微影术设备市场－全球产业规模、份额、趋势、机会和预测：按类型、深紫外线类型、波长、装置波长、最终用途、应用、地区和竞争格局划分，2021-2031年

全球微影术设备市场预计将从2025年的149.1亿美元成长到2031年的233.1亿美元，复合年增长率（CAGR）为7.73%。此设备类别包括用于在半导体製造过程中将几何图案从光掩模转移到涂覆有光敏化学光阻剂的基板上的光学系统。市场成长的主要驱动力是高效能运算领域对小型化积体电路的需求不断增长，以及汽车电子产品对大规模晶片生产的强劲需求。根据SEMI预测，包括微影术设备在内的晶圆製造设备市场规模预计将在2024年达到1,010亿美元，主要得益于对记忆体和逻辑装置的投资。

儘管前景乐观，但由于先进极紫外线（EUV）系统需要巨额资本投资，市场仍面临许多障碍。这项资金门槛限制了小型代工厂进入市场，也限制了能够采用3奈米以下製程节点的製造商数量。因此，高昂的进入成本，加上在先进节点上维持产量比率的技术复杂性，可能会阻碍市场的进一步扩张。

市场驱动因素

极紫外线 (EUV) 和高数值孔径 (NA)微影术系统的日益普及，是推动先进节点逻辑晶片和记忆体晶片生产的关键成长要素。半导体製造商正致力于开发以人工智慧 (AI) 和高效能运算 (HPC) 应用的 2 奈米以下架构，并持续依赖这些高解析度系统。主要设备製造商的大量资本投资清晰地印证了这项技术变革。例如，ASML 在 2024 年 7 月发布的「2024 财年第二季财务业绩」中报告称，其季度净订单达到 56 亿欧元，其中 25 亿欧元订单EUV 设备。如此强劲的订单态势表明，儘管整个产业处于经济週期波动之中，但下一代微影术设备在晶体管尺寸持续微缩方面仍然发挥着至关重要的作用。

同时，旨在实现国内半导体製造自给自足的政府战略奖励正在推动各地采购微影术设备。各国积极补贴新建製造工厂，以确保本地供应链并降低地缘政治风险。正如美国商务部在2024年4月发布的公告《拜登-哈里斯政府宣布与台积电达成初步协议》中所述，美国政府提案提供高达66亿美元的直接资金，用于支持在亚利桑那州新建三家製造工厂。这些大规模的公共投资减轻了工厂扩建带来的财务负担，并直接转化为设备订单的成长。 SEMI预测，为满足此基础设施需求，2024年全球半导体製造产能将成长6%，凸显了倡议与设备市场规模之间的关联性。

市场挑战

先进极紫外线 (EUV) 曝光设备所需的巨额资本投入，是限制全球微影术设备市场成长的一大财务障碍。如此高昂的高成本，使得只有少数资金雄厚的半导体製造商能够采用下一代微影术技术，也阻碍了小型代工厂向 3nm 以下的製程节点转型。因此，市场基本客群高度集中，限制了多元化竞争环境所能带来的潜在销售额，并有效地阻止了新企业进入先进製造领域。

如此庞大的资本支出需求构成了强大的准入壁垒，阻碍了整个产业的参与，并加剧了市场力量的集中。近期投资数据显示，这种极高的资本密集度显而易见：根据SEMI统计，2025年第二季全球半导体製造设备订单达到330.7亿美元。这一庞大的数字表明，在先进製程节点上维持营运需要巨额资源，并强化了这样一种市场结构：市场扩张仅受限于最具主导地位的行业参与者的投资能力。

市场趋势

先进封装和异构整合技术的广泛应用从根本上改变了设备需求，需要能够处理更大基板并确保晶片结构高套刻精度的微影术设备。随着产业物理尺寸缩小的极限日益逼近，製造商正将重心转向3D堆迭技术，而这种技术需要专门的后端微影术系统来实现不同晶粒之间的精确互连。这种转变推动了对兼具线路重布所需的宽视野和高解析度的设备的需求，而非专注于电晶体尺寸缩小的前端製程。例如，英特尔在2024年1月宣布其新墨西哥州製造地投产的新闻稿中，宣布投资35亿美元用于支援先进半导体封装技术（特别是其3D堆迭技术Foveros）的大规模生产。

