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市场调查报告书
商品编码
1503297

2030 年积体被动元件市场预测：按被动元件、基板、无线技术、最终用户和地区进行的全球分析

Integrated Passive Devices Market Forecasts to 2030 - Global Analysis By Passive Device, Substrate, Wireless Technology, End User and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3个工作天内

价格

根据Stratistics MRC的数据，2024年全球积体被动元件市场规模为22.2亿美元，预计到2030年将达到44.3亿美元，预测期内复合年增长率为12.23%。

积体被动元件(IPD) 是通常使用半导体製造技术直接在基板上製造的微型电子元件。这些元件透过将多个被动元件（例如电阻器、电容器和电感器）整合到单一封装中来减小尺寸、重量和製造复杂性。 IPD广泛应用于空间受限的现代化电子系统，例如行动电话、穿戴式装置和物联网装置。

根据印度品牌股权基金会（IBEF）统计，2021年印度家电和家用电子电器市场价值为98.4亿美元，预计到2025年将成长至211.8亿美元。

高频应用的需求不断增长

与分离式被动元件相比，积体被动元件由于尺寸更小、效能更高且成本效益更高，因此在行动通讯、物联网设备和汽车电子中变得至关重要。这些装置具有诸如更小的电路基板占用空间、更高的可靠性和更好的完整性等优点，这对于高频操作至关重要。随着5G网路的普及和物联网生态系统的扩展，对电子元件变得更小、更有效率的需求不断增加。这一趋势正在推动製造商创新并扩展其 IPD 产品，以满足最新技术不断变化的需求。

设计复杂性

然而，设计这些集成设备需要来自多个学科的复杂知识，包括材料科学、电路设计和製造流程。复杂性源自于需要优化电气性能、温度控管和可靠性，同时确保与现有电子系统的兼容性。此外，实现高产量比率并保持成本效益使设计过程更加复杂。因此，投资 IPD 的公司必须克服这些挑战，以充分利用市场潜力。

射频应用的增加

随着 5G 等无线通讯技术的不断普及，对紧凑、高效能射频元件的需求不断增加。将电阻器、电容器和电感器等被动元件整合到单一装置中的 IPD 在尺寸、性能和可靠性方面具有显着优势。 IPD 能够简化製造流程并减少整体系统占用空间，这对于智慧型手机、物联网设备、汽车电子和医疗设备等 RF 应用尤其有吸引力。此外，RF 电路日益增长的复杂性和效能要求需要 IPD 提供的先进整合技术。

製造商利润率下降

随着製造商利润率下降，积体被动元件将电容器、电阻器和电感器等组件组合在一个封装中，面临重大挑战。较低的利润率可能会导致製造商减少研发投资，从而限制创新和先进 IPD 技术的引入。此外，较低的盈利可能会导致行销预算减少，并阻碍对潜在客户进行宣传和教育，让他们了解 IPD 相对于传统分立被动元件的优势。

COVID-19 的影响：

最初，全球供应链中断导致製造延误和零件短缺，影响了 IPD 生产和交货计划。全球范围内实施的封锁和限制导致家用电子电器的需求波动，造成了不确定的市场环境，并减少了技术升级的投资。此外，向远端工作和数数位化的转变加速了对具有强大连接性和效率的设备的需求，影响了製造商寻求的 IPD 类型。儘管有这些挑战，疫情也刺激了 IPD 设计的创新，重点是更小的外形尺寸、低耗电量和更高的效能，以满足不断变化的消费者需求。

Balan 部分预计将在预测期内成为最大的部分

预计巴伦部分在预测期内将是最大的部分。这些装置对于射频 (RF) 应用中的平衡和不平衡讯号转换至关重要，有助于高效的讯号传输和接收。在将电阻器、电容器和电感器等多个被动元件整合到单一封装中的 IPD 中，巴伦透过最大限度地减少讯号损耗并确保电阻来帮助优化电路性能。此功能在无线通讯系统中尤其有价值，在无线通讯系统中，保持完整性和最大化效率至关重要。

玻璃晶圆领域预计在预测期内复合年增长率最高。

预计玻璃晶圆产业在预测期内将经历最高的复合年增长率。与硅和陶瓷等传统基板相比，玻璃晶圆具有多种优势，包括卓越的电气性能、热稳定性和小规模可製造性。玻璃晶圆能够实现 IPD 的精密製造，具有更高的整合密度和更低的寄生效应，从而提高整体电路性能。与微影术和蚀刻等先进製造技术的兼容性进一步增强了玻璃在 IPD 应用中的吸引力。此外，玻璃在某些波长下优异的透明度也可用于 IPD 中的光电应用。

