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市场调查报告书
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1943656

整合式被动元件市场 - 全球产业规模、份额、趋势、机会及预测（按应用、最终用途、地区和竞争格局划分，2021-2031年）

Integrated Passive Devices Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Application, By End-use, By Region & Competition, 2021-2031F
出版日期: | 出版商: TechSci Research | 英文 180 Pages | 商品交期: 2-3个工作天内

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简介目录

全球整合式被动元件市场预计将从 2025 年的 22.6 亿美元成长到 2031 年的 37.9 亿美元，复合年增长率为 9.01%。

整合式被动元件 (IPD) 是一种高性能元件，它将电阻器、电容器和电感器等被动元件直接嵌入玻璃或半导体基板中，而不是像传统封装方式那样将它们封装成单独的单元。这种整合方式显着缩小了装置的面积并提高了电气性能，从而满足了高频环境下对讯号完整性和小型化的关键产业需求。市场的主要驱动力是家用电子电器日益增长的需求，以及先进汽车系统和 5G 通讯对性能的严格要求，这些要求比传统表面黏着技术更低的寄生电感。

市场概览
预测期 2027-2031
市场规模：2025年 22.6亿美元
市场规模：2031年 37.9亿美元
复合年增长率：2026-2031年 9.01%
成长最快的细分市场 卫生保健
最大的市场 亚太地区

市场发展与整个半导体产业的趋势密切相关，半导体产业是这些整合解决方案的基础平台。根据半导体产业协会 (SIA) 预测，2024 年第三季全球半导体销售额预计将达到 1,660 亿美元，年成长 23.2%。半导体产业的强劲成长表明，支援数据密集应用的先进组件技术（例如整合元件）正得到越来越广泛的应用。然而，市场扩张的主要障碍在于整合装置相关的高昂非重复性工程成本和复杂的製造工艺，这使得它们在大批量、低利润应用中的成本效益低于标准分立组件。

市场驱动因素

5G通讯基础设施的快速部署正成为整合式被动元件（IPD）应用的重要催化剂。随着通讯业者向更高频段过渡，对能够最大限度降低寄生电容并保持讯号完整性的组件的需求日益增长。 IPD能够将高效能滤波器、耦合器和平衡-不平衡转换器直接整合到基板上，这对于大规模MIMO部署中现代射频前端模组的有效运作至关重要。根据爱立信于2024年6月发布的《行动报告》，2024年第一季全球5G用户数将增加1.6亿人。这种持续的网路扩张推动了小型基地台和广域基地台的硬体需求，进而导致对射频效能超越传统分立组件的整合式被动解决方案的需求不断增长。

同时，小型化家用电子电器和穿戴式装置的激增，对设备设计提出了更严格的空间限制，加速了市场需求的成长。製造商正越来越多地采用系统级封装（SiP）技术，将被动元件整合到基板，以便为更大的处理器和电池腾出空间。苹果在2024财年第三季财报中公布，其穿戴式家居配件部门的净销售额达到81亿美元，显示该领域对元件的需求规模庞大。製造业生态系统的復苏也进一步支持了这些小型电子产品的需求。根据SEMI的报告，2024年第二季全球硅晶圆出货量较上季成长7.1%，确保了基板供应能满足消费性电子市场的高需求。

市场挑战

复杂的製造要求和高昂的非重复性工程成本是限制全球整合被动元件市场成长的重要障碍。与依赖标准低成本生产方法的离散元件不同，整合式被动元件需要利用光刻和薄膜沉积等先进的半导体製造技术。这种依赖关係需要在开发阶段投入大量领先资本，导致最终单位成本远高于传统方案。因此，这些高成本削弱了整合解决方案在价格敏感型和低利润应用中的经济可行性，从而有效地限制了其在高效能领域的应用。

维持必要的生产基础设施所需的高昂营运成本进一步加剧了这项财务挑战。这种生产环境的资本密集特性直接影响这些元件的定价结构。近期行业数据显示，製造业支出也印证了这高昂的营运成本。根据SEMI统计，2024年第二季全球半导体製造设备销售额达268亿美元。如此庞大的生产设施支出凸显了製造商面临的沉重财务负担，也使得整合式被动元件进入通用市场领域面临较高的进入门槛。

