与数据中心的铜缆和光纤连接
市场调查报告书
商品编码
1103082

与数据中心的铜缆和光纤连接

Copper and Fiber Connectivity in the Data Center

出版日期: | 出版商: Bishop & Associates, Inc. | 英文 275 Pages | 商品交期: 请询问到货日

价格
简介目录

报告摘要

快速铜缆和光纤互连支持对更高带宽、信号完整性、更长距离和更高面板密度的不断增长的需求,同时降低总系统功耗和成本。那么它是如何发展的?

  • 哪些应用继续推动对数据中心容量和速度的迫切需求?有源光缆是铜缆和光纤网络之间的长期解决方案还是过渡工具?热管理问题如何影响 I/O 连接器的选择?
  • 正在开发和正在开发哪些新的光纤连接器以支持许多新的光链路应用?谁是开发这些的製造商以及这些接口的主要特性是什么?
  • 你是否达到了基础技术的极限?什么是联合封装光学器件 (CPO),这种方法如何影响功耗?面板密度是多少?
  • 当前的可插拔光模块如何改变了市场?使用可插拔有什么好处?
  • 使用铜有哪些电气和机械限制?电缆的重量和体积如何影响重量和成本?

Bishop & Associates 的最新研究报告“数据中心的铜和光纤连接”将是此类接口市场重大演变的第一步。要准备了解此内容,请订阅购入数据中心的铜缆和光纤连接。

其他详情

数据中心从最初作为计算和存储硬件中心位置的概念转变为今天的数据中心,即连接数字生活几乎所有方面的中心。我长大了。数据中心已经从与世界隔离的单客户端本地设施发展为拥有数千台服务器的多英亩超大规模设施,这些服务器充当连接到世界的高速网络中的节点。

在过去的三十年里,包括虚拟化在内的大量新计算技术被引入,以实现动态适应以支持不断变化的资源需求。随着互联网的普及,数以百万计的应用程序,以及流媒体视频的出现,互联网流量达到了巨大的水平。向软件定义和託管数据中心的转变使现代数据中心基础设施更加高效,并彻底改变了云计算和边缘计算,但它需要在不久的将来支持预期的工作负载,它仍处于起步阶段。在不久的将来,人工智能、全自动运输、8K 影像、工业 4.0 和人工现实等新技术将会出现,这将需要以接近零延迟的方式提供令人难以置信的计算能力。元界对数据中心流量水平的潜在需求是不可想像的。全球数据中心网路基础设施需要有效地支持这些需求,同时应对诸如降低功率和热量、提高可靠性和确保绝对安全性等挑战。高速数据链路,包括铜缆和光纤,将在实现这些目标方面发挥重要作用。

自数据中心诞生以来,基于铜的电路一直是高速电子信号的主要介质。多年来,印刷电路板 (PCB)、电线和电缆组件中的铜导体具有良好的可靠性记录。这项技术发展良好,拥有数十年的製造经验,可从世界各地的供应商处获得。

光纤具有多种技术优势,例如近乎无限的宽频、低信号损耗和长距离失真、减小尺寸和体积,以及与电磁干扰 (EMI) 和静电放电 (ESD) 隔离。我有。早期的玻璃纤维极其脆弱、难以终止且成本高昂。在链路两端执行电光转换过程所需的组件增加了功率和热量预算,占用了宝贵的空间并增加了成本。光纤链路填补了从数百到数千英里的长距离通信应用的有限利基。使用这种长度的铜线需要昂贵的放大器,这是不实用的,尤其是对于海底电缆。

除了数据中心之外,光纤的新用途最初将集中在特定行业,例如高性能计算 (HPC)、军事和航空设备。凭藉经验和较低的组件价格,商业化可以将光纤转移到更主流的设备上,包括嵌入式计算机。光纤到户 (FTTH) 已经为数百万居民提供了带宽增加的好处。未来,光纤可能会成为高速住宅数据传输的通用主干,就像过去家庭和办公室使用以太网电缆连接一样。

