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市场调查报告书

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1402174

全球对流回流焊炉市场研究报告 - 2023 年至 2030 年产业分析、规模、份额、成长、趋势与预测

Global Convection Reflow Soldering Oven Market Research Report - Industry Analysis, Size, Share, Growth, Trends and Forecast 2023 to 2030

出版日期: 2023年12月01日 | 出版商:

Value Market Research | 英文 171 Pages | 商品交期: 最快1-2个工作天内

价格

简介目录图表

全球对流回流焊炉市场的需求预计将从 2022 年的 10 亿美元达到 2030 年近 15.6 亿美元的市场规模，2023-2030 年研究期间CAGR为 5.78%。

对流回流焊炉是电子製造中用于将表面贴装元件焊接到印刷电路板 (PCB) 上的关键设备。此过程涉及使用热量来熔化焊膏，从而将元件固定到 PCB 上。

市场动态

不断发展的电子产业（包括智慧型手机和电脑等设备）需要高效的焊接设备来将复杂的元件组装到 PCB 上。随着电子产品尺寸不断缩小，对精确焊接解决方案的需求不断增加，从而推动了对先进回流焊炉的需求。这些烤箱的技术进步，例如改进的加热方法、增强的控制系统和能源效率，吸引了製造商寻求更有效率的生产流程。此外，逐步淘汰含铅焊料的环境法规刺激了对能够处理无铅焊料材料的烤箱的需求。自动化和智慧製造（包括工业 4.0 整合）的推动推动了对具有连接和资料分析功能的回流焊炉的需求。品质和可靠性仍然至关重要，促使製造商寻求可靠的焊接解决方案，以确保高品质的组装并最大限度地减少缺陷。最后，电子製造的全球化和新兴经济体的崛起有助于回流焊炉在各个地区的广泛采用，进一步推动市场成长。

研究报告涵盖波特五力模型、市场吸引力分析和价值链分析。这些工具有助于清晰地了解行业结构并评估全球范围内的竞争吸引力。此外，这些工具也对全球对流回流焊炉市场的各个细分市场进行了包容性评估。对流回流焊炉产业的成长和趋势为本研究提供了整体方法。

区域分析

本节涵盖区域前景，重点介绍北美、欧洲、亚太地区、拉丁美洲以及中东和非洲对流回流焊炉市场当前和未来的需求。此外，该报告重点关注所有主要地区各个应用领域的需求、估计和预测。

该研究报告还涵盖了市场主要参与者的全面概况以及对全球竞争格局的深入了解。对流回流焊炉市场的主要参与者包括 Nordson Corporation、JLW Electronics、PVA Tepla America、Heller、ANTOM、SEHO、VIRTRONIC、Tamura、Nihon Handa、BTU、Shenzhen Riding、Vitronics Soltec 等。本节包含竞争格局的整体视图，包括各种策略发展，例如关键併购、未来产能、合作伙伴关係、财务概况、合作、新产品开发、新产品发布和其他发展。

如果您有任何客製化要求，请写信给我们。我们的研究团队可以根据您的需求提供客製化报告。

区域展望
介绍
北美销售分析
- 概览、历史与预测资料销售分析
- 北美按细分市场销售分析
- 北美按国家销售分析
- 美国销售分析
- 加拿大销售分析
- 墨西哥销售分析
欧洲销售分析
- 概览、历史与预测资料销售分析
- 欧洲按细分市场销售分析
- 欧洲按国家销售分析
- 英国销售分析
- 法国销售分析
- 德国销售分析
- 义大利销售分析
- 俄罗斯销售分析
- 欧洲其他地区销售分析
亚太地区销售分析
- 概览、历史与预测资料销售分析
- 亚太地区按细分市场销售分析
- 亚太地区国家/地区销售分析
- 中国销售分析
- 印度销售分析
- 日本销售分析
- 韩国销售分析
- 澳洲销售分析
- 东南亚销售分析
- 亚太地区其他地区销售分析
拉丁美洲销售分析
- 概览、历史与预测资料销售分析
- 拉丁美洲按细分市场销售分析
- 拉丁美洲按国家销售分析
- 巴西销售分析
- 阿根廷销售分析
- 秘鲁销售分析
- 智利销售分析
- 拉丁美洲其他地区销售分析
中东和非洲销售分析
- 概览、历史与预测资料销售分析
- 中东和非洲按细分市场销售分析
- 中东和非洲国家销售分析
- 沙乌地阿拉伯销售分析
- 阿联酋销售分析
- 以色列销售分析
- 南非销售分析
- 中东其他地区和非洲销售分析

