半导体组装和检测服务市场：按服务、封装解决方案、应用、区域-规模、份额、展望、机会分析，2023-2030 年

预计2023年全球半导体封装与测试服务市场规模为334.2亿美元，预计2030年将达到488.1亿美元，预测期（2023-2030）的复合年增长率为5.6%。

半导体、微电路和微晶片的製造需要在製造/加工区域内保持极其精确的条件。 半导体製造和加工通常使用吸湿元件，这些元件对高湿度高度敏感。 在半导体和积体电路的製造过程中，组装区域的湿度过高会对键结过程产生不利影响并导致故障。 在蚀刻电路线之前，它们会被一种称为光致抗蚀剂的光敏聚合物化合物覆盖。 光致抗蚀剂具有吸湿性，会吸收水分，透过切割或桥接微小电路线而导致电路故障。

市场动态

由于技术进步，对消费性电子产品的需求不断增长，正在推动全球半导体组装和测试服务市场的成长。 手机和平板设备的快速发展是半导体组装和测试服务（SATS）的潜在市场之一。 预计移动性的增加和数位内容的增加将在预测期内推动全球半导体组装和检查服务市场的成长。 下一代汽车对采用电子元件、提高车辆安全性的系统和管理系统的汽车电子产品的需求不断增长，正在推动全球半导体组装和检查服务市场的成长。 导航、混合动力电动驱动器和 LED 领域越来越多地采用最新技术，为该市场创造了需求。

本研究的主要特点

• 本报告详细分析了以 2022 年为基准年的全球半导体组装和检测服务市场规模以及预测期内（2023-2030 年）的复合年增长率。
• 它揭示了各个细分市场的潜在收入机会，并为该市场提供了一系列有吸引力的投资建议。
• 它还提供了有关市场驱动因素、限制因素、机会、新产品发布和批准、区域前景、主要市场参与者采取的竞争策略等的重要见解。
• 根据公司概况、绩效、产品组合、地理分布、市值、主要发展、策略和未来计划等参数，对全球半导体组装和检测服务市场的主要参与者进行分析。
• 本调查涵盖的公司包括 ASE Group, Powertech Technology Inc., Global Foundries Inc., Amkor Technology Inc., CORWIL Technology Corp., Integrated Microelectronics Inc.（Psi Technologies Inc.）, STATS chipPAC Ltd.（JCET）, Chipbond Technology Corporation, and Silicon Precision Industries Company Ltd.
• 该报告的见解使公司行销人员和高阶主管能够就未来的产品发布、产品升级、市场扩张和行销策略做出明智的决策。
• 本研究报告针对该产业的各个利害关係人，包括投资者、供应商、託管服务提供者、第三方服务提供者、经销商、新进业者和加值经销商。
• 利害关係人可以透过用于分析全球半导体组装和检测服务市场的各种策略矩阵来促进决策。

目录

第一章研究目的与前提

• 研究目的
• 先决条件
• 缩写

第二章市场概述

• 报告摘要
  • 市场定义和范围
• 执行摘要
• 连贯的机会地图 (COM)

第三章市场动态、法规与趋势分析

• 市场动态
  • 促进因素
• 消费性电子产品对行动性和连结性的需求不断增长
• SATS 提供者提供内部测试和封装功能之外的其他功能。
  • 抑制因素
• 汇率波动
• 高阶包装解决方案的高资本投资
  • 市场机会
• 投资先进包装解决方案
• 监管场景
• 产业趋势
• 併购
• 新系统的启动/批准
• COVID-19 大流行的影响

第 4 章全球半导体组装与侦测服务市场：依服务划分，2018-2030 年

• 组装与包装服务
• 测试服务

第 5 章全球半导体组装与侦测服务市场：依封装解法划分，2018-2030 年

• 铜线/金线接合
• 铜夹
• 倒装晶片
• 晶圆级封装
• TSV

第 6 章全球半导体组装与侦测服务市场：依应用划分，2018-2030

• 通讯
• 运算与网络
• 消费性电子产品
• 工业
• 汽车电子

第 7 章全球半导体组装与侦测服务市场：按地区划分，2018-2030 年

• 北美
  • 2018-2030 年市场规模与预测
  • 按服务划分的市场规模和预测以及同比增长率：2018-2030 年
  • 包装解决方案的市场规模与预测，年成长率：2018-2030 年
  • 2018-2030 年市场规模与预测、年成长率（按应用划分）
  • 市场占有率分析：按国家/地区划分，2023 年和 2030 年 (%)
• 欧洲
• 亚太地区
• 拉丁美洲
• 中东/非洲

第八章竞争态势

• 公司简介
  • ASE Group
  • Powertech Technology Inc.
  • Global Foundries Inc.
  • Amkor Technology Inc.
  • CORWIL Technology Corp.
  • Integrated Microelectronics Inc.（Psi Technologies Inc.）
  • STATS chipPAC Ltd.（JCET）
  • Chipbond Technology Corporation
  • Silicon Precision Industries Company Ltd.

