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到 2030 年球焊机市场预测：按驱动、电线类型、组件、用途、最终用户和地区进行的全球分析
市场调查报告书
商品编码
1340005

到 2030 年球焊机市场预测：按驱动、电线类型、组件、用途、最终用户和地区进行的全球分析

Ball Bonder Machine Market Forecasts to 2030 - Global Analysis By Actuation, Wire Type, Component, Application, End User and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 175+ Pages | 商品交期: 2-3个工作天内

价格

根据Stratistics MRC的数据，2023年全球球焊机市场规模为12.513亿美元，预计复合年增长率为6.04%，到2030年达到18.864亿美元。

IC（积体电路）和任何半导体器件之间的连接都可以通过球焊机实现。连接由细线製成，通常由铜、铝、金或银结构。球焊是一种结合压力、热量和超音波能量来建立这种连接的技术。

市场动态：

促进因素：

  • 新电气设备的开发和半导体产业的扩张。
  • 在预测期内，市场预计将受益于新电子设备的推出，例如改进的功能和新标准的智能手机。此外，随着消费者对电子产品的需求增加以及3D芯片封装的使用增加，芯片需求也将增加。半导体是结构各种电子设备的重要零件，包括计算机、行动电话、汽车电子和工业机械。随着半导体需求的不断增加，对球焊机的需求也在增加。

抑制因素：

  • 技术创新和成本压力。
  • 球焊机製造商可能会因技术改进而面临困难。如果新技术取代引线键合或提供更有效的替代方案，对球焊机的需求可能会受到影响。然而，球焊机製造商之间的激烈竞争可能会带来价格压力。尤其是在价格敏感的行业，製造商可能很难在提供有竞争力的价格的同时保持盈利能力。

机会：

  • 对先进封装的需求。
  • 倒装芯片、晶圆级封装、3D封装等创新封装技术在半导体行业日益流行。这些封装技术具有提高电气性能、改进热控制和缩小外形尺寸等优点。球焊机对于这些尖端封装技术中引线键合应用的扩展至关重要，并为其提供支持。

威胁

  • 技能和劳动力挑战。
  • 球焊机的操作和维护需要合格的工程师和技术人员。可能没有足够的合格人员来操作和维护此类机械。对于生产商和最终用户来说，球焊机的引进和有效使用可能会因人才短缺而受到阻碍。

新冠肺炎 (COVID-19) 影响：

  • 疫情改变了消费者的需求模式，人们对生活必需品的需求增加，对奢侈品的需求减少。消费电子产品是半导体设备的大消费者，是受这一转型影响的行业之一。由于疫情导致消费电子产品需求下降，球焊机的需求可能间接受到影响。
  • 自动化领域预计将在预测期内成为最大的领域
  • 由于半导体封装中新技术的不断使用，自动化领域将在预测期内占据大部分市场。自动执行器使用外部电源来产生打开阀门所需的力。自动执行器使用液压、气动或电力来操作阀门。
  • 预计半导体和电子行业在预测期内将经历最高的年复合成长率。
  • 预计半导体和电子行业在预测期内将出现良好增长。半导体是电子设备的重要结构要素，它推动了许多行业的进步，包括清洁能源、交通、计算机、医疗保健和军事系统。此外，随着电子设备变得更小、更快、更可靠，半导体技术也在不断进步。

占比最大的地区：

由于智能手机和其他小工具的尺寸更小、使用金属盖以及更大的显示屏，设计复杂性不断增加，预计亚太地区将在预测期内占据最大比例。此外，半导体封装行业研发活动的活性化和最尖端科技的采用预计将支持该地区的市场扩张。

复合年复合成长率最高的地区：

由于越来越多的 IDM 供应商使用焊线机设备进行先进芯片生产，预计亚太地区在预测期内的年复合成长率最高。此外，生产能力的提高和包装方法的技术进步也促进了该地区的增长。

免费定制服务：

订阅此报告的客户将收到以下免费定制选项之一：

  • 公司简介
    • 其他市场参与者的综合分析（最多 3 家公司）
    • 主要企业SWOT分析（最多3家企业）
  • 区域分割
    • 根据客户意愿对主要国家的市场估计、预测和年复合成长率（注：基于可行性检查）
  • 竞争标杆管理
    • 根据产品系列、地域分布和战略联盟对主要企业进行基准测试

目录

第1章执行摘要

第2章前言

  • 概述
  • 利益相关者
  • 调查范围
  • 调查方法
    • 资料挖掘
    • 资料分析
    • 资料检验
    • 研究途径
  • 调查来源
    • 主要调查来源
    • 二次调查来源
    • 假设

