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市场调查报告书
商品编码
1701694

全球半导体组装测试服务市场：产业分析、规模、份额、成长、趋势和预测（2025-2032 年）

Semiconductor Assembly Test Services Market: Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2025 - 2032
出版日期: | 出版商: Persistence Market Research | 英文 280 Pages | 商品交期: 2-5个工作天内

价格
简介目录

预计 2025 年全球半导体组装测试服务市场价值将达到 394 亿美元，到 2032 年将达到 601 亿美元，预测期内（2025-2032 年）的复合年增长率为 6.2%。

半导体组装测试服务 (SATS) 在半导体製造价值链中发挥至关重要的作用，该价值链包括晶圆切割、晶片黏接、引线接合法封装、封装和功能测试等製程。这些服务可确保积体电路 (IC) 在嵌入到最终用户应用（如家用电子电器、汽车系统、工业和通讯设备）之前的品质、可靠性和性能。 SATS 市场服务于无晶圆厂半导体公司、集成设备製造商 (IDM) 和代工厂，提供具有成本效益、扩充性且技术先进的后端服务。市场成长的动力来自各行各业对半导体的需求不断增长、晶片封装技术的快速进步以及集成电路设计日益复杂。

全球 SATS 市场受到先进电子产品需求激增的推动，尤其是在智慧型手机、电动车、人工智慧、物联网和 5G 基础设施等高成长领域。随着晶片设计尺寸缩小、特征密度增加，对精密组装和测试的需求也随之增加。此外，无厂半导体公司和IDM将业务外包给专业OSAT（外包半导体组装测试）供应商的趋势正透过提供规模经济和业务效率来促进市场成长。 SiP（系统级封装）、3D IC封装和 TSV（硅通孔）技术等技术进步为 SATS 供应商开闢了新的成长途径。

SATS 市场预计将经历强劲成长，但面临高资本支出、技术过时和供应链中断等挑战。半导体设计的快速创新步伐要求 SATS 供应商不断升级其设备和功能，这可能会花费大量成本，尤其是对于中小型企业而言。此外，设备供应商的集中度以及对主要半导体生产地区地缘政治紧张局势的依赖，造成了供应链弹性的脆弱性。有限的熟练劳动力资源和来自大型 IDM 内部测试能力日益激烈的竞争也可能影响独立 SATS 提供者的盈利和成长潜力。

随着对异质整合、小晶片架构和电子产品小型化的需求不断增长，SATS 市场提供了庞大的商机。自动驾驶汽车、智慧製造和穿戴式技术的兴起，对高性能、紧凑型半导体解决方案的需求强劲，进而推动了对专业封装和测试服务的需求。此外，对人工智慧主导的测试、自动化和数数位双胞胎技术的策略性投资增强了品管、缩短了产品上市时间并优化了业务效率。亚太和拉丁美洲的新兴市场在不断发展的电子製造生态系统和积极的政府倡议的支持下，为 SATS 提供者带来了尚未开发的潜力。

本报告研究了全球半导体组装测试服务市场，深入了解了服务、应用和地区的趋势，以及参与市场的公司概况。

目录

第一章执行摘要

第二章 市场概述

第三章 主要市场趋势

第四章定价分析

5. 全球半导体组装测试服务市场需求（十亿美元）分析

  • 2019-2024年历史市场价值（十亿美元）分析
  • 当前和未来市场价值预测（十亿美元），2025-2032年

第六章 市场背景

7. 全球半导体组装测试服务市场分析（按服务）

  • 简介/主要发现
  • 2019 年至 2024 年按服务分類的历史市场规模（十亿美元）分析
  • 目前与未来市场规模（十亿美元）分析与预测（按服务分类），2025 年至 2032 年
    • 组装和包装服务
    • 测试服务
  • 按服务进行市场吸引力分析

8. 全球半导体组装测试服务市场分析（按应用）

  • 简介/主要发现
  • 2019 年至 2024 年历史市场规模（十亿美元）分析（按应用）
  • 目前和未来市场规模（十亿美元）分析与预测（按应用），2025 年至 2032 年
    • 通讯
    • 运算和网路
    • 家电
    • 产业
    • 汽车电子
  • 按应用进行市场吸引力分析