市场趋势

玻璃基板在高频射频和高效能运算应用中的日益普及，正在从根本上改变市场格局。与传统的有机基板相比，玻璃具有更优异的尺寸稳定性和显着更低的电损耗，这些特性对于下一代人工智慧加速器和采用玻璃通孔（TGV）技术的5G/6G模组所需的高密度互连至关重要。这种材料转型正在推动大规模的产业投资，以建立先进整合解决方案所需的製造基础设施。例如，2024年5月，美国商务部宣布，Absolics公司已获得《晶片技术创新法案》（CHIPS Act）高达7,500万美元的津贴，用于支持其在乔治亚建造一座专门用于半导体产业玻璃基板研发的商业设施。

同时，高可靠性整合式被动元件 (IPD) 在电动车系统和汽车高级驾驶辅助系统 (ADAS) 的应用日益广泛，成为一个重要的新兴成长领域。随着车辆架构越来越依赖复杂的感测器阵列来实现自动驾驶和高压动力传动系统，製造商正在转向整合被动元件，因为与分离式表面黏着技术元件相比，这些元件能够更好地承受机械振动和严苛的热循环。全球汽车的快速电气化直接推动了这一转变，因为汽车安全关键硬体需要坚固耐用且节省空间的组件。为了佐证这项需求，国际能源总署 (IEA) 发布的《2024 年全球电动车展望》预测，到 2024 年，全球电动车销量将达到约 1,700 万辆，凸显了对汽车级电子元件的巨大需求。

目录

第一章概述

第二章调查方法

第三章执行摘要

第四章：客户评价

第五章 全球整合式被动元件市场展望

  • 市场规模及预测
    • 按金额
  • 市占率及预测
    • 依应用领域（EMS/EMI 保护 IPD、RF IPD、LED 照明、数位/混合讯号 IPD）
    • 按最终用户（汽车、家用电子电器、医疗、其他）
    • 按地区
    • 按公司（2025 年）
  • 市场地图

6. 北美整合式被动元件市场展望

  • 市场规模及预测
  • 市占率及预测
  • 北美洲：国家分析
    • 我们
    • 加拿大
    • 墨西哥

7. 欧洲整合被动元件市场展望

  • 市场规模及预测
  • 市占率及预测
  • 欧洲：国家分析
    • 德国
    • 法国
    • 英国
    • 义大利
    • 西班牙

8. 亚太地区整合式被动元件市场展望

  • 市场规模及预测
  • 市占率及预测
  • 亚太地区：国家分析
    • 中国
    • 印度
    • 日本
    • 韩国
    • 澳洲

9. 中东和非洲整合式被动元件市场展望

  • 市场规模及预测
  • 市占率及预测
  • 中东和非洲：国家分析
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 南非

10. 南美洲整合式被动元件市场展望

  • 市场规模及预测
  • 市占率及预测
  • 南美洲：国家分析
    • 巴西
    • 哥伦比亚
    • 阿根廷

第十一章 市场动态

  • 司机
  • 任务

第十二章 市场趋势与发展

  • 併购
  • 产品发布
  • 最新进展

第十三章 全球整合式被动元件市场：SWOT分析

第十四章：波特五力分析

  • 产业竞争
  • 新进入者的可能性
  • 供应商电力
  • 顾客权力
  • 替代品的威胁

第十五章 竞争格局

  • Murata Manufacturing Co., Ltd.
  • Infineon Technologies AG
  • STMicroelectronics NV
  • ON Semiconductor Corporation
  • Broadcom Inc.
  • NXP Semiconductors NV
  • Texas Instruments Incorporated
  • Qorvo, Inc.
  • MACOM Technology Solutions Holdings Inc.
  • CTS Corporation

第十六章 策略建议

第十七章：关于研究公司及免责声明

简介目录
Product Code: 19466

The Global Integrated Passive Devices Market is projected to expand from USD 2.26 Billion in 2025 to USD 3.79 Billion by 2031, registering a CAGR of 9.01%. Integrated Passive Devices (IPDs) are high-performance components in which passive elements like resistors, capacitors, and inductors are embedded directly into glass or semiconductor substrates instead of being packaged as individual units. This integration facilitates significantly reduced device footprints and improved electrical performance, satisfying critical industry needs for signal integrity and miniaturization in high-frequency environments. The market is primarily driven by the growing demand for compact consumer electronics and the stringent performance requirements of advanced automotive systems and 5G telecommunications, which demand lower parasitic inductance than traditional surface-mount technologies.

