全球半导体溅镀靶材市场规模（按类型、应用、区域范围和预测）

半导体溅镀靶材市场规模及预测

预计2024年半导体溅镀靶材市场价值将达45亿美元，2031年将达69.6亿美元，2024年至2031年的复合年增长率为5.6%。

半导体溅镀靶材是用于溅镀製程的专用材料，用于在半导体晶圆上沉积薄膜。在溅镀过程中，靶材受到高能量离子轰击，释放出的原子凝聚在基板上形成薄膜。

这些材料包括金属、合金和复合材料，对于製造半导体装置至关重要。

溅镀靶材对于半导体产业生产各种组件至关重要，包括积体电路 (IC)、储存晶片和光伏电池。

溅镀靶材用于在晶圆上沉积导电层、绝缘层和半导体层，这是装置功能的基础。

应用范围包括薄膜电晶体、光伏板和其他先进电子元件的製造。

全球半导体溅镀靶材市场动态

影响全球半导体溅镀靶材市场的关键市场动态是：

关键市场驱动因素

半导体技术的进步：半导体装置的不断发展，包括小型化和功能增强，正在推动对满足严格製造要求的高性能溅射靶材的需求。根据国际装置与系统路线图 (IRDS)，半导体产业的目标是到 2028 年实现 1.5 奈米节点技术。

电子产品需求不断增长：智慧型手机、平板电脑和穿戴式装置等消费性电子产品的消费量不断增长，推动了对高效可靠的溅射靶材的需求，用于製造这些设备的半导体元件。国际数据公司 (IDC) 预测，到 2024 年，全球智慧型手机出货量将达到 13.8 亿部，年增 7.7%。

新兴技术的扩展：5G、物联网和人工智慧等技术创新将创造新的应用和对先进半导体装置的需求，从而推动溅镀靶材市场的成长。例如，高通将于2024年4月推出专为物联网应用设计的全新5G晶片组，这可能会推动对专用溅镀靶材的需求。

新型半导体材料的开发：化合物半导体和先进合金等新型半导体材料的探索和应用需要专门的溅射靶材来支援尖端装置的製造。例如，应用材料公司于2024年1月推出了一系列针对氮化镓（GaN）和碳化硅（SiC）半导体製造进行最佳化的新型溅镀靶材。

日益重视能源效率：对更节能、更高性能电子设备的需求，推动了对溅射靶材的需求，这些靶材能够用于生产先进的低功耗半导体元件。美国能源局估计，宽能带隙半导体可将电力电子设备的能量损耗降低高达 90%。

主要挑战

製造成本高：高纯度溅镀靶材的生产涉及复杂且昂贵的工艺，这使得一些半导体製造商的成本过高，并阻碍了市场成长。

材料可得性：某些原材料（例如溅射靶中使用的稀有金属）的可用性有限，导致供应链中断和成本增加，从而抑制了市场扩张。

技术挑战：半导体装置的不断小型化和日益复杂化，要求溅镀技术不断创新，技术挑战巨大，研发成本高昂。

环境和监管问题：有关溅射靶材原料提取和加工的严格环境法规可能会给製造商带来额外的成本和营运限制。

来自替代沉淀技术的竞争：化学气相沉积（CVD）和原子层沉积（ALD）等替代薄膜沉积技术的存在可能会限制溅射靶材料在某些应用中的采用，从而影响市场成长。

主要趋势

转向先进材料：使用复合半导体和新型合金等先进高纯度材料来提高半导体装置的性能和效率的趋势日益增长，这推动了溅射靶材的创新。根据半导体产业协会 (SIA) 预测，宽能带隙半导体市场规模将从 2021 年的 21 亿美元成长到 2026 年的 65 亿美元。

人工智慧与机器学习的融合：在半导体製造过程中采用人工智慧和机器学习，可以提高溅镀靶材使用的准确性和效率，从而改善品管并优化生产。根据麦肯锡的报告，到2025年，人工智慧每年可为半导体公司增加400亿美元的价值。

注重永续性：对永续性和环境影响的日益关注，正在推动环保溅镀靶材和更高效生产流程的开发，以满足全球监管标准并减少废弃物。根据世界半导体理事会的数据，全球半导体产业的目标是到2030年将温室气体排放在2010年的基础上减少30%。

