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市场调查报告书
商品编码
1621333

半导体/ IC封装材料市场：按类型、技术、封装技术、应用分类 - 2025-2030 年全球预测

Semiconductor & IC Packaging Materials Market by Type (Bonding wires, Ceramic Packages, Die Attach Materials), Technology (Flip Chip, Grid Array, Quad Flat Package), Packaging Technology, Application - Global Forecast 2025-2030
出版日期: | 出版商: 360iResearch | 英文 196 Pages | 商品交期: 最快1-2个工作天内

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2023年半导体及IC封装材料市场规模为384.4亿美元，预计2024年将达到421.6亿美元，复合年增长率为10.35%，2030年将达766.4亿美元。

半导体和 IC 封装材料市场包括用于保护和绝缘半导体装置并确保其功能和效率的材料。产品范围包括基板、导线架、接合线、晶片连接材料、封装、热界面材料等。这些材料对于电子设备的小型化和提高性能至关重要，并在消费性电子、汽车、通讯和工业领域中得到应用。对更小、更有效率、更节能的电子设备的需求推动了对高性能封装材料的需求，并且材料技术正在快速发展以满足下一代半导体的需求。

主要市场统计
基准年[2023] 384.4亿美元
预测年份 [2024] 421.6亿美元
预测年份 [2030] 766.4亿美元
复合年增长率（%） 10.35%

主要成长要素包括物联网设备的激增、人工智慧和机器学习的进步以及 5G 网路的扩展，这将推动半导体消费。电动车的日益普及和可再生能源系统的日益普及存在着机会，这两者都需要先进的半导体解决方案。为了抓住这些机会，新兴市场必须专注于开发环保且具成本效益的材料，并遵守环保意识日益增强的市场的法规。然而，市场也面临原材料成本高、製造流程复杂、品质标准严格等挑战，可能会限製成长潜力。

在技​​术创新方面，探索和开发具有优异热电性能的先进复合材料是有希望的。此外，奈米技术和生物基材料的研究也具有巨大的潜力。公司应该投资研发来创造能够实现异质整合整合并支援先进封装技术（例如 3D 堆迭和系统级封装 (SiP) 架构）的材料。市场的特点是技术日新月异，适应性和持续创新对于保持竞争优势至关重要。透过专注于永续性、品质和成本效率，公司可以利用不断扩大的半导体格局。

市场动态：快速发展的半导体和IC封装材料市场的关键市场洞察

半导体和IC封装材料市场正因供需的动态互动而转变。透过了解这些不断变化的市场动态，公司可以准备好做出明智的投资决策、完善策略决策并抓住新的商机。全面了解这些趋势可以帮助企业降低政治、地理、技术、社会和经济领域的风险，同时消费行为及其对製造成本的影响以及对采购趋势的影响。

  • 市场驱动因素
    • 消费性电子产品对半导体和IC封装材料的需求增加
    • 支持创新包装材料的技术不断进步
    • 电子领域小型化、高密度化进展
  • 市场限制因素
    • 半导体产业外包和测试中的智慧财产权问题
  • 市场机会
    • 与先进技术的融合
    • 5G 和自动驾驶汽车的采用
  • 市场挑战
    • 增加有关材料使用和处置的环境法规

波特五力：驾驭半导体与IC封装材料市场的策略工具

波特的五力框架是了解市场竞争格局的重要工具。波特的五力框架为评估公司的竞争地位和探索策略机会提供了清晰的方法。该框架可帮助公司评估市场动态并确定新业务的盈利。这些见解使公司能够利用自己的优势，解决弱点并避免潜在的挑战，从而确保更强大的市场地位。

PESTLE分析：了解外部对半导体和IC封装材料市场的影响

外部宏观环境因素对半导体和IC封装材料市场的表现动态起着至关重要的作用。对政治、经济、社会、技术、法律和环境因素的分析提供了应对这些影响所需的资讯。透过调查 PESTLE 因素，公司可以更了解潜在的风险和机会。这种分析可以帮助公司预测法规、消费者偏好和经济趋势的变化，并为他们做出积极主动的决策做好准备。

