Wafer Fab Equipment Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Wafer Fab Equipment Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies wafer fab equipment companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the wafer fab equipment companies profiled in this report include-

  • Applied Materials
  • Taiwan Semiconductor Manufacturing Company Limited
  • Nikon
  • Lam Research
  • KLA-Tencor
  • Tokyo Electron Limited
  • Motorola Solutions
  • Hitachi Kokusai Electronic
  • ASML
  • Dainippon Screen Manufacturing

Wafer Fab Equipment Market Insights

Lucintel forecasts that front-end-of-line processing will remain the larger segment over the forecast period due to the creation of the basic electrical circuits on the wafer and inclusion of several equipment such as lithography machines, deposition equipment, etching equipment, and Ion implantation equipment.

APAC is expected to witness highest growth over the forecast period due to growth of semiconductor and consumer appliances industry, as well as, robust supply networks that span nations like Taiwan, Japan, and China for semiconductor products, including circuits, discrete devices, and logic circuits.

Features of the Global Wafer Fab Equipment Market

Market Size Estimates: Wafer fab equipment market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Wafer fab equipment market size by fabrication process, node size, end use, and region in terms of value ($B).

Regional Analysis: Wafer fab equipment market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different fabrication process, node size, end use, and regions for the wafer fab equipment market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the wafer fab equipment market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q.1 What is the wafer fab equipment market size?

Answer: The global wafer fab equipment market is expected to reach an estimated $71.46 billion by 2030.

Q.2 What is the growth forecast for wafer fab equipment market?

Answer: The global wafer fab equipment market is expected to grow with a CAGR of 3.0% from 2024 to 2030.

Q.3 What are the major drivers influencing the growth of the wafer fab equipment market?

Answer: The major drivers for this market are growing demand for consumer electronics, rising technological development with semiconductor and telecom industry, as well as, increasing usage of internet connected devices such as, smart home and autonomous vehicles.

Q4. What are the major segments for wafer fab equipment market?

Answer: The future of the global wafer fab equipment market looks promising with opportunities in the foundry, memory, and integrated device manufacturer markets.

Q5. Who are the key wafer fab equipment market companies?

Answer: Some of the key wafer fab equipment companies are as follows:

  • Applied Materials
  • Taiwan Semiconductor Manufacturing Company Limited
  • Nikon
  • Lam Research
  • KLA-Tencor
  • Tokyo Electron Limited
  • Motorola Solutions
  • Hitachi Kokusai Electronic
  • ASML
  • Dainippon Screen Manufacturing

Q6. Which wafer fab equipment market segment will be the largest in future?

Answer: Lucintel forecasts that front-end-of-line processing will remain the larger segment over the forecast period due to the creation of the basic electrical circuits on the wafer and inclusion of several equipment such as lithography machines, deposition equipment, etching equipment, and Ion implantation equipment.

Q7. In wafer fab equipment market, which region is expected to be the largest in next 5 years?

Answer: APAC is expected to witness highest growth over the forecast period due to growth of semiconductor and consumer appliances industry, as well as, robust supply networks that span nations like Taiwan, Japan, and China for semiconductor products, including circuits, discrete devices, and logic circuits.

Q.8 Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the wafer fab equipment market by fabrication process (front-end-of-line processing and back-end-of-line processing), node size (7 nm and below, 10 nm, 14 nm, 22 nm, and 65 nm and above), end use (foundry, memory, integrated device manufacturer, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Wafer Fab Equipment Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global Wafer Fab Equipment Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global Wafer Fab Equipment Market by Fabrication Process
    • 3.3.1: Front-End-of-Line Processing
    • 3.3.2: Back-End-of-Line Processing
  • 3.4: Global Wafer Fab Equipment Market by Node Size
    • 3.4.1: 7 nm and below
    • 3.4.2: 10 nm
    • 3.4.3: 14 nm
    • 3.4.4: 22 nm
    • 3.4.5: 65 nm and above
  • 3.5: Global Wafer Fab Equipment Market by End Use
    • 3.5.1: Foundry
    • 3.5.2: Memory
    • 3.5.3: Integrated Device Manufacturer
    • 3.5.4: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global Wafer Fab Equipment Market by Region
  • 4.2: North American Wafer Fab Equipment Market
    • 4.2.2: North American Wafer Fab Equipment Market by End Use: Foundry, Memory, Integrated Device Manufacturer, and Others
  • 4.3: European Wafer Fab Equipment Market
    • 4.3.1: European Wafer Fab Equipment Market by Fabrication Process: Front-End-of-Line Processing and Back-End-of-Line Processing
    • 4.3.2: European Wafer Fab Equipment Market by End Use: Foundry, Memory, Integrated Device Manufacturer, and Others
  • 4.4: APAC Wafer Fab Equipment Market
    • 4.4.1: APAC Wafer Fab Equipment Market by Fabrication Process: Front-End-of-Line Processing and Back-End-of-Line Processing
    • 4.4.2: APAC Wafer Fab Equipment Market by End Use: Foundry, Memory, Integrated Device Manufacturer, and Others
  • 4.5: ROW Wafer Fab Equipment Market
    • 4.5.1: ROW Wafer Fab Equipment Market by Fabrication Process: Front-End-of-Line Processing and Back-End-of-Line Processing
    • 4.5.2: ROW Wafer Fab Equipment Market by End Use: Foundry, Memory, Integrated Device Manufacturer, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Wafer Fab Equipment Market by Fabrication Process
    • 6.1.2: Growth Opportunities for the Global Wafer Fab Equipment Market by Node Size
    • 6.1.3: Growth Opportunities for the Global Wafer Fab Equipment Market by End Use
    • 6.1.4: Growth Opportunities for the Global Wafer Fab Equipment Market by Region
  • 6.2: Emerging Trends in the Global Wafer Fab Equipment Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Wafer Fab Equipment Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Wafer Fab Equipment Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Applied Materials
  • 7.2: Taiwan Semiconductor Manufacturing Company Limited
  • 7.3: Nikon
  • 7.4: Lam Research
  • 7.5: KLA-Tencor
  • 7.6: Tokyo Electron Limited
  • 7.7: Motorola Solutions
  • 7.8: Hitachi Kokusai Electronic
  • 7.9: ASML
  • 7.10: Dainippon Screen Manufacturing