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市场调查报告书
商品编码
1708075

3D成像ToF感测器市场:现状分析与预测(2024年~2032年)

3D Imaging TOF Sensor Market: Current Analysis and Forecast (2024-2032)

出版日期: | 出版商: UnivDatos Market Insights Pvt Ltd | 英文 143 Pages | 商品交期: 最快1-2个工作天内

价格
简介目录

3D 成像 ToF 感测器是先进的深度感测器,可以估算设备发射的光到达目标表面所需的时间,反之亦然。它透过使用光速确定距离来提供高度精确的深度测量。热释电感测器采用触控启动并透过红外线操作,适用于脸部辨识、扩增实境、机器人和汽车光达等应用。与立体视觉和结构光方法相比,ToF 可以提供高解析度、即时的深度感知,且处理负荷较小。这些感测器进一步分为两类:直接飞行时间 (dToF) 感测器和间接飞行时间 (iToF) 感测器。许多消费性电子设备都使用 iToF 感测器。该感测器对于手势控制、物体检测和自主自动化(包括智慧型手机使用和游戏产业)至关重要。由于这种雷射可以在各种照明条件下工作,因此可以方便地用于现代 3D 成像应用。

预计预测期内(2024-2032 年),3D 成像 ToF 感测器市场规模将以 22.96% 的显着复合年增长率成长。 3D 成像 ToF 感测器,也称为 3D 成像飞行时间感测器,正在应用于多个现有和新兴行业,以提供高度精确的深度灵敏度和即时精确的 3D 成像功能。在消费性电子领域,ToF 感测器正在改善脸部辨识、扩增实境 (AR)、虚拟实境 (VR) 和智慧型手机摄影,使其成为下一代科技产品必不可少的。汽车是另一个重要的应用领域,其中 ToF 感测器广泛应用于 ADAS、自动导航和 LiDAR。此外,ToF 感测器开始应用于工业自动化和机器人领域,用于物件侦测、库存控制和产品品质监控。其他可以从 3D 影像中受益的行业包括医疗保健行业的诊断和医疗机器人。此外,智慧城市解决方案的兴起、人工智慧营运监控的扩展以及人工智慧和边缘运算的发展也进一步推动了需求。

例如,2022 年 10 月,SICK 推出了市场上首款配备性能等级 c (PL c) 的 ToF 感测器的 3D 飞行时间 (ToF) 相机:safeVisionary2。它的开发是为了支援 3D 定位和物体识别以及完全自主。它非常适合与自主移动机器人一起使用,因为它可以提供精确的 3D 测量数据,从而实现自主和智慧移动机器人导航。

按产品类型划分,间接飞行时间 (iToF) 感测器目前占据最大的市场占有率,因为它们提供更高的精度和更低的功耗,广泛应用于智慧型手机、耐用型 AR/VR 设备、视讯游戏机等。然而,直接飞行时间 (dToF) 型感测器未来可能会以更高的速度扩展,因为它们需要自动驾驶汽车、机器人和雷射雷达所需的远距离和深度精度。 dToF 技术因其精确的 3D 映射和环境感知能力而被应用于 ADAS、航空航天和智慧城市专案。随着对自动驾驶汽车、人工智慧安全和工业自动化的需求不断增长,dToF 感测器预计将在未来几年内更加普及。

根据应用,3D 扫描和成像类别在 3D 成像 ToF 感测器市场中占据最大的市场占有率。这些领域包括脸部辨识和生物辨识安全的深度感应,以及消费性产品中的辅助摄影。然而,汽车安全和导航领域预计未来几年将以最高的复合年增长率成长。随着消费者转向自动驾驶汽车并且 ADAS 与汽车的整合度不断提高,即时深度感知和物件侦测能力变得越来越重要。这些 ToF 感测器对于自动驾驶汽车技术至关重要,并且由于它们有助于碰撞管理、车道侦测辅助和自适应巡航控制,因此正在迅速变得更加普及。