市场占有率分析 了解半导体/ IC封装材料市场竞争状况

对半导体和IC封装材料市场的详细市场占有率分析可以对供应商绩效进行全面评估。公司可以透过比较收益、客户群和成长率等关键指标来揭示其竞争地位。该分析揭示了市场集中、分散和整合的趋势，为供应商提供了製定策略决策所需的洞察力，使他们能够在日益激烈的竞争中占有一席之地。

FPNV定位矩阵半导体及IC封装材料市场厂商绩效评估

FPNV定位矩阵是评估半导体和IC封装材料市场供应商的重要工具。此矩阵允许业务组织根据商务策略和产品满意度评估供应商，从而做出与其目标相符的明智决策。这四个象限使您能够清晰、准确地划分供应商，并确定最能满足您的策略目标的合作伙伴和解决方案。

策略分析和建议，规划半导体和IC封装材料市场的成功之路

半导体和IC封装材料市场的策略分析对于旨在加强其在全球市场的影响力的公司至关重要。透过审查关键资源、能力和绩效指标，公司可以识别成长机会并努力改进。这种方法使您能够克服竞争环境中的挑战，利用新的商机并取得长期成功。

本报告对市场进行了全面分析，涵盖关键重点领域：

1. 市场渗透率：对当前市场环境的详细审查、主要企业的广泛资料、对其在市场中的影响力和整体影响力的评估。

2. 市场开发：辨识新兴市场的成长机会，评估现有领域的扩张潜力，并提供未来成长的策略蓝图。

3. 市场多元化：分析近期产品发布、未开发地区、关键产业进展、塑造市场的策略投资。

4. 竞争评估与情报：彻底分析竞争格局，检验市场占有率、业务策略、产品系列、认证、监理核准、专利趋势、主要企业的技术进步等。

5. 产品开发与创新：重点在于有望推动未来市场成长的最尖端科技、研发活动和产品创新。

我们也回答重要问题，帮助相关人员做出明智的决策：

1.目前的市场规模和未来的成长预测是多少？

2. 哪些产品、区隔市场和地区提供最佳投资机会？

3.塑造市场的主要技术趋势和监管影响是什么？

4.主要厂商的市场占有率和竞争地位如何？

5. 推动供应商市场进入和退出策略的收益来源和策略机会是什么？

目录

第一章 前言

第二章调查方法

第三章执行摘要

第四章市场概况

第五章市场洞察

  • 市场动态
    • 促进因素
      • 家电半导体和IC封装材料需求增加
      • 支持创新包装材料的技术不断进步
      • 电子设备领域小型化、高密度化进展
    • 抑制因素
      • 半导体产业外包和测试的智慧财产权问题
    • 机会
      • 与先进技术融合
      • 介绍 5G 和自动驾驶汽车
    • 任务
      • 加强有关材料使用和处置的环境法规
  • 市场区隔分析
    • 类型：陶瓷封装，适合高效能、高可靠性应用
    • 应用：汽车产业中半导体和积体电路 (IC) 封装材料使用的演变
  • 波特五力分析
  • PESTEL分析
    • 政治的
    • 经济
    • 社群
    • 技术的
    • 合法地
    • 环境

第六章半导体/ IC封装材料市场：依类型

  • 键合线
  • 陶瓷封装
  • 晶片贴装材料
  • 封装树脂
  • 导线架
  • 有机基材物
  • 焊球
  • 导热材料

第七章半导体/ IC封装材料市场：依技术分类

  • 覆晶
  • 网格阵列
  • 四方扁平封装
  • 小外形封装

第八章半导体/ IC封装材料市场封装技术

  • 2.5D IC
  • 3D IC
  • 穿透硅通孔
  • 晶圆级封装

第9章半导体/ IC封装材料市场：依应用分类

  • 航太和国防
  • 车
  • 运算和网路
  • 家电
  • 卫生保健
  • 产业
  • 通讯

第十章 美洲半导体/ IC封装材料市场

  • 阿根廷
  • 巴西
  • 加拿大
  • 墨西哥
  • 美国

第十一章亚太半导体/ IC封装材料市场

  • 澳洲
  • 中国
  • 印度
  • 印尼
  • 日本
  • 马来西亚
  • 菲律宾
  • 新加坡
  • 韩国
  • 台湾
  • 泰国
  • 越南