Market Overview
Forecast Period2027-2031
Market Size 2025USD 2.26 Billion
Market Size 2031USD 3.79 Billion
CAGR 2026-20319.01%
Fastest Growing SegmentHealthcare
Largest MarketAsia Pacific

The market's progression is tightly connected to the broader semiconductor industry, which serves as the foundational platform for these integrated solutions. As reported by the Semiconductor Industry Association, global semiconductor sales hit $166.0 billion in the third quarter of 2024, marking a 23.2% increase over the same period in 2023. This strong growth in the underlying semiconductor sector highlights the increasing adoption of advanced component technologies, such as IPDs, to sustain data-intensive applications. However, a major obstacle to widespread market growth is the high non-recurring engineering costs and manufacturing complexity associated with IPDs, which can render them less cost-effective than standard discrete components for high-volume, low-margin applications.

Market Driver

The swift rollout of 5G telecommunications infrastructure acts as a major catalyst for the adoption of Integrated Passive Devices (IPDs). As telecommunications providers move toward higher frequency bands, the need for components that preserve signal integrity while minimizing parasitic capacitance becomes increasingly critical. IPDs enable the direct integration of high-performance filters, couplers, and baluns onto substrates, which is vital for the effective operation of modern radio frequency front-end modules in massive MIMO implementations. According to Ericsson's June 2024 'Ericsson Mobility Report', global 5G subscriptions increased by 160 million in the first quarter of 2024. This ongoing network expansion drives hardware requirements for both small cells and macro base stations, thereby boosting the volume of integrated passive solutions that outperform traditional discrete components in radio frequency performance.

Simultaneously, the proliferation of miniaturized consumer electronics and connected wearables is accelerating market demand by placing strict space limitations on device architecture. Manufacturers are increasingly adopting System-in-Package technologies where passive components are embedded to save board space for larger processors and batteries. Apple Inc. reported in its fiscal 2024 third-quarter results that the Wearables, Home, and Accessories segment achieved net sales of $8.1 billion, demonstrating the vast scale of component usage in this sector. This demand for compact electronics is bolstered by a rebounding manufacturing ecosystem; SEMI reported that global silicon wafer shipments rose by 7.1% quarter-over-quarter in the second quarter of 2024, ensuring that substrate availability can meet the high volume needs of the consumer electronics market.

Market Challenge

Complex manufacturing requirements and high non-recurring engineering expenses pose a significant barrier to the growth of the Global Integrated Passive Devices Market. Unlike discrete components that rely on standard, low-cost production methods, integrated passive devices utilize advanced semiconductor fabrication techniques such as photolithography and thin-film deposition. This reliance necessitates substantial upfront capital investment during the development phase, resulting in a final unit cost that is considerably higher than traditional alternatives. Consequently, these elevated costs make integrated solutions less financially feasible for price-sensitive or low-margin applications, effectively limiting their adoption to high-performance sectors.

The financial challenge is further exacerbated by the significant operational costs required to maintain the necessary manufacturing infrastructure. The capital-intensive nature of sustaining such production environments directly influences the pricing structure of these components. This high cost of operation is evidenced by recent industry data regarding manufacturing expenditures; according to SEMI, worldwide semiconductor equipment billings reached $26.8 billion in the second quarter of 2024. Such massive spending on production tooling highlights the heavy financial overhead that manufacturers face, which sustains high entry barriers for integrated passive devices in mass-market segments.