从垂直角度来看,消费性电子领域目前在 3D 成像飞行时间 (ToF) 感测器市场中占有最大的市场占有率,这得益于其在智慧型手机、平板电脑、增强/混合实境设备和游戏中的应用。消费性电子产品占据最大的市场占有率,苹果、三星和微软等领先的科技品牌采用 ToF 感测器进行脸部辨识、提高摄影影像深度以及手势控制。然而,由于汽车在 ADAS、雷射雷达导航和自动驾驶汽车中的应用,预计未来几年汽车领域将出现最高的成长率。光达感测器在碰撞检测、驾驶员监控和停车方面发挥着重要作用,在新一代汽车中占据着突出的地位。这是由于两大趋势,即自动驾驶和电动车(EV),预计这两者都将显着推动 3D 成像 ToF 感测器市场的发展。

为了更了解市场,我们根据北美(美国、加拿大和其他国家)、欧洲(德国、法国、英国、西班牙、义大利和其他国家)、亚太地区(中国、日本、印度和其他国家)以及世界其他地区等各个垂直领域的全球采用情况,对 3D 成像 ToF 感测器市场的成长情况进行了分析。预计亚太地区未来将实现最高成长。这一成长是由消费性电子和汽车领域强劲的市场需求以及医疗保健领域不断扩大的应用所推动的。此外,医疗影像和炼式智慧监控的投资增加也是影响市场成长的因素。预测期内,亚太地区半导体製造商的崛起和研发整合将进一步推动 3D 成像 ToF 感测器市场的发展。

市场的主要参与者包括意法半导体、索尼半导体解决方案公司、Pmdtechnologies AG、英飞凌科技股份公司、Melexis、ams-OSRAM AG、德州仪器公司、ADI公司、Teledyne Vision Solutions(Teledyne Technologies)和ifm electronic India Pvt。 (ifm 集团)。

本报告提供全球3D成像ToF感测器市场相关调查,提供市场概要,以及各产品类型,各用途,各业界,各地区的趋势,及加入此市场的主要企业简介等资讯。

目录

第1章 市场简介

第2章 调查手法或假设

第3章 摘要整理

第4章 市场动态

  • 促进因素
  • 机会
  • 阻碍因素
  • 趋势
  • PESTEL分析
  • 需求面分析
  • 供给面分析

第5章 价格分析

  • 地区价格分析
  • 价格的影响因素

第6章 全球3D成像ToF感测器市场收益(100万美元),2022年~2032年的预测

第7章 各产品类型的市场分析

  • 直接ToF感测器
  • 间接ToF感测器

第8章 各用途的市场分析

  • 手势姿态辨识
  • 3D扫描和成像
  • 扩增实境和虚拟实境
  • 汽车的安全性和导航
  • 工业自动化和机器人技术
  • 其他

第9章 各业界的市场分析

  • 家电
  • 汽车
  • 产业
  • 其他

第10章 各地区的市场分析

  • 北美
    • 美国
    • 加拿大
    • 其他
  • 欧洲
    • 德国
    • 英国
    • 法国
    • 义大利
    • 西班牙
    • 其他
  • 亚太地区
    • 中国
    • 日本
    • 印度
    • 其他
  • 其他地区

第11章 价值链分析

第12章 竞争情形

  • 竞争仪表板
  • 竞争的市场定位分析
  • 波特五力分析

第13章 企业简介

  • STMicroelectronics
  • Sony Semiconductor Solutions Corporation
  • Pmdtechnologies AG
  • Infineon Technologies AG
  • Melexis
  • ams-OSRAM AG
  • Texas Instruments Incorporated
  • Analog Devices, Inc.
  • Teledyne Vision Solutions(Teledyne Technologies)
  • ifm electronic India Pvt. Ltd.(ifm Group)

第14章 缩写与假设

第15章 附录

简介目录
Product Code: UMSE213216

A 3D Imaging ToF sensor is a highly sophisticated depth sensor that estimates the amount of time it takes for light emitted by a device to reach the target surface and vice-versa. It makes a high precision in depth measurement through determining distance by the speed of light. Pyroelectric sensors are of the touch type and work with infrared light, making them a good fit for applications like face recognition, augmented reality, robotic applications, and automobile LiDAR applications. Compared to the stereo vision or structured light methods, ToF is able to provide real-time perception of depth at high resolutions with less processing demand. These sensors are further classified into two categories: Direct time-of-flight (dToF) and indirect time-of-flight (iToF) sensors. In most of the consumer electronic gadgets, iToF sensors are used because of their cheaper and better performance. This sensor is very important in Gesture control, object detection, and Autonomous automation, including the smartphone usage and gaming industry. That is why it has been considered convenient to use these types of lasers for modern 3D imaging applications since they function well in different lighting conditions.