比最大的地区

估计期间，亚太地区占据市场最大份额。积体被动元件将多个被动元件组合到一个封装中，在电子製造中变得越来越重要，特别是在亚太地区的消费性电子、通讯和汽车产业。这些装置具有占地面积更小、性能更高、组装成本更低等优点，满足了该地区对紧凑型高性能电子产品的重视。此外，亚太地区强大的製造基础和技术专长使其成为 IPD 开发和製造的主要中心。

复合年增长率最高的地区：

预计欧洲地区在预测期内将保持盈利成长。该地区的法规结构将环境保护放在首位，迫使IPD製造商开发节能环保的解决方案。支持技术进步和研究经费的政策将进一步刺激该行业的成长。这些法规使企业更容易投资 IPD 技术，从而提高竞争力并培养强大的市场生态系统。此外，遵守欧洲标准可以提高市场信誉，促进进入国际市场并吸引全球投资。

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    • 其他市场参与者的综合分析（最多 3 家公司）
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  • 竞争基准化分析
    • 根据产品系列、地理分布和策略联盟对主要企业基准化分析

目录

第一章执行摘要

第二章 前言

  • 概述
  • 相关利益者
  • 调查范围
  • 调查方法
    • 资料探勘
    • 资料分析
    • 资料检验
    • 研究途径
  • 研究资讯来源
    • 主要研究资讯来源
    • 二次研究资讯来源
    • 先决条件

第三章市场趋势分析

  • 促进因素
  • 抑制因素
  • 机会
  • 威胁
  • 最终用户分析
  • 新兴市场
  • COVID-19 的影响

第4章波特五力分析

  • 供应商的议价能力
  • 买方议价能力
  • 替代品的威胁
  • 新进入者的威胁
  • 竞争公司之间的敌对关係

第五章全球积体被动元件市场：依被动元件分类

  • 双工器
  • 客自订IPD
  • 耦合器
  • 巴伦
  • 共振器
  • 衰减器
  • 功率分配器/整合器
  • 其他被动元件

第六章全球积体被动元件市场：依基板

  • 玻璃晶圆
  • 硅
  • 陶瓷製品
  • 其他基板

第七章全球积体被动元件市场：无线技术

  • 细胞的
  • Bluetooth
  • 无线区域网路
  • 其他无线技术

第八章全球积体被动元件市场：依最终用户分类

  • 车
  • 家用电器
  • 航太和国防
  • 卫生保健
  • 资讯科技和通讯
  • 能源和公共事业
  • 其他最终用户

第九章全球积体被动元件市场：按地区

  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 义大利
    • 法国
    • 西班牙
    • 其他欧洲国家
  • 亚太地区
    • 日本
    • 中国
    • 印度
    • 澳洲
    • 纽西兰
    • 韩国
    • 其他亚太地区
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 南美洲其他地区
  • 中东/非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 卡达
    • 南非
    • 其他中东和非洲

第10章 主要进展

  • 合约、伙伴关係、协作和合资企业
  • 收购和合併
  • 新产品发布
  • 业务扩展
  • 其他关键策略

第十一章 公司概况

  • NXP Semiconductors
  • Murata Manufacturing Co., Ltd
  • Infineon Technologies AG
  • Taiwan Semiconductor Manufacturing Company
  • Samsung Electro-Mechanics
  • Qualcomm Technologies, Inc
  • TDK Corporation
  • Yageo Corporation
  • Skyworks Solutions
  • API Technologies
  • Kyocera Corporation
Product Code: SMRC26463

According to Stratistics MRC, the Global Integrated Passive Devices Market is accounted for $2.22 billion in 2024 and is expected to reach $4.43 billion by 2030 growing at a CAGR of 12.23% during the forecast period. Integrated Passive Devices (IPDs) refer to miniaturized electronic components that are fabricated directly onto a substrate, often using semiconductor fabrication techniques. These devices consolidate multiple passive components, such as resistors, capacitors, and inductors, into a single package, thereby reducing size, weight, and manufacturing complexity. IPDs are widely used in modern electronic systems where space is constrained, such as mobile phones, wearables, and IoT devices.

