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市场调查报告书
商品编码
1623187

静电放电(ESD)包装的全球市场规模:各产品,各用途,各终端用户,地区范围及预测

Global Electrostatic Discharge ESD Packaging Market Size By Product, By Application, By End-User, By Geographic Scope And Forecast

出版日期: | 出版商: Verified Market Research | 英文 202 Pages | 商品交期: 2-3个工作天内

价格
简介目录

静电放电 (ESD) 封装市场规模及预测

2024 年静电放电 (ESD) 封装市场规模为 22.7 亿美元,预计到 2031 年将达到 34.5 亿美元,复合年增长率为 5%。静电放电 (ESD) 封装对于保护电子元件和设备免受静电突然释放造成的损坏至关重要。当两个具有不同电位的物体接触时,就会发生静电放电,导致电流快速流动,从而损坏敏感的电子元件。在电子设备的生产、运输和储存过程中,这种放电会带来重大风险,并可能导致设备故障或完全失效。 ESD 封装透过建立安全消散静电的受控环境来最大限度地减少这种威胁,从而确保对封装组件的保护。

半导体製造、航空航太、汽车和医疗设备等行业因其敏感的电子设备而严重依赖 ESD 封装。

随着电子设备变得越来越小、越来越复杂,对强大的 ESD 保护的需求变得更加重要,因为较小的组件更容易受到静电的损坏。此外,对先进 ESD 封装解决方案的需求持续成长。

未来 ESD 封装的创新预计将集中在透过使用新材料和製造技术来提高效率、减轻重量和提高环境永续性。

静电放电 (ESD) 封装的全球市场动态

塑造全球静电放电 (ESD) 封装市场的主要市场动态

主要市场驱动因子

电子设备需求增加:

电子设备需求不断成长:电子设备需求不断成长是主要推动因素之一。随着消费者和产业接受技术进步,越来越需要保护敏感电子元件在製造、运输和储存过程中免受静电放电。根据国际数据公司(IDC)预测,2022年全球智慧型手机出货量预计将达到12.1亿部,2026年将成长至13.8亿部。

半导体产业的成长:

半导体产业的快速扩张推动了对专业 ESD 封装的需求。根据半导体产业协会(SIA)的报告,2022年全球半导体销售额将达到50亿美元,预计2030年将超过1兆美元。这种成长需要在整个供应链中采取先进的 ESD 保护措施。

严格的法规和标准:

有关电子元件处理和保护的日益严格的法规和行业标准正在推动 ESD 封装市场的发展。 ESD 协会报告称,许多电子设备製造商都必须遵守 ANSI/ESD S20.20 等标准。根据该协会 2021 年的调查,78% 的电子製造商制定了全面的 ESD 管理计划,高于 2018 年的 65%,这表明确实如此。

主要问题

成本高:

在整个供应链中实施 ESD 措施的成本很高。根据美国能源部的报告,实施全面的 ESD 管理计画每年每平方英尺製造空间的成本为 0.10 至 0.50 美元。

缺乏意识:

中小企业缺乏意识和适当的训练。根据 EU-OSHA(欧洲工作安全与健康机构)进行的一项研究,电子行业中 76% 的中小企业拥有正式的 ESD 计划,而大型企业则只有这一比例。

处置 ESD 包装材料的环境问题:

根据美国环保署 (EPA) 的一份报告,防静电包装材料中常用的塑胶占每年产生的所有城市固体废物的 18% 以上,并且只有约 9% 未被回收。

主要趋势

电子元件的小型化:

随着电子元件变得越来越小、越来越敏感,静电损坏的风险也增加。这增加了对 ESD 封装解决方案的需求,这些解决方案可以在运输、储存和搬运过程中有效保护这些零件。根据国际半导体技术路线图(ITRS),积体电路中的平均电晶体尺寸预计将从1995年的350奈米缩小到2020年的仅5奈米,到2028年将达到1.5奈米。

物联网 (IoT) 装置日益普及

物联网设备在医疗保健、汽车和智慧家庭等领域的激增增加了对 ESD 封装来保护敏感元件的需求。国际数据公司 (IDC) 预测,到 2025 年,将有 416 亿个物联网设备连接,产生 79.4 ZB 的数据。这意味着 2018 年至 2025 年的复合年增长率为 28.7%。

