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市场调查报告书
商品编码
1789942

美国半导体组装和封装设备市场规模、份额和趋势分析报告：按产品、最终用途和细分市场预测，2025-2033 年

U.S. Semiconductor Assembly And Packaging Equipment Market Size, Share & Trends Analysis Report By Product (Dicing Equipment, Bonding Equipment), By Packaging Type (Flip Chip Packaging Equipment), By End-use (IDMs), And Segment Forecasts, 2025 - 2033
出版日期: | 出版商: Grand View Research | 英文 100 Pages | 商品交期: 2-10个工作天内

价格

美国半导体组装和封装设备市场摘要

美国半导体组装和封装设备市场规模预计在 2024 年为 4.407 亿美元，预计到 2033 年将达到 7.725 亿美元，2025 年至 2033 年的复合年增长率为 6.6%。 2.5D/3D IC、扇出型晶圆级封装 (FOWLP) 和系统级封装(SiP) 等先进封装解决方案的日益普及，大大推动了美国的市场需求。

这些技术能够提升效能、缩小外形规格并提高能源效率，所有这些对于人工智慧 (AI)、物联网 (IoT) 和 5G 应用都至关重要。联邦政府透过《晶片与科学法案》等倡议提供的大力支持，正在振兴国内半导体製造和封装基础设施。这种支援减少了对海外供应商的依赖，并增强了供应链的韧性。在地缘政治紧张局势加剧和全球供应中断的背景下，促进本地製造尤其重要。

目录

第一章调查方法与范围

第二章执行摘要

第三章美国半导体组装和封装设备市场变数、趋势和范围

  • 绘製市场集中度与成长前景
  • 产业价值链分析
    • 原料和零件的前景
    • 製造商的展望
    • 分销展望
    • 最终使用者视角
  • 法律规范
  • 技术概述
  • 市场动态
    • 市场驱动因素分析
    • 市场限制因素分析
    • 市场问题分析
    • 市场机会分析
  • 经济大趋势分析
  • 产业分析工具
    • 波特五力分析
    • 宏观环境分析

第四章美国半导体组装和封装设备市场：按最终用途的估计和趋势分析

  • 2024 年和 2033 年按最终用途分類的变化分析和市场占有率
  • 依最终用途，2021-2033 年
  • IDM（整合设备製造商）
  • OSAT（外包半导体组装和测试）

第五章美国半导体组装与封装设备市场：依封装类型估算与趋势分析

  • 2024年和2033年按包装类型分類的变化分析和市场占有率
  • 2021-2033 年包装类型
  • 覆晶构装设备
  • 晶圆层次电子构装（WLP）设备
  • 扇出型封装设备
  • 系统级封装(SiP) 设备
  • 3D/2.5D包装设备
  • 其他的

第六章：美国半导体组装和封装设备市场：按产品分類的估计和趋势分析

  • 2024 年和 2033 年产品变化分析和市场占有率
  • 按产品，2021-2033
  • 切割设备
    • 抄写员
    • 切丁机
    • 晶圆安装设备
  • 键合设备
    • 晶片焊接机
    • 引线键合机
    • 其他的
  • 包装设备
    • 成型设备
    • 焊锡电镀设备
    • 去毛刺器
    • 其他的
  • 其他的

第七章美国半导体组装与封装设备市场：竞争格局

  • 主要市场参与企业的近期趋势和影响分析
  • 公司分类
  • 企业仪錶板分析
  • 供应商格局
  • 2024年公司市场占有率分析
  • 2024年企业定位分析
  • 2024年企业热图分析
  • 战略地图
  • 公司简介
  • Applied Materials
  • ASM Pacific Technology
  • Besi
  • Disco Corporation
  • Kulicke & Soffa Industries, Inc. (K&S)
  • Lam Research Corporation
  • Nikon Corporation
  • Plasma-Therm
  • Rudolph Technologies, Inc.
  • SCREEN Semiconductor Solutions Co., Ltd.
Product Code: GVR-4-68040-676-4

U.S. Semiconductor Assembly And Packaging Equipment Market Summary

The U.S. semiconductor assembly and packaging equipment market size was estimated at USD 440.7 million in 2024 and is projected to reach USD 772.5 million by 2033, growing at a CAGR of 6.6% from 2025 to 2033. The growing adoption of advanced packaging solutions such as 2.5D/3D ICs, fan-out wafer-level packaging (FOWLP), and system-in-package (SiP) is significantly driving market demand in the U.S.

