光罩材料的全球市场2024

光掩模市场正在经历显着成长，预计将从 2022 年的 20 亿美元增长到 2030 年的超过 30 亿美元，复合年增长率约为 5%。半导体技术的不断进步、消费性电子产品的使用增加以及电子产品小型化的持续趋势都促进了对光掩模材料的需求。

本报告提供光罩材料市场详细评估，并深入探讨以下几点:

产品概要

光罩材料所使用的主要材料概要

• 石英
• 钠盐石灰

光罩材料的全球市场概要

混杂光罩的全球市场的现状(2022年)与预测(2030年)相关资料，市场趋势与推动因素的分析解说。

各材料类型全球市场市场区隔

所使用的主要各材料的全球市场市场区隔-石英，钠盐石灰

材料选择的关键选择标准或性能参数，包括客户对图案保真度、缺陷密度和对准精度等参数的回馈

竞争概要:

主要的竞争企业的简介和SK-Electronics, Toppan Photomask, 厦门 Powerway Advanced Material, Nippon Filcon, KLA Corporation等10公司以上的竞争形势分析。

专利概要:

过去4-5年主要的专利转让处的主要专利系列分析。还有专利的研究焦点，讨论中的材料，相关应用相关洞察也包含。

市场展望

在广泛的二次和初步研究验证的支持下，本报告还提供了对市场前景及其影响因素的权威看法。

目录

第1章 简介

• 报告概要
• 产品焦点
• 调查手法

第2章 流程概要

• 薄膜成型
• 光刻
• 蚀刻
• 掺杂
• CMP
• 切割
• 引线接合法
• 包装

第3章 价值链概要

第4章 市场概要

第5章 详细市场评估

• 光罩

第5章 专利概要

第6章 市场展望

第7章 市场展望附录

The Photomask market is poised for remarkable growth, projected to surpass USD 3 billion by 2030, with a CAGR of approximately 5% from a value of USD 2 billion in 2022. The continuous progress of semiconductor technology, the increase in consumer electronics usage, and the ongoing trend of electronics miniaturization are all contributing to the demand for photomask materials

This report provides a deep-dive into the following points in this detailed assessment of the Photomask materials market:

Product Overview

Overview on the key materials used as photomask material:

• Quartz
• Soda Lime

Global Photomask Materials Market Overview

Insight on current (2022) and forecasted (2030) global market for Photomask including an analysis of the key trends and drivers impacting market growth and choice of materials.

Global market segmentation by material type

Global market segmentation by key materials used – Quartz, Soda Lime.

Key Selection criteria or Performance Parameters for material selection including the voice of the customer on parameters such as Pattern Fidelity, Defect density, Alignment accuracy, etc.

Competition overview:

Key competitor profiles and analyzing the competitor landscape of 10+ companies including SK-Electronics, Toppan Photomask, Xiamen Powerway Advanced Material, Nippon Filcon, KLA Corporation, etc.

Patent overview:

Analyzing key patent families by major assignees in the last 4-5 years. The report also includes insights on the research focus of the patents, materials under consideration and the associated applications

Market outlook

Backed by extensive secondary research and validation through primary research, this report also presents a reliable view of the market outlook and factors influencing the same.

Table of Contents

1. Introduction

• 1.1 Report Overview
• 1.2 Product Focus
• 1.3 Methodology

2. Process Overview

• 2.1 Thin Film Molding
• 2.2 Photolithography
• 2.3 Etching
• 2.4 Doping
• 2.5 CMP
• 2.6 Dicing
• 2.7 Wire Bonding
• 2.8 Packaging

3. Value Chain Overview

4. Market Overview

5. Detailed Market Assessment

• 5.1 Photomask

5. Patent Overview

6. Market Outlook

7. Annexure

List of Tables

• Table 4.1: Global Semiconductor Materials Market - By Material Type
• Table 4.2: Global Semiconductor Materials Market - Key Competitors
• Table 5.1.1: Global Photomask Materials Market - By Material Type
• Table 5.1.2: Manufacturers v/s Component and Material Used - Photomask
• Table 6.1: Patent Publications by Geography - Photomask
• Table 6.2: Patent Listing - Photomask

List of Figures

• Chart 4.1: Global Semiconductor Materials Market
• Chart 4.2: Global Semiconductor Materials Market - By Material Type
• Chart 4.3: Global Semiconductor Materials Market - By Component
• Chart 5.1.1: Global Photomask Materials Market
• Chart 5.1.2: Global Photomask Materials Market, By Material
• Chart 6.1: Patent Publication Trend - Photomask