Market Trends

The increasing adoption of glass-based substrates for high-frequency RF and high-performance computing applications is fundamentally altering the technological landscape of the market. Glass provides superior dimensional stability and significantly lower electrical loss compared to traditional organic cores, properties that are vital for the dense interconnects required by next-generation AI accelerators and 5G/6G modules using Through-Glass Via (TGV) technologies. This material shift is driving substantial industrial investment to build the necessary manufacturing infrastructure for these advanced integrated solutions. For instance, the U.S. Department of Commerce announced in May 2024 that Absolics was awarded up to $75 million under CHIPS Act incentives to support the construction of a commercial facility in Georgia dedicated to developing glass substrates for the semiconductor industry.

Concurrently, the expanding use of high-reliability IPDs in electric vehicle systems and automotive ADAS represents a critical new growth area. As vehicle architectures increasingly depend on complex sensor arrays for autonomous driving and high-voltage powertrains, manufacturers are transitioning to integrated passive devices that can withstand mechanical vibrations and extreme thermal cycles better than discrete surface-mount components. This shift is directly supported by the rapid electrification of the global fleet, which necessitates robust, space-efficient components for safety-critical hardware. Underscoring this demand, the International Energy Agency's 'Global EV Outlook 2024' projected that global electric car sales would reach approximately 17 million units in 2024, highlighting the massive scale of demand for automotive-grade electronic components.

Key Market Players

  • Murata Manufacturing Co., Ltd.
  • Infineon Technologies AG
  • STMicroelectronics N.V.
  • ON Semiconductor Corporation
  • Broadcom Inc.
  • NXP Semiconductors N.V.
  • Texas Instruments Incorporated
  • Qorvo, Inc.
  • MACOM Technology Solutions Holdings Inc.
  • CTS Corporation

Report Scope

In this report, the Global Integrated Passive Devices Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Integrated Passive Devices Market, By Application

  • EMS & EMI Protection IPD
  • RF IPD
  • LED Lighting
  • Digital & Mixed Signal IPD

Integrated Passive Devices Market, By End-use

  • Automobile
  • Consumer electronics
  • Healthcare
  • Others

Integrated Passive Devices Market, By Region

  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • France
    • United Kingdom
    • Italy
    • Germany
    • Spain
  • Asia Pacific
    • China
    • India
    • Japan
    • Australia
    • South Korea
  • South America
    • Brazil
    • Argentina
    • Colombia
  • Middle East & Africa
    • South Africa
    • Saudi Arabia
    • UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Integrated Passive Devices Market.

Available Customizations:

Global Integrated Passive Devices Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

  • Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

  • 1.1. Market Definition
  • 1.2. Scope of the Market
    • 1.2.1. Markets Covered
    • 1.2.2. Years Considered for Study
    • 1.2.3. Key Market Segmentations

2. Research Methodology

  • 2.1. Objective of the Study
  • 2.2. Baseline Methodology
  • 2.3. Key Industry Partners
  • 2.4. Major Association and Secondary Sources
  • 2.5. Forecasting Methodology
  • 2.6. Data Triangulation & Validation
  • 2.7. Assumptions and Limitations

3. Executive Summary

  • 3.1. Overview of the Market
  • 3.2. Overview of Key Market Segmentations
  • 3.3. Overview of Key Market Players
  • 3.4. Overview of Key Regions/Countries
  • 3.5. Overview of Market Drivers, Challenges, Trends

4. Voice of Customer

5. Global Integrated Passive Devices Market Outlook

  • 5.1. Market Size & Forecast
    • 5.1.1. By Value
  • 5.2. Market Share & Forecast
    • 5.2.1. By Application (EMS & EMI Protection IPD, RF IPD, LED Lighting, Digital & Mixed Signal IPD)
    • 5.2.2. By End-use (Automobile, Consumer electronics, Healthcare, Others)
    • 5.2.3. By Region
    • 5.2.4. By Company (2025)
  • 5.3. Market Map