9. 全球半导体组装测试服务市场分析（按地区）

  • 简介/主要发现
  • 2019 年至 2024 年各地区历史市场规模（十亿美元）分析
  • 2025 年至 2032 年各地区现今及未来市场规模（十亿美元）分析与预测
    • 北美洲
    • 拉丁美洲
    • 欧洲
    • 东亚
    • 南亚太平洋地区
    • 中东和非洲
  • 区域市场吸引力分析

10.北美半导体组装测试服务市场分析

11.拉丁美洲半导体组装测试服务市场分析

12.欧洲半导体组装测试服务市场分析

13.南亚太半导体组装测试服务市场分析

第十四章东亚半导体组装测试服务市场分析

15.中东和非洲半导体组装和测试服务市场分析

第十六章：主要国家半导体组装测试服务市场分析

  • 美国
  • 加拿大
  • 墨西哥
  • 巴西
  • 德国
  • 义大利
  • 法国
  • 英国
  • 西班牙
  • 比荷卢经济联盟
  • 俄罗斯
  • 其他欧洲国家
  • 中国
  • 日本
  • 韩国
  • 印度
  • 马来西亚
  • 印尼
  • 新加坡
  • 澳洲和纽西兰
  • 海湾合作委员会国家
  • 土耳其
  • 南非
  • 其他中东和非洲国家

第十七章市场结构分析

第十八章 竞争分析

  • 竞争仪錶板
  • 竞争基准
  • 衝突详情
    • ASE Group, Inc.
    • Amkor Technology, Inc.
    • Siliconware Precision Industries Co., Ltd.
    • Powertech Technology, Inc.
    • United Test and Assembly Center Ltd.
    • JCET Group Co Ltd
    • Chips Technologies, Inc.
    • Chipbond Technology Corporation.
    • King Yuan Electronics Co Ltd
    • .Unisem

第 19 章 使用的假设与缩写

第二十章调查方法

简介目录
Product Code: PMRREP4786

Persistence Market Research has recently released a comprehensive report on the worldwide market for semiconductor assembly and testing services (SATS). The report offers a thorough assessment of crucial market dynamics, including drivers, trends, opportunities, and challenges, providing detailed insights into the market structure. This research publication presents exclusive data and statistics outlining the anticipated growth trajectory of the global semiconductor assembly and testing services market from 2025 to 2032.

Key Insights:

  • Semiconductor Assembly and Testing Services Market Size (2025E): USD 39.4 Billion
  • Projected Market Value (2032F): USD 60.1 Billion
  • Global Market Growth Rate (CAGR 2025 to 2032): 6.2%

Semiconductor Assembly and Testing Services Market - Report Scope:

Semiconductor assembly and testing services (SATS) play a vital role in the semiconductor manufacturing value chain, involving processes such as wafer dicing, die attach, wire bonding, encapsulation, and functional testing. These services ensure the quality, reliability, and performance of integrated circuits (ICs) before they are integrated into end-user applications, including consumer electronics, automotive systems, industrial equipment, and communication devices. The SATS market serves fabless semiconductor companies, integrated device manufacturers (IDMs), and foundries, offering cost-effective, scalable, and technologically advanced backend services. Market growth is being driven by increasing semiconductor demand across industries, rapid advancements in chip packaging technologies, and the rising complexity of integrated circuit designs.

Market Growth Drivers:

The global SATS market is propelled by surging demand for advanced electronics, particularly in high-growth segments such as smartphones, electric vehicles, AI, IoT, and 5G infrastructure. As chip designs become more sophisticated, with smaller nodes and greater functional density, the need for precision assembly and testing intensifies. Additionally, the trend toward outsourcing by fabless companies and IDMs to specialized OSAT (outsourced semiconductor assembly and test) providers boosts market growth by offering economies of scale and operational efficiency. Technological advancements, including the adoption of system-in-package (SiP), 3D IC packaging, and through-silicon via (TSV) technology, are reshaping the landscape and opening new growth avenues for SATS providers.

