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市场调查报告书
商品编码
1426957
半导体组装设备市场 - 按类型(晶片键合机、焊线机、包装设备)、按应用(IDM、OSAT)、按最终用途(消费电子、医疗保健、工业自动化、汽车、A&D)预测2024 - 2032年Semiconductor Assembly Equipment Market - By Type (Die Bonders, Wire Bonders, Packaging Equipment), By Application (IDMs, OSAT), By End Use (Consumer Electronics, Healthcare, Industrial Automation, Automotive, A&D) Forecast 2024 - 2032 |
由于技术进步,2024 年至 2032 年间,半导体组装设备市场的CAGR预计将超过 9%。对半导体製造流程创新的不懈追求正在推动更先进组装设备的开发。这包括能够处理更小和更复杂组件的设备,从而提高半导体组装过程的效率和生产率。
此外,智慧型手机、平板电脑和智慧型装置等消费性电子产品的需求不断增长,正在推动产业成长。根据 GSMA Intelligence 的报告,2022 年全球智慧型手机用户约 56 亿,平板电脑用户约 12.8 亿。
全球半导体组装设备产业根据类型、应用、最终用途和地区进行细分。
由于先进的封装解决方案能够满足不断变化的需求,晶片键合机领域预计将获得成长动力,并在 2032 年之前实现强劲的CAGR。随着半导体元件变得更加复杂和紧凑,晶片焊接机有助于将单个半导体元件精确地放置和焊接到基板上。这种精度等级对于实现小型化和提高整体设备性能非常重要。
在现代汽车中先进半导体技术不断整合的推动下,预计汽车领域在 2024 年和 2032 年将出现显着的CAGR。随着汽车製造商转向电动和自动驾驶汽车,需要半导体元件来支援感测器、人工智慧驱动系统和连接解决方案等复杂功能。汽车行业半导体应用的激增推动了对能够满足可靠性、耐用性和精度严格要求的专业组装设备的需求。
由于主要半导体製造商的强势存在以及对研发的重视,北美半导体组装设备市场将在 2024 年至 2032 年间大幅成长。该地区对这些措施的承诺促进了半导体组装过程的持续进步。此外,对半导体製造活动回流的日益关注增强了国内半导体生产能力,加速了北美产业的成长。
Semiconductor Assembly Equipment Market is set to record a CAGR of over 9% between 2024 and 2032, owing to the technological advancements. The relentless pursuit of innovation in semiconductor manufacturing processes is driving the development of more advanced assembly equipment. This includes equipment capable of handling smaller and more complex components, leading to enhanced efficiency and productivity in the semiconductor assembly process.
Additionally, the surging demand for consumer electronics, such as smartphones, tablets, and smart devices, is propelling the industry growth. As per the reports from GSMA Intelligence, there were around 5.60 billion smart phone users, and around 1.28 billion tablet users in 2022 across the globe.
The worldwide semiconductor assembly equipment industry is segmented on the basis of type, application, end use, and region.
Die bonder segment is slated to gain momentum and record a strong CAGR through 2032, due to advanced packaging solutions for the evolving needs. As semiconductor devices become more complex and compact, die bonder helps in precisely placing and bonding individual semiconductor components onto substrates. This level of precision is important for achieving miniaturization and for enhancing overall device performance.
Automotive segment is anticipated to observe a significant CAGR during 2024 and 2032, driven by the rising integration of advanced semiconductor technologies in modern vehicles. As the automakers shift towards electric and autonomous vehicles, there is a demand for semiconductor components to power sophisticated features such as sensors, AI-driven systems, and connectivity solutions. This surge in semiconductor adoption within the automotive sector drives the need for specialized assembly equipment capable of meeting the stringent requirements for reliability, durability, and precision.
North America semiconductor assembly equipment market will grow substantially between 2024 and 2032, attributed to the strong presence of major semiconductor manufacturers and an emphasis on R&D. The region's commitment towards the initiatives fosters a continuous cycle of advancements in semiconductor assembly processes. Moreover, the growing focus on reshoring semiconductor manufacturing activities bolsters domestic semiconductor production capabilities, accelerating the industry growth in North America.