第十二章 欧洲、中东、非洲半导体/ IC封装材料市场

  • 丹麦
  • 埃及
  • 芬兰
  • 法国
  • 德国
  • 以色列
  • 义大利
  • 荷兰
  • 奈及利亚
  • 挪威
  • 波兰
  • 卡达
  • 俄罗斯
  • 沙乌地阿拉伯
  • 南非
  • 西班牙
  • 瑞典
  • 瑞士
  • 土耳其
  • 阿拉伯聯合大公国
  • 英国

第十三章竞争格局

  • 2023 年市场占有率分析
  • FPNV 定位矩阵，2023
  • 竞争情境分析
    • Amkor 与 Apple 结成策略联盟，建造最大的先进半导体封装厂
    • Resonac 在硅谷开设新的封装解决方案中心，为半导体创新奠定基础
    • 半导体封装的策略扩张与创新
  • 战略分析和建议

公司名单

  • 3M Company
  • Advanced Semiconductor Engineering Inc
  • AMETEK Electronic Components & Packaging
  • Amtech Microelectronics, Inc.
  • ASE Group
  • California Fine Wire Co.
  • Canatu Oy
  • Ceramtec GmbH
  • Chipbond Technology Corporation
  • Chipmos Technologies Inc.
  • Deca Technologies
  • FlipChip International LLC
  • Fujitsu Semiconductor Limited
  • Henkel AG & Co. KGaA
  • Intel Corporation
  • Interconnect Systems Inc.（ISI）
  • Kyocera Chemical Corporation
  • Microchip Technology
  • Powertech Technology, Inc.
  • Samsung Electronics Co. Ltd
  • Siemens AG
  • Sumitomo Chemical Co., Ltd.
  • Taiwan Semiconductor Manufacturing Company
  • Tianshui Huatian Technology Co., Ltd.
  • Toray Industries, Inc.
  • Unisem Berhad
  • UTAC Group
Product Code: MRR-7A22CB0E5917

The Semiconductor & IC Packaging Materials Market was valued at USD 38.44 billion in 2023, expected to reach USD 42.16 billion in 2024, and is projected to grow at a CAGR of 10.35%, to USD 76.64 billion by 2030.

The semiconductor and IC packaging materials market encompasses materials used to protect and insulate semiconductor devices, ensuring their functionality and efficiency. The scope includes substrates, lead frames, bonding wires, die-attach materials, encapsulants, and thermal interface materials. These materials are crucial for the miniaturization and performance enhancement of electronic devices, finding applications in consumer electronics, automotive, telecommunications, and industrial sectors. The necessity of high-performance packaging materials is driven by the demand for compact, efficient, and energy-saving electronic devices, leading to rapid evolution in material technologies to pace with next-gen semiconductor requirements.

KEY MARKET STATISTICS
Base Year [2023] USD 38.44 billion
Estimated Year [2024] USD 42.16 billion
Forecast Year [2030] USD 76.64 billion
CAGR (%) 10.35%

Key growth factors include the proliferation of IoT devices, advancements in AI and machine learning, and the expansion of 5G networks, which drive semiconductor consumption. Opportunities lie in the growing adoption of electric vehicles and the increasing deployment of renewable energy systems, both of which require sophisticated semiconductor solutions. Companies should focus on developing eco-friendly and cost-efficient materials to seize these opportunities, meeting the regulatory compliance of an increasingly eco-conscious market. However, the market also faces challenges such as high raw material costs, complex manufacturing processes, and stringent quality standards, which could limit growth potential.