According to the India Brand Equity Foundation (IBEF), the Indian appliances and consumer electronics market was valued at US$ 9.84 billion in 2021 and is expected to be valued at US$ 21.18 billion by 2025.

Market Dynamics:

Driver:

Rising demand for high-frequency applications

Integrated Passive Devices are becoming integral in mobile communication, IoT devices, and automotive electronics due to their compact size, improved performance, and cost-effectiveness compared to discrete passive components. These devices offer advantages such as reduced footprint on circuit boards, enhanced reliability, and better signal integrity, crucial for high-frequency operations. With the proliferation of 5G networks and the expanding IoT ecosystem, the need for miniaturization and efficiency in electronic components has intensified. This trend is prompting manufacturers to innovate and expand their IPD offerings, catering to the evolving needs of modern technology.

Restraint:

Design complexity

However, designing these integrated devices requires intricate knowledge of various disciplines including materials science, circuit design, and manufacturing processes. The complexity arises from the need to optimize electrical performance, thermal management, and reliability while ensuring compatibility with existing electronic systems. Moreover, achieving high yields and maintaining cost-effectiveness further complicates the design process. As a result, companies investing in IPDs must navigate these challenges to capitalize on the market's potential.

Opportunity:

Rising radio frequency applications

As wireless communication technologies like 5G continue to proliferate, there is a heightened demand for compact and efficient RF components. IPDs, which integrate passive components such as resistors, capacitors, and inductors into a single device, offer substantial advantages in terms of miniaturization, performance, and reliability. Their ability to streamline manufacturing processes and reduce overall system footprint makes them particularly attractive for RF applications in smartphones, IoT devices, automotive electronics, and medical devices. Moreover, the increasing complexity and performance requirements of RF circuits necessitate advanced integration techniques provided by IPDs.

Threat:

Declining profit margins of manufacturers

Integrated Passive Devices, which include components like capacitors, resistors, and inductors integrated into a single package, face significant challenges due to reduced profitability among their producers. As profit margins shrink, manufacturers may cut back on research and development investments, limiting innovation and the introduction of advanced IPD technologies. Furthermore, reduced profitability can lead to constrained marketing budgets, hindering efforts to promote and educate potential customers about the benefits of IPDs over traditional discrete passive components.

Covid-19 Impact:

Initially, disruptions in the global supply chain caused manufacturing delays and component shortages, affecting IPD production and delivery schedules. As lockdowns and restrictions were imposed worldwide, demand for consumer electronics fluctuated, leading to uncertain market conditions and reduced investments in technology upgrades. Additionally, the shift towards remote work and digitalization accelerated the demand for devices with robust connectivity and efficiency, influencing the types of IPDs sought by manufacturers. Despite these challenges, the pandemic also spurred innovation in IPD designs, emphasizing smaller form factors, lower power consumption, and enhanced performance to meet evolving consumer needs.

The Baluns segment is expected to be the largest during the forecast period

Baluns segment is expected to be the largest during the forecast period. These devices are crucial in converting between balanced and unbalanced signals in radio frequency (RF) applications, facilitating efficient signal transmission and reception. In IPD, which integrates multiple passive components like resistors, capacitors, and inductors into a single package, baluns serve to optimize circuit performance by minimizing signal loss and ensuring impedance matching. This capability is particularly valuable in wireless communication systems, where maintaining signal integrity and maximizing efficiency are paramount.

The Glass Wafer segment is expected to have the highest CAGR during the forecast period

Glass Wafer segment is expected to have the highest CAGR during the forecast period. Glass wafers offer several advantages over traditional substrates like silicon or ceramic, including superior electrical properties, thermal stability, and manufacturability at smaller scales. Glass wafers enable higher integration densities and precise fabrication of IPDs with reduced parasitic effects, enhancing overall circuit performance. Their compatibility with advanced manufacturing techniques such as photolithography and etching further boosts their appeal for IPD applications. Moreover, glass's excellent transparency in certain wavelengths can also be leveraged for optoelectronic applications in IPDs.