越来越关注可持续和可回收的 ESD 包装材料:

随着人们对环境问题的日益关注,人们开始转向开发和使用环保的 ESD 封装材料。根据欧盟委员会关于包装和包装废弃物的报告,欧盟塑胶包装的回收率从2017年的42.4%上升到2019年的44.5%,反映出永续包装解决方案的成长趋势。

目录

第1章 静电放电(ESD)包装的全球市场:简介

  • 市场概要
  • 调查范围
  • 前提条件

第2章 摘要整理

第3章 VERIFIED MARKET RESEARCH的调查手法

  • 资料探勘
  • 验证
  • 第一手资料
  • 资料来源一览

第4章 静电放电(ESD)包装的全球市场展望

  • 概要
  • 市场动态
  • 促进因素
  • 阻碍因素
  • 机会
  • 波特的五力分析
  • 价值链分析

第5章 静电放电(ESD)包装的全球市场:各产品

  • 托盘
  • 贝壳式
  • 收缩膜
  • 箱子·容器
  • 胶带和标籤
  • 泡沫
  • 购物袋/IBC
  • 机柜

第6章 静电放电(ESD)包装的全球市场:各用途

  • 电器及电子
  • 汽车
  • 防卫·军事
  • 製造
  • 航太
  • 医疗保健

第7章 静电放电(ESD)包装的全球市场:各地区

  • 北美
  • 美国
  • 加拿大
  • 墨西哥
  • 欧洲
  • 德国
  • 英国
  • 法国
  • 其他欧洲
  • 亚太地区
  • 中国
  • 日本
  • 印度
  • 其他亚太地区
  • 全球其他地区
  • 南美
  • 中东·非洲

第8章 全球静电放电(ESD)包装市场竞争情形

  • 概要
  • 各公司的市场排行榜
  • 主要的开发策略

第9章 企业简介

  • Smurfit Kappa
  • DS Smith
  • Sealed Air
  • Pregis
  • Achilles
  • Desco
  • Storopack
  • NEFAB
  • Teknis
  • Elcom
  • Summit Container
  • Kiva Container
  • Protective Packaging
  • GWP
  • Pure-Stat
  • International Plastics
  • AUER Packaging
  • Dou Yee Enterprises
  • Botron

第10章 附录

  • 相关报告
简介目录
Product Code: 16402

Electrostatic Discharge ESD Packaging Market Size And Forecast

The Electrostatic Discharge ESD Packaging Market size was valued at USD 2.27 Billion in 2024 and is projected to reach USD 3.45 Billion by 2031 , growing at a CAGR of 5% from 2024 to 2031. Electrostatic discharge (ESD) packaging is essential for protecting electronic components and devices from damage caused by the sudden release of static electricity. ESD occurs when two objects with differing electrical potentials come into contact, resulting in an abrupt flow of electricity that can harm sensitive electronic components. In the manufacturing, transportation, and storage of electronics, this discharge poses a significant risk, potentially causing malfunctions or complete failure of devices. ESD packaging minimizes this threat by creating a controlled environment that safely dissipates static electricity, ensuring the protection of enclosed components.

Industries such as semiconductor manufacturing, aerospace, automotive, and medical devices rely heavily on ESD packaging due to the prevalence of sensitive electronics.

As miniaturization and complexity in electronics increase, the need for robust ESD protection has become more critical, with smaller components being more vulnerable to electrostatic damage. In addition, the demand for advanced ESD packaging solutions continues to grow.

Future innovations in ESD packaging are expected to focus on improving efficiency, reducing weight, and increasing environmental sustainability through the use of new materials and manufacturing techniques.

Global Electrostatic Discharge ESD Packaging Market Dynamics

The key market dynamics that are shaping the global electrostatic discharge ESD packaging market include:

Key Market Drivers

Increasing Demand for Electronic Devices:

The increasing demand for electronic devices is one of the primary drivers. As consumers and industries alike embrace technological advancements, there's a growing need to safeguard sensitive electronic components from electrostatic discharge during manufacturing, transportation, and storage. According to the International Data Corporation (IDC), global shipments of smartphones reached 1.21 billion units in 2022, with a projected growth of 1.38 billion units by 2026.