本市场研究报告确定并比较了在传统上使用铜电路的一系列应用中考虑的光纤通信的主要趋势。了解连接器和传输技术等光学硬件的进步,以及未来的进步将如何使我们能够满足不断变化的网络流量需求。

长期以来,人们一直预测铜电路的废除和光纤的替代今天仍在继续,但随着带宽需求的增加,光通信对于日益增加的应用来说是一种具有成本效益的替代方案。将继续提供这种手段。

目录

第 1 章-调查范围及调查方法

  • 报告的目的
  • 报告您调查的问题
  • 调查方法和途径

第 2 章-执行摘要

  • 执行摘要

第 3 章-简介

  • 铜线的优越性
  • 信号调理技术
  • 先进的调製技术
  • 渠道建模与仿真
  • 铜电路限制
  • 光纤替代品
  • 可插拔光模块
  • 联合封装光学器件 (CPO)
  • 摩尔定律的终结和香农的极限
  • 新型光连接器进入市场

第 4 章-数据中心架构

  • 概览
  • 基本数据中心架构
  • 云端数据中心
  • 边缘计算的兴起
  • 不断发展的数据中心趋势
  • 分解网路
  • 分布式网路
  • 改变数据流向
  • 数据中心架构“扁平化”
  • 电信网路架构
  • 数据中心面临的挑战

第 5 章 - 数据中心增长的驱动力

  • 数据中心增长的驱动力
  • 移动设备的快速增长
  • COVID19 世界病毒大流行
  • 云计算
  • 边缘计算
  • 物联网 (IoT)
  • 工业物联网(工业4.0)
  • 增强现实/虚拟现实
  • 传感器浪涌
  • 5G 蜂窝通信
  • 增强宽带可用性
  • 人工智能
  • 支持下一代交换机和路由器的功能
  • 自动驾驶
  • 远程医疗监控和诊断
  • 节能
  • 现在增加容量很重要

第 6 章-高速铜连接器

  • 高速铜连接器

第 7 章-启用高速铜连接

  • 启用高速铜线连接
  • 高级信号调理
  • 高速信号测量与验证
  • 散射参数
  • 先进的信号调製技术

第 8 章-高级光纤连接器

  • 先进的光纤连接器
  • 多纤连接器

第 9 章-启用高速□□/电容式光纤连接

  • 实现高速/大容量光纤连接
  • 多芯光纤
  • 并行光纤链路
  • 波分复用
  • 相干检测
  • 以太网
  • OIF 实施合同
  • COBO

第 10 章-高级光纤

  • 光纤传输基础

第 11 章-铜线和光互连标准

  • 主要铜线和光通信标准组织
  • Standards Organizations
  • Ethernet
  • Institute of Electrical and Electronics Engineers (IEEE)
  • Optical Internetworking Forum (OIF)
  • InfiniBand Trade Association
  • Ethernet Technology Consortium
  • Fibre Channel Industry Association (FCIA)
  • PCI-SIG
  • Small Form Factor Committee
  • "Open" Standards Organizations
  • Open ZR+ Multisource Agreement (MSA)
  • Open ROADM MSA
  • Gen-Z Consortium
  • Consortium for On-Board Optics (COBO)
  • Open Compute Project
  • Open 19 Foundation
  • Open Power Foundation
  • The Open Disaggregated Transport Network Foundation Project
  • 800G Pluggable MSA
  • Open EYE Consortium (Open EYE MSA)
  • Open XR Forum
  • Additional Standards Organizations Include
  • Continuous-Wave Division Multiplexing MSA
  • Terabit BIDI MSA
  • Universal Chiplet Interconnect Express (UCIe)