The 3D Imaging ToF Sensor Market is expected to grow with a significant CAGR of 22.96% during the forecast period (2024-2032). The 3D Imaging ToF sensor is also referred to as the 3D imaging Time-of-Flight sensor, and it is applied across several existing and emerging industries to provide high precision in depth sensitivity and real-time and accurate 3D imaging proficiency. In the consumer electronics sector, ToF sensors improve facial recognition, augmented reality, virtual reality, and smartphone photography applications, which makes them crucial in the next generation of tech gadgets. Automotive is another important application segment, where ToF sensors have extensive application in ADAS, autonomous navigation, and LiDAR. Also, industrial automation and robotics applications have started to adopt ToF sensors for detecting objects, inventory management, and monitoring product quality. Other industries that stand to benefit from 3D imaging are diagnostics and medical robotics in the healthcare industry. Also, increasing smart city solutions, growing AI-operational surveillance, and developments in AI and edge computing are propelling the demand even further.

For instance, in October 2022, SICK introduced the first 3D time-of-flight (ToF) camera that uses ToF sensors, with Performance Level c (PL c) on the market - the safeVisionary2. It was developed to support customers in becoming fully autonomous in addition to providing 3D localization and object recognition. It is very effective for use on an autonomous mobile robot because it provides precise 3D measurement data that allows for autonomous and intelligent mobile robot navigation.

Based on the product type, currently, the highest market share is held by Indirect Time-of-Flight (iToF) sensors as these offer higher accuracy and lesser power consumption and have huge applications into smartphones, enduring AR/VR gadgets, and video gaming consoles. However, direct ToF (dToF) type of sensors will expand at a higher rate in the future due to its feature of long-range and high-depth accuracy required in autonomous vehicles, robotics and LiDAR applications. The dToF technology is getting adopted in ADAS, aerospace, and smart city projects because of its accurate 3D mapping and environmental sensing. With the rising demand for self-driving cars, AI-powered security, and automation in industries, dToF sensors are expected to gain popularity in the next few years.

Based on the application category, the 3D Scanning & Imaging class holds the largest market share in the market of 3D Imaging ToF sensors, as this type of sensor is actively used in smartphones, security systems, and industry. These areas include depth sensing for facial identification and biometric security, as well as assistive photography in consumer products. However, the Automotive Safety & Navigation segment is projected to witness the highest CAGR in the years to come. With the growing consumer inclination towards self-driven cars and the integration of vehicles with ADAS, real-time depth sensing and object detection feature is gaining significance. These ToF sensors contribute to controlling collision, lane detection assist, and adaptive cruise control, thus, they are crucial for autonomous car technology and are gaining popularity rapidly.

Based on the industry verticals category, currently, the Consumer Electronics segment occupies the largest market share in the 3D Imaging Time-of-Flight (ToF) sensor market due to its applications in smartphones, tablets, augmented/mixed reality devices, and games. Consumer electronics account for the largest market share, with leading tech brands such as Apple, Samsung, and Microsoft employing ToF sensors for facial recognition, better image depth for photographic purposes, and gesture control. However, the Automotive segment is expected to show the highest growth rate in the upcoming years due to its application in ADAS, LiDAR navigation, and self-driving automobiles. LIDAR sensors are critical in detecting collisions, monitoring drivers, and car parking, which gives them significant importance in the new generation of cars. This is due to two major trends- self-driving and electric vehicles (EVs), both of which are expected to boost the 3d imaging ToF sensors market massively.

For a better understanding of the market, the growth of the 3D Imaging ToF Sensor market is analyzed based on their worldwide adoption in different sectors in regions such as North America (U.S., Canada, and the Rest of North America), Europe (Germany, France, U.K., Spain, Italy, Rest of Europe), Asia-Pacific (China, Japan, India, Rest of Asia-Pacific), Rest of World. The Asia-Pacific region is expected to have the highest growth in the future. This growth is driven by its large market need in the sectors of consumer electronics and automotive, and the rise in applications in the healthcare sector. Moreover, increasing investment in healthcare imaging and chain smart surveillance is another factor that affects the growth of the market. Semiconductor manufacturers and rising research and development integration across the Asia-Pacific region will further boost the market growth of 3D Imaging ToF sensors in the forecasted period.