Growth in the Semiconductor Industry:

The rapid expansion of the semiconductor industry is driving the need for specialized ESD packaging. The Semiconductor Industry Association (SIA) reported that global semiconductor sales reached USD 5 Billion in 2022, with projections suggesting the market could surpass USD 1 Trillion by 2030. This growth necessitates advanced ESD protection measures throughout the supply chain.

Stringent Regulations and Standards:

Increasingly strict regulations and industry standards regarding the handling and protection of electronic components are boosting the ESD packaging market. The ESD Association reported that compliance with standards such as ANSI/ESD S20.20 has become mandatory for many electronics manufacturers. A survey conducted by the association in 2021 found that 78% of electronics manufacturers had implemented comprehensive ESD control programs, up from 65% in 2018, indicating a growing emphasis on ESD protection measures.

Key Challenges

High Cost:

High cost associated with implementing ESD protection measures throughout the supply chain. According to a report by the U.S. Department of Energy, implementing comprehensive ESD control programs can cost companies between $0.10 to $0.50 per square foot of manufacturing space annually.

Lack of Awareness:

Lack of awareness and proper training among small and medium-sized enterprises (SMEs). A survey conducted by the European Agency for Safety and Health at Work (EU-OSHA) found that only 38% of SMEs in the electronics industry had implemented formal ESD control programs, compared to 76% of large enterprises.

Environmental Concerns Related to the Disposal of ESD Packaging Materials:

The U.S. Environmental Protection Agency (EPA) reports that plastics, which are commonly used in ESD packaging, account for more than 18% of total municipal solid waste generated annually, with only about 9% being recycled.

Key Trends

Increasing Miniaturization of Electronic Components:

As electronic components become smaller and more sensitive, the risk of electrostatic damage increases. This has led to a higher demand for ESD packaging solutions that can effectively protect these components during transportation, storage, and handling. According to the International Technology Roadmap for Semiconductors (ITRS), the average transistor size in integrated circuits has shrunk from 350 nanometers in 1995 to just 5 nanometers in 2020, with projections reaching 1.5 nanometers by 2028.

Growing Adoption of Internet of Things (IoT) Devices

: The proliferation of IoT devices in sectors such as healthcare, automotive, and smart homes is driving the need for ESD packaging to protect sensitive components. The International Data Corporation (IDC) forecasts that there will be 41.6 billion connected IoT devices by 2025, generating 79.4 zettabytes of data. This represents a compound annual growth rate (CAGR) of 28.7% from 2018 to 2025.

Increasing Focus on Sustainable and Recyclable ESD Packaging Materials:

With growing environmental concerns, there's a shift towards developing and using eco-friendly ESD packaging materials. A report by the European Commission on Packaging and Packaging Waste found that the recycling rate for plastic packaging in the EU increased from 42.4% in 2017 to 44.5% in 2019, indicating a growing trend towards sustainable packaging solutions.

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Global Electrostatic Discharge ESD Packaging Market Regional Analysis

Here is a more detailed regional analysis of the global electrostatic discharge ESD packaging market:

Asia Pacific

Asia Pacific substantially dominates the global electrostatic discharge ESD Packaging Market driven by the concentration of electronics manufacturing in countries such as China, Japan, South Korea, and Taiwan, producing a significant portion of the world's electronic components and devices.

According to the United Nations Conference on Trade and Development (UNCTAD) Digital Economy Report 2021, East Asian economies accounted for nearly 80% of global exports of ICT goods in 2020, with China alone contributing 44% of the global total.

The semiconductor industry is rapidly growing in the region, particularly in countries like Taiwan and South Korea.

The Semiconductor Industry Association (SIA) reported in 2022 that Taiwan and South Korea accounted for 81% of the global foundry market share in 2021, with Taiwan Semiconductor Manufacturing Company (TSMC) alone holding a 53% market share.

Increasing investments in 5G infrastructure and IoT technologies across Asia Pacific countries.