In terms of innovation, exploring and developing advanced composite materials with superior thermal and electrical properties is promising. Additionally, research into nanotechnology and bio-based materials offers significant potential. Companies should invest in R&D for creating materials that allow for heterogeneous integration and support advanced packaging techniques like 3D stacking or system-in-package (SiP) architectures. The market is characterized by rapid technological change, making adaptability and continuous innovation crucial for maintaining competitive advantage. By focusing on sustainability, quality, and cost-effectiveness, businesses can position themselves to capitalize on the expanding semiconductor landscape.

Market Dynamics: Unveiling Key Market Insights in the Rapidly Evolving Semiconductor & IC Packaging Materials Market

The Semiconductor & IC Packaging Materials Market is undergoing transformative changes driven by a dynamic interplay of supply and demand factors. Understanding these evolving market dynamics prepares business organizations to make informed investment decisions, refine strategic decisions, and seize new opportunities. By gaining a comprehensive view of these trends, business organizations can mitigate various risks across political, geographic, technical, social, and economic domains while also gaining a clearer understanding of consumer behavior and its impact on manufacturing costs and purchasing trends.

  • Market Drivers
    • Rising demand for semiconductor and IC packaging materials for consumer electronics
    • Relentless advancement in technology supporting innovative packaging materials
    • Growing miniaturization and densification in electronic sector
  • Market Restraints
    • IP Concerns of semiconductor industry in outsourcing and testing
  • Market Opportunities
    • Integration with advance technologies
    • Adoption of 5G and autonomous vehicles
  • Market Challenges
    • Increasing environmental regulations regarding the use and disposal of materials

Porter's Five Forces: A Strategic Tool for Navigating the Semiconductor & IC Packaging Materials Market

Porter's five forces framework is a critical tool for understanding the competitive landscape of the Semiconductor & IC Packaging Materials Market. It offers business organizations with a clear methodology for evaluating their competitive positioning and exploring strategic opportunities. This framework helps businesses assess the power dynamics within the market and determine the profitability of new ventures. With these insights, business organizations can leverage their strengths, address weaknesses, and avoid potential challenges, ensuring a more resilient market positioning.

PESTLE Analysis: Navigating External Influences in the Semiconductor & IC Packaging Materials Market

External macro-environmental factors play a pivotal role in shaping the performance dynamics of the Semiconductor & IC Packaging Materials Market. Political, Economic, Social, Technological, Legal, and Environmental factors analysis provides the necessary information to navigate these influences. By examining PESTLE factors, businesses can better understand potential risks and opportunities. This analysis enables business organizations to anticipate changes in regulations, consumer preferences, and economic trends, ensuring they are prepared to make proactive, forward-thinking decisions.

Market Share Analysis: Understanding the Competitive Landscape in the Semiconductor & IC Packaging Materials Market

A detailed market share analysis in the Semiconductor & IC Packaging Materials Market provides a comprehensive assessment of vendors' performance. Companies can identify their competitive positioning by comparing key metrics, including revenue, customer base, and growth rates. This analysis highlights market concentration, fragmentation, and trends in consolidation, offering vendors the insights required to make strategic decisions that enhance their position in an increasingly competitive landscape.

FPNV Positioning Matrix: Evaluating Vendors' Performance in the Semiconductor & IC Packaging Materials Market

The Forefront, Pathfinder, Niche, Vital (FPNV) Positioning Matrix is a critical tool for evaluating vendors within the Semiconductor & IC Packaging Materials Market. This matrix enables business organizations to make well-informed decisions that align with their goals by assessing vendors based on their business strategy and product satisfaction. The four quadrants provide a clear and precise segmentation of vendors, helping users identify the right partners and solutions that best fit their strategic objectives.

Strategy Analysis & Recommendation: Charting a Path to Success in the Semiconductor & IC Packaging Materials Market

A strategic analysis of the Semiconductor & IC Packaging Materials Market is essential for businesses looking to strengthen their global market presence. By reviewing key resources, capabilities, and performance indicators, business organizations can identify growth opportunities and work toward improvement. This approach helps businesses navigate challenges in the competitive landscape and ensures they are well-positioned to capitalize on newer opportunities and drive long-term success.