同时，将人工智慧整合到微影术刻製程控制中正成为应对反向微影术技术和掩模合成中呈指数级增长的计算复杂性的关键趋势。半导体製造商正在利用生成式人工智慧演算法来显着加速计算微影术工作负载，而传统上，计算精确的光掩模图案需要大量的 CPU 时间。这项技术整合透过将复杂的运算卸载到加速平台，提高了晶圆吞吐量并优化了能耗。根据英伟达 (NVIDIA) 于 2024 年 3 月发布的公告“NVIDIA 宣布生成式人工智慧在半导体製造领域得到广泛应用”，cuLitho 平台将使代工厂处理光掩模的速度比传统方法快 40 倍，从而显着缩短先进节点的开发週期。

目录

第一章概述

第二章调查方法

第三章执行摘要

第四章：客户评价

第五章 全球微影术设备市场展望

• 市场规模及预测
  • 按金额
• 市占率及预测
  • 按类型（极紫外光 (EUV)、深紫外光 (DUV)）
  • 依深紫外线类型（ArF（氟化氩浸没）、KrF（氟化氪）、ArF（氟化氩）、I线）
  • 依波长（1nm-170nm、170nm-270nm、270nm-370nm）
  • 按元件波长（汞灯、氟灯、准分子雷射、雷射等离子体）
  • 按最终用户（IDM（集成设备製造商）、代工厂）
  • 透过用途（后端、前端）
  • 按地区
  • 按公司（2025 年）
• 市场地图

第六章 北美微影术设备市场展望

• 市场规模及预测
• 市占率及预测
• 北美洲：国家分析
  • 美国
  • 加拿大
  • 墨西哥

7. 欧洲微影术设备市场展望

• 市场规模及预测
• 市占率及预测
• 欧洲：国家分析
  • 德国
  • 法国
  • 英国
  • 义大利
  • 西班牙

8. 亚太地区微影术设备市场展望

• 市场规模及预测
• 市占率及预测
• 亚太地区：国家分析
  • 中国
  • 印度
  • 日本
  • 韩国
  • 澳洲

9. 中东和非洲微影术设备市场展望

• 市场规模及预测
• 市占率及预测
• 中东和非洲：国家分析
  • 沙乌地阿拉伯
  • 阿拉伯聯合大公国
  • 南非

第十章：南美洲微影术设备市场展望

• 市场规模及预测
• 市占率及预测
• 南美洲：国家分析
  • 巴西
  • 哥伦比亚
  • 阿根廷

第十一章 市场动态

• 司机
• 任务

第十二章 市场趋势与发展

• 併购
• 产品发布
• 最新进展

第十三章：全球微影术设备市场：SWOT分析

第十四章 波特五力分析

• 产业竞争
• 新进入者的可能性
• 供应商电力
• 顾客权力
• 替代品的威胁

第十五章 竞争格局

• ASML Holding NV
• Canon Inc.
• EV Group
• GlobalFoundries Inc.
• Nikon Corporation
• Veeco Instruments Inc.
• SUSS MicroTec SE
• Taiwan Semiconductor Manufacturing Company Limited
• Eulitha AG
• NuFlare Technology Inc.

第十六章 策略建议

第十七章：关于研究公司及免责声明

The Global Photolithography Equipment Market is anticipated to expand from USD 14.91 Billion in 2025 to USD 23.31 Billion by 2031, registering a CAGR of 7.73%. This equipment category consists of optical systems used during semiconductor fabrication to transfer geometric patterns from a photomask onto a substrate treated with light-sensitive chemical photoresist. Market growth is primarily propelled by the rising need for miniaturized integrated circuits in high-performance computing and the substantial demand for automotive electronics, which requires high-volume chip production. According to SEMI, the wafer fab equipment segment, which includes the photolithography sector, was projected to reach $101 billion in 2024, driven by investments in memory and logic devices.

Despite this positive outlook, the market encounters a major obstacle due to the immense capital expenditure necessary for advanced Extreme Ultraviolet systems. This financial hurdle restricts market access for smaller foundries and limits the number of manufacturers able to pursue sub-3nm process nodes. Consequently, the combination of high entry costs and the technical complexity involved in maintaining yield rates at advanced nodes may hinder broader market expansion.