Market Restraints:

Despite strong growth prospects, the SATS market faces challenges related to high capital investment, technological obsolescence, and supply chain disruptions. The rapid pace of innovation in semiconductor design requires SATS providers to continuously upgrade their equipment and capabilities, posing cost burdens, especially for small and mid-sized players. Additionally, dependence on a concentrated number of equipment vendors and geopolitical tensions in key semiconductor-producing regions create vulnerabilities in supply chain resilience. Limited skilled labor and increasing competition from in-house testing capabilities of large IDMs may also impact the profitability and growth potential of independent SATS providers.

Market Opportunities:

The SATS market presents significant opportunities fueled by the expanding demand for heterogeneous integration, chiplet architecture, and miniaturized electronics. The rise of autonomous vehicles, smart manufacturing, and wearable technologies is generating a robust pipeline of demand for high-performance and compact semiconductor solutions, which in turn drives the need for specialized packaging and testing services. Furthermore, strategic investments in AI-driven testing, automation, and digital twin technologies are enhancing quality control, reducing time-to-market, and optimizing operational efficiency. Emerging markets in Asia Pacific and Latin America offer untapped potential for SATS providers, supported by growing electronics manufacturing ecosystems and favorable government initiatives.

Key Questions Answered in the Report:

  • What are the primary factors driving the growth of the semiconductor assembly and testing services market globally?
  • Which technologies and end-use applications are accelerating SATS adoption across industries?
  • How are advancements in packaging and testing techniques reshaping the competitive landscape?
  • Who are the major players in the SATS market, and what strategies are they implementing to maintain competitiveness?
  • What are the emerging trends and future outlook for the global SATS market?

Competitive Intelligence and Business Strategy:

Leading players in the global SATS market, including ASE Technology Holding Co., Ltd., Amkor Technology, Inc., JCET Group Co., Ltd., and Powertech Technology Inc., focus on continuous innovation, capacity expansion, and strategic collaborations to stay competitive. These companies are investing in advanced packaging technologies such as fan-out wafer-level packaging (FOWLP), flip-chip, and 2.5D/3D ICs to meet the evolving demands of end-use sectors. Mergers and acquisitions are being pursued to strengthen geographic presence and technological capabilities. Additionally, partnerships with semiconductor foundries, fabless firms, and EDA tool providers enable these SATS players to deliver integrated solutions and streamline the product development lifecycle.

Key Companies Profiled:

  • ASE Group, Inc.
  • Amkor Technology, Inc.
  • Siliconware Precision Industries Co., Ltd.
  • Powertech Technology, Inc.
  • United Test and Assembly Center Ltd.
  • JCET Group Co Ltd
  • Chips Technologies, Inc.
  • Chipbond Technology Corporation.
  • King Yuan Electronics Co Ltd
  • Unisem

Key Segments of Semiconductor Assembly Test Services Market Research

By Service:

  • Assembly & Packaging Services
  • Copper Wire & Gold Wire Bonding
  • Flip Chip
  • Wafer Level Packaging
  • TSV
  • Others
  • Testing Services

By Application:

  • Communication
  • Computing & Networking
  • Consumer Electronics
  • Industrial
  • Automotive Electronics

By Region:

  • North America
  • Latin America
  • Europe
  • East Asia
  • South Asia & Pacific
  • Middle East and Africa (MEA)

Table of Contents

1. Executive Summary

  • 1.1. Global Market Outlook
  • 1.2. Demand Side Trends
  • 1.3. Supply Side Trends
  • 1.4. Analysis and Recommendations

2. Market Overview

  • 2.1. Market Coverage / Taxonomy
  • 2.2. Market Definition / Scope / Limitations

3. Key Market Trends

  • 3.1. Key Trends Impacting the Market
  • 3.2. Product Innovation / Development Trends

4. Pricing Analysis

  • 4.1. Pricing Analysis, By Semiconductor Assembly Test Services
  • 4.2. Average Pricing Analysis Benchmark

5. Global Semiconductor Assembly and Test Services Market Demand (Value in US$ Bn) Analysis 2019-2024 and Forecast, 2025-2032

  • 5.1. Historical Market Value (US$ Bn) Analysis, 2019-2024
  • 5.2. Current and Future Market Value (US$ Bn) Projections, 2025-2032
    • 5.2.1. Y-o-Y Growth Trend Analysis
    • 5.2.2. Absolute $ Opportunity Analysis

