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市场调查报告书
商品编码
1623228

半导体设备封装和测试的全球市场规模:类别，各用途，各地区，范围及预测

Global Semiconductor Equipment Packaging And Test Market Size By Type (Packaging Service, Test Service), By Application (Communication, Computing), By Geographic Scope And Forecast
出版日期: | 出版商: Verified Market Research | 英文 202 Pages | 商品交期: 2-3个工作天内

价格
简介目录

半导体元件封装测试市场规模及预测

半导体设备封装和测试市场规模预计到2023年将达到316.5亿美元，到2030年将达到597.2亿美元，在2024-2030年的预测期内复合年增长率为8.26%。为了提高电子系统的性能、可靠性和成本效益，先进的封装技术被用于半导体封装，这是市场的关键成长因素。全球半导体设备封装和测试市场报告提供了对市场的整体评估。它对关键细分市场、趋势、市场推动因素、阻碍因素、竞争格局以及在市场中发挥关键作用的因素进行了全面分析。

定义全球半导体元件封装与测试市场

半导体是物理产品，通常由硅製成，其导电性能比玻璃等绝缘体更好，但不如铜或铝等纯导体。此外，引入杂质（称为掺杂）可以改变半导体的电导率和其他特性，以满足安装半导体的电子元件的特定需求。封装是半导体生产和设计的关键部分。因此，它在宏观层面影响效能、成本和功耗，在微观层面影响每个晶片的核心效能。此外，封装是容纳半导体晶片的容器。

此外，儘管代工供应商专注于封装，但封装有时是由其他供应商完成的。另外，封装可以固定晶片、将晶片附接至基板或其他晶片以及散热。半导体封装将积体电路 (IC) 限制在适合特定设备的形状元件中。半导体晶片和 IC 必须经过电气封装工艺，在该工艺中将它们塑造成适当的设计和结构，以便在电路板上加速或在电子设备中使用。相反，测试是在整个半导体装置製造过程中进行的。这意味着测试晶圆上存在的每个积体电路。此外，还使用适当的测试标准对各个电路进行了活动错误测试。此外，测试是使用称为处理机或晶圆探测器的设备进行的。

全球半导体元件封装测试市场概况

半导体封装是一种屏蔽壳，可在半导体製造过程的最后阶段防止逻辑单元、硅晶圆和记忆体的材料损坏和腐蚀。此外，晶片还可以连接至电路板。此外，在消费性电子产品和工业产品中，现代封装依赖机械工程原理，例如传热、流体动力学、力学、应力分析、保护元件免受机械损坏、冷却、射频噪音辐射和静电放电。因此，先进的封装技术被用于半导体封装，以提高电子系统的性能、可靠性和成本效益，成为市场的关键成长因素。

相反，高昂的采购成本和维护成本成为市场阻碍因素，抑制了半导体设备封测市场的成长。此外，半导体封装技术有望透过增加半导体产品的操作功能、提高和维持性能来增加半导体产品的价值，同时降低封装的整体成本。此外，半导体封装的采用也为多种消费性电子产品创造了对高性能晶片的需求。这推动了对智慧型手机和其他行动装置中使用的封装晶片的需求。

目录

第1章 全球半导体设备封装和测试市场简介

  • 市场概要
  • 调查范围
  • 前提条件

第2章 摘要整理

第3章 VERIFIED MARKET RESEARCH的调查手法

  • 资料探勘
  • 验证
  • 第一手资料
  • 资料来源一览

第4章 半导体设备封装和测试的全球市场展望

  • 概要
  • 市场动态
    • 促进因素
    • 阻碍因素
    • 机会
  • 波特的五力分析
  • 价值链分析

第5章 半导体设备封装和测试的全球市场:各类型

  • 概要
  • 包装服务
  • 试验服务

第6章 半导体设备封装和测试的全球市场:各用途

  • 概要
  • 通讯
  • 运算
  • 消费者电子产品
  • 其他

第7章 半导体设备封装和测试的全球市场:各地区

  • 概要
  • 北美
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 法国
    • 其他欧洲
  • 亚太地区
    • 中国
    • 日本
    • 印度
    • 其他亚太地区
  • 全球其他地区
    • 南美
    • 中东·非洲

第8章 全球半导体设备封装和测试市场竞争情形

  • 概要
  • 各公司的市场排行榜
  • 主要的发展策略

第9章 企业简介

  • GREATEK
  • Samsung
  • KYEC
  • LINGSEN PRECISION INDUSTRIES
  • UTAC
  • CHIPMOS
  • POWERTECH TECHNOLOGY
  • SILICONWARE PRECISION INDUSTRIES(SPIL)
  • AMKOR TECHNOLOGY
  • ASE

第10章 附录

  • 相关调查
简介目录
Product Code: 20758

Semiconductor Equipment Packaging And Test Market Size And Forecast

Semiconductor Equipment Packaging And Test Market size was valued at 31.65 USD Billion in 2023 and is projected to reach 59.72 USD Billion by 2030 , growing at a CAGR of 8.26% during the forecast period 2024-2030. To enhance the performance, reliability & cost-effectiveness of electronics systems, advanced packaging technology is being used for packaging semiconductors which act as the key growth element of the market. The Global Semiconductor Equipment Packaging And Test Market report provides a holistic evaluation of the market. The report offers a comprehensive analysis of key segments, trends, drivers, restraints, competitive landscape, and factors that are playing a substantial role in the market.