Key Company Profiles

The report delves into recent significant developments in the Semiconductor & IC Packaging Materials Market, highlighting leading vendors and their innovative profiles. These include 3M Company, Advanced Semiconductor Engineering Inc, AMETEK Electronic Components & Packaging, Amtech Microelectronics, Inc., ASE Group, California Fine Wire Co., Canatu Oy, Ceramtec GmbH, Chipbond Technology Corporation, Chipmos Technologies Inc., Deca Technologies, FlipChip International LLC, Fujitsu Semiconductor Limited, Henkel AG & Co. KGaA, Intel Corporation, Interconnect Systems Inc. (ISI), Kyocera Chemical Corporation, Microchip Technology, Powertech Technology, Inc., Samsung Electronics Co. Ltd, Siemens AG, Sumitomo Chemical Co., Ltd., Taiwan Semiconductor Manufacturing Company, Tianshui Huatian Technology Co., Ltd., Toray Industries, Inc., Unisem Berhad, and UTAC Group.

Market Segmentation & Coverage

This research report categorizes the Semiconductor & IC Packaging Materials Market to forecast the revenues and analyze trends in each of the following sub-markets:

  • Based on Type, market is studied across Bonding wires, Ceramic Packages, Die Attach Materials, Encapsulation Resins, Leadframes, Organic substrate, Solder Balls, and Thermal Interface Materials.
  • Based on Technology, market is studied across Flip Chip, Grid Array, Quad Flat Package, and Small Outline Package.
  • Based on Packaging Technology, market is studied across 2.5D IC, 3D IC, Through-silicon Via, and Wafer-level Packaging.
  • Based on Application, market is studied across Aerospace & Defense, Automotive, Computing & Networking, Consumer Electronics, Healthcare, Industrial, and Telecommunications.
  • Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

The report offers a comprehensive analysis of the market, covering key focus areas:

1. Market Penetration: A detailed review of the current market environment, including extensive data from top industry players, evaluating their market reach and overall influence.

2. Market Development: Identifies growth opportunities in emerging markets and assesses expansion potential in established sectors, providing a strategic roadmap for future growth.

3. Market Diversification: Analyzes recent product launches, untapped geographic regions, major industry advancements, and strategic investments reshaping the market.

4. Competitive Assessment & Intelligence: Provides a thorough analysis of the competitive landscape, examining market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, and technological advancements of key players.

5. Product Development & Innovation: Highlights cutting-edge technologies, R&D activities, and product innovations expected to drive future market growth.

The report also answers critical questions to aid stakeholders in making informed decisions:

1. What is the current market size, and what is the forecasted growth?

2. Which products, segments, and regions offer the best investment opportunities?

3. What are the key technology trends and regulatory influences shaping the market?

4. How do leading vendors rank in terms of market share and competitive positioning?

5. What revenue sources and strategic opportunities drive vendors' market entry or exit strategies?

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Stakeholders

2. Research Methodology

  • 2.1. Define: Research Objective
  • 2.2. Determine: Research Design
  • 2.3. Prepare: Research Instrument
  • 2.4. Collect: Data Source
  • 2.5. Analyze: Data Interpretation
  • 2.6. Formulate: Data Verification
  • 2.7. Publish: Research Report
  • 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