第 9 章

• 参考文献
• 调查方法

The global semiconductor assembly and testing services market is estimated at US$ 33.42 Billion in 2023, and is projected to reach US$ 48.81 Billion by 2030, exhibiting a CAGR of 5.6% over the forecast period (2023-2030).

Manufacturing semiconductors, microcircuits, and microchips requires extremely precise conditions to be kept in the production/processing area. Hygroscopic components are typically employed in semiconductor manufacturing or processing, making them extremely vulnerable to high humidity levels. Excessive moisture in the assembly area during the manufacture of semiconductors and integrated circuits negatively impacts the bonding process and raises faults. Circuit lines are covered with photosensitive polymer compounds called photoresists before being etched. They absorb moisture due to their hygroscopic nature, which causes the minuscule circuit wires to be cut or bridged, resulting in circuit failure.

Market Dynamics

The ongoing demand for consumer electronics with the advancement of technology is driving growth of the global semiconductor assembly and testing services market. The high development of cell phones and tablets is one of the potential markets for semiconductor assembly and testing services (SATS). Increasing mobility and growing digital content are expected to drive growth of the global semiconductor assembly and testing services market's growth during the forecast period. Increasing demand for automotive electronics in the upcoming generation of cars built with electronic components, systems to enhance car safety, and management systems are driving growth of the global semiconductor assembly and testing services market. Rising adoption of latest technologies in navigation, hybrid electric drivers, and LEDs creates demand for this market.

Key features of the study:

• This report provides an in-depth analysis of the global semiconductor assembly and testing services market size (US$ Billion) and compound annual growth rate (CAGR %) for the forecast period (2023-2030), considering 2022 as the base year
• It elucidates potential revenue opportunities across different segments and explains attractive investment proposition matrices for this market
• This study also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, regional outlook, and competitive strategies adopted by the leading market players
• It profiles leading players in the global semiconductor assembly and testing services market based on the following parameters - company overview, financial performance, product portfolio, geographical presence, market capital, key developments, strategies, and future plans
• Companies covered as a part of this study are ASE Group, Powertech Technology Inc., Global Foundries Inc., Amkor Technology Inc., CORWIL Technology Corp., Integrated Microelectronics Inc. (Psi Technologies Inc.), STATS chipPAC Ltd. (JCET), Chipbond Technology Corporation, and Silicon Precision Industries Company Ltd.
• Insights from this report would allow marketers and management authorities of companies to make informed decisions regarding future product launches, product upgrades, market expansion, and marketing tactics
• The global semiconductor assembly and testing services market report caters to various stakeholders in this industry including investors, suppliers, managed service providers, third-party service providers, distributors, new entrants, and value-added resellers
• Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the global semiconductor assembly and testing services market

Detailed Segmentation

• Global Semiconductor Assembly And Testing Services Market, By Service:
  • Assembly & Packaging Services
  • Testing Services
• Global Semiconductor Assembly And Testing Services Market, By Packaging Solutions:
  • Copper Wire and Gold Wire Bonding
  • Copper Clip
  • Flip Chip
  • Wafer Level Packaging
  • TSV
• Global Semiconductor Assembly And Testing Services Market, By Application:
  • Communication
  • Computing & Networking
  • Consumer Electronics
  • Industrial
  • Automotive Electronics
• Global Semiconductor Assembly And Testing Services Market, By Region:
  • North America
  • By Country
  • U.S.
  • Canada
  • Europe
  • By Country
  • Germany
  • U.K.
  • France
  • Italy
  • Spain
  • Russia
  • Rest of Europe
  • Asia Pacific
  • By Country
  • China
  • India
  • Japan
  • Australia
  • South Korea
  • ASEAN
  • Rest of Asia Pacific
  • Latin America
  • By Country
  • Brazil
  • Mexico
  • Rest of Latin America
  • Middle East and Africa
  • By Country/Region:
  • GCC Countries
  • South Africa
  • Rest of Middle East and Africa
• Company Profiles
  • ASE Group
  • Powertech Technology Inc.
  • Global Foundries Inc.
  • Amkor Technology Inc.
  • CORWIL Technology Corp.
  • Integrated Microelectronics Inc. (Psi Technologies Inc.)
  • STATS chipPAC Ltd. (JCET)
  • Chipbond Technology Corporation
  • Silicon Precision Industries Company Ltd.