Market Driver

The increasing adoption of Extreme Ultraviolet and High-NA lithography systems acts as a primary catalyst for market growth, facilitating the production of logic and memory chips at advanced nodes. As semiconductor manufacturers target sub-2nm architectures for artificial intelligence and high-performance computing applications, reliance on these high-resolution systems is intensifying. This technological shift is highlighted by significant capital commitments from leading equipment providers; for instance, ASML reported in its 'Q2 2024 Financial Results' in July 2024 that quarterly net bookings reached €5.6 billion, with €2.5 billion specifically for EUV system orders. This strong order intake underscores the essential role of next-generation lithography tools in enabling continued transistor downscaling despite broader industry cyclicality.

Simultaneously, strategic government incentives aimed at achieving domestic semiconductor manufacturing sovereignty are stimulating the procurement of photolithography equipment across various regions. Nations are actively subsidizing the construction of new fabrication facilities to secure local supply chains and reduce geopolitical risks. As noted by the U.S. Department of Commerce in April 2024 regarding the 'Biden-Harris Administration Announces Preliminary Terms with TSMC', the government proposed up to $6.6 billion in direct funding to support three greenfield fabrication plants in Arizona. These massive public investments alleviate the financial burden of facility expansion, leading directly to increased equipment orders. SEMI projected in 2024 that global semiconductor manufacturing capacity would rise by 6% to meet this infrastructure demand, highlighting the link between sovereign manufacturing initiatives and equipment market volume.

Market Challenge

The massive capital expenditure necessary for advanced Extreme Ultraviolet systems constitutes a critical financial barrier hampering the growth of the Global Photolithography Equipment Market. This prohibitively high cost limits the adoption of next-generation lithography technologies to a select group of semiconductor manufacturers with deep financial reserves, thereby preventing smaller foundries from transitioning to sub-3nm process nodes. Consequently, the market suffers from a consolidated customer base, which restricts the potential volume sales that would result from a more diversified competitive landscape and effectively bars new entrants from the advanced manufacturing sector.

The requirement for such vast financial outlays creates a rigid entry barrier that stifles broader industry participation and concentrates market power. This intense capital intensity is evident in recent investment data; according to SEMI, global semiconductor equipment billings rose to $33.07 billion in the second quarter of 2025. This substantial figure demonstrates the sheer magnitude of resources needed to sustain operations at advanced nodes, reinforcing a market structure where expansion is constrained by the investment capacity of only the most dominant industry players.

Market Trends

The proliferation of advanced packaging and heterogeneous integration is fundamentally altering equipment requirements, creating a preference for lithography tools capable of handling larger substrates and ensuring high overlay accuracy for chiplet architectures. As the industry nears physical scaling limits, manufacturers are pivoting toward 3D stacking techniques that require specialized back-end lithography systems to create precise interconnects between disparate dies. This shift drives demand for equipment that balances resolution with the wide-field capabilities needed for redistribution layers, distinct from the front-end focus on transistor shrinkage. For example, Intel announced in its January 2024 'Intel Opens New Mexico Manufacturing Hub' press release that it invested $3.5 billion to equip operations for advanced semiconductor packaging technologies, specifically to support mass production of its 3D stacking Foveros capabilities.

Concurrently, the integration of artificial intelligence for lithography process control is emerging as a vital trend to manage the exponential rise in computational complexity associated with inverse lithography technology and mask synthesis. Semiconductor fabricators are utilizing generative AI algorithms to drastically accelerate computational lithography workloads, which traditionally consume massive amounts of CPU time to calculate accurate photomask patterns. This technological integration enhances wafer throughput and optimizes energy consumption by offloading complex calculations to accelerated computing platforms. According to NVIDIA's March 2024 announcement, 'NVIDIA Announces Production Launch of Generative AI for Semiconductor Manufacturing', the cuLitho platform allows foundries to process photomasks up to 40 times faster than conventional methods, significantly shortening the development cycle for advanced nodes.