目录

第一章 引言

• 市场定义
• 市场区隔
• 调查方法

第二章执行摘要

• 主要发现
• 市场概况
• 市集亮点

第三章 市场概况

• 市场规模和成长潜力
• 市场趋势
• 市场驱动因素
• 市场限制
• 市场机会
• 波特五力分析

4. 半导体溅镀靶材市场（依类型）

• 金属
• 合金
• 化合物

5. 半导体溅镀靶材市场（依应用）

• 半导体晶片靶材

第六章 区域分析

• 北美洲
• 美国
• 加拿大
• 墨西哥
• 欧洲
• 英国
• 德国
• 法国
• 义大利
• 亚太地区
• 中国
• 日本
• 印度
• 澳洲
• 拉丁美洲
• 巴西
• 阿根廷
• 智利
• 中东和非洲
• 南非
• 沙乌地阿拉伯
• 阿拉伯聯合大公国

第七章市场动态

• 市场驱动因素
• 市场限制
• 市场机会
• COVID-19 市场影响

第八章 竞争态势

• 主要企业
• 市占率分析

第九章：公司简介

• JX Nippon Mining & Metals Corporation
• Praxair
• Plansee SE
• Mitsui Mining & Smelting
• Hitachi Metals
• Honeywell
• Sumitomo Chemical
• ULVAC
• Materion（formerly Heraeus）

第十章：市场展望与机会

• 新兴技术
• 未来市场趋势
• 投资机会

第十一章 市场展望 附录

• 简称列表
• 来源和参考文献

Sputtering Target Material For Semiconductor Market Size And Forecast

Sputtering Target Material For Semiconductor Market size was valued at USD 4.50 Billion in 2024 and is projected to reach USD 6.96 Billion by 2031, growing at a CAGR of 5.6% from 2024 to 2031.

Sputtering target materials for semiconductors are specialized materials used in the sputtering process to deposit thin films onto semiconductor wafers. During sputtering, a target material is bombarded with high-energy ions, causing it to eject atoms that then condense onto a substrate, forming a thin film.

These materials can include metals, alloys, and compound materials, and are crucial for fabricating semiconductor devices.

Sputtering target materials are essential in the semiconductor industry for the production of various components, including integrated circuits (ICs), memory chips, and photovoltaic cells.

They are used to create conductive, insulating, and semiconducting layers on wafers, which are fundamental for device functionality.

Applications extend to the production of thin-film transistors, photovoltaic panels, and other advanced electronic components.

Global Sputtering Target Material For Semiconductor Market Dynamics

The key market dynamics that are shaping the global sputtering target material for semiconductor market include:

Key Market Drivers

Advancements in Semiconductor Technology: The continuous evolution of semiconductor devices, including smaller geometries and increased functionality, drives the demand for high-performance sputtering target materials to meet stringent fabrication requirements. According to the International Roadmap for Devices and Systems (IRDS), the semiconductor industry is targeting 1.5nm node technology by 2028.

Growing Demand for Electronics: The rising consumption of consumer electronics, such as smartphones, tablets, and wearable devices, boosts the need for efficient and reliable sputtering targets to produce semiconductor components for these devices. The International Data Corporation (IDC) forecasts global smartphone shipments to reach 1.38 billion units in 2024, a 7.7% year-over-year growth.

Expansion of Emerging Technologies: Innovations in technologies like 5G, IoT, and artificial intelligence create new applications and demand for advanced semiconductor devices, driving growth in the sputtering target materials market. For instance, in April 2024, Qualcomm introduced a new 5G chipset specifically designed for IoT applications, potentially increasing demand for specialized sputtering targets.

Development of New Semiconductor Materials: The exploration and adoption of new semiconductor materials, such as compound semiconductors and advanced alloys, require specialized sputtering targets to support the fabrication of cutting-edge devices. For instance, in January 2024, Applied Materials launched a new line of sputtering targets optimized for gallium nitride (GaN) and silicon carbide (SiC) semiconductor production.

Increasing Focus on Energy Efficiency: The push for more energy-efficient and high-performance electronic devices drives the need for sputtering targets that enable the production of advanced, low-power semiconductor components. The U.S. Department of Energy estimates that wide bandgap semiconductors could reduce energy losses by up to 90% in power electronics.

Key Challenges:

High Production Costs: The manufacturing of high-purity sputtering target materials involves complex and expensive processes, making it cost-prohibitive for some semiconductor manufacturers and limiting market growth.

Material Availability: Limited availability of certain raw materials, such as rare metals used in sputtering targets, can lead to supply chain disruptions and increased costs, restraining market expansion.