These technologies enhance performance, reduce form factor, and improve power efficiency vital for artificial intelligence (AI), IoT, and 5G applications. Strong federal backing through initiatives like the CHIPS and Science Act is catalyzing domestic semiconductor manufacturing and packaging infrastructure. Substantial funding incentives are encouraging companies to establish or expand advanced packaging facilities in the U.S. This support reduces reliance on overseas providers and enhances supply chain resilience. The push toward localized production is especially critical amid rising geopolitical tensions and global supply disruptions.

U.S. Semiconductor Assembly And Packaging Equipment Market Report Segmentation

This report forecasts revenue growth at the U.S. level and provides an analysis of the latest industry trends in each of the sub-segments from 2021 to 2033. For this study, Grand View Research has segmented the U.S. semiconductor assembly and packaging equipment market report based on packaging type,end use, and product:

  • Packaging Type Outlook (Revenue, USD Million, 2021 - 2033)
  • Flip Chip Packaging Equipment
  • Wafer Level Packaging (WLP) Equipment
  • Fan-Out Packaging Equipment
  • System-in-Package (SiP) Equipment
  • 3D/2.5D Packaging Equipment
  • Others
  • End Use Outlook (Revenue, USD Million, 2021 - 2033)
  • IDMs (Integrated Device Manufacturers)
  • OSAT (Outsourced Semiconductor Assembly and Test)
  • Product Outlook (Revenue, USD Million, 2021 - 2033)
  • Dicing Equipment
    • Scriber
    • Dicer
    • Wafer Mounting Equipment
  • Bonding Equipment
    • Die Bonder
    • Wire Bonder
    • Others
  • Packaging Equipment
    • Molding Equipment
    • Solder Plating Equipment
    • Deflasher
    • Others
  • Others

Table of Contents

Chapter 1. Methodology and Scope

  • 1.1. Market Segmentation & Scope
  • 1.2. Market Definition
  • 1.3. Information Procurement
    • 1.3.1. Purchased Database
    • 1.3.2. GVR's Internal Database
    • 1.3.3. Secondary Sources & Third-Party Perspectives
    • 1.3.4. Primary Research
  • 1.4. Information Analysis
    • 1.4.1. Data Analysis Models
  • 1.5. Market Formulation & Data Visualization
  • 1.6. Data Validation & Publishing

Chapter 2. Executive Summary

  • 2.1. Market Snapshot
  • 2.2. Segment Snapshot
  • 2.3. Competitive Landscape Snapshot

Chapter 3. U.S. Semiconductor Assembly and Packaging Equipment Market Variables, Trends & Scope

  • 3.1. Market Concentration & Growth Prospect Mapping
  • 3.2. Industry Value Chain Analysis
    • 3.2.1. Raw Material/Component Outlook
    • 3.2.2. Manufacturer Outlook
    • 3.2.3. Distribution Outlook
    • 3.2.4. End User Outlook
  • 3.3. Regulatory Framework
  • 3.4. Technology Overview
  • 3.5. Market Dynamics
    • 3.5.1. Market Driver Analysis
    • 3.5.2. Market Restraint Analysis
    • 3.5.3. Market Challenges Analysis
    • 3.5.4. Market Opportunity Analysis
  • 3.6. Economic Mega-Trend Analysis
  • 3.7. Industry Analysis Tools
    • 3.7.1. Porter's Five Forces Analysis
    • 3.7.2. Macro-environmental Analysis

Chapter 4. U.S. Semiconductor Assembly and Packaging Equipment Market: End Use Estimates & Trend Analysis

  • 4.1. End Use Movement Analysis & Market Share, 2024 & 2033
  • 4.2. U.S. Semiconductor Assembly and Packaging Equipment Market Estimates & Forecast, By End Use, 2021 to 2033 (USD Million)
  • 4.3. IDMs (Integrated Device Manufacturers)
    • 4.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 4.4. OSAT (Outsourced Semiconductor Assembly and Test)
    • 4.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)

Chapter 5. U.S. Semiconductor Assembly and Packaging Equipment Market: Packaging Type Estimates & Trend Analysis

