半导体封装材料的全球市场2024

半导体封装材料市场正经历显着成长，预计将从2022年的250亿美元成长到2030年的超过400亿美元，复合年增长率约为7%。半导体技术的不断进步、消费性电子产品的使用不断增加以及电子产品小型化的持续趋势都促进了对封装材料的需求。

本报告提供半导体封装材料市场详细评估，并深入探讨以下几点:

产品概要

主要的半导体包装零组件所使用的功能与主要材料定义

• 粘晶
• 封装材
• 底部填充
• 热介面材料
• 晶圆基板包装等

半导体封装材料的全球市场概要

半导体封装材料的现在(2022年)与预测(2030年)的全球市场相关洞察。包括对影响市场成长和材料选择的主要趋势和驱动因素的分析。

各材料类型的全球市场市场区隔

所使用的主要各材料的全球市场市场区隔- 聚合物，金属，陶瓷，复合材料等

含隔热性和弹性等的参数相关之客户迴响，材料选择的主要选择标准或性能参数

竞争概要:

主要的竞争企业简介包含有 DuPont, Henkel, Kyocera, Heraeus, Panasonic等的20公司以上的竞争形势分析。

专利概要:

过去4-5年的主要受让人约40专利系列分析。还有专利的调查对象，也包含讨论中的材料，相关用途相关洞察。

市场展望

在广泛的二次和初步研究验证的支持下，本报告还提供了对市场前景及其影响因素的权威看法。

目录

第1章 简介

• 报告概要
• 产品焦点
• 调查手法

第2章 流程概要

• 薄膜成型
• 光刻
• 蚀刻
• 掺杂
• CMP
• 切割
• 引线接合法
• 包装

第3章 价值链概要

第4章 市场概要

第5章 详细市场评估

• 半导体包装

第5章 专利概要

第6章 市场展望

第7章 市场展望附录

The Semiconductor packaging materials market is poised for remarkable growth, projected to surpass USD 40 billion by 2030, with a compelling CAGR of approximately 7% from a value of USD 25 billion in 2022. The continuous progress of semiconductor technology, the increase in consumer electronics usage, and the ongoing trend of electronics miniaturization are all contributing to the demand for packaging materials.

This report provides a deep-dive into the following points in this detailed assessment of semiconductor packaging materials market:

Product Overview

Defining the functions and the key materials used for major semiconductor packaging components:

• Die-attach
• Encapsulants
• Underfills
• Thermal interface material
• Wafer substrate packaging, etc.

Global Semiconductor Packaging Materials Market overview

Insight on current (2022) and forecasted (2030) global market for Semiconductor Packaging Materials including an analysis of the key trends and drivers impacting market growth and choice of materials.

Global market segmentation by material type

Global market segmentation by key materials used – Polymers, Metals, Ceramics, Composites, etc.

Key Selection criteria or Performance Parameters for material selection including voice of customer on parameters such as Thermal insulation and flexibility

Competition overview:

Key competitor profiles and analyzing the competitor landscape of 20+ companies including DuPont, Henkel, Kyocera, Heraeus, Panasonic, etc.

Patent overview:

Analyzing about 40 patent families by key assignees in the last 4-5 years. Report also includes insights on the research focus of the patents, materials under consideration and the associated applications.

Market outlook

Backed by extensive secondary research and validation through primary research, this report also presents a reliable view of the market outlook and factors influencing the same.

Table of Contents

1. Introduction

• 1.1 Report Overview
• 1.2 Product Focus
• 1.3 Methodology

2. Process Overview

• 2.1 Thin Film Molding
• 2.2 Photolithography
• 2.3 Etching
• 2.4 Doping
• 2.5 CMP
• 2.6 Dicing
• 2.7 Wire Bonding
• 2.8 Packaging

3. Value Chain Overview

4. Market Overview

5. Detailed Market Assessment

• 5.1 Semiconductor Packaging

5. Patent Overview

6. Market Outlook

7. Annexure

List of Tables

• Table 4.1: Global Semiconductor Materials Market - By Material Type
• Table 4.2: Global Semiconductor Materials Market - Key Competitors
• Table 5.1.1: Global Semiconductor Packaging Materials Market - By Material Type
• Table 5.1.2: Manufacturers v/s Component and Material Used - Semiconductor Packaging Materials
• Table 6.1: Patent Publications by Geography - Semiconductor Packaging Materials
• Table 6.2: Patent Listing - Semiconductor Packaging Materials

List of Figures

• Chart 4.1: Global Semiconductor Materials Market
• Chart 4.2: Global Semiconductor Materials Market - By Material Type
• Chart 4.3: Global Semiconductor Materials Market - By Component
• Chart 5.1.1: Global Semiconductor Packaging Materials Market
• Chart 5.1.2: Global Semiconductor Packaging Materials Market, By Material
• Chart 6.1: Patent Publication Trend - Semiconductor Packaging Materials