Technological Challenges: The continuous miniaturization and increasing complexity of semiconductor devices require constant innovation in sputtering technology, posing significant technical challenges and high research and development costs.

Environmental and Regulatory Concerns: Stringent environmental regulations regarding the extraction and processing of raw materials used in sputtering targets can impose additional costs and operational constraints on manufacturers.

Competition from Alternative Deposition Methods: The presence of alternative thin-film deposition techniques, such as chemical vapor deposition (CVD) and atomic layer deposition (ALD), can limit the adoption of sputtering target materials in certain applications, affecting market growth.

Key Trends

Shift towards Advanced Materials: There is an increasing trend towards the use of advanced and high-purity materials, such as compound semiconductors and new alloys, to enhance the performance and efficiency of semiconductor devices, driving innovation in sputtering target materials. According to Semiconductor Industry Association (SIA), the wide bandgap semiconductor market is expected to grow from USD 2.1 Billion in 2021 to USD 6.5 Billion by 2026.

Integration of AI and Machine Learning: The adoption of artificial intelligence and machine learning in semiconductor manufacturing processes is improving the precision and efficiency of sputtering target usage, leading to better quality control and optimized production. According to a report by McKinsey, AI could create up to USD 40 Billion in value annually for semiconductor companies by 2025.

Focus on Sustainability: Growing emphasis on sustainability and environmental impact is leading to the development of eco-friendly sputtering target materials and more efficient production processes, aligning with global regulatory standards and reducing waste. According to the World Semiconductor Council, the global semiconductor industry aims to reduce greenhouse gas emissions by 30% by 2030 compared to 2010 levels.

Global Sputtering Target Material For Semiconductor Market Regional Analysis

Here is a more detailed regional analysis of the global sputtering target material for semiconductor market:

North America

North America dominating the sputtering target material for the semiconductor market. According to the Semiconductor Industry Association (SIA), the U.S. semiconductor industry accounted for 47% of the global semiconductor market share in 2023.

It is driven by robust research and development activities, the presence of major semiconductor manufacturers, and strong demand for advanced electronics. The National Science Foundation's 2022 report shows that the U.S. invested USD 124 Billion in semiconductor R&D in 2021, representing about 18% of global semiconductor R&D spending.

The United States, in particular, leads the region with its high-tech infrastructure and continuous innovation in semiconductor technology. The National Institute of Standards and Technology (NIST) established a new Semiconductor Metrology Division in December 2023 to support the development of advanced measurement techniques for semiconductor manufacturing.

Asia Pacific

The Asia-Pacific region is experiencing rapid growth in the sputtering target material market due to the presence of major semiconductor manufacturing hubs in countries such as China, Japan, South Korea, and Taiwan. According to the World Semiconductor Trade Statistics (WSTS), the Asia Pacific semiconductor market is expected to grow by 15.8% in 2024, reaching USD 415 Billion.

The region's growth is fueled by increasing digitalization, rising demand for consumer electronics, and significant investments in semiconductor fabrication facilities. For instance, Samsung Electronics (South Korea) announced in March 2024 a USD 116 Billion investment plan to become the world leader in advanced chip-making by 2030 and launched production of 3nm chips using Gate-All-Around (GAA) technology in April 2024.

China, in particular, is expanding its semiconductor industry to reduce reliance on imports. The China Semiconductor Industry Association reported that China's integrated circuit (IC) industry revenue reached 1.05 trillion yuan (USD 162 Billion) in 2023, a 17.8% year-on-year increase.

Global Sputtering Target Material For Semiconductor Market: Segmentation Analysis

The Global Sputtering Target Material For Semiconductor Market is Segmented on the basis of Type, Application, And Geography.

Sputtering Target Material For Semiconductor Market, By Type

Metal Sputtering Target Material

Alloy Sputtering Target Material

Based on Type, the Global Sputtering Target Material For Semiconductor Market is bifurcated into Metal Sputtering Target Material and Alloy Sputtering Target Material. In the sputtering target material market for semiconductors, metal sputtering target material is currently dominating due to its widespread use in various semiconductor applications, including integrated circuits and memory devices, where metals like copper, aluminum, and tungsten are essential. Alloy sputtering target material is the second rapidly growing segment, driven by the need for advanced materials that offer enhanced performance characteristics and the ability to support the development of next-generation semiconductor devices. The demand for alloys is increasing as semiconductor technology evolves and the industry seeks materials that can provide superior electrical and thermal properties.