  • 5.1. Packaging Type Movement Analysis & Market Share, 2024 & 2033
  • 5.2. U.S. Semiconductor Assembly and Packaging Equipment Market Estimates & Forecast, By Distribution Channel, 2021 to 2033 (USD Million)
  • 5.3. Flip Chip Packaging Equipment
    • 5.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 5.4. Wafer Level Packaging (WLP) Equipment
    • 5.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 5.5. Fan-Out Packaging Equipment
    • 5.5.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 5.6. System-in-Package (SiP) Equipment
    • 5.6.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 5.7. 3D/2.5D Packaging Equipment
    • 5.7.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 5.8. Others
    • 5.8.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)

Chapter 6. U.S. Semiconductor Assembly and Packaging Equipment Market: Product Estimates & Trend Analysis

  • 6.1. Product Movement Analysis & Market Share, 2024 & 2033
  • 6.2. U.S. Semiconductor Assembly and Packaging Equipment Market Estimates & Forecast, By Product, 2021 to 2033 (USD Million)
  • 6.3. Dicing Equipment
    • 6.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.3.2. Scriber
      • 6.3.2.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.3.3. Dicer
      • 6.3.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.3.4. Wafer Mounting Equipment
      • 6.3.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.4. Bonding Equipment
    • 6.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.4.2. Die Bonder
      • 6.4.2.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.4.3. Wire Bonder
      • 6.4.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.4.4. Others
      • 6.4.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.5. Packaging Equipment
    • 6.5.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.5.2. Molding Equipment
      • 6.5.2.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.5.3. Solder Plating Equipment
      • 6.5.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.5.4. Deflasher
      • 6.5.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.5.5. Others
      • 6.5.5.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.6. Others
    • 6.6.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)

Chapter 7. U.S. Semiconductor Assembly and Packaging Equipment Market: Competitive Landscape

  • 7.1. Recent Developments & Impact Analysis, By Key Market Participants
  • 7.2. Company Categorization
  • 7.3. Company Dashboard Analysis
  • 7.4. Vendor Landscape
    • 7.4.1. List of Key Raw Material/Component Providers
    • 7.4.2. List of Key Manufacturers
    • 7.4.3. List of Key Distributors
  • 7.5. Company Market Share Analysis, 2024
  • 7.6. Company Positioning Analysis, 2024
  • 7.7. Company Heat Map Analysis, 2024
  • 7.8. Strategy Mapping
  • 7.9. Company Profiles
    • 7.9.1. Applied Materials
      • 7.9.1.1. Participant's overview
      • 7.9.1.2. Financial performance
      • 7.9.1.3. Product benchmarking
      • 7.9.1.4. Recent developments
    • 7.9.2. ASM Pacific Technology
      • 7.9.2.1. Participant's overview
      • 7.9.2.2. Financial performance
      • 7.9.2.3. Product benchmarking
      • 7.9.2.4. Recent developments
    • 7.9.3. Besi
      • 7.9.3.1. Participant's overview
      • 7.9.3.2. Financial performance
      • 7.9.3.3. Product benchmarking
      • 7.9.3.4. Recent developments
    • 7.9.4. Disco Corporation
      • 7.9.4.1. Participant's overview
      • 7.9.4.2. Financial performance
      • 7.9.4.3. Product benchmarking
      • 7.9.4.4. Recent developments
    • 7.9.5. Kulicke & Soffa Industries, Inc. (K&S)
      • 7.9.5.1. Participant's overview
      • 7.9.5.2. Financial performance
      • 7.9.5.3. Product benchmarking
      • 7.9.5.4. Recent developments
    • 7.9.6. Lam Research Corporation
      • 7.9.6.1. Participant's overview
      • 7.9.6.2. Financial performance
      • 7.9.6.3. Product benchmarking
      • 7.9.6.4. Recent developments
    • 7.9.7. Nikon Corporation
      • 7.9.7.1. Participant's overview
      • 7.9.7.2. Financial performance
      • 7.9.7.3. Product benchmarking
      • 7.9.7.4. Recent developments
    • 7.9.8. Plasma-Therm
      • 7.9.8.1. Participant's overview
      • 7.9.8.2. Financial performance
      • 7.9.8.3. Product benchmarking
      • 7.9.8.4. Recent developments
    • 7.9.9. Rudolph Technologies, Inc.
      • 7.9.9.1. Participant's overview
      • 7.9.9.2. Financial performance
      • 7.9.9.3. Product benchmarking
      • 7.9.9.4. Recent developments
    • 7.9.10. SCREEN Semiconductor Solutions Co., Ltd.
      • 7.9.10.1. Participant's overview
      • 7.9.10.2. Financial performance
      • 7.9.10.3. Product benchmarking
      • 7.9.10.4. Recent developments