Key Market Players

• ASML Holding N.V.
• Canon Inc.
• EV Group
• GlobalFoundries Inc.
• Nikon Corporation
• Veeco Instruments Inc.
• SUSS MicroTec SE
• Taiwan Semiconductor Manufacturing Company Limited
• Eulitha AG
• NuFlare Technology Inc.

Report Scope

In this report, the Global Photolithography Equipment Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Photolithography Equipment Market, By Type

• EUV (Extreme Ultraviolet)
• DUV (Deep Ultraviolet)

Photolithography Equipment Market, By DUV Type

• ArFi (Argon Fluoride Immersion)
• KrF (Krypton Fluoride)
• ArF (Argon Fluoride, I-Line)

Photolithography Equipment Market, By Wavelength

• 1nm-170nm
• 170nm-270nm
• 270nm-370nm

Photolithography Equipment Market, By Device Wavelength

• Mercury Lamps
• Fluorine Lamps
• Excimer Lasers
• Laser Produced Plasma

Photolithography Equipment Market, By End-Use

• IDMs (Integrated Device Manufacturer)
• Foundries

Photolithography Equipment Market, By Application

• Back-End
• Front-End

Photolithography Equipment Market, By Region

• North America
  • United States
  • Canada
  • Mexico
• Europe
  • France
  • United Kingdom
  • Italy
  • Germany
  • Spain
• Asia Pacific
  • China
  • India
  • Japan
  • Australia
  • South Korea
• South America
  • Brazil
  • Argentina
  • Colombia
• Middle East & Africa
  • South Africa
  • Saudi Arabia
  • UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Photolithography Equipment Market.

Available Customizations:

Global Photolithography Equipment Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

• Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

• 1.1. Market Definition
• 1.2. Scope of the Market
  • 1.2.1. Markets Covered
  • 1.2.2. Years Considered for Study
  • 1.2.3. Key Market Segmentations

2. Research Methodology

• 2.1. Objective of the Study
• 2.2. Baseline Methodology
• 2.3. Key Industry Partners
• 2.4. Major Association and Secondary Sources
• 2.5. Forecasting Methodology
• 2.6. Data Triangulation & Validation
• 2.7. Assumptions and Limitations

3. Executive Summary

• 3.1. Overview of the Market
• 3.2. Overview of Key Market Segmentations
• 3.3. Overview of Key Market Players
• 3.4. Overview of Key Regions/Countries
• 3.5. Overview of Market Drivers, Challenges, Trends

4. Voice of Customer

5. Global Photolithography Equipment Market Outlook

• 5.1. Market Size & Forecast
  • 5.1.1. By Value
• 5.2. Market Share & Forecast
  • 5.2.1. By Type (EUV (Extreme Ultraviolet), DUV (Deep Ultraviolet))
  • 5.2.2. By DUV Type (ArFi (Argon Fluoride Immersion, KrF (Krypton Fluoride), ArF (Argon Fluoride), I-Line))
  • 5.2.3. By Wavelength (1nm-170nm, 170nm-270nm, 270nm-370nm)
  • 5.2.4. By Device Wavelength (Mercury Lamps, Fluorine Lamps, Excimer Lasers, Laser Produced Plasma)
  • 5.2.5. By End-Use (IDMs (Integrated Device Manufacturer), Foundries)
  • 5.2.6. By Application (Back-End, Front-End)
  • 5.2.7. By Region
  • 5.2.8. By Company (2025)
• 5.3. Market Map