  • 5.1. Market Dynamics
    • 5.1.1. Drivers
      • 5.1.1.1. Rising demand for semiconductor and IC packaging materials for consumer electronics
      • 5.1.1.2. Relentless advancement in technology supporting innovative packaging materials
      • 5.1.1.3. Growing miniaturization and densification in electronic sector
    • 5.1.2. Restraints
      • 5.1.2.1. IP Concerns of semiconductor industry in outsourcing and testing
    • 5.1.3. Opportunities
      • 5.1.3.1. Integration with advance technologies
      • 5.1.3.2. Adoption of 5G and autonomous vehicles
    • 5.1.4. Challenges
      • 5.1.4.1. Increasing environmental regulations regarding the use and disposal of materials
  • 5.2. Market Segmentation Analysis
    • 5.2.1. Type: Suitability of ceramic packages for high-performance and high-reliability applications
    • 5.2.2. Applications: Evolving usage of the semiconductor and integrated circuit (IC) packaging materials across the automotive sector
  • 5.3. Porter's Five Forces Analysis
    • 5.3.1. Threat of New Entrants
    • 5.3.2. Threat of Substitutes
    • 5.3.3. Bargaining Power of Customers
    • 5.3.4. Bargaining Power of Suppliers
    • 5.3.5. Industry Rivalry
  • 5.4. PESTLE Analysis
    • 5.4.1. Political
    • 5.4.2. Economic
    • 5.4.3. Social
    • 5.4.4. Technological
    • 5.4.5. Legal
    • 5.4.6. Environmental

6. Semiconductor & IC Packaging Materials Market, by Type

  • 6.1. Introduction
  • 6.2. Bonding wires
  • 6.3. Ceramic Packages
  • 6.4. Die Attach Materials
  • 6.5. Encapsulation Resins
  • 6.6. Leadframes
  • 6.7. Organic substrate
  • 6.8. Solder Balls
  • 6.9. Thermal Interface Materials

7. Semiconductor & IC Packaging Materials Market, by Technology

  • 7.1. Introduction
  • 7.2. Flip Chip
  • 7.3. Grid Array
  • 7.4. Quad Flat Package
  • 7.5. Small Outline Package

8. Semiconductor & IC Packaging Materials Market, by Packaging Technology

  • 8.1. Introduction
  • 8.2. 2.5D IC
  • 8.3. 3D IC
  • 8.4. Through-silicon Via
  • 8.5. Wafer-level Packaging

9. Semiconductor & IC Packaging Materials Market, by Application

  • 9.1. Introduction
  • 9.2. Aerospace & Defense
  • 9.3. Automotive
  • 9.4. Computing & Networking
  • 9.5. Consumer Electronics
  • 9.6. Healthcare
  • 9.7. Industrial
  • 9.8. Telecommunications

10. Americas Semiconductor & IC Packaging Materials Market

  • 10.1. Introduction
  • 10.2. Argentina
  • 10.3. Brazil
  • 10.4. Canada
  • 10.5. Mexico
  • 10.6. United States

11. Asia-Pacific Semiconductor & IC Packaging Materials Market

  • 11.1. Introduction
  • 11.2. Australia
  • 11.3. China
  • 11.4. India
  • 11.5. Indonesia
  • 11.6. Japan
  • 11.7. Malaysia
  • 11.8. Philippines
  • 11.9. Singapore
  • 11.10. South Korea
  • 11.11. Taiwan
  • 11.12. Thailand
  • 11.13. Vietnam

12. Europe, Middle East & Africa Semiconductor & IC Packaging Materials Market

  • 12.1. Introduction
  • 12.2. Denmark
  • 12.3. Egypt
  • 12.4. Finland
  • 12.5. France
  • 12.6. Germany
  • 12.7. Israel
  • 12.8. Italy
  • 12.9. Netherlands
  • 12.10. Nigeria
  • 12.11. Norway
  • 12.12. Poland
  • 12.13. Qatar
  • 12.14. Russia
  • 12.15. Saudi Arabia
  • 12.16. South Africa
  • 12.17. Spain
  • 12.18. Sweden
  • 12.19. Switzerland
  • 12.20. Turkey
  • 12.21. United Arab Emirates
  • 12.22. United Kingdom