List of Tables

  • Table 1 U.S. semiconductor assembly and packaging equipment market estimates and forecasts, 2021 - 2033 (USD Million)
  • Table 2 U.S. semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 3 U.S. semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 4 U.S. semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 5 Company Heat Map Analysis, 2024
  • Table 6 Strategy Mapping

List of Figures

  • Fig. 1 Market research process
  • Fig. 2 Data triangulation techniques
  • Fig. 3 Primary research pattern
  • Fig. 4 Market research approaches
  • Fig. 5 QFD modeling for market share assessment
  • Fig. 6 Information Procurement
  • Fig. 7 Market Formulation and Validation
  • Fig. 8 Data Validating & Publishing
  • Fig. 9 Market Segmentation & Scope
  • Fig. 10 U.S. Semiconductor Assembly and Packaging Equipment Market Snapshot
  • Fig. 11 Segment Snapshot
  • Fig. 12 Competitive Landscape Snapshot
  • Fig. 13 Parent market outlook
  • Fig. 14 U.S. Semiconductor Assembly and Packaging Equipment Market Value, 2024 (USD Million)
  • Fig. 15 U.S. Semiconductor Assembly and Packaging Equipment Market - Value Chain Analysis
  • Fig. 16 U.S. Semiconductor Assembly and Packaging Equipment Market - Market Dynamics
  • Fig. 17 U.S. Semiconductor Assembly and Packaging Equipment Market - PORTER's Analysis
  • Fig. 18 U.S. Semiconductor Assembly and Packaging Equipment Market - PESTEL Analysis
  • Fig. 19 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, By Packaging Type: Key Takeaways
  • Fig. 20 U.S. Semiconductor Assembly and Packaging Equipment Market Share, By Packaging Type, 2024 & 2033
  • Fig. 21 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Flip Chip Packaging Equipment, 2021 - 2033 (USD Million)
  • Fig. 22 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Wafer Level Packaging (WLP) Equipment, 2021 - 2033 (USD Million)
  • Fig. 23 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Fan-Out Packaging Equipment, 2021 - 2033 (USD Million)
  • Fig. 24 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By System-in-Package (SiP) Equipment, 2021 - 2033 (USD Million)
  • Fig. 25 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By 3D/2.5D Packaging Equipment, 2021 - 2033 (USD Million)
  • Fig. 26 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Others 2021 - 2033 (USD Million)
  • Fig. 27 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, By Product: Key Takeaways
  • Fig. 28 U.S. Semiconductor Assembly and Packaging Equipment Market Share, By Product, 2024 & 2033
  • Fig. 29 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Dicing Equipment, 2021 - 2033 (USD Million)
  • Fig. 30 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Scriber, 2021 - 2033 (USD Million)
  • Fig. 31 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Dicer, 2021 - 2033 (USD Million)
  • Fig. 32 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Wafer Mounting Equipment, 2021 - 2033 (USD Million)
  • Fig. 33 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Bonding Equipment, 2021 - 2033 (USD Million)
  • Fig. 34 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Die Bonder, 2021 - 2033 (USD Million)
  • Fig. 35 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Wire Bonder, 2021 - 2033 (USD Million)
  • Fig. 36 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Others, 2021 - 2033 (USD Million)
  • Fig. 37 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Packaging Equipment, 2021 - 2033 (USD Million)
  • Fig. 38 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Molding Equipment, 2021 - 2033 (USD Million)
  • Fig. 39 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Solder Plating Equipment, 2021 - 2033 (USD Million)
  • Fig. 40 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Deflasher, 2021 - 2033 (USD Million)
  • Fig. 41 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Others, 2021 - 2033 (USD Million)
  • Fig. 42 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Others, 2021 - 2033 (USD Million)
  • Fig. 43 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, By End Use: Key Takeaways
  • Fig. 44 U.S. Semiconductor Assembly and Packaging Equipment Market Share, By End Use, 2024 & 2033
  • Fig. 45 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, In IDMs (Integrated Device Manufacturers) 2021 - 2033 (USD Million)
  • Fig. 46 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, In OSAT (Outsourced Semiconductor Assembly and Test) 2021 - 2033 (USD Million)
  • Fig. 47 Key Company Categorization
  • Fig. 48 Company Market Positioning
  • Fig. 49 Key Company Market Share Analysis, 2024
  • Fig. 50 Strategy Mapping