Global Semiconductor Equipment Packaging And Test Market Definition

The semiconductor is a physical product normally constituted of silicon, which conducts electricity more than an insulator, such as glass, but less than a pure conductor, such as copper or aluminum. Furthermore, their conductivity and other characteristics can be modified with the introduction of impurities, called doping, to meet the specific needs of the electronic component in which it lies. Packaging is a crucial part of semiconductor production and design. Therefore, it influences performance, cost, and power on a huge level and the primary performance of all chips on a micro-level. In addition, the package is the container that grips the semiconductor die.

Also, the packaging may be done by a separate vendor, despite foundries are amplifying their packaging endeavor. Furthermore, the package assures the die, attaches the chip to a board or other chips, and may vanish heat. Semiconductor packaging engages constraint integrated circuits (IC) in a form element that can fit into a particular device. Since a semiconductor chip or IC, is accelerated on a circuit board or used in an electronic device, it requires to go through an electrical packaging process to be molded into the proper design and structure. On the contrary, testing is electrocuted throughout semiconductor device manufacturing. Therefore, this associates the testing of all individual integrated circuits present on the wafer. Moreover, the individual circuits are tested for active bugs using appropriate test standards. In addition, the testing is implemented using an apparatus called a handler or wafer prober.

Global Semiconductor Equipment Packaging And Test Market Overview

Semiconductor packaging is a shielding case that stops material damage and corrosion to logic units, silicon wafers, and memory throughout the last stage of the semiconductor production process. Moreover, it permits the chip to be connected to a circuit board. In addition, in consumer electronics and industrial products, modern packaging depends on mechanical engineering principles, such as heat transfer and fluid mechanics, dynamics, stress analysis and safeguard elements from mechanical damage, cooling, RF noise emission, and electrostatic discharge. Consequently, to enhance the performance, reliability & cost-effectiveness of electronics systems, advanced packaging technology is being used for packaging semiconductors which act as the key growth element of the market.

On the contrary, high purchase and maintenance costs are acting as the restraint element and diminish the growth of the Semiconductor Equipment Packaging And Test Market. Furthermore, the technology of semiconductor packaging is expected to raise the value of a semiconductor product by adding functionality to its operation, growing and conserving the performance while lowering the overall cost of packaging. Moreover, the adoption of semiconductor packaging is also creating demand for high-performance chips for several consumer electronic products. This increases the demand for packaging chips used in smartphones and other mobile devices.

Global Semiconductor Equipment Packaging And Test Market Segmentation Analysis

The Global Semiconductor Equipment Packaging And Test Market is segmented on the basis of Type, Application, and Geography.

Semiconductor Equipment Packaging And Test Market, By Type

  • Packaging Service
  • Test Service

Based on Type, the market is segmented into Packaging Service and Test Service. The Packaging Service segment is dominating the market with the highest market share and is expected to grow substantially and dominate the global market during the forecast period. The section shows each type of production, revenue received price, market share, as well as growth rate.

Semiconductor Equipment Packaging And Test Market, By Application

  • Communication
  • Computing
  • Consumer Electronics
  • Others

Based on Application, the market is segmented into Communication, Computing, Consumer Electronics, and Others. The Communication segment is witnessing the highest market share with strong market growth during the forecast period in the global market. The Segment centers on the standing and opportunity for significant application value, market share, and growth valuation of each application.

Semiconductor Equipment Packaging And Test Market, By Geography

  • North America
  • Europe
  • Asia Pacific
  • Rest of the world
  • On the basis of Regional Analysis, the Global Semiconductor Equipment Packaging And Test Market is classified into North America, Europe, Asia Pacific, and Rest of the world. The North America and Europe region is expected to witness the highest CAGR during the forecast period. This is primarily due to the rise in disposable income in these countries, and the growth in urbanization.

Key Players

  • The "Global Semiconductor Equipment Packaging And Test Market" study report will provide a valuable insight with an emphasis on the global market. The major players in the market are
  • Greatek, Samsung, KYEC, Lingsen Precision Industries, Amkor Technology, ASE, Powertech Technology, Siliconware Precision Industries (SPIL), UTAC, and ChipMos.

Our market analysis also entails a section solely dedicated for such major players wherein our analysts provide an insight to the financial statements of all the major players, along with its product benchmarking and SWOT analysis. The competitive landscape section also includes key development strategies, market share and market ranking analysis of the above-mentioned players globally.