第 12 章-可插拔光收发器

  • 为什么是可插拔的?
  • 小型可插拔的演进
  • 电源/热管理
  • 提高能源效率
  • 相干光端机

第 13 章-Box 中的电气和光学连接

  • 替代铜解决方案
  • 不断发展的板载光学引擎架构

第 14 章-市场统计

  • 简介
  • 2019-2020 年用于计算机市场的世界上最快的铜端接连接器
  • 2020-2021年用于计算机市场的世界高速铜端接连接器
  • 2021-2022F计算机市场使用的世界高速铜端接连接器
  • 世界高速铜端接连接器应用于电脑市场2022-2027F,5年CAGR
  • 2019-2020年用于电信/数据通信市场的全球高速铜端接连接器
  • 用于电信/数据通信市场的全球高速铜端接连接器 2020-2021
  • 用于电信/数据通信市场的全球高速铜端接连接器 2021-2022
  • 全球用于电信/数据通信市场的高速铜端接连接器2022-2027F,5年CAGR
  • 2019-2020 年用于计算机和电信/数据通信市场的全球高速铜端接连接器
  • 2020-2021 年用于计算机和电信/数据通信市场的全球高速铜端接连接器
  • 用于计算机和电信/数据通信市场的全球高速铜端接连接器 2021-2022F
  • 全球高速铜端接连接器2022F-2027F用于计算机和电信/数据通信市场,5年CAGR
  • 2019-2020年全球计算机市场使用的高速光纤端接连接器
  • 2020-2021 年全球计算机市场使用的高速光纤端接连接器
  • 2021年至2022年计算机市场使用的全球高速光纤端接连接器
  • 全球计算机市场使用的高速光纤端接连接器2022-2027F,5年CAGR
  • 2019-2020年用于电信/数据通信市场的全球高速光纤端接连接器
  • 2020-2021 年用于电信/数据通信市场的全球高速光纤端接连接器
  • 2021 年至 2022 年用于电信/数据通信市场的全球高速光纤端接连接器
  • 全球电信/数据通信市场使用的高速光纤端接连接器 2022-2027F,5年CAGR
  • 2019-2020 年用于计算机和电信/数据通信市场的全球高速光纤端接连接器
  • 2020-2021 年用于计算机和电信/数据通信市场的全球高速光纤端接连接器
  • 用于计算机和电信/数据通信市场的全球高速光纤端接连接器 2021-2022F
  • 全球高速光纤端接连接器2022F-2027F用于计算机和电信/数据通信市场,5年CAGR
  • 2019-2020 年用于区域计算机市场的全球高速电缆组件
  • 世界上最快的用于计算机的电缆组件
  • 2020-2021 年区域市场
  • Region 2021-2022F 世界高速电缆组件用于另一个计算机市场
  • 区域 2022F-2027F,全球高速电缆组件用于计算机市场 5 年 CAGR
  • 2019-2020 年用于区域电信/数据通信市场的全球高速电缆组件
  • 2020-2021 年用于区域电信/数据通信市场的全球高速电缆组件
  • 用于区域电信/数据通信市场的全球高速电缆组件 2021-2022F
  • 用于区域电信/数据通信市场的全球高速电缆组件 2022F-2027F,5 年復合增长率
  • 2019-2020 年用于区域计算机和电信/数据通信市场的全球高速电缆组件
  • 2020-2021 年用于区域计算机和电信/数据通信市场的全球高速电缆组件
  • 用于区域计算机和电信/数据通信市场的全球高速电缆组件 2021-2022F
  • 全球高速电缆组件 2022F-2027F 用于区域计算机和电信/数据通信市场,5 年復合增长率

第 15 章-主要发现和结论

简介目录
Product Code: P-675-22

Report Summary:

How are high-speed copper and fiber optic interconnect continuing to evolve to support ever-increasing demand for higher bandwidth, signal integrity, longer reach, and increased face plate density while reducing total system power consumption and cost?

  • What applications will continue to drive exponential demand for data center capacity and speed? Are active optical cables a long-term solution or a transitional tool between copper and fiber networks? How do thermal management issues impact I/O connector selection?
  • What new fiber optic connectors have, or are being developed, to support the many new applications for optical links? Who are the manufacturers developing these and what key features do these interfaces incorporate?
  • Have we reached basic technology limits? What is co-packaged optics (CPO) and how does this approach affect power consumption? Panel density?
  • How have the current iterations of pluggable optical transceivers changed the market? What are the advantages of using pluggables?
  • What are some of the electrical and mechanical limitations associated with using copper? How does cable weight and bulk affect things like weight and cost?