第3章市场趋势分析

  • 促进因素
  • 抑制因素
  • 机会
  • 威胁
  • 用途分析
  • 最终用户分析
  • 新兴市场
  • 新型冠状病毒感染疾病（COVID-19）的影响

第4章波特五力分析

  • 供应商的议价能力
  • 买方议价能力
  • 替代品的威胁
  • 新进入者的威胁
  • 竞争公司之间的敌对关係

第5章全球焊球机市场：按运营划分

  • 自动化
    • 全自动球焊机
    • 半自动球焊机
  • 手动的
  • 其他操作

第6章全球球焊机市场：按线材类型

  • 银
  • 铜
  • 钱
  • 其他电线类型

第7章全球球焊机市场：按组成部分

  • 工件固定架
  • 夹钳
  • 感应器
  • 加热装置
  • 其他组件

第8章全球球焊机市场：按用途

  • 信息技术和通讯
  • 半导体和电子产品
  • 包装
  • 其他用途

第9章全球球焊机市场：按最终用户分类

  • 医疗保健
  • 航太和国防
  • 车
  • 其他最终用户

第10章全球球焊机市场：按地区

  • 北美
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 义大利
    • 法国
    • 西班牙
    • 其他欧洲国家
  • 亚太地区
    • 日本
    • 中国
    • 印度
    • 澳大利亚
    • 纽西兰
    • 韩国
    • 其他亚太地区
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 南美洲其他地区
  • 中东和非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 卡达
    • 南非
    • 其他中东和非洲

第11章进展

  • 合同、伙伴关係、协作和合资企业
  • 收购和合併
  • 新产品发布
  • 业务扩展
  • 其他关键策略

第12章公司简介

  • Anza Technology
  • ASM Pacific Technology
  • F&K
  • FandK
  • Hesse
  • Hybond
  • KAIJO
  • Kulicke and Soffa（KandS）
  • Mech-El Industries
  • Micro Point Pro（MPP）
  • Palomar
  • Planar
  • Questar Products
  • Shinkawa
  • TPT
  • Ultrasonic Engineering
  • West-Bond
Product Code: SMRC23712

According to Stratistics MRC, the Global Ball Bonder Machine Market is accounted for $1,251.3 million in 2023 and is expected to reach $1,886.4 million by 2030 growing at a CAGR of 6.04% during the forecast period. Connections between ICs (Integrated Circuits) or any semiconductor device are made accessible by a ball bonder machine. The connection is created with a thin wire, typically consisting of copper, aluminum, gold, or silver. Ball bonding is a technique that establishes this link using a combination of pressure, heat, and ultrasonic energy.

Market Dynamics:

Driver:

  • New electrical device development and expanding industry for semiconductors.
  • The market is anticipated to gain from the introduction of new electronic devices during the course of the forecast period, such as smartphones with improved functionality and novel standards. Additionally, as consumer demand for gadgets rises and 3D chip packaging usage rises, chip demand also rises. Semiconductors are essential parts that comprise a wide range of electronic devices, including computers, cell phones, car electronics, and industrial machinery. Ball bonder machines are becoming more necessary as the manufacture of semiconductors rises along with the demand for these devices.

Restraint:

  • Technological innovations and cost pressure.
  • Manufacturers of ball bonding machines may face difficulties as a result of technological improvements. Ball bonder machine demand may be impacted if a new technology replaces wire bonding or provides a more effective substitute. However, price pressures could result from the intense rivalry among ball bonder machine makers. Particularly in price-sensitive sectors, manufacturers may struggle to sustain profitability while providing competitive prices.

Opportunity:

  • Advanced packaging demand.
  • In the semiconductor industry, innovative packaging techniques, including flip-chip, wafer-level packaging, and 3D packaging, are becoming more popular. These packaging methods offer benefits such as enhanced electrical performance, better thermal control, and form factor reduction. Ball bonder machines are essential for wire bonding applications in these cutting-edge packaging technologies, assisting in their expansion.

Threat:

  • Challenges in skills and workforce.
  • Ball bonder machine operation and maintenance demand qualified engineers and technicians. It's possible that there might not be enough qualified personnel available for the operation and upkeep of these machines. Ball bonder machine uptake and effective use may be hampered by this shortage for producers and end users.