Key Developments

  • In June 2021, Samsung had announced to launch of new chipsets for its next-generation 5G solution and products, including the compact macro, massive Mimo radios, and based units which will be available in the commercial market.
  • In July 2020, ASE had announced its strategic agreement with Apple INC to steadily improve its energy efficiency and steadily shift into greener production.

TABLE OF CONTENTS

1 INTRODUCTION OF GLOBAL SEMICONDUCTOR EQUIPMENT PACKAGING AND TEST MARKET

  • 1.1 Overview of the Market
  • 1.2 Scope of Report
  • 1.3 Assumptions

2 EXECUTIVE SUMMARY

3 RESEARCH METHODOLOGY OF VERIFIED MARKET RESEARCH

  • 3.1 Data Mining
  • 3.2 Validation
  • 3.3 Primary Interviews
  • 3.4 List of Data Sources

4 GLOBAL SEMICONDUCTOR EQUIPMENT PACKAGING AND TEST MARKET OUTLOOK

  • 4.1 Overview
  • 4.2 Market Dynamics
    • 4.2.1 Drivers
    • 4.2.2 Restraints
    • 4.2.3 Opportunities
  • 4.3 Porters Five Force Model
  • 4.4 Value Chain Analysis

5 GLOBAL SEMICONDUCTOR EQUIPMENT PACKAGING AND TEST MARKET, BY TYPE

  • 5.1 Overview
  • 5.2 Packaging Service
  • 5.3 Test Service

6 GLOBAL SEMICONDUCTOR EQUIPMENT PACKAGING AND TEST MARKET, BY APPLICATION

  • 6.1 Overview
  • 6.2 Communication
  • 6.3 Computing
  • 6.4 Consumer Electronics
  • 6.5 Others

7 GLOBAL SEMICONDUCTOR EQUIPMENT PACKAGING AND TEST MARKET, BY GEOGRAPHY

  • 7.1 Overview
  • 7.2 North America
    • 7.2.1 U.S.
    • 7.2.2 Canada
    • 7.2.3 Mexico
  • 7.3 Europe
    • 7.3.1 Germany
    • 7.3.2 U.K.
    • 7.3.3 France
    • 7.3.4 Rest of Europe
  • 7.4 Asia Pacific
    • 7.4.1 China
    • 7.4.2 Japan
    • 7.4.3 India
    • 7.4.4 Rest of Asia Pacific
  • 7.5 Rest of the World
    • 7.5.1 Latin America
    • 7.5.2 Middle East and Africa

8 GLOBAL SEMICONDUCTOR EQUIPMENT PACKAGING AND TEST MARKET COMPETITIVE LANDSCAPE

  • 8.1 Overview
  • 8.2 Company Market Ranking
  • 8.3 Key Development Strategies

9 COMPANY PROFILES

  • 9.1 GREATEK
    • 9.1.1 Overview
    • 9.1.2 Financial Performance
    • 9.1.3 Product Outlook
    • 9.1.4 Key Developments
  • 9.2 Samsung
    • 9.2.1 Overview
    • 9.2.2 Financial Performance
    • 9.2.3 Product Outlook
    • 9.2.4 Key Developments
  • 9.3 KYEC
    • 9.3.1 Overview
    • 9.3.2 Financial Performance
    • 9.3.3 Product Outlook
    • 9.3.4 Key Developments
  • 9.4 LINGSEN PRECISION INDUSTRIES
    • 9.4.1 Overview
    • 9.4.2 Financial Performance
    • 9.4.3 Product Outlook
    • 9.4.4 Key Developments
  • 9.5 UTAC
    • 9.5.1 Overview
    • 9.5.2 Financial Performance
    • 9.5.3 Product Outlook
    • 9.5.4 Key Developments
  • 9.6 CHIPMOS
    • 9.6.1 Overview
    • 9.6.2 Financial Performance
    • 9.6.3 Product Outlook
    • 9.6.4 Key Developments
  • 9.7 POWERTECH TECHNOLOGY
    • 9.7.1 Overview
    • 9.7.2 Financial Performance
    • 9.7.3 Product Outlook
    • 9.7.4 Key Developments
  • 9.8 SILICONWARE PRECISION INDUSTRIES (SPIL)
    • 9.8.1 Overview
    • 9.8.2 Financial Performance
    • 9.8.3 Product Outlook
    • 9.8.4 Key Developments
  • 9.9 AMKOR TECHNOLOGY
    • 9.9.1 Overview
    • 9.9.2 Financial Performance
    • 9.9.3 Product Outlook
    • 9.9.4 Key Developments
  • 9.10 ASE
    • 9.10.1 Overview
    • 9.10.2 Financial Performance
    • 9.10.3 Product Outlook
    • 9.10.4 Key Developments

10 Appendix

    • 10.1.1 Related Research