6. North America Photolithography Equipment Market Outlook

• 6.1. Market Size & Forecast
  • 6.1.1. By Value
• 6.2. Market Share & Forecast
  • 6.2.1. By Type
  • 6.2.2. By DUV Type
  • 6.2.3. By Wavelength
  • 6.2.4. By Device Wavelength
  • 6.2.5. By End-Use
  • 6.2.6. By Application
  • 6.2.7. By Country
• 6.3. North America: Country Analysis
  • 6.3.1. United States Photolithography Equipment Market Outlook
    • 6.3.1.1. Market Size & Forecast
      • 6.3.1.1.1. By Value
    • 6.3.1.2. Market Share & Forecast
      • 6.3.1.2.1. By Type
      • 6.3.1.2.2. By DUV Type
      • 6.3.1.2.3. By Wavelength
      • 6.3.1.2.4. By Device Wavelength
      • 6.3.1.2.5. By End-Use
      • 6.3.1.2.6. By Application
  • 6.3.2. Canada Photolithography Equipment Market Outlook
    • 6.3.2.1. Market Size & Forecast
      • 6.3.2.1.1. By Value
    • 6.3.2.2. Market Share & Forecast
      • 6.3.2.2.1. By Type
      • 6.3.2.2.2. By DUV Type
      • 6.3.2.2.3. By Wavelength
      • 6.3.2.2.4. By Device Wavelength
      • 6.3.2.2.5. By End-Use
      • 6.3.2.2.6. By Application
  • 6.3.3. Mexico Photolithography Equipment Market Outlook
    • 6.3.3.1. Market Size & Forecast
      • 6.3.3.1.1. By Value
    • 6.3.3.2. Market Share & Forecast
      • 6.3.3.2.1. By Type
      • 6.3.3.2.2. By DUV Type
      • 6.3.3.2.3. By Wavelength
      • 6.3.3.2.4. By Device Wavelength
      • 6.3.3.2.5. By End-Use
      • 6.3.3.2.6. By Application

7. Europe Photolithography Equipment Market Outlook

• 7.1. Market Size & Forecast
  • 7.1.1. By Value
• 7.2. Market Share & Forecast
  • 7.2.1. By Type
  • 7.2.2. By DUV Type
  • 7.2.3. By Wavelength
  • 7.2.4. By Device Wavelength
  • 7.2.5. By End-Use
  • 7.2.6. By Application
  • 7.2.7. By Country
• 7.3. Europe: Country Analysis
  • 7.3.1. Germany Photolithography Equipment Market Outlook
    • 7.3.1.1. Market Size & Forecast
      • 7.3.1.1.1. By Value
    • 7.3.1.2. Market Share & Forecast
      • 7.3.1.2.1. By Type
      • 7.3.1.2.2. By DUV Type
      • 7.3.1.2.3. By Wavelength
      • 7.3.1.2.4. By Device Wavelength
      • 7.3.1.2.5. By End-Use
      • 7.3.1.2.6. By Application
  • 7.3.2. France Photolithography Equipment Market Outlook
    • 7.3.2.1. Market Size & Forecast
      • 7.3.2.1.1. By Value
    • 7.3.2.2. Market Share & Forecast
      • 7.3.2.2.1. By Type
      • 7.3.2.2.2. By DUV Type
      • 7.3.2.2.3. By Wavelength
      • 7.3.2.2.4. By Device Wavelength
      • 7.3.2.2.5. By End-Use
      • 7.3.2.2.6. By Application
  • 7.3.3. United Kingdom Photolithography Equipment Market Outlook
    • 7.3.3.1. Market Size & Forecast
      • 7.3.3.1.1. By Value
    • 7.3.3.2. Market Share & Forecast
      • 7.3.3.2.1. By Type
      • 7.3.3.2.2. By DUV Type
      • 7.3.3.2.3. By Wavelength
      • 7.3.3.2.4. By Device Wavelength
      • 7.3.3.2.5. By End-Use
      • 7.3.3.2.6. By Application
  • 7.3.4. Italy Photolithography Equipment Market Outlook
    • 7.3.4.1. Market Size & Forecast
      • 7.3.4.1.1. By Value
    • 7.3.4.2. Market Share & Forecast
      • 7.3.4.2.1. By Type
      • 7.3.4.2.2. By DUV Type
      • 7.3.4.2.3. By Wavelength
      • 7.3.4.2.4. By Device Wavelength
      • 7.3.4.2.5. By End-Use
      • 7.3.4.2.6. By Application
  • 7.3.5. Spain Photolithography Equipment Market Outlook
    • 7.3.5.1. Market Size & Forecast
      • 7.3.5.1.1. By Value
    • 7.3.5.2. Market Share & Forecast
      • 7.3.5.2.1. By Type
      • 7.3.5.2.2. By DUV Type
      • 7.3.5.2.3. By Wavelength
      • 7.3.5.2.4. By Device Wavelength
      • 7.3.5.2.5. By End-Use
      • 7.3.5.2.6. By Application

