切割胶带材料的全球市场2024

切割胶带市场经历了显着成长，预计到 2030 年将达到约 20 亿美元，复合年增长率约为 6%，而 2022 年为 10 亿美元。半导体技术的不断进步、消费性电子产品的使用不断增加以及电子产品小型化的持续趋势都促进了对切割胶带的需求。

本报告提供切割胶带材料市场详细评估，并深入探讨以下几点:

产品概要

切割胶带的功能定义

• UV硬化型切割胶带
• 非UV硬化型切割胶带等

切割胶带的全球市场概要

切割胶带材料的现在(2022年)与预测(2030年)的全球市场相关洞察。包括对影响市场成长和材料选择的主要趋势和驱动因素的分析。

全球市场的各材料类型市场区隔

主要切割胶带全球市场细分化:UV硬化型切割胶带，非UV硬化型切割胶带等

剥离特性，粘着力，含均一性，一贯性等的参数相关之客户迴响，材料选择主要的选择标准或性能参数

竞争概要:

主要的竞争企业的简介和Nitto Denko, LINTEC, Furukawa Electric, Denka, Sumitomo Bakelite等的主要企业的竞争形势的分析。

专利概要:

过去4-5年主要的转让处的主要专利系列的分析。还有专利的调查对象，也包含讨论中的材料，相关用途相关洞察。

市场展望

在广泛的二次和初步研究验证的支持下，本报告还提供了对市场前景及其影响因素的权威看法。

目录

第1章 简介

• 报告概要
• 产品焦点
• 调查手法

第2章 流程概要

• 薄膜成型
• 光刻
• 蚀刻
• 掺杂
• CMP
• 切割
• 引线接合法
• 包装

第3章 价值链概要

第4章 市场概要

第5章 详细市场评估

• 切割胶带

第5章 专利概要

第6章 市场展望

第7章 市场展望附录

The Dicing tape market is poised for remarkable growth, projected to reach approximately USD 2 billion by 2030, with a compelling CAGR of approximately 6% from a value of USD 1 billion in 2022. The continuous progress of semiconductor technology, the increase in consumer electronics usage, and the ongoing trend of electronics miniaturization are all contributing to the demand for dicing tape.

This report provides a deep-dive into the following points in this detailed assessment of the Dicing tape materials market:

Product Overview

Defining the functions of the Dicing tape:

• UV Curable Dicing Tape
• Non-UV Curable Dicing Tape, etc.

Global Dicing Tape Market overview

Insight on current (2022) and forecasted (2030) global market for dicing tape materials including an analysis of the key trends and drivers impacting market growth and choice of materials.

Global market segmentation by material type

Global market segmentation by key dicing tape – UV Curable Dicing Tape, Non-UV Curable Dicing Tape, etc

Key Selection criteria or Performance Parameters for material selection including the voice of the customer on parameters such as Release Properties, Adhesion Strength, Uniformity, and Consistency

Competition overview:

Key competitor profiles and analyzing the competitor landscape of major companies including Nitto Denko, LINTEC, Furukawa Electric, Denka, Sumitomo Bakelite, etc.

Patent overview:

Analyzing key patent families by major assignees in the last 4-5 years. The report also includes insights on the research focus of the patents, materials under consideration and the associated applications.

Market Outlook

Backed by extensive secondary research and validation through primary research, this report also presents a reliable view of the market outlook and factors influencing the same.

Table of Contents

1. Introduction

• 1.1 Report Overview
• 1.2 Product Focus
• 1.3 Methodology

2. Process Overview

• 2.1 Thin Film Molding
• 2.2 Photolithography
• 2.3 Etching
• 2.4 Doping
• 2.5 CMP
• 2.6 Dicing
• 2.7 Wire Bonding
• 2.8 Packaging

3. Value Chain Overview

4. Market Overview

5. Detailed Market Assessment

• 5.1 Dicing Tape

5. Patent Overview

6. Market Outlook

7. Annexure

List of Tables

• Table 4.1: Global Semiconductor Materials Market - By Material Type
• Table 4.2: Global Semiconductor Materials Market - Key Competitors
• Table 5.1.1: Global Dicing Tape Materials Market - By Material Type
• Table 5.1.2: Manufacturers v/s Component and Material Used - Dicing Tape
• Table 6.1: Patent Publications by Geography - Dicing Tape
• Table 6.2: Patent Listing - Dicing Tape

List of Figures

• Chart 4.1: Global Semiconductor Materials Market
• Chart 4.2: Global Semiconductor Materials Market - By Material Type
• Chart 4.3: Global Semiconductor Materials Market - By Component
• Chart 5.1.1: Global Dicing Tape Materials Market
• Chart 5.1.2: Global Dicing Tape Materials Market, By Material
• Chart 6.1: Patent Publication Trend - Dicing Tape