Region with largest share:

Asia Pacific region commanded the largest share of the market over the extrapolated period. Integrated Passive Devices, which combine multiple passive components into a single package, are becoming increasingly crucial in electronics manufacturing, particularly in consumer electronics, telecommunications, and automotive sectors across the region. These devices offer advantages such as smaller footprint, improved performance, and reduced assembly costs, aligning with the region's emphasis on compact, high-performance electronics in the region. Furthermore, Asia Pacific's robust manufacturing base and technological expertise make it a prime hub for IPD development and production.

Region with highest CAGR:

Europe region is poised to hold profitable growth during the projection period. The region's regulatory framework prioritizes environmental conservation, which compels IPD manufacturers to develop energy-efficient and eco-friendly solutions. Policies supporting technological advancement and research funding further stimulate growth in the sector. These regulations create a conducive environment for businesses to invest in IPD technologies, driving competitiveness and fostering a robust market ecosystem. Moreover, compliance with European standards enhances market credibility and facilitates international market access, attracting global investments.

Key players in the market

Some of the key players in Integrated Passive Devices market include NXP Semiconductors, Murata Manufacturing Co., Ltd, Infineon Technologies AG, Taiwan Semiconductor Manufacturing Company, Samsung Electro-Mechanics, Qualcomm Technologies, Inc, TDK Corporation, Yageo Corporation, Skyworks Solutions, API Technologies and Kyocera Corporation.

Key Developments:

In May 2022, STMicroelectronics, an electronics and semiconductor manufacturing company, collaborated with Microsoft, an ST authorized company, for leading the development of the IoT devices. This collaboration has brought about security features, provided secure boot and storage, and fulfilled customer demands for efficient and trusted solutions.

In March 2022, MACOM Technology announced availability of its 128 GBaud Transimpedance Amplifiers (TIAs) and Modulator Drivers for coherent optical networking applications. MACOM's new products support long-haul, metropolitan and Data Center Interconnect (DCI) optical module applications.

Passive Devices Covered:

  • Diplexers
  • Customized IPDs
  • Couplers
  • Baluns
  • Resonators
  • Attenuators
  • Power Splitters/Combiners
  • Other Passive Devices

Substrates Covered:

  • Glass Wafer
  • Silicon
  • Ceramic
  • Other Substrates

Wireless Technologies Covered:

  • Cellular
  • Bluetooth
  • Wireless local-area Network
  • Other Wireless Technologies

End Users Covered:

  • Automotive
  • Consumer Electronics
  • Aerospace & Defense
  • Healthcare
  • IT & Telecommunication
  • Energy and Utility
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2022, 2023, 2024, 2026, and 2030
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 End User Analysis
  • 3.7 Emerging Markets
  • 3.8 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Integrated Passive Devices Market, By Passive Device

  • 5.1 Introduction
  • 5.2 Diplexers
  • 5.3 Customized IPDs
  • 5.4 Couplers
  • 5.5 Baluns
  • 5.6 Resonators
  • 5.7 Attenuators
  • 5.8 Power Splitters/Combiners
  • 5.9 Other Passive Devices

6 Global Integrated Passive Devices Market, By Substrate

  • 6.1 Introduction
  • 6.2 Glass Wafer
  • 6.3 Silicon
  • 6.4 Ceramic
  • 6.5 Other Substrates

7 Global Integrated Passive Devices Market, By Wireless Technology

  • 7.1 Introduction
  • 7.2 Cellular
  • 7.3 Bluetooth
  • 7.4 Wireless local-area Network
  • 7.5 Other Wireless Technologies

8 Global Integrated Passive Devices Market, By End User

  • 8.1 Introduction
  • 8.2 Automotive
  • 8.3 Consumer Electronics
  • 8.4 Aerospace & Defense
  • 8.5 Healthcare
  • 8.6 IT & Telecommunication
  • 8.7 Energy and Utility
  • 8.8 Other End Users

9 Global Integrated Passive Devices Market, By Geography

  • 9.1 Introduction
  • 9.2 North America
    • 9.2.1 US
    • 9.2.2 Canada
    • 9.2.3 Mexico
  • 9.3 Europe
    • 9.3.1 Germany
    • 9.3.2 UK
    • 9.3.3 Italy
    • 9.3.4 France
    • 9.3.5 Spain
    • 9.3.6 Rest of Europe
  • 9.4 Asia Pacific
    • 9.4.1 Japan
    • 9.4.2 China
    • 9.4.3 India
    • 9.4.4 Australia
    • 9.4.5 New Zealand
    • 9.4.6 South Korea
    • 9.4.7 Rest of Asia Pacific
  • 9.5 South America
    • 9.5.1 Argentina
    • 9.5.2 Brazil
    • 9.5.3 Chile
    • 9.5.4 Rest of South America
  • 9.6 Middle East & Africa
    • 9.6.1 Saudi Arabia
    • 9.6.2 UAE
    • 9.6.3 Qatar
    • 9.6.4 South Africa
    • 9.6.5 Rest of Middle East & Africa