8. Asia Pacific Photolithography Equipment Market Outlook

• 8.1. Market Size & Forecast
  • 8.1.1. By Value
• 8.2. Market Share & Forecast
  • 8.2.1. By Type
  • 8.2.2. By DUV Type
  • 8.2.3. By Wavelength
  • 8.2.4. By Device Wavelength
  • 8.2.5. By End-Use
  • 8.2.6. By Application
  • 8.2.7. By Country
• 8.3. Asia Pacific: Country Analysis
  • 8.3.1. China Photolithography Equipment Market Outlook
    • 8.3.1.1. Market Size & Forecast
      • 8.3.1.1.1. By Value
    • 8.3.1.2. Market Share & Forecast
      • 8.3.1.2.1. By Type
      • 8.3.1.2.2. By DUV Type
      • 8.3.1.2.3. By Wavelength
      • 8.3.1.2.4. By Device Wavelength
      • 8.3.1.2.5. By End-Use
      • 8.3.1.2.6. By Application
  • 8.3.2. India Photolithography Equipment Market Outlook
    • 8.3.2.1. Market Size & Forecast
      • 8.3.2.1.1. By Value
    • 8.3.2.2. Market Share & Forecast
      • 8.3.2.2.1. By Type
      • 8.3.2.2.2. By DUV Type
      • 8.3.2.2.3. By Wavelength
      • 8.3.2.2.4. By Device Wavelength
      • 8.3.2.2.5. By End-Use
      • 8.3.2.2.6. By Application
  • 8.3.3. Japan Photolithography Equipment Market Outlook
    • 8.3.3.1. Market Size & Forecast
      • 8.3.3.1.1. By Value
    • 8.3.3.2. Market Share & Forecast
      • 8.3.3.2.1. By Type
      • 8.3.3.2.2. By DUV Type
      • 8.3.3.2.3. By Wavelength
      • 8.3.3.2.4. By Device Wavelength
      • 8.3.3.2.5. By End-Use
      • 8.3.3.2.6. By Application
  • 8.3.4. South Korea Photolithography Equipment Market Outlook
    • 8.3.4.1. Market Size & Forecast
      • 8.3.4.1.1. By Value
    • 8.3.4.2. Market Share & Forecast
      • 8.3.4.2.1. By Type
      • 8.3.4.2.2. By DUV Type
      • 8.3.4.2.3. By Wavelength
      • 8.3.4.2.4. By Device Wavelength
      • 8.3.4.2.5. By End-Use
      • 8.3.4.2.6. By Application
  • 8.3.5. Australia Photolithography Equipment Market Outlook
    • 8.3.5.1. Market Size & Forecast
      • 8.3.5.1.1. By Value
    • 8.3.5.2. Market Share & Forecast
      • 8.3.5.2.1. By Type
      • 8.3.5.2.2. By DUV Type
      • 8.3.5.2.3. By Wavelength
      • 8.3.5.2.4. By Device Wavelength
      • 8.3.5.2.5. By End-Use
      • 8.3.5.2.6. By Application

9. Middle East & Africa Photolithography Equipment Market Outlook

• 9.1. Market Size & Forecast
  • 9.1.1. By Value
• 9.2. Market Share & Forecast
  • 9.2.1. By Type
  • 9.2.2. By DUV Type
  • 9.2.3. By Wavelength
  • 9.2.4. By Device Wavelength
  • 9.2.5. By End-Use
  • 9.2.6. By Application
  • 9.2.7. By Country
• 9.3. Middle East & Africa: Country Analysis
  • 9.3.1. Saudi Arabia Photolithography Equipment Market Outlook
    • 9.3.1.1. Market Size & Forecast
      • 9.3.1.1.1. By Value
    • 9.3.1.2. Market Share & Forecast
      • 9.3.1.2.1. By Type
      • 9.3.1.2.2. By DUV Type
      • 9.3.1.2.3. By Wavelength
      • 9.3.1.2.4. By Device Wavelength
      • 9.3.1.2.5. By End-Use
      • 9.3.1.2.6. By Application
  • 9.3.2. UAE Photolithography Equipment Market Outlook
    • 9.3.2.1. Market Size & Forecast
      • 9.3.2.1.1. By Value
    • 9.3.2.2. Market Share & Forecast
      • 9.3.2.2.1. By Type
      • 9.3.2.2.2. By DUV Type
      • 9.3.2.2.3. By Wavelength
      • 9.3.2.2.4. By Device Wavelength
      • 9.3.2.2.5. By End-Use
      • 9.3.2.2.6. By Application
  • 9.3.3. South Africa Photolithography Equipment Market Outlook
    • 9.3.3.1. Market Size & Forecast
      • 9.3.3.1.1. By Value
    • 9.3.3.2. Market Share & Forecast
      • 9.3.3.2.1. By Type
      • 9.3.3.2.2. By DUV Type
      • 9.3.3.2.3. By Wavelength
      • 9.3.3.2.4. By Device Wavelength
      • 9.3.3.2.5. By End-Use
      • 9.3.3.2.6. By Application