COVID-19 Impact:

  • Consumer demand patterns changed as a result of the epidemic, with a greater emphasis on necessities and a decline in the demand for luxury. Consumer electronics, a big consumer of semiconductor devices, was among the businesses affected by this transition. Ball bonder machine demand may have been indirectly impacted by the pandemic's lower demand for consumer electronics.
  • The automated segment is expected to be the largest during the forecast period
  • Due to the ongoing use of new technologies in semiconductor packaging, the automated segment held the majority of the market over the forecast period. Automated actuators produce the force necessary to open valves using an external power source. Automatic actuators employ hydraulic, pneumatic, or electrical power to operate valves.
  • The semiconductor & electronics segment is expected to have the highest CAGR during the forecast period
  • Semiconductor & Electronics segment is estimated to witness lucrative growth over the forecast period. A crucial component of electronic devices, semiconductors enable advances in a number of industries, including clean energy, transportation, computers, healthcare, and military systems. In addition, as semiconductor technology has improved as electronic devices have become smaller, faster, and more dependable.

Region with largest share:

Due to increased design complexity, which has led to smaller versions, the use of metallic covers, and larger displays in smartphones and other gadgets, the Asia-Pacific area is anticipated to hold the largest proportion over the projected time. Additionally, growing R&D activities and the adoption of cutting-edge technologies by the semiconductor packaging industry are anticipated to fuel the market's expansion in the region.

Region with highest CAGR:

Asia Pacific is predicted to experience the highest CAGR over the projected period due to an expansion in the number of IDM suppliers using wire bonder equipment for advanced chip production. Additionally, the expansion of production capacity and ongoing technological advancements in packaging methods are contributing to the region's growth.

Key players in the market:

Some of the key players in Ball Bonder Machine market include: Anza Technology, ASM Pacific Technology, F&K, FandK, Hesse, Hybond, KAIJO, Kulicke and Soffa (KandS), Mech-El Industries, Micro Point Pro(MPP), Palomar, Planar, Questar Products, Shinkawa, TPT, Ultrasonic Engineering and West-Bond.

Key Developments:

In February 2022, ASMPT Completes Acquisition of Automation Engineering Inc (AEi). The acquisition provides ASMPT not only a significant presence in the automotive camera assembly and test solutions space.

Actuations Covered:

  • Automated
  • Manual
  • Other Actuations

Wire Types Covered:

  • Silver
  • Copper
  • Gold
  • Other Wire Types

Components Covered:

  • Workholders
  • Clamps
  • Transducers
  • Heating Units
  • Other Components

Applications Covered:

  • IT & Telecommunication
  • Semiconductor & Electronics
  • Packaging
  • Other Applications

End Users Covered:

  • Medical
  • Aerospace & Defense
  • Automotive
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2021, 2022, 2023, 2026, and 2030
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options::

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Application Analysis
  • 3.7 End User Analysis
  • 3.8 Emerging Markets
  • 3.9 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Ball Bonder Machine Market, By Actuation

  • 5.1 Introduction
  • 5.2 Automated
    • 5.2.1 Fully Automatic Ball Bonder
    • 5.2.2 Semi-Automatic Ball Bonder
  • 5.3 Manual
  • 5.4 Other Actuations

6 Global Ball Bonder Machine Market, By Wire Type

  • 6.1 Introduction
  • 6.2 Silver
  • 6.3 Copper
  • 6.4 Gold
  • 6.5 Other Wire Types

7 Global Ball Bonder Machine Market, By Component

  • 7.1 Introduction
  • 7.2 Workholders
  • 7.3 Clamps
  • 7.4 Transducers
  • 7.5 Heating Units
  • 7.6 Other Components

8 Global Ball Bonder Machine Market, By Application

  • 8.1 Introduction
  • 8.2 IT & Telecommunication
  • 8.3 Semiconductor & Electronics
  • 8.4 Packaging
  • 8.5 Other Applications

9 Global Ball Bonder Machine Market, By End User

  • 9.1 Introduction
  • 9.2 Medical
  • 9.3 Aerospace & Defense
  • 9.4 Automotive
  • 9.5 Other End Users

10 Global Ball Bonder Machine Market, By Geography

  • 10.1 Introduction
  • 10.2 North America
    • 10.2.1 US
    • 10.2.2 Canada
    • 10.2.3 Mexico
  • 10.3 Europe
    • 10.3.1 Germany
    • 10.3.2 UK
    • 10.3.3 Italy
    • 10.3.4 France
    • 10.3.5 Spain
    • 10.3.6 Rest of Europe
  • 10.4 Asia Pacific
    • 10.4.1 Japan
    • 10.4.2 China
    • 10.4.3 India
    • 10.4.4 Australia
    • 10.4.5 New Zealand
    • 10.4.6 South Korea
    • 10.4.7 Rest of Asia Pacific
  • 10.5 South America
    • 10.5.1 Argentina
    • 10.5.2 Brazil
    • 10.5.3 Chile
    • 10.5.4 Rest of South America
  • 10.6 Middle East & Africa
    • 10.6.1 Saudi Arabia
    • 10.6.2 UAE
    • 10.6.3 Qatar
    • 10.6.4 South Africa
    • 10.6.5 Rest of Middle East & Africa