6. Market Background

  • 6.1. Macro-Economic Factors
  • 6.2. Forecast Factors - Relevance & Impact
  • 6.3. Value Chain
  • 6.4. COVID-19 Crisis - Impact Assessment
    • 6.4.1. Current Statistics
    • 6.4.2. Short-Mid-Long Term Outlook
    • 6.4.3. Likely Rebound
  • 6.5. Market Dynamics
    • 6.5.1. Drivers
    • 6.5.2. Restraints
    • 6.5.3. Opportunities

7. Global Semiconductor Assembly and Test Services Market Analysis 2019-2024 and Forecast 2025-2032, By Service

  • 7.1. Introduction / Key Findings
  • 7.2. Historical Market Size (US$ Bn) Analysis By Service, 2019-2024
  • 7.3. Current and Future Market Size (US$ Bn) Analysis and Forecast By Service, 2025-2032
    • 7.3.1. Assembly & Packaging Services
      • 7.3.1.1. Copper Wire & Gold Wire Bonding
      • 7.3.1.2. Flip Chip
      • 7.3.1.3. Wafer Level Packaging
      • 7.3.1.4. TSV
      • 7.3.1.5. Others
    • 7.3.2. Testing Services
  • 7.4. Market Attractiveness Analysis By Service

8. Global Semiconductor Assembly and Test Services Market Analysis 2019-2024 and Forecast 2025-2032, by Application

  • 8.1. Introduction / Key Findings
  • 8.2. Historical Market Size (US$ Bn) Analysis By Application, 2019-2024
  • 8.3. Current and Future Market Size (US$ Bn) Analysis and Forecast By Application, 2025-2032
    • 8.3.1. Communication
    • 8.3.2. Computing & Networking
    • 8.3.3. Consumer Electronics
    • 8.3.4. Industrial
    • 8.3.5. Automotive Electronics
  • 8.4. Market Attractiveness Analysis By Application

9. Global Semiconductor Assembly and Test Services Market Analysis 2019-2024 and Forecast 2025-2032, by Region

  • 9.1. Introduction / Key Findings
  • 9.2. Historical Market Size (US$ Bn) Analysis By Region, 2019-2024
  • 9.3. Current and Future Market Size (US$ Bn) Analysis and Forecast By Region, 2025-2032
    • 9.3.1. North America
    • 9.3.2. Latin America
    • 9.3.3. Europe
    • 9.3.4. East Asia
    • 9.3.5. South Asia Pacific
    • 9.3.6. Middle East and Africa
  • 9.4. Market Attractiveness Analysis By Region

10. North America Semiconductor Assembly and Test Services Market Analysis 2019-2024 and Forecast 2025-2032

  • 10.1. Introduction
  • 10.2. Historical Market Size (US$ Bn) Trend Analysis By Market Taxonomy, 2019-2024
  • 10.3. Current and Future Market Size (US$ Bn) Forecast By Market Taxonomy, 2025-2032
    • 10.3.1. By Service
    • 10.3.2. By Application
    • 10.3.3. By Country
      • 10.3.3.1. U.S.
      • 10.3.3.2. Canada
  • 10.4. Market Attractiveness Analysis
    • 10.4.1. By Service
    • 10.4.2. By Application
    • 10.4.3. By Country
  • 10.5. Market Trends
  • 10.6. Key Market Participants - Intensity Mapping

11. Latin America Semiconductor Assembly and Test Services Market Analysis 2019-2024 and Forecast 2025-2032

  • 11.1. Introduction
  • 11.2. Historical Market Size (US$ Bn) Trend Analysis By Market Taxonomy, 2019-2024
  • 11.3. Current and Future Market Size (US$ Bn) Forecast By Market Taxonomy, 2025-2032
    • 11.3.1. By Service
    • 11.3.2. By Application
    • 11.3.3. By Country
      • 11.3.3.1. Brazil
      • 11.3.3.2. Mexico
      • 11.3.3.3. Rest of Latin America
  • 11.4. Market Attractiveness Analysis
    • 11.4.1. By Service
    • 11.4.2. By Application
    • 11.4.3. By Country