6. North America Integrated Passive Devices Market Outlook

  • 6.1. Market Size & Forecast
    • 6.1.1. By Value
  • 6.2. Market Share & Forecast
    • 6.2.1. By Application
    • 6.2.2. By End-use
    • 6.2.3. By Country
  • 6.3. North America: Country Analysis
    • 6.3.1. United States Integrated Passive Devices Market Outlook
      • 6.3.1.1. Market Size & Forecast
        • 6.3.1.1.1. By Value
      • 6.3.1.2. Market Share & Forecast
        • 6.3.1.2.1. By Application
        • 6.3.1.2.2. By End-use
    • 6.3.2. Canada Integrated Passive Devices Market Outlook
      • 6.3.2.1. Market Size & Forecast
        • 6.3.2.1.1. By Value
      • 6.3.2.2. Market Share & Forecast
        • 6.3.2.2.1. By Application
        • 6.3.2.2.2. By End-use
    • 6.3.3. Mexico Integrated Passive Devices Market Outlook
      • 6.3.3.1. Market Size & Forecast
        • 6.3.3.1.1. By Value
      • 6.3.3.2. Market Share & Forecast
        • 6.3.3.2.1. By Application
        • 6.3.3.2.2. By End-use

7. Europe Integrated Passive Devices Market Outlook

  • 7.1. Market Size & Forecast
    • 7.1.1. By Value
  • 7.2. Market Share & Forecast
    • 7.2.1. By Application
    • 7.2.2. By End-use
    • 7.2.3. By Country
  • 7.3. Europe: Country Analysis
    • 7.3.1. Germany Integrated Passive Devices Market Outlook
      • 7.3.1.1. Market Size & Forecast
        • 7.3.1.1.1. By Value
      • 7.3.1.2. Market Share & Forecast
        • 7.3.1.2.1. By Application
        • 7.3.1.2.2. By End-use
    • 7.3.2. France Integrated Passive Devices Market Outlook
      • 7.3.2.1. Market Size & Forecast
        • 7.3.2.1.1. By Value
      • 7.3.2.2. Market Share & Forecast
        • 7.3.2.2.1. By Application
        • 7.3.2.2.2. By End-use
    • 7.3.3. United Kingdom Integrated Passive Devices Market Outlook
      • 7.3.3.1. Market Size & Forecast
        • 7.3.3.1.1. By Value
      • 7.3.3.2. Market Share & Forecast
        • 7.3.3.2.1. By Application
        • 7.3.3.2.2. By End-use
    • 7.3.4. Italy Integrated Passive Devices Market Outlook
      • 7.3.4.1. Market Size & Forecast
        • 7.3.4.1.1. By Value
      • 7.3.4.2. Market Share & Forecast
        • 7.3.4.2.1. By Application
        • 7.3.4.2.2. By End-use
    • 7.3.5. Spain Integrated Passive Devices Market Outlook
      • 7.3.5.1. Market Size & Forecast
        • 7.3.5.1.1. By Value
      • 7.3.5.2. Market Share & Forecast
        • 7.3.5.2.1. By Application
        • 7.3.5.2.2. By End-use

8. Asia Pacific Integrated Passive Devices Market Outlook

  • 8.1. Market Size & Forecast
    • 8.1.1. By Value
  • 8.2. Market Share & Forecast
    • 8.2.1. By Application
    • 8.2.2. By End-use
    • 8.2.3. By Country
  • 8.3. Asia Pacific: Country Analysis
    • 8.3.1. China Integrated Passive Devices Market Outlook
      • 8.3.1.1. Market Size & Forecast
        • 8.3.1.1.1. By Value
      • 8.3.1.2. Market Share & Forecast
        • 8.3.1.2.1. By Application
        • 8.3.1.2.2. By End-use
    • 8.3.2. India Integrated Passive Devices Market Outlook
      • 8.3.2.1. Market Size & Forecast
        • 8.3.2.1.1. By Value
      • 8.3.2.2. Market Share & Forecast
        • 8.3.2.2.1. By Application
        • 8.3.2.2.2. By End-use
    • 8.3.3. Japan Integrated Passive Devices Market Outlook
      • 8.3.3.1. Market Size & Forecast
        • 8.3.3.1.1. By Value
      • 8.3.3.2. Market Share & Forecast
        • 8.3.3.2.1. By Application
        • 8.3.3.2.2. By End-use
    • 8.3.4. South Korea Integrated Passive Devices Market Outlook
      • 8.3.4.1. Market Size & Forecast
        • 8.3.4.1.1. By Value
      • 8.3.4.2. Market Share & Forecast
        • 8.3.4.2.1. By Application
        • 8.3.4.2.2. By End-use
    • 8.3.5. Australia Integrated Passive Devices Market Outlook
      • 8.3.5.1. Market Size & Forecast
        • 8.3.5.1.1. By Value
      • 8.3.5.2. Market Share & Forecast
        • 8.3.5.2.1. By Application
        • 8.3.5.2.2. By End-use