Table of Contents

1. Research Objectives and Assumptions

• Research Objectives
• Assumptions
• Abbreviations

2. Market Purview

• Report Description
  • Market Definition and Scope
• Executive Summary
  • Market Snippet, By Service
  • Market Snippet, By Packaging Solutions
  • Market Snippet, By Application
  • Market Snippet, By Region
• Coherent Opportunity Map (COM)

3. Market Dynamics, Regulations, and Trends Analysis

• Market Dynamics
  • Drivers
• Increasing demand for mobility and connectivity in consumer electronic products
• Additional features offered by SATS providers over in-house testing and packaging capabilities
  • Restraints
• Constant fluctuations in exchange rates
• High capital investment for high-end packaging solutions
  • Market Opportunities
• Investments in advanced packaging solution
• Regulatory Scenario
• Industry Trend
• Merger and Acquisitions
• New system Launch/Approvals
• Impact of COVID-19 Pandemic

4. Global Semiconductor Assembly And Testing Services Market , By Service, 2018-2030 (US$ Billion)

• Introduction
  • Market Share Analysis, 2023 and 2030 (%)
  • Y-o-Y Growth Analysis, 2018 - 2030
  • Segment Trends
• Assembly & Packaging Services
  • Introduction
  • Market Size and Forecast, and Y-o-Y Growth, 2018-2030, (US$ Billion)
• Testing Services
  • Introduction
  • Market Size and Forecast, and Y-o-Y Growth, 2018-2030, (US$ Billion)

5. Global Semiconductor Assembly And Testing Services Market, By Packaging Solutions, 2018-2030 (US$ Billion)

• Introduction
  • Market Share Analysis, 2023 and 2030 (%)
  • Y-o-Y Growth Analysis, 2018 - 2030
  • Segment Trends
• Copper Wire and Gold Wire Bonding
  • Introduction
  • Market Size and Forecast, and Y-o-Y Growth, 2018-2030, (US$ Billion)
• Copper Clip
  • Introduction
  • Market Size and Forecast, and Y-o-Y Growth, 2018-2030, (US$ Billion)
• Flip Chip
  • Introduction
  • Market Size and Forecast, and Y-o-Y Growth, 2018-2030, (US$ Billion)
• Wafer Level Packaging
  • Introduction
  • Market Size and Forecast, and Y-o-Y Growth, 2018-2030, (US$ Billion)
• TSV
  • Introduction
  • Market Size and Forecast, and Y-o-Y Growth, 2018-2030, (US$ Billion)

6. Global Semiconductor Assembly And Testing Services Market, By Application, 2018-2030 (US$ Billion)

• Introduction
  • Market Share Analysis, 2023 and 2030 (%)
  • Y-o-Y Growth Analysis, 2018 - 2030
  • Segment Trends
• Communication
  • Introduction
  • Market Size and Forecast, and Y-o-Y Growth, 2018-2030, (US$ Billion)
• Computing & Networking
  • Introduction
  • Market Size and Forecast, and Y-o-Y Growth, 2018-2030, (US$ Billion)
• Consumer Electronics
  • Introduction
  • Market Size and Forecast, and Y-o-Y Growth, 2018-2030, (US$ Billion)
• Industrial
  • Introduction
  • Market Size and Forecast, and Y-o-Y Growth, 2018-2030, (US$ Billion)
• Automotive Electronics
  • Introduction
  • Market Size and Forecast, and Y-o-Y Growth, 2018-2030, (US$ Billion)