12. Europe Semiconductor Assembly and Test Services Market Analysis 2019-2024 and Forecast 2025-2032

  • 12.1. Introduction
  • 12.2. Historical Market Size (US$ Bn) Trend Analysis By Market Taxonomy, 2019-2024
  • 12.3. Current and Future Market Size (US$ Bn) Forecast By Market Taxonomy, 2025-2032
    • 12.3.1. By Service
    • 12.3.2. By Application
    • 12.3.3. By Country
      • 12.3.3.1. Germany
      • 12.3.3.2. Italy
      • 12.3.3.3. France
      • 12.3.3.4. U.K.
      • 12.3.3.5. Spain
      • 12.3.3.6. BENELUX
      • 12.3.3.7. Russia
      • 12.3.3.8. Rest of Europe
  • 12.4. Market Attractiveness Analysis
    • 12.4.1. By Service
    • 12.4.2. By Application
    • 12.4.3. By Country

13. South Asia & Pacific Semiconductor Assembly and Test Services Market Analysis 2019-2024 and Forecast 2025-2032

  • 13.1. Introduction
  • 13.2. Historical Market Size (US$ Bn) Trend Analysis By Market Taxonomy, 2019-2024
  • 13.3. Current and Future Market Size (US$ Bn) Forecast By Market Taxonomy, 2025-2032
    • 13.3.1. By Service
    • 13.3.2. By Application
    • 13.3.3. By Country
      • 13.3.3.1. India
      • 13.3.3.2. Indonesia
      • 13.3.3.3. Malaysia
      • 13.3.3.4. Singapore
      • 13.3.3.5. Australia & New Zealand
      • 13.3.3.6. Rest of South Asia and Pacific
  • 13.4. Market Attractiveness Analysis
    • 13.4.1. By Service
    • 13.4.2. By Application
    • 13.4.3. By Country

14. East Asia Semiconductor Assembly and Test Services Market Analysis 2019-2024 and Forecast 2025-2032

  • 14.1. Introduction
  • 14.2. Historical Market Size (US$ Bn) Trend Analysis By Market Taxonomy, 2019-2024
  • 14.3. Current and Future Market Size (US$ Bn) Forecast By Market Taxonomy, 2025-2032
    • 14.3.1. By Service
    • 14.3.2. By Application
    • 14.3.3. By Country
      • 14.3.3.1. China
      • 14.3.3.2. Japan
      • 14.3.3.3. South Korea
  • 14.4. Market Attractiveness Analysis
    • 14.4.1. By Service
    • 14.4.2. By Application
    • 14.4.3. By Country

15. Middle East and Africa Semiconductor Assembly and Test Services Market Analysis 2019-2024 and Forecast 2025-2032

  • 15.1. Introduction
  • 15.2. Historical Market Size (US$ Bn) Trend Analysis By Market Taxonomy, 2019-2024
  • 15.3. Current and Future Market Size (US$ Bn) Forecast By Market Taxonomy, 2025-2032
    • 15.3.1. By Service
    • 15.3.2. By Application
    • 15.3.3. By Country
      • 15.3.3.1. GCC Countries
      • 15.3.3.2. Turkey
      • 15.3.3.3. South Africa
      • 15.3.3.4. Rest of Middle East and Africa
  • 15.4. Market Attractiveness Analysis
    • 15.4.1. By Service
    • 15.4.2. By Application
    • 15.4.3. By Country

16. Key Countries Analysis- Semiconductor Assembly and Test Services Market

  • 16.1. U.S. Semiconductor Assembly and Test Services Market Analysis
    • 16.1.1. By Service
    • 16.1.2. By Application
  • 16.2. Canada Semiconductor Assembly and Test Services Market Analysis
    • 16.2.1. By Service
    • 16.2.2. By Application
  • 16.3. Mexico Semiconductor Assembly and Test Services Market Analysis
    • 16.3.1. By Service
    • 16.3.2. By Application
  • 16.4. Brazil Semiconductor Assembly and Test Services Market Analysis
    • 16.4.1. By Service
    • 16.4.2. By Application
  • 16.5. Germany Semiconductor Assembly and Test Services Market Analysis
    • 16.5.1. By Service
    • 16.5.2. By Application
  • 16.6. Italy Semiconductor Assembly and Test Services Market Analysis
    • 