9. Middle East & Africa Integrated Passive Devices Market Outlook

  • 9.1. Market Size & Forecast
    • 9.1.1. By Value
  • 9.2. Market Share & Forecast
    • 9.2.1. By Application
    • 9.2.2. By End-use
    • 9.2.3. By Country
  • 9.3. Middle East & Africa: Country Analysis
    • 9.3.1. Saudi Arabia Integrated Passive Devices Market Outlook
      • 9.3.1.1. Market Size & Forecast
        • 9.3.1.1.1. By Value
      • 9.3.1.2. Market Share & Forecast
        • 9.3.1.2.1. By Application
        • 9.3.1.2.2. By End-use
    • 9.3.2. UAE Integrated Passive Devices Market Outlook
      • 9.3.2.1. Market Size & Forecast
        • 9.3.2.1.1. By Value
      • 9.3.2.2. Market Share & Forecast
        • 9.3.2.2.1. By Application
        • 9.3.2.2.2. By End-use
    • 9.3.3. South Africa Integrated Passive Devices Market Outlook
      • 9.3.3.1. Market Size & Forecast
        • 9.3.3.1.1. By Value
      • 9.3.3.2. Market Share & Forecast
        • 9.3.3.2.1. By Application
        • 9.3.3.2.2. By End-use

10. South America Integrated Passive Devices Market Outlook

  • 10.1. Market Size & Forecast
    • 10.1.1. By Value
  • 10.2. Market Share & Forecast
    • 10.2.1. By Application
    • 10.2.2. By End-use
    • 10.2.3. By Country
  • 10.3. South America: Country Analysis
    • 10.3.1. Brazil Integrated Passive Devices Market Outlook
      • 10.3.1.1. Market Size & Forecast
        • 10.3.1.1.1. By Value
      • 10.3.1.2. Market Share & Forecast
        • 10.3.1.2.1. By Application
        • 10.3.1.2.2. By End-use
    • 10.3.2. Colombia Integrated Passive Devices Market Outlook
      • 10.3.2.1. Market Size & Forecast
        • 10.3.2.1.1. By Value
      • 10.3.2.2. Market Share & Forecast
        • 10.3.2.2.1. By Application
        • 10.3.2.2.2. By End-use
    • 10.3.3. Argentina Integrated Passive Devices Market Outlook
      • 10.3.3.1. Market Size & Forecast
        • 10.3.3.1.1. By Value
      • 10.3.3.2. Market Share & Forecast
        • 10.3.3.2.1. By Application
        • 10.3.3.2.2. By End-use

11. Market Dynamics

  • 11.1. Drivers
  • 11.2. Challenges

12. Market Trends & Developments

  • 12.1. Merger & Acquisition (If Any)
  • 12.2. Product Launches (If Any)
  • 12.3. Recent Developments

13. Global Integrated Passive Devices Market: SWOT Analysis

14. Porter's Five Forces Analysis

  • 14.1. Competition in the Industry
  • 14.2. Potential of New Entrants
  • 14.3. Power of Suppliers
  • 14.4. Power of Customers
  • 14.5. Threat of Substitute Products

15. Competitive Landscape

  • 15.1. Murata Manufacturing Co., Ltd.
    • 15.1.1. Business Overview
    • 15.1.2. Products & Services
    • 15.1.3. Recent Developments
    • 15.1.4. Key Personnel
    • 15.1.5. SWOT Analysis
  • 15.2. Infineon Technologies AG
  • 15.3. STMicroelectronics N.V.
  • 15.4. ON Semiconductor Corporation
  • 15.5. Broadcom Inc.
  • 15.6. NXP Semiconductors N.V.
  • 15.7. Texas Instruments Incorporated
  • 15.8. Qorvo, Inc.
  • 15.9. MACOM Technology Solutions Holdings Inc.
  • 15.10. CTS Corporation

16. Strategic Recommendations

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