10 Key Developments

  • 10.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 10.2 Acquisitions & Mergers
  • 10.3 New Product Launch
  • 10.4 Expansions
  • 10.5 Other Key Strategies

11 Company Profiling

  • 11.1 NXP Semiconductors
  • 11.2 Murata Manufacturing Co., Ltd
  • 11.3 Infineon Technologies AG
  • 11.4 Taiwan Semiconductor Manufacturing Company
  • 11.5 Samsung Electro-Mechanics
  • 11.6 Qualcomm Technologies, Inc
  • 11.7 TDK Corporation
  • 11.8 Yageo Corporation
  • 11.9 Skyworks Solutions
  • 11.10 API Technologies
  • 11.11 Kyocera Corporation

List of Tables

  • Table 1 Global Integrated Passive Devices Market Outlook, By Region (2022-2030) ($MN)
  • Table 2 Global Integrated Passive Devices Market Outlook, By Passive Device (2022-2030) ($MN)
  • Table 3 Global Integrated Passive Devices Market Outlook, By Diplexers (2022-2030) ($MN)
  • Table 4 Global Integrated Passive Devices Market Outlook, By Customized IPDs (2022-2030) ($MN)
  • Table 5 Global Integrated Passive Devices Market Outlook, By Couplers (2022-2030) ($MN)
  • Table 6 Global Integrated Passive Devices Market Outlook, By Baluns (2022-2030) ($MN)
  • Table 7 Global Integrated Passive Devices Market Outlook, By Resonators (2022-2030) ($MN)
  • Table 8 Global Integrated Passive Devices Market Outlook, By Attenuators (2022-2030) ($MN)
  • Table 9 Global Integrated Passive Devices Market Outlook, By Power Splitters/Combiners (2022-2030) ($MN)
  • Table 10 Global Integrated Passive Devices Market Outlook, By Other Passive Devices (2022-2030) ($MN)
  • Table 11 Global Integrated Passive Devices Market Outlook, By Substrate (2022-2030) ($MN)
  • Table 12 Global Integrated Passive Devices Market Outlook, By Glass Wafer (2022-2030) ($MN)
  • Table 13 Global Integrated Passive Devices Market Outlook, By Silicon (2022-2030) ($MN)
  • Table 14 Global Integrated Passive Devices Market Outlook, By Ceramic (2022-2030) ($MN)
  • Table 15 Global Integrated Passive Devices Market Outlook, By Other Substrates (2022-2030) ($MN)
  • Table 16 Global Integrated Passive Devices Market Outlook, By Wireless Technology (2022-2030) ($MN)
  • Table 17 Global Integrated Passive Devices Market Outlook, By Cellular (2022-2030) ($MN)
  • Table 18 Global Integrated Passive Devices Market Outlook, By Bluetooth (2022-2030) ($MN)
  • Table 19 Global Integrated Passive Devices Market Outlook, By Wireless local-area Network (2022-2030) ($MN)
  • Table 20 Global Integrated Passive Devices Market Outlook, By Other Wireless Technologies (2022-2030) ($MN)
  • Table 21 Global Integrated Passive Devices Market Outlook, By End User (2022-2030) ($MN)
  • Table 22 Global Integrated Passive Devices Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 23 Global Integrated Passive Devices Market Outlook, By Consumer Electronics (2022-2030) ($MN)
  • Table 24 Global Integrated Passive Devices Market Outlook, By Aerospace & Defense (2022-2030) ($MN)
  • Table 25 Global Integrated Passive Devices Market Outlook, By Healthcare (2022-2030) ($MN)
  • Table 26 Global Integrated Passive Devices Market Outlook, By IT & Telecommunication (2022-2030) ($MN)
  • Table 27 Global Integrated Passive Devices Market Outlook, By Energy and Utility (2022-2030) ($MN)
  • Table 28 Global Integrated Passive Devices Market Outlook, By Other End Users (2022-2030) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.