13. Competitive Landscape

  • 13.1. Market Share Analysis, 2023
  • 13.2. FPNV Positioning Matrix, 2023
  • 13.3. Competitive Scenario Analysis
    • 13.3.1. Amkor and Apple Forge Strategic Alliance to Build Largest Advanced Semiconductor Packaging Facility
    • 13.3.2. Resonac Sets Foundation for Semiconductor Innovation with New Packaging Solution Center in Silicon Valley
    • 13.3.3. Strategic Expansion and Innovation in Semiconductor Packaging
  • 13.4. Strategy Analysis & Recommendation

Companies Mentioned

  • 1. 3M Company
  • 2. Advanced Semiconductor Engineering Inc
  • 3. AMETEK Electronic Components & Packaging
  • 4. Amtech Microelectronics, Inc.
  • 5. ASE Group
  • 6. California Fine Wire Co.
  • 7. Canatu Oy
  • 8. Ceramtec GmbH
  • 9. Chipbond Technology Corporation
  • 10. Chipmos Technologies Inc.
  • 11. Deca Technologies
  • 12. FlipChip International LLC
  • 13. Fujitsu Semiconductor Limited
  • 14. Henkel AG & Co. KGaA
  • 15. Intel Corporation
  • 16. Interconnect Systems Inc. (ISI)
  • 17. Kyocera Chemical Corporation
  • 18. Microchip Technology
  • 19. Powertech Technology, Inc.
  • 20. Samsung Electronics Co. Ltd
  • 21. Siemens AG
  • 22. Sumitomo Chemical Co., Ltd.
  • 23. Taiwan Semiconductor Manufacturing Company
  • 24. Tianshui Huatian Technology Co., Ltd.
  • 25. Toray Industries, Inc.
  • 26. Unisem Berhad
  • 27. UTAC Group

LIST OF FIGURES

  • FIGURE 1. SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET RESEARCH PROCESS
  • FIGURE 2. SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, 2023 VS 2030
  • FIGURE 3. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, 2018-2030 (USD MILLION)
  • FIGURE 4. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY REGION, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 5. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 6. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2023 VS 2030 (%)
  • FIGURE 7. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 8. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2023 VS 2030 (%)
  • FIGURE 9. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 10. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2023 VS 2030 (%)
  • FIGURE 11. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 12. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2023 VS 2030 (%)
  • FIGURE 13. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 14. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 15. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 16. UNITED STATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY STATE, 2023 VS 2030 (%)
  • FIGURE 17. UNITED STATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY STATE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 18. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 19. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 20. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 21. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 22. SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SHARE, BY KEY PLAYER, 2023
  • FIGURE 23. SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, FPNV POSITIONING MATRIX, 2023

