引线键结材料的全球市场2024

引线键合材料市场正在经历显着成长，预计到 2030 年将达到约 20 亿美元，复合年增长率约为 6%，而 2022 年为 12 亿美元。半导体技术的不断进步、消费性电子产品使用的增加以及电子产品小型化的持续趋势都促进了对引线键合材料的需求。

本报告提供引线键结材料详细评估，并深入探讨以下几点:

产品概要

主要的引线接合法所使用的主要材料定义

• 贵金属
• 非贵金属等

引线键结材料的全球市场概要

引线键结材料的现在(2022年)与预测(2030年)的全球市场相关洞察。包括对影响市场成长和材料选择的主要趋势和驱动因素的分析。

各材料类型的全球市场市场区隔

所使用的主要各材料的全球市场市场区隔- 贵金属，非贵金属

材料选择的关键选择标准或性能参数，包括客户对耐热性、黏合精度、互连电阻等参数的回馈

竞争概要:

主要的竞争企业的简介和LT Metals, Nippon Micrometal, TATSUTA Electric Wire & Cable, Cirexx International, California Fine Wire等的主要企业的竞争形势的分析。

专利概要:

过去4～5年主要的专利转让处的主要专利系列分析。还有专利的研究焦点，调查对象材料，相关应用相关洞察也包含。

市场展望

在广泛的二次和初步研究验证的支持下，本报告还提供了对市场前景及其影响因素的权威看法。

目录

第1章 简介

• 报告概要
• 产品焦点
• 调查手法

第2章 流程概要

• 薄膜成型
• 光刻
• 蚀刻
• 掺杂
• CMP
• 切割
• 引线接合法
• 包装

第3章 价值链概要

第4章 市场概要

第5章 详细市场评估

• 引线接合法

第5章 专利概要

第6章 市场展望

第7章 市场展望附录

The Wire bonding materials market is poised for remarkable growth, projected to reach approximately USD 2 billion by 2030, with a compelling CAGR of approximately 6% from a value of USD 1.2 billion in 2022. The continuous progress of semiconductor technology, the increase in consumer electronics usage, and the ongoing trend of electronics miniaturization are all contributing to the demand for wire bonding materials.

This report provides a deep-dive into the following points in this detailed assessment of wire bonding materials:

Product Overview

Defining the key materials used for major wire bonding:

• Precious
• Non-Precious, etc.

Global Wire Bonding Materials Market Overview

Insight on current (2022) and forecasted (2030) global market for Wire Bonding Materials including an analysis of the key trends and drivers impacting market growth and choice of materials.

Global market segmentation by material type

Global market segmentation by key materials used – Precious, Non-Precious metals

Key Selection criteria or Performance Parameters for material selection including the voice of the customer on parameters such as Heat Resistance, Bond Placement Accuracy, Interconnect Resistance, etc.

Competition overview:

Key competitor profiles and analyzing the competitor landscape of major companies including LT Metals, Nippon Micrometal, TATSUTA Electric Wire & Cable, Cirexx International, California Fine Wire, etc.

Patent overview:

Analyzing key patent families by major assignees in the last 4-5 years. The report also includes insights on the research focus of the patents, materials under consideration and the associated applications.

Market Outlook

Backed by extensive secondary research and validation through primary research, this report also presents a reliable view of the market outlook and factors influencing the same.

Table of Contents

1. Introduction

• 1.1 Report Overview
• 1.2 Product Focus
• 1.3 Methodology

2. Process Overview

• 2.1 Thin Film Molding
• 2.2 Photolithography
• 2.3 Etching
• 2.4 Doping
• 2.5 CMP
• 2.6 Dicing
• 2.7 Wire Bonding
• 2.8 Packaging

3. Value Chain Overview

4. Market Overview

5. Detailed Market Assessment

• 5.1 Wire Bonding

5. Patent Overview

6. Market Outlook

7. Annexure

List of Tables

• Table 4.1: Global Semiconductor Materials Market - By Material Type
• Table 4.2: Global Semiconductor Materials Market - Key Competitors
• Table 5.1.1: Global Wire Bonding Materials Market - By Material Type
• Table 5.1.2: Manufacturers v/s Component and Material Used - Wire Bonding
• Table 6.1: Patent Publications by Geography - Wire Bonding
• Table 6.2: Patent Listing - Wire Bonding

List of Figures

• Chart 4.1: Global Semiconductor Materials Market
• Chart 4.2: Global Semiconductor Materials Market - By Material Type
• Chart 4.3: Global Semiconductor Materials Market - By Component
• Chart 5.1.1: Global Wire Bonding Materials Market
• Chart 5.1.2: Global Wire Bonding Materials Market, By Material
• Chart 6.1: Patent Publication Trend - Wire Bonding