11 Key Developments

  • 11.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 11.2 Acquisitions & Mergers
  • 11.3 New Product Launch
  • 11.4 Expansions
  • 11.5 Other Key Strategies

12 Company Profiling

  • 12.1 Anza Technology
  • 12.2 ASM Pacific Technology
  • 12.3 F&K
  • 12.4 FandK
  • 12.5 Hesse
  • 12.6 Hybond
  • 12.7 KAIJO
  • 12.8 Kulicke and Soffa (KandS)
  • 12.9 Mech-El Industries
  • 12.10 Micro Point Pro(MPP)
  • 12.11 Palomar
  • 12.12 Planar
  • 12.13 Questar Products
  • 12.14 Shinkawa
  • 12.15 TPT
  • 12.16 Ultrasonic Engineering
  • 12.17 West-Bond

List of Tables

  • Table 1 Global Ball Bonder Machine Market Outlook, By Region (2021-2030) ($MN)
  • Table 2 Global Ball Bonder Machine Market Outlook, By Actuation (2021-2030) ($MN)
  • Table 3 Global Ball Bonder Machine Market Outlook, By Automated (2021-2030) ($MN)
  • Table 4 Global Ball Bonder Machine Market Outlook, By Fully Automatic Ball Bonder (2021-2030) ($MN)
  • Table 5 Global Ball Bonder Machine Market Outlook, By Semi-Automatic Ball Bonder (2021-2030) ($MN)
  • Table 6 Global Ball Bonder Machine Market Outlook, By Manual (2021-2030) ($MN)
  • Table 7 Global Ball Bonder Machine Market Outlook, By Other Actuations (2021-2030) ($MN)
  • Table 8 Global Ball Bonder Machine Market Outlook, By Wire Type (2021-2030) ($MN)
  • Table 9 Global Ball Bonder Machine Market Outlook, By Silver (2021-2030) ($MN)
  • Table 10 Global Ball Bonder Machine Market Outlook, By Copper (2021-2030) ($MN)
  • Table 11 Global Ball Bonder Machine Market Outlook, By Gold (2021-2030) ($MN)
  • Table 12 Global Ball Bonder Machine Market Outlook, By Other Wire Types (2021-2030) ($MN)
  • Table 13 Global Ball Bonder Machine Market Outlook, By Component (2021-2030) ($MN)
  • Table 14 Global Ball Bonder Machine Market Outlook, By Workholders (2021-2030) ($MN)
  • Table 15 Global Ball Bonder Machine Market Outlook, By Clamps (2021-2030) ($MN)
  • Table 16 Global Ball Bonder Machine Market Outlook, By Transducers (2021-2030) ($MN)
  • Table 17 Global Ball Bonder Machine Market Outlook, By Heating Units (2021-2030) ($MN)
  • Table 18 Global Ball Bonder Machine Market Outlook, By Other Components (2021-2030) ($MN)
  • Table 19 Global Ball Bonder Machine Market Outlook, By Application (2021-2030) ($MN)
  • Table 20 Global Ball Bonder Machine Market Outlook, By IT & Telecommunication (2021-2030) ($MN)
  • Table 21 Global Ball Bonder Machine Market Outlook, By Semiconductor & Electronics (2021-2030) ($MN)
  • Table 22 Global Ball Bonder Machine Market Outlook, By Packaging (2021-2030) ($MN)
  • Table 23 Global Ball Bonder Machine Market Outlook, By Other Applications (2021-2030) ($MN)
  • Table 24 Global Ball Bonder Machine Market Outlook, By End User (2021-2030) ($MN)
  • Table 25 Global Ball Bonder Machine Market Outlook, By Medical (2021-2030) ($MN)
  • Table 26 Global Ball Bonder Machine Market Outlook, By Aerospace & Defense (2021-2030) ($MN)
  • Table 27 Global Ball Bonder Machine Market Outlook, By Automotive (2021-2030) ($MN)
  • Table 28 Global Ball Bonder Machine Market Outlook, By Other End Users (2021-2030) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.