10. South America Photolithography Equipment Market Outlook

• 10.1. Market Size & Forecast
  • 10.1.1. By Value
• 10.2. Market Share & Forecast
  • 10.2.1. By Type
  • 10.2.2. By DUV Type
  • 10.2.3. By Wavelength
  • 10.2.4. By Device Wavelength
  • 10.2.5. By End-Use
  • 10.2.6. By Application
  • 10.2.7. By Country
• 10.3. South America: Country Analysis
  • 10.3.1. Brazil Photolithography Equipment Market Outlook
    • 10.3.1.1. Market Size & Forecast
      • 10.3.1.1.1. By Value
    • 10.3.1.2. Market Share & Forecast
      • 10.3.1.2.1. By Type
      • 10.3.1.2.2. By DUV Type
      • 10.3.1.2.3. By Wavelength
      • 10.3.1.2.4. By Device Wavelength
      • 10.3.1.2.5. By End-Use
      • 10.3.1.2.6. By Application
  • 10.3.2. Colombia Photolithography Equipment Market Outlook
    • 10.3.2.1. Market Size & Forecast
      • 10.3.2.1.1. By Value
    • 10.3.2.2. Market Share & Forecast
      • 10.3.2.2.1. By Type
      • 10.3.2.2.2. By DUV Type
      • 10.3.2.2.3. By Wavelength
      • 10.3.2.2.4. By Device Wavelength
      • 10.3.2.2.5. By End-Use
      • 10.3.2.2.6. By Application
  • 10.3.3. Argentina Photolithography Equipment Market Outlook
    • 10.3.3.1. Market Size & Forecast
      • 10.3.3.1.1. By Value
    • 10.3.3.2. Market Share & Forecast
      • 10.3.3.2.1. By Type
      • 10.3.3.2.2. By DUV Type
      • 10.3.3.2.3. By Wavelength
      • 10.3.3.2.4. By Device Wavelength
      • 10.3.3.2.5. By End-Use
      • 10.3.3.2.6. By Application

11. Market Dynamics

• 11.1. Drivers
• 11.2. Challenges

12. Market Trends & Developments

• 12.1. Merger & Acquisition (If Any)
• 12.2. Product Launches (If Any)
• 12.3. Recent Developments

13. Global Photolithography Equipment Market: SWOT Analysis

14. Porter's Five Forces Analysis

• 14.1. Competition in the Industry
• 14.2. Potential of New Entrants
• 14.3. Power of Suppliers
• 14.4. Power of Customers
• 14.5. Threat of Substitute Products

15. Competitive Landscape

• 15.1. ASML Holding N.V.
  • 15.1.1. Business Overview
  • 15.1.2. Products & Services
  • 15.1.3. Recent Developments
  • 15.1.4. Key Personnel
  • 15.1.5. SWOT Analysis
• 15.2. Canon Inc.
• 15.3. EV Group
• 15.4. GlobalFoundries Inc.
• 15.5. Nikon Corporation
• 15.6. Veeco Instruments Inc.
• 15.7. SUSS MicroTec SE
• 15.8. Taiwan Semiconductor Manufacturing Company Limited
• 15.9. Eulitha AG
• 15.10. NuFlare Technology Inc.

16. Strategic Recommendations

17. About Us & Disclaimer