第 8 章：对流回流焊炉公司的竞争格局

对流回流焊炉市场竞争
伙伴关係/协作/协议
併购
新产品发布
其他发展

第 9 章：公司简介

顶级公司市占率分析
市场集中度
Nordson Corporation

公司简介
公司收入
产品
最近的发展

JLW Electronics

公司简介
公司收入
产品
最近的发展

PVA Tepla America

公司简介
公司收入
产品
最近的发展

Heller

公司简介
公司收入
产品
最近的发展

ANTOM

公司简介
公司收入
产品
最近的发展

SEHO

公司简介
公司收入
产品
最近的发展

VIRTRONIC

公司简介
公司收入
产品
最近的发展

Tamura

公司简介
公司收入
产品
最近的发展

Nihon Handa

公司简介
公司收入
产品
最近的发展

公司简介
公司收入
产品
最近的发展

Shenzhen Riding

公司简介
公司收入
产品
最近的发展

Vitronics Soltec

公司简介
公司收入
产品
最近的发展

其他的
- 公司简介
- 公司收入
- 产品
- 最近的发展

注意 - 在公司概况中，财务详细资讯和近期发展视情况而定，或者如果是私人公司，则可能不包括在内

简介目录图表

Product Code: VMR112113018

The global demand for Convection Reflow Soldering Oven Market is presumed to reach the market size of nearly USD 1.56 BN by 2030 from USD 1 BN in 2022 with a CAGR of 5.78% under the study period 2023 - 2030.

A convection reflow soldering oven is a crucial piece of equipment used in electronics manufacturing to solder surface-mount components onto printed circuit boards (PCBs). This process involves the use of heat to melt solder paste, which attaches the components to the PCB.

MARKET DYNAMICS

The expanding electronics industry, encompassing devices like smartphones and computers, necessitates efficient soldering equipment for assembling intricate components onto PCBs. As electronics continue to shrink in size, there's a heightened demand for precise soldering solutions, driving the need for advanced reflow ovens. Technological advancements in these ovens, such as improved heating methods, enhanced control systems, and energy efficiency, attract manufacturers seeking more efficient production processes. Additionally, environmental regulations phasing out lead-based solder have spurred the need for ovens capable of handling lead-free solder materials. The push towards automation and smart manufacturing, including Industry 4.0 integration, fuels the demand for reflow ovens with connectivity and data analytics features. Quality and reliability remain crucial, prompting manufacturers to seek reliable soldering solutions to ensure high-quality assembly and minimize defects. Lastly, the globalization of electronics manufacturing and the rise of emerging economies contribute to the widespread adoption of reflow ovens across various regions, further bolstering market growth.

The research report covers Porter's Five Forces Model, Market Attractiveness Analysis, and Value Chain analysis. These tools help to get a clear picture of the industry's structure and evaluate the competition attractiveness at a global level. Additionally, these tools also give an inclusive assessment of each segment in the global market of convection reflow soldering oven. The growth and trends of convection reflow soldering oven industry provide a holistic approach to this study.

MARKET SEGMENTATION

This section of the convection reflow soldering oven market report provides detailed data on the segments at country and regional level, thereby assisting the strategist in identifying the target demographics for the respective product or services with the upcoming opportunities.

By Application

Automotive
Telecommunications
Consumer Electronics
Others

By Product Type

More Than 20 Heating Zones
10-20 Heating Zones
Less Than 10 Heating Zones

REGIONAL ANALYSIS

This section covers the regional outlook, which accentuates current and future demand for the Convection Reflow Soldering Oven market across North America, Europe, Asia-Pacific, Latin America, and Middle East & Africa. Further, the report focuses on demand, estimation, and forecast for individual application segments across all the prominent regions.