LIST OF TABLES

  • TABLE 1. SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SEGMENTATION & COVERAGE
  • TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2023
  • TABLE 3. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, 2018-2030 (USD MILLION)
  • TABLE 4. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 5. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 6. SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET DYNAMICS
  • TABLE 7. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 8. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY BONDING WIRES, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 9. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY CERAMIC PACKAGES, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 10. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIE ATTACH MATERIALS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 11. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ENCAPSULATION RESINS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 12. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LEADFRAMES, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 13. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ORGANIC SUBSTRATE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 14. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SOLDER BALLS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 15. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY THERMAL INTERFACE MATERIALS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 16. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 17. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY FLIP CHIP, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 18. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY GRID ARRAY, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 19. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY QUAD FLAT PACKAGE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 20. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SMALL OUTLINE PACKAGE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 21. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 22. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY 2.5D IC, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 23. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY 3D IC, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 24. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY THROUGH-SILICON VIA, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 25. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY WAFER-LEVEL PACKAGING, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 26. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 27. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY AEROSPACE & DEFENSE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 28. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY AUTOMOTIVE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 29. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COMPUTING & NETWORKING, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 30. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 31. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY HEALTHCARE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 32. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY INDUSTRIAL, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 33. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TELECOMMUNICATIONS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 34. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 35. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 36. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 37. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 38. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 39. ARGENTINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 40. ARGENTINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 41. ARGENTINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 42. ARGENTINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 43. BRAZIL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 44. BRAZIL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 45. BRAZIL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 46. BRAZIL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 47. CANADA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 48. CANADA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 49. CANADA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 50. CANADA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 51. MEXICO SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 52. MEXICO SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 53. MEXICO SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 54. MEXICO SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 55. UNITED STATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 56. UNITED STATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 57. UNITED STATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 58. UNITED STATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 59. UNITED STATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY STATE, 2018-2030 (USD MILLION)
  • TABLE 60. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 61. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 62. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 63. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 64. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 65. AUSTRALIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 66. AUSTRALIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 67. AUSTRALIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 68. AUSTRALIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 69. CHINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 70. CHINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 71. CHINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 72. CHINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 73. INDIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 74. INDIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 75. INDIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 76. INDIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 77. INDONESIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 78. INDONESIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 79. INDONESIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 80. INDONESIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 81. JAPAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 82. JAPAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 83. JAPAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 84. JAPAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 85. MALAYSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 86. MALAYSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 87. MALAYSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 88. MALAYSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 89. PHILIPPINES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 90. PHILIPPINES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 91. PHILIPPINES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 92. PHILIPPINES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 93. SINGAPORE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 94. SINGAPORE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 95. SINGAPORE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 96. SINGAPORE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 97. SOUTH KOREA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 98. SOUTH KOREA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 99. SOUTH KOREA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 100. SOUTH KOREA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 101. TAIWAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 102. TAIWAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 103. TAIWAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 104. TAIWAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 105. THAILAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 106. THAILAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 107. THAILAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 108. THAILAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 109. VIETNAM SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 110. VIETNAM SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 111. VIETNAM SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 112. VIETNAM SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 113. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 114. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 115. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 116. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 117. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 118. DENMARK SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 119. DENMARK SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 120. DENMARK SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 121. DENMARK SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 122. EGYPT SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 123. EGYPT SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 124. EGYPT SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 125. EGYPT SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 126. FINLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 127. FINLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 128. FINLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 129. FINLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 130. FRANCE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 131. FRANCE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 132. FRANCE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 133. FRANCE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 134. GERMANY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 135. GERMANY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 136. GERMANY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 137. GERMANY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 138. ISRAEL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 139. ISRAEL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 140. ISRAEL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 141. ISRAEL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 142. ITALY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 143. ITALY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 144. ITALY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 145. ITALY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 146. NETHERLANDS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 147. NETHERLANDS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 148. NETHERLANDS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 149. NETHERLANDS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 150. NIGERIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 151. NIGERIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 152. NIGERIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 153. NIGERIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 154. NORWAY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 155. NORWAY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 156. NORWAY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 157. NORWAY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 158. POLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 159. POLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 160. POLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 161. POLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 162. QATAR SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 163. QATAR SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 164. QATAR SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 165. QATAR SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 166. RUSSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 167. RUSSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 168. RUSSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 169. RUSSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 170. SAUDI ARABIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 171. SAUDI ARABIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 172. SAUDI ARABIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 173. SAUDI ARABIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 174. SOUTH AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 175. SOUTH AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 176. SOUTH AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 177. SOUTH AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 178. SPAIN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 179. SPAIN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 180. SPAIN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 181. SPAIN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 182. SWEDEN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 183. SWEDEN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 184. SWEDEN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 185. SWEDEN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 186. SWITZERLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 187. SWITZERLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 188. SWITZERLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 189. SWITZERLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 190. TURKEY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 191. TURKEY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 192. TURKEY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 193. TURKEY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 194. UNITED ARAB EMIRATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 195. UNITED ARAB EMIRATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 196. UNITED ARAB EMIRATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 197. UNITED ARAB EMIRATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 198. UNITED KINGDOM SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 199. UNITED KINGDOM SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 200. UNITED KINGDOM SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 201. UNITED KINGDOM SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 202. SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SHARE, BY KEY PLAYER, 2023
  • TABLE 203. SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, FPNV POSITIONING MATRIX, 2023