Bishop & Associates' newest research report, ‘ ’Copper and Fiber Connectivity in the Data Center’ looks at what maybe the first steps of a major evolutionary change in the market for this class of interfaces. Be prepared for these steps. Order your copy of Copper and Fiber Connectivity in the Data Center.

Additional Details:

The data center has grown from its original concept as a central location for computing and storage hardware to the data center of today that is at the epicenter of connection of nearly every aspect of our digitized lives. Data centers have evolved from single client on-premises facilities that were isolated from the world to multi-acre hyperscale facilities that contain thousands of servers and act as nodes in a globally connected high-speed network.

The past 30 years have seen massive adoption of new computing technologies including virtualization that enabled dynamic adaptation to support constantly changing resource demands. Widespread adoption of the Internet and the literally millions of subsequent applications together with the advent of streaming video has driven Internet traffic to incredible levels. The transition to software defined and managed data centers increased the efficiency of modern data center infrastructure and ushered in the cloud and edge computing revolution, but we are only at an early stage in what will be required to support the workload expected in the near future. Looming on the horizon are emerging technologies including artificial intelligence, fully autonomous transportation, 8K video, Industry 4.0, and artificial reality that will demand incredible computing power delivered with nearly zero latency. The potential demands that the metaverse could add to the level of data center traffic is unimaginable. The infrastructure of the global data center network will be tasked with efficiency supporting these demands while addressing challenges in power and heat reduction, and improved reliability, while assuring absolute security. High-speed data links, both copper and fiber optic will play critical roles in achieving each of these objectives.

Copper based circuits have been the primary media choice for high-speed electronic signals within the data center since its beginning years. Copper conductors in printed circuit boards (PCB), wire and cable assemblies have a proven track record of reliability over many years. The technology is well developed and supported with decades of manufacturing experience available from a universe of global vendors.

Fiber offers multiple technical advantages including, near unlimited bandwidth, low signal loss and distortion over long distances, reduced size and bulk, as well as isolation from electromagnetic interference (EMI) and electrostatic discharge (ESD). Early glass fiber was extremely fragile, difficult to terminate and costly. Components required to perform the electro-optic conversion process at both ends of a link added to the power and heat budget, consumed valuable space as well as added cost. Fiber optic links filled a limited niche in long-haul telecommunication applications that could extend for hundreds or thousands of miles. To use copper cables in lengths that long would require many expensive amplifiers, making copper impractical especially in undersea cables.

In addition to the data center, emerging applications of fiber will initially be concentrated in select industries including high performance computing (HPC), military, and avionic. As experience is gained and component prices decline, commercialization will allow the migration of fiber into more mainstream equipment including embedded computers. Fiber to the home (FTTH) has already brought the advantages of increased bandwidth to millions of residents. It is possible in the future that as homes and offices in the past were wired with Ethernet cable, fiber will become a universal backbone of high-speed residential data distribution in the future.

This market research report identifies and compares the leading trends that are driving the consideration of fiber optic communication in an expanding range of applications that have traditionally been served by copper electrical circuits. Advances in optical hardware including connectors as well as transmission technology is discussed along with how future advances will enable support of evolving network traffic demands.

The long-predicted demise and replacement of copper circuitry by fiber optic alternatives, remains just that, but as bandwidth demands continue to rise, optical transmission will continue to offer a cost-effective alternative in a gradually increasing number of applications.

Table of Contents

Chapter 1 - Report Scope and Methodology

  • Report Objectives
  • Report Issues Explored
  • Methodology and Approach

Chapter 2 - Executive Summary

  • Executive Summary

Chapter 3 - Introduction

  • Dominance of Copper Interconnects
  • Signal Conditioning Technology
  • Advanced Modulation Technology
  • Channel Modeling and Simulation
  • Limitations of Copper Circuits
  • The Fiber Optic Alternative
  • Pluggable Optical Transceivers
  • Co-Packaged Optics (CPO)
  • The End of Moore's Law and the Shannon Limit
  • New Optical Connectors Entering the Market

Chapter 4 - Data Center Architecture

  • Overview
  • Basic Data Center Architecture
  • Cloud Data Centers
  • The Rise of Edge Computing
  • Evolving Data Center Trends
  • Disaggregated Networks
  • Distributed Networks
  • Data Flow Direction Change
  • "Flattening" of Data Center Architecture
  • Telecom Network Architecture
  • Challenges Facing Data Centers

Chapter 5 - Drivers of Data Center Growth

  • Drivers of Data Center Growth
  • Proliferation of Mobile Devices
  • COVID 19 Global Virus Pandemic
  • Cloud Computing
  • Edge Computing
  • Internet of Things (IoT)
  • Industrial Internet of Things (Industry 4.0)
  • Augmented Reality / Virtual Reality
  • Proliferation of Sensors
  • 5G Cellular Communications
  • Expanded Broadband Availability
  • Artificial Intelligence
  • Ability to Support Next Generation Switches and Routers
  • Autonomous Transportation
  • Remote Healthcare Monitoring and Diagnostics
  • Energy Reduction
  • Imperative to Increase Capacity Now

Chapter 6 - High-Speed Copper Connectors

  • High-Speed Copper Connectors

Chapter 7 - Enabling High-Speed Copper Connectivity

  • Enabling High-Speed Copper Connectivity
  • Advanced Signal Conditioning
  • High-Speed Signal Measurement and Verification
  • Scattering Parameters
  • Advanced Signal Modulation Techniques

Chapter 8 - Advanced Fiber Optic Connectors

  • Advanced Fiber Optic Connectors
  • Multi-Fiber Connectors

Chapter 9 - Enabling High-Speed / Capacity Fiber Optic Connectivity

  • Enabling High-Speed / Capacity Fiber Optic Connectivity
  • Multicore Fiber
  • Parallel Fiber Links
  • Wavelength Division Multiplexing
  • Coherent Detection
  • Ethernet
  • OIF Implementation Agreements
  • COBO

Chapter 10 - Advanced Optical Fiber

  • Basics of Fiber Optic Transmission

Chapter 11 - Copper and Optical Interconnect Standards

  • Major Copper and Optical Communication Standards Organizations
  • Ethernet
  • Institute of Electrical and Electronics Engineers (IEEE)
  • Optical Internetworking Forum (OIF)
  • InfiniBand Trade Association
  • Ethernet Technology Consortium
  • Fibre Channel Industry Association (FCIA)
  • PCI-SIG
  • Small Form Factor Committee
  • "Open" Standards Organizations
  • Open ZR+ Multisource Agreement (MSA)
  • Open ROADM MSA
  • Gen-Z Consortium
  • Consortium for On-Board Optics (COBO)
  • Open Compute Project
  • Open 19 Foundation
  • Open Power Foundation
  • The Open Disaggregated Transport Network Foundation Project
  • 800G Pluggable MSA
  • Open EYE Consortium (Open EYE MSA)
  • Open XR Forum
  • Additional Standards Organizations Include
  • Continuous-Wave Division Multiplexing MSA
  • Terabit BIDI MSA
  • Universal Chiplet Interconnect Express (UCIe)

Chapter 12 - Pluggable Optical Transceivers

  • Why Pluggables?
  • Evolution of Small Form Factor Pluggables
  • Power / Thermal Management
  • Increased Energy Efficiency
  • Coherent Optical Transceivers

Chapter 13 - Electrical and Optical Connectivity Inside the Box

  • Alternative Copper Solutions
  • Evolving On-Board Optical Engine Architecture

Chapter 14 - Market Statistics

  • Introduction
  • World High-Speed Copper Terminated Connectors Used in the Computer Market 2019-2020
  • World High-Speed Copper Terminated Connectors Used in the Computer Market 2020-2021
  • World High-Speed Copper Terminated Connectors Used in the Computer Market 2021-2022F
  • World High-Speed Copper Terminated Connectors Used in the Computer Market 2022F-2027F with 5-Year CAGR
  • World High-Speed Copper Terminated Connectors Used in the Telecom/Datacom Market 2019-2020
  • World High-Speed Copper Terminated Connectors Used in the Telecom/Datacom Market 2020-2021
  • World High-Speed Copper Terminated Connectors Used in the Telecom/Datacom Market 2021-2022
  • World High-Speed Copper Terminated Connectors Used in the Telecom/Datacom Market 2022F-2027F with 5-Year CAGR
  • World High-Speed Copper Terminated Connectors Used in the Computer & Telecom/Datacom Market 2019-2020
  • World High-Speed Copper Terminated Connectors Used in the Computer & Telecom/Datacom Market 2020-2021
  • World High-Speed Copper Terminated Connectors Used in the Computer & Telecom/Datacom Market 2021-2022F
  • World High-Speed Copper Terminated Connectors Used in the Computer & Telecom/Datacom Market 2022F- 2027F with 5-Year CAGR
  • World High-Speed Fiber Terminated Connectors Used in the Computer Market 2019 - 2020
  • World High-Speed Fiber Terminated Connectors Used in the Computer Market 2020 - 2021
  • World High-Speed Fiber Terminated Connectors Used in the Computer Market 2021 - 2022F
  • World High-Speed Fiber Terminated Connectors Used in the Computer Market 2022F - 2027F with 5-Year CAGR
  • World High-Speed Fiber Terminated Connectors Used in the Telecom/Datacom Market 2019 - 2020
  • World High-Speed Fiber Terminated Connectors Used in the Telecom/Datacom Market 2020 - 2021
  • World High-Speed Fiber Terminated Connectors Used in the Telecom/Datacom Market 2021 - 2022F
  • World High-Speed Fiber Terminated Connectors Used in the Telecom/Datacom Market 2022F - 2027F with 5-Year CAGR
  • World High-Speed Fiber Terminated Connectors Used in the Computer & Telecom/Datacom Market 2019 - 2020
  • World High-Speed Fiber Terminated Connectors Used in the Computer & Telecom/Datacom Market 2020 - 2021
  • World High-Speed Fiber Terminated Connectors Used in the Computer & Telecom/Datacom Market 2021 - 2022F
  • World High-Speed Fiber Terminated Connectors Used in the Computer & Telecom/Datacom Market 2022F - 2027F with 5-Year CAGR
  • World High-Speed Cable Assemblies Used in the Computer Market by Region 2019 - 2020
  • World High-Speed Cable Assemblies Used in the Computer
  • Market by Region 2020 - 2021
  • World High-Speed Cable Assemblies Used in the Computer Market by Region 2021 - 2022F
  • World High-Speed Cable Assemblies Used in the Computer Market by Region 2022F - 2027F with 5-Year CAGR
  • World High-Speed Cable Assemblies Used in the Telecom/Datacom Market by Region 2019 - 2020
  • World High-Speed Cable Assemblies Used in the Telecom/Datacom Market by Region 2020 - 2021
  • World High-Speed Cable Assemblies Used in the Telecom/Datacom Market by Region 2021 - 2022F
  • World High-Speed Cable Assemblies Used in the Telecom/Datacom Market by Region 2022F - 2027F with 5-Year CAGR
  • World High-Speed Cable Assemblies Used in the Computer & Telecom/Datacom Market by Region 2019 - 2020
  • World High-Speed Cable Assemblies Used in the Computer & Telecom/Datacom Market by Region 2020 - 2021
  • World High-Speed Cable Assemblies Used in the Computer & Telecom/Datacom Market by Region 2021 - 2022F
  • World High-Speed Cable Assemblies Used in the Computer & Telecom/Datacom Market by Region 2022F - 2027F with 5-Year CAGR

Chapter 15 - Major Findings and Conclusions