Sputtering Target Material For Semiconductor Market, By Application

Analog IC

Digital IC

Analog/Digital IC

Based on Application, the Global Sputtering Target Material For Semiconductor Market is bifurcated into Analog IC, Digital IC, Analog/Digital IC. In the sputtering target material market for semiconductors, digital ICs dominate due to their extensive use in a wide range of electronic devices, including computers, smartphones, and other consumer electronics that require high-performance digital processing capabilities. Analog/Digital ICs are the second rapidly growing segment, driven by the increasing demand for mixed-signal devices that integrate both analog and digital functions, which are essential for advanced applications such as IoT, automotive electronics, and telecommunications. The need for versatile and high-efficiency ICs in these emerging technologies fuels the growth of this segment.

Sputtering Target Material For Semiconductor Market, By Geography

North America

Europe

Asia Pacific

Rest of the world

Based on Geography, the Global Sputtering Target Material For Semiconductor Market is classified into North America, Europe, Asia Pacific, and the Rest of the world. In the sputtering target material market for semiconductors, Asia Pacific is dominating due to its position as the leading hub for semiconductor manufacturing, with major players like China, Japan, South Korea, and Taiwan driving significant demand. The region benefits from substantial investments in semiconductor fabrication facilities and the high demand for consumer electronics. North America is the second rapidly growing region, propelled by advanced R&D, the presence of leading semiconductor companies, and increasing demand for cutting-edge technologies in sectors such as IT, automotive, and healthcare.

Key Players

The "Global Sputtering Target Material For Semiconductor Market" study report will provide valuable insight with an emphasis on the global market. The major players in the market are JX Nippon Mining & Metals Corporation, Praxair, Plansee SE, Mitsui Mining & Smelting, Hitachi Metals, Honeywell, Sumitomo Chemical, ULVAC, Materion (Heraeus), GRIKIN Advanced Material Co., Ltd., TOSOH, Ningbo Jiangfeng, Heesung, Luvata, Fujian Acetron New Materials Co., Ltd, Changzhou Sujing Electronic Material, Luoyang Sifon Electronic Materials.

Our market analysis also entails a section solely dedicated to such major players wherein our analysts provide an insight into the financial statements of all the major players, along with its product benchmarking and SWOT analysis. The competitive landscape section also includes key development strategies, market share, and market ranking analysis of the above-mentioned players globally.

Sputtering Target Material For Semiconductor Market Key Developments

• In November 2023, Materion Corporation unveiled a new line of high-purity sputtering targets designed specifically for advanced semiconductor fabrication, featuring enhanced performance for ultra-thin film deposition.
• In September 2023, Hitachi Metals launched an innovative series of sputtering targets made from rare earth metals, aimed at improving the efficiency and reliability of next-generation semiconductor devices.
• In June 2023, Nippon Light Metal introduced a breakthrough sputtering target material with a novel alloy composition that enhances film uniformity and adhesion in high-tech semiconductor applications.

TABLE OF CONTENTS

1. Introduction

• Market Definition
• Market Segmentation
• Research Methodology

2. Executive Summary

• Key Findings
• Market Overview
• Market Highlights

3. Market Overview

• Market Size and Growth Potential
• Market Trends
• Market Drivers
• Market Restraints
• Market Opportunities
• Porter's Five Forces Analysis

4. Sputtering Target Material For Semiconductor Market, By Type

• Metals
• Alloys
• Compounds

5. Sputtering Target Material For Semiconductor Market, By Application

• Semiconductor Chip Target Materials

6. Regional Analysis

• North America
• United States
• Canada
• Mexico
• Europe
• United Kingdom
• Germany
• France
• Italy
• Asia-Pacific
• China
• Japan
• India
• Australia
• Latin America
• Brazil
• Argentina
• Chile
• Middle East and Africa
• South Africa
• Saudi Arabia
• UAE

7. Market Dynamics

• Market Drivers
• Market Restraints
• Market Opportunities
• Impact of COVID-19 on the Market

8. Competitive Landscape

• Key Players
• Market Share Analysis

9. Company Profiles

• JX Nippon Mining & Metals Corporation
• Praxair
• Plansee SE
• Mitsui Mining & Smelting
• Hitachi Metals
• Honeywell
• Sumitomo Chemical
• ULVAC
• Materion (formerly Heraeus)

10. Market Outlook and Opportunities

• Emerging Technologies
• Future Market Trends
• Investment Opportunities

11. Appendix

• List of Abbreviations
• Sources and References