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市场调查报告书
商品编码
1483043
全球整合式被动元件 (IPD) 市场 2024-2031Global Integrated Passive Devices (IPDs) Market 2024-2031 |
整合式被动元件(IPD) 市场规模、份额和趋势分析报告,按被动元件(巴伦、滤波器、耦合器、双工器和客製化IPD)、按应用(EMI 和EMS 保护IPD、RF IPD 以及数位与混合讯号IPD)以最终用户(消费性电子、汽车、IT 与电信、航太与国防、医疗保健与生命科学等)预测期 (2024-2031)
预计 IPD 市场在预测期内(2024-2031 年)将以 12.6% 的复合年增长率成长。无线通讯技术的日益普及以及行动装置、物联网设备和 5G 基础设施等 RF(射频)应用中整合被动元件的需求不断增加,推动了市场的成长。 IPD 越来越多地应用于消费性电子产品,例如游戏系统、无线扬声器、路由器、机上盒、无人机、穿戴式和听觉技术、智慧电视和智慧家电。
Integrated Passive Devices (IPDs) Market Size, Share & Trends Analysis Report by Passive Devices (Baluns, Filter, Couplers, Diplexers, and Customized IPDs), by Application (EMI and EMS protection IPD, RF IPD and Digital & Mixed-Signal IPD) and by End-User (Consumer Electronics, Automotive, IT & Telecommunication, Aerospace & Defense, Healthcare & Lifesciences and Others) Forecast Period (2024-2031)
IPD market is anticipated to grow at a CAGR of 12.6% during the forecast period (2024-2031). The growing adoption of wireless communication technologies with increased demand for integrated passive devices in RF (Radio Frequency) applications, such as mobile devices, IoT devices, and 5G infrastructure drive the growth of the market. IPDs are being increasingly used in consumer electronics such as gaming systems, wireless speakers, routers, set-top boxes, drones, Wearable and hearable technology, smart TVs, and smart appliances.
Market Dynamics
Increasing Adoption of RF Front-End Modules
RF front-end module (FEM) is used to boost RF signals to extend a link's range, strength, and resilience. A high-resistivity substrate is used by the RF-integrated passive device (RF IPD) to integrate quality factor parts including capacitors and indicators. IPD technology can be used to construct a wide range of components, including power combiners/splitters, couplers, harmonic filters, impedance matching networks, and baluns. IPDs offer stand-alone items like filters and baluns in addition to foundry services. Their compatibility with various assembly modalities, such as wire bonding, microbumping, and CSP, allows them to be mounted as a complete RF module or on the main printed wiring board (PWB).
Advancement in IPDs using Through- Glass-Via (TGV) Substrate for High-frequency Applications
The demand for mobile high-speed connections is constantly increasing. IPDs made with glass thin films are growing more favored over those made using through-silicon-via (TSV) substrate. Glass substrate's high resistivity, low dielectric loss, high thermal stability, and tunable coefficient of thermal expansion led to its increasing use in the manufacturing of passive devices. Using Glass-Via (TGV) Substrate that offers high-frequency electrical properties, remarkable heat and chemical resistance, and high geometrical tolerances, glass has become a highly versatile substrate for a wide range of sensor and MEMS packaging applications, including electromechanical, thermal, optical, biomedical, and RF devices.
Market Segmentation
EMI and EMS protection IPD is Projected to Emerge as the Largest Segment
Based on the application, the global integrated passive devices market is sub-segmented into EMI and EMS protection IPD, RF IPD and digital & mixed-signal IPD. Among these, the EMI and EMS protection IPD sub-segment is expected to hold the largest share of the market. The primary factor supporting the segment's growth includes the growing adoption of customized solutions that are provided by EMS & EMI Protection IPDs, which protect delicate parts and guarantee peak performance in a range of gadgets, such as laptops, smartphones, automobile electronics, and industrial machinery. The increasing demand for electromagnetic interference (EMI) shielding and electrostatic discharge (EMS) protection solutions across diverse electronic applications. It is essential to reduce interference and provide protection against static electricity as electronic equipment gets denser and more compact. The ongoing development of electronics and the growing demand for reliable EMI and EMS protection. Robust protection measures offered by EMS & EMI Protection IPDs remain in high demand as sectors including consumer electronics, automotive, and telecommunications continue to evolve.
Consumer Electronics Sub-segment to Hold a Considerable Market Share
Based on application, the global integrated passive devices market is sub-segmented into consumer electronics, automotive, IT & telecommunication, aerospace & defense, healthcare & life sciences and others (energy and utility). Among these, consumer electronics sub-segment is expected to hold a considerable share of the market. The growing demand for numerous electronic devices makes use of integrated passive components. These consist of RF modules, portable gadgets, and cell phones. IPDs come in a variety of forms and can be combined into a single circuit by simplifying its design and minimizing the number of connections needed. Furthermore, technological developments like smaller chips have made it possible for electronic equipment to get smaller, which has led to a rise in the popularity of consumer electronics like laptops, LED televisions, tablets, and mobile phones.
The global Integrated Passive Devices market is further segmented based on geography including North America (the US, and Canada), Europe (UK, Italy, Spain, Germany, France, and the Rest of Europe), Asia-Pacific (India, China, Japan, South Korea, and Rest of Asia), and the Rest of the World (the Middle East & Africa, and Latin America).
An Increasing Integrated Passive Devices (IPD) Application in Europe
Global Integrated Passive Devices Market Growth by Region 2024-2031
Source: OMR Analysis
North America Holds Major Market Share
Among all the regions, North America holds a significant share owing to the presence of an enormous number of providers offering integrated passive devices. The key market players include Texas Instruments Inc., Silicon Laboratories, Inc., Intel Corp., Semiconductor Components Industries, LLC, Analog Devices, Inc., and others. The market growth is attributed to the increase in the semiconductor industry, the Internet of Things (IoT) is widely used with an increase in 5G connectivity. For instance, Semiconductor Components Industries, LLC, offers High-Q(TM) Integrated Passive Device (IPD) process technology from Onsemi offers a copper on high resistivity silicon platform ideal for the production of passive devices such as baluns, filters, couplers, and diplexers that are used in portable, wireless and RF applications.
Note: Major Players Sorted in No Particular Order.
The major companies serving the global integrated passive devices market include Analog Devices, Inc., Murata Manufacturing Co., Ltd., NXP Semiconductors N.V., STMicroelectronics N.V., and Texas Instruments Inc., among others. The market players are increasingly focusing on business expansion and product development by applying strategies such as collaborations, mergers, and acquisitions to stay competitive in the market. For instance,