Some of the major players operating in the market include STMicroelectronics, Sony Semiconductor Solutions Corporation, Pmdtechnologies AG, Infineon Technologies AG, Melexis, ams-OSRAM AG, Texas Instruments Incorporated, Analog Devices, Inc., Teledyne Vision Solutions (Teledyne Technologies), ifm electronic India Pvt. Ltd. (ifm Group).

TABLE OF CONTENTS

1.Market Introduction

  • 1.1. Market Definitions
  • 1.2. Main Objective
  • 1.3. Stakeholders
  • 1.4. Limitation

2.Research Methodology or Assumption

  • 2.1. Research Process of the 3D Imaging TOF Sensor Market
  • 2.2. Research Methodology of the 3D Imaging TOF Sensor Market
  • 2.3. Respondent Profile

3.Executive Summary

  • 3.1. Industry Synopsis
  • 3.2. Segmental Outlook
    • 3.2.1. Market Growth Intensity
  • 3.3. Regional Outlook

4.Market Dynamics

  • 4.1. Drivers
  • 4.2. Opportunity
  • 4.3. Restraints
  • 4.4. Trends
  • 4.5. Pestel Analysis
  • 4.6. Demand Side Analysis
  • 4.7. Supply Side Analysis
    • 4.7.1. Merger & Acquisition
    • 4.7.2. Investment Scenario
    • 4.7.3. Industry Insights: Leading Startups and Their Unique Strategies

5.Pricing Analysis

  • 5.1. Regional Pricing Analysis
  • 5.2. Price Influencing Factors

6.Global 3D Imaging TOF Sensor Market Revenue (USD Mn), 2022-2032F

7.Market Insights by Product Type

  • 7.1. Direct ToF Sensors
  • 7.2. Indirect ToF Sensors

8.Market Insights by Application

  • 8.1. Gesture Recognition
  • 8.2. 3D Scanning & Imaging
  • 8.3. Augmented Reality & Virtual Reality
  • 8.4. Automotive Safety & Navigation
  • 8.5. Industrial Automation & Robotics
  • 8.6. Others

9.Market Insights by Industry Vertical

  • 9.1. Consumer Electronics
  • 9.2. Automotive
  • 9.3. Industrial
  • 9.4. Others

10.Market Insights by Region

  • 10.1. North America
    • 10.1.1. U.S.
    • 10.1.2. Canada
    • 10.1.3. Rest of North America
  • 10.2. Europe
    • 10.2.1. Germany
    • 10.2.2. U.K.
    • 10.2.3. France
    • 10.2.4. Italy
    • 10.2.5. Spain
    • 10.2.6. Rest of Europe
  • 10.3. Asia-Pacific
    • 10.3.1. China
    • 10.3.2. Japan
    • 10.3.3. India
    • 10.3.4. Rest of Asia-Pacific
  • 10.4. Rest of World

11.Value Chain Analysis

  • 11.1. Marginal Analysis
  • 11.2. List of Market Participants

12.Competitive Landscape

  • 12.1. Competition Dashboard
  • 12.2. Competitor Market Positioning Analysis
  • 12.3. Porter Five Forces Analysis

13.Company Profiles

  • 13.1. STMicroelectronics
    • 13.1.1. Company Overview
    • 13.1.2. Key Financials
    • 13.1.3. SWOT Analysis
    • 13.1.4. Product Portfolio
    • 13.1.5. Recent Developments
  • 13.2. Sony Semiconductor Solutions Corporation
  • 13.3. Pmdtechnologies AG
  • 13.4. Infineon Technologies AG
  • 13.5. Melexis
  • 13.6. ams-OSRAM AG
  • 13.7. Texas Instruments Incorporated
  • 13.8. Analog Devices, Inc.
  • 13.9. Teledyne Vision Solutions (Teledyne Technologies)
  • 13.10. ifm electronic India Pvt. Ltd. (ifm Group)

14.Acronyms & Assumption

15.Annexure