The research report also covers the comprehensive profiles of the key players in the market and an in-depth view of the competitive landscape worldwide. The major players in the Convection Reflow Soldering Oven market include Nordson Corporation, JLW Electronics, PVA Tepla America, Heller, ANTOM, SEHO, VIRTRONIC, Tamura, Nihon Handa, BTU, Shenzhen Riding, Vitronics Soltec, and others. This section consists of a holistic view of the competitive landscape that includes various strategic developments such as key mergers & acquisitions, future capacities, partnerships, financial overviews, collaborations, new product developments, new product launches, and other developments.

In case you have any custom requirements, do write to us. Our research team can offer a customized report as per your need.

1 . PREFACE

1.1. Report Description
- 1.1.1. Objective
- 1.1.2. Target Audience
- 1.1.3. Unique Selling Proposition (USP) & offerings
1.2. Research Scope
1.3. Research Methodology
- 1.3.1. Market Research Process
- 1.3.2. Market Research Methodology

2 . EXECUTIVE SUMMARY

2.1. Highlights of Market
2.2. Global Market Snapshot

3 . CONVECTION REFLOW SOLDERING OVEN - INDUSTRY ANALYSIS

3.1. Introduction - Market Dynamics
3.2. Market Drivers
3.3. Market Restraints
3.4. Opportunities
3.5. Industry Trends
3.6. Porter's Five Force Analysis
3.7. Market Attractiveness Analysis
- 3.7.1 Market Attractiveness Analysis By Application
- 3.7.2 Market Attractiveness Analysis By Product Type
- 3.7.3 Market Attractiveness Analysis By Region

4 . VALUE CHAIN ANALYSIS

4.1. Value Chain Analysis
4.2. Raw Material Analysis
- 4.2.1. List of Raw Materials
- 4.2.2. Raw Material Manufactures List
- 4.2.3. Price Trend of Key Raw Materials
4.3. List of Potential Buyers
4.4. Marketing Channel
- 4.4.1. Direct Marketing
- 4.4.2. Indirect Marketing
- 4.4.3. Marketing Channel Development Trend

5 . GLOBAL CONVECTION REFLOW SOLDERING OVEN MARKET ANALYSIS BY APPLICATION

5.1 Overview by Application
5.2 Historical and Forecast Data
5.3 Analysis by Application
5.4 Automotive Historic and Forecast Sales by Regions
5.5 Telecommunications Historic and Forecast Sales by Regions
5.6 Consumer Electronics Historic and Forecast Sales by Regions
5.7 Others Historic and Forecast Sales by Regions

6 . GLOBAL CONVECTION REFLOW SOLDERING OVEN MARKET ANALYSIS BY PRODUCT TYPE

6.1 Overview by Product Type
6.2 Historical and Forecast Data
6.3 Analysis by Product Type
6.4 More Than 20 Heating Zones Historic and Forecast Sales by Regions
6.5 10-20 Heating Zones Historic and Forecast Sales by Regions
6.6 Less Than 10 Heating Zones Historic and Forecast Sales by Regions