According to the GSM Association (GSMA) Mobile Economy Asia Pacific 2022 report, 5G connections in the Asia Pacific region are expected to reach 1.2 billion by 2025, accounting for 40% of global 5G connections. The report also projects that operators in the region will invest USD 370 Billion in their networks between 2022 and 2025, with 90% of this dedicated to 5G.

North America

North America is anticipated to witness the fastest growth in the global electrostatic discharge ESD packaging market during the forecast period owing to the presence of major technology companies and a strong focus on innovation and research and development (R&D).

According to the National Science Foundation's National Center for Science and Engineering Statistics, businesses in the United States spent USD 7 Billion on R&D in 2021, with the information and computer/electronic products sectors accounting for 37.3% of this total.

Rapid growth in the aerospace and defense industries, which require high-performance ESD packaging for sensitive electronic components.

The Aerospace Industries Association reported that in 2022, the U.S. aerospace and defense industry generated USD 892 Billion in sales revenue, with a 4.7% year-over-year growth rate, indicating a strong demand for specialized packaging solutions.

Increasing adoption of electric vehicles (EVs) and autonomous driving technologies, driving demand for ESD protection in automotive electronics.

The U.S. Department of Energy reported that electric vehicle sales in the United States grew by 85% from 2020 to 2021, reaching a record high of 608,000 units. This trend continued in 2022, with EV sales surpassing 800,000 units, representing about 5.8% of all new vehicle sales in the U.S.

Global Electrostatic Discharge ESD Packaging Market: Segmentation Analysis

The Global Electrostatic Discharge ESD Packaging Market is segmented based on Product, Application, End-User, And Geography.

Electrostatic Discharge ESD Packaging Market, By Product

  • Bags
  • Trays
  • Clamshell
  • Shrink Films
  • Boxes and Containers
  • Tapes and Labels
  • Foams
  • Totes/IBC
  • Racks

Based on the Product, the Global Electrostatic Discharge (ESD) Packaging Market is bifurcated into Bag, Trays, Clamshell, Shrink Films, Boxes and Containers, Tapes and Labels, Foams, Totes/IBC, and Racks. The bag is a dominant segment within the global electrostatic discharge (ESD) packaging market, favored for their versatility, affordability, and ease of use. ESD bags are commonly employed to shield sensitive electronic components, such as integrated circuits, microchips, and circuit boards, from electrostatic discharge during storage, transportation, and handling. Made from specialized anti-static materials like metalized polyester or polyethylene, these bags provide a reliable barrier that dissipates static electricity, preventing damage to the enclosed electronics.

Electrostatic Discharge ESD Packaging Market, By Application

  • Printed Circuit Boards
  • Integrated Circuits
  • Semiconductors

Based on the Application, the Global Electrostatic Discharge (ESD) Packaging Market is bifurcated into Printed Circuit Boards, Integrated Circuits, and Semiconductors. The printed circuit boards (PCBs) segment dominates the global electrostatic discharge (ESD) packaging market owing to the need to protect sensitive components. PCBs, which contain high-density elements like microprocessors and memory chips, are highly vulnerable to ESD damage. The growing use of electronics in sectors requiring high reliability, such as medical devices, further emphasizes the importance of ESD protection to ensure the safe handling and longevity of PCBs.

Electrostatic Discharge ESD Packaging Market, By End-User

  • Electrical and Electronics
  • Automobile
  • Defense and Military
  • Manufacturing
  • Aerospace
  • Healthcare

Based on the End-User, the Global Electrostatic Discharge (ESD) Packaging Market is bifurcated into Electrical and Electronics, Automobile, Defense and Military, Manufacturing, Aerospace, and Healthcare. The electrical and electronics segment is the leading in the global electrostatic discharge (ESD) packaging market owing to its critical need for ESD protection to safeguard sensitive electronic components. This sector spans various industries, including semiconductor manufacturing, consumer electronics, telecommunications, and industrial automation, all of which depend on ESD packaging solutions to prevent damage from electrostatic discharge during key processes such as manufacturing, assembly, and transportation.

