DRAMeXchange 市场情报服务：晶圆代工白金级报告

晶圆代工白金级资料表

"白金级报告" 首先分析了 TrendForce 的记忆体产业及下游应用需求，然后扩展到上游半导体产业，对晶圆代工产业进行分析，包括晶圆产能、製程节点路线图和晶圆厂利用率。

"白金级报告" 聚焦于台积电 (TSMC)、联电 (UMC)、三星 (Samsung)、中芯国际 (SMIC) 和格罗方德 (GlobalFoundries) 等主要公司，深入分析晶圆代工竞争力及利用率，并探讨晶圆代工市场的未来前景。

晶圆代工市场最新动态

每家晶圆製造商的资讯均提供，并每两週更新一次。

Foundry Platinum Datasheet

The Platinum reports provide analyses of the foundry industry, starting from TrendForce's memory industry analysis and application demand in the downstream, extending to the semiconductor upstream, encompassing wafer production capacity, process node roadmap, and capacity utilization of each fab. The Platinum reports provide detailed analyses of foundries' competitiveness and capacity utilization rates, specifically focusing on major players including TSMC, UMC, Samsung, SMIC, and GlobalFoundries, etc.. The Platinum reports also discuss the future outlook of the foundry market.

Foundry Market Bulletin

We will provide and update on each wafer manufacturers on the biweekly basis.