7 . GLOBAL CONVECTION REFLOW SOLDERING OVEN MARKET ANALYSIS BY GEOGRAPHY

7.1. Regional Outlook
7.2. Introduction
7.3. North America Sales Analysis
- 7.3.1. Overview, Historic and Forecast Data Sales Analysis
- 7.3.2. North America By Segment Sales Analysis
- 7.3.3. North America By Country Sales Analysis
- 7.3.4. United State Sales Analysis
- 7.3.5. Canada Sales Analysis
- 7.3.6. Mexico Sales Analysis
7.4. Europe Sales Analysis
- 7.4.1. Overview, Historic and Forecast Data Sales Analysis
- 7.4.2. Europe by Segment Sales Analysis
- 7.4.3. Europe by Country Sales Analysis
- 7.4.4. United Kingdom Sales Analysis
- 7.4.5. France Sales Analysis
- 7.4.6. Germany Sales Analysis
- 7.4.7. Italy Sales Analysis
- 7.4.8. Russia Sales Analysis
- 7.4.9. Rest Of Europe Sales Analysis
7.5. Asia Pacific Sales Analysis
- 7.5.1. Overview, Historic and Forecast Data Sales Analysis
- 7.5.2. Asia Pacific by Segment Sales Analysis
- 7.5.3. Asia Pacific by Country Sales Analysis
- 7.5.4. China Sales Analysis
- 7.5.5. India Sales Analysis
- 7.5.6. Japan Sales Analysis
- 7.5.7. South Korea Sales Analysis
- 7.5.8. Australia Sales Analysis
- 7.5.9. South East Asia Sales Analysis
- 7.5.10. Rest Of Asia Pacific Sales Analysis
7.6. Latin America Sales Analysis
- 7.6.1. Overview, Historic and Forecast Data Sales Analysis
- 7.6.2. Latin America by Segment Sales Analysis
- 7.6.3. Latin America by Country Sales Analysis
- 7.6.4. Brazil Sales Analysis
- 7.6.5. Argentina Sales Analysis
- 7.6.6. Peru Sales Analysis
- 7.6.7. Chile Sales Analysis
- 7.6.8. Rest of Latin America Sales Analysis
7.7. Middle East & Africa Sales Analysis
- 7.7.1. Overview, Historic and Forecast Data Sales Analysis
- 7.7.2. Middle East & Africa by Segment Sales Analysis
- 7.7.3. Middle East & Africa by Country Sales Analysis
- 7.7.4. Saudi Arabia Sales Analysis
- 7.7.5. UAE Sales Analysis
- 7.7.6. Israel Sales Analysis
- 7.7.7. South Africa Sales Analysis
- 7.7.8. Rest Of Middle East And Africa Sales Analysis

8 . COMPETITIVE LANDSCAPE OF THE CONVECTION REFLOW SOLDERING OVEN COMPANIES

8.1. Convection Reflow Soldering Oven Market Competition
8.2. Partnership/Collaboration/Agreement
8.3. Merger And Acquisitions
8.4. New Product Launch
8.5. Other Developments

9 . COMPANY PROFILES OF CONVECTION REFLOW SOLDERING OVEN INDUSTRY

9.1. Top Companies Market Share Analysis
9.2. Market Concentration Rate
9.3. Nordson Corporation
- 9.3.1. Company Overview
- 9.3.2. Company Revenue
- 9.3.3. Products
- 9.3.4. Recent Developments
9.4. JLW Electronics
- 9.4.1. Company Overview
- 9.4.2. Company Revenue
- 9.4.3. Products
- 9.4.4. Recent Developments
9.5. PVA Tepla America
- 9.5.1. Company Overview
- 9.5.2. Company Revenue
- 9.5.3. Products
- 9.5.4. Recent Developments
9.6. Heller
- 9.6.1. Company Overview
- 9.6.2. Company Revenue
- 9.6.3. Products
- 9.6.4. Recent Developments
9.7. ANTOM
- 9.7.1. Company Overview
- 9.7.2. Company Revenue
- 9.7.3. Products
- 9.7.4. Recent Developments
9.8. SEHO
- 9.8.1. Company Overview
- 9.8.2. Company Revenue
- 9.8.3. Products
- 9.8.4. Recent Developments
9.9. VIRTRONIC
- 9.9.1. Company Overview
- 9.9.2. Company Revenue
- 9.9.3. Products
- 9.9.4. Recent Developments
9.10. Tamura
- 9.10.1. Company Overview
- 9.10.2. Company Revenue
- 9.10.3. Products
- 9.10.4. Recent Developments
9.11. Nihon Handa
- 9.11.1. Company Overview
- 9.11.2. Company Revenue
- 9.11.3. Products
- 9.11.4. Recent Developments
9.12. BTU
- 9.12.1. Company Overview
- 9.12.2. Company Revenue
- 9.12.3. Products
- 9.12.4. Recent Developments
9.13. Shenzhen Riding
- 9.13.1. Company Overview
- 9.13.2. Company Revenue
- 9.13.3. Products
- 9.13.4. Recent Developments
9.14. Vitronics Soltec
- 9.14.1. Company Overview
- 9.14.2. Company Revenue
- 9.14.3. Products
- 9.14.4. Recent Developments
9.15. Others
- 9.15.1. Company Overview
- 9.15.2. Company Revenue
- 9.15.3. Products
- 9.15.4. Recent Developments