Electrostatic Discharge ESD Packaging Market, By Geography

  • North America
  • Europe
  • Asia Pacific
  • Rest of the World

Based on Geography, the Global Electrostatic Discharge ESD Packaging Market is classified into North America, Europe, Asia Pacific, and the Rest of the world. Asia Pacific substantially dominates the global electrostatic discharge ESD packaging market driven by the concentration of electronics manufacturing in countries such as China, Japan, South Korea, and Taiwan, producing a significant portion of the world's electronic components and devices. According to the United Nations Conference on Trade and Development (UNCTAD) Digital Economy Report 2021, East Asian economies accounted for nearly 80% of global exports of ICT goods in 2020, with China alone contributing 44% of the global total. The semiconductor industry is rapidly growing in the region, particularly in countries like Taiwan and South Korea.

Key Players

  • The "Global Electrostatic Discharge ESD Packaging Market" study report will provide valuable insight with an emphasis on the global market. The major players in the market are
  • Desco Industries, Inc., Sealed Air Corporation, Protektive Pak, Teknis Limited, GWP Group Limited, Elcom, Inc., Summit Packaging Solutions, Statclean Technology (S) Pte Ltd, Conductive Containers, Inc.
  • This section offers in-depth analysis through a company overview, position analysis, the regional and industrial footprint of the company, and the ACE matrix for insightful competitive analysis. The section also provides an exhaustive analysis of the financial performances of mentioned players in the given market.

Our market analysis also entails a section solely dedicated to such major players wherein our analysts provide an insight into the financial statements of all the major players, along with product benchmarking and SWOT analysis. The competitive landscape section also includes key development strategies, market share, and market ranking analysis of the above-mentioned players globally.

Global Electrostatic Discharge ESD Packaging Market Key Developments

  • In June 2024, Nefab announced the launch of a second factory in Vina del Mar, Chile, expanding its activities in Latin America. The new facility addresses the increased need for contract logistics and sustainable packaging services in the area.
  • In July 2023, Smurfit Kappa announced the launch of its new integrated corrugated facility in Rabat, Morocco. This is Smurfit Kappa's first operation in North Africa, with the plant powered by green energy.

TABLE OF CONTENTS

1. Introduction of Global Electrostatic Discharge (ESD) Packaging Market

  • Overview of the Market
  • Scope of Report
  • Assumptions

2. Executive Summary

3. Research Methodology of Verified Market Research

  • Data Mining
  • Validation
  • Primary Interviews
  • List of Data Sources

4. Global Electrostatic Discharge (ESD) Packaging Market Outlook

  • Overview
  • Market Dynamics
  • Drivers
  • Restraints
  • Opportunities
  • Porters Five Force Model
  • Value Chain Analysis

5. Global Electrostatic Discharge (ESD) Packaging Market, By Product

  • Bags
  • Trays
  • Clamshell
  • Shrink Films
  • Boxes and Containers
  • Tapes and Labels
  • Foams
  • Totes/IBC
  • Racks

6. Global Electrostatic Discharge (ESD) Packaging Market, By Application

  • Electrical and Electronics
  • Automobile
  • Defense and Military
  • Manufacturing
  • Aerospace
  • Healthcare

7. Global Electrostatic Discharge (ESD) Packaging Market, By Geography

  • North America
  • U.S.
  • Canada
  • Mexico
  • Europe
  • Germany
  • UK
  • France
  • Rest of Europe
  • Asia Pacific
  • China
  • Japan
  • India
  • Rest of Asia Pacific
  • Rest of the World
  • Latin America
  • Middle East & Africa

8. Global Electrostatic Discharge (ESD) Packaging Market Competitive Landscape

  • Overview
  • Company Market Ranking
  • Key Development Strategies

9. Company Profiles

  • Smurfit Kappa
  • DS Smith
  • Sealed Air
  • Pregis
  • Achilles
  • Desco
  • Storopack
  • NEFAB
  • Teknis
  • Elcom
  • Summit Container
  • Kiva Container
  • Protective Packaging
  • GWP
  • Pure-Stat
  • International Plastics
  • AUER Packaging
  • Dou Yee Enterprises
  • Botron

10. Appendix

  • Related Reports