7. Global Semiconductor Assembly And Testing Services Market , By Region, 2018-2030 (US$ Billion)

• Introduction
  • Market Share Analysis, By Region, 2023 and 2030 (%)
• North America
  • Introduction
• Market size and Forecast,2018-2030 (US$ Billion)
  • Regional Trends
• Market Size and Forecast, and Y-o-Y Growth, By Service, 2018-2030 (US$ Billion)
• Market Size and Forecast, and Y-o-Y Growth, By Packaging Solutions, 2018-2030 (US$ Billion)
• Market Size and Forecast, and Y-o-Y Growth, By Application, 2018-2030 (US$ Billion)
• Market Share Analysis, By Country, 2023 and 2030(%)
  • U.S.
  • Canada
• Europe
  • Introduction
• Market Size and Forecast, and Y-o-Y Growth,2018-2030 (US$ Billion)
  • Regional Trends
• Market Size and Forecast, and Y-o-Y Growth, By Service, 2018-2030 (US$ Billion)
• Market Size and Forecast, and Y-o-Y Growth, By Packaging Solutions, 2018-2030 (US$ Billion)
• Market Size and Forecast, and Y-o-Y Growth, By Application, 2018-2030 (US$ Billion)
• Market Share Analysis, By Country, 2023 and 2030(%)
  • Germany
  • U.K.
  • France
  • Italy
  • Spain
  • Russia
  • Rest of Europe
• Asia Pacific
  • Introduction
• Market Size and Forecast, and Y-o-Y Growth,2018-2030 (US$ Billion)
  • Regional Trends
• Market Size and Forecast, and Y-o-Y Growth, By Service, 2018-2030 (US$ Billion)
• Market Size and Forecast, and Y-o-Y Growth, By Packaging Solutions, 2018-2030 (US$ Billion)
• Market Size and Forecast, and Y-o-Y Growth, By Application, 2018-2030 (US$ Billion)
• Market Share Analysis, By Country, 2023 and 2030(%)
  • China
  • India
  • Japan
  • Australia
  • South Korea
  • ASEAN
  • Rest Of Asia Pacific
• Latin America
  • Introduction
• Market Size and Forecast, and Y-o-Y Growth,2018-2030 (US$ Billion)
  • Regional Trends
• Market Size and Forecast, and Y-o-Y Growth, By Service, 2018-2030 (US$ Billion)
• Market Size and Forecast, and Y-o-Y Growth, By Packaging Solutions, 2018-2030 (US$ Billion)
• Market Size and Forecast, and Y-o-Y Growth, By Application, 2018-2030 (US$ Billion)
• Market Share Analysis, By Country, 2023 and 2030(%)
  • Brazil
  • Mexico
  • Rest Of Latin America
• Middle East and Africa
  • Introduction
• Market Size and Forecast, and Y-o-Y Growth,2018-2030 (US$ Billion)
  • Regional Trends
• Market Size and Forecast, and Y-o-Y Growth, By Service, 2018-2030 (US$ Billion)
• Market Size and Forecast, and Y-o-Y Growth, By Packaging Solutions, 2018-2030 (US$ Billion)
• Market Size and Forecast, and Y-o-Y Growth, By Application, 2018-2030 (US$ Billion)
• Market Share Analysis, By Country, 2023 and 2030 (%)
  • South Africa
  • GCC Countries
  • Rest of the Middle East and Africa

8. Competitive Landscape

• Company Profiles
  • ASE Group
• Company Overview
• Product Portfolio
• Financial Performance
• Key Strategies
• Recent Developments/Updates
  • Powertech Technology Inc.
• Company Overview
• Product Portfolio
• Financial Performance
• Recent Developments/Updates
  • Global Foundries Inc.
• Company Overview
• Product Portfolio
• Financial Performance
• Recent Developments/Updates
  • Amkor Technology Inc.
• Company Overview
• Product Portfolio
• Financial Performance
• Recent Developments/Updates
  • CORWIL Technology Corp.
• Company Overview
• Product Portfolio
• Financial Performance
• Recent Developments/Updates
  • Integrated Microelectronics Inc. (Psi Technologies Inc.)
• Company Overview
• Product Portfolio
• Financial Performance
• Recent Developments/Updates
  • STATS chipPAC Ltd. (JCET)
• Company Overview
• Product Portfolio
• Financial Performance
• Recent Developments/Updates
  • Chipbond Technology Corporation
• Company Overview
• Product Portfolio
• Financial Performance
• Recent Developments/Updates
  • Silicon Precision Industries Company Ltd.
• Company Overview
• Product Portfolio
• Financial Performance
• Recent Developments/Updates
• Analyst Views

9. Section

• References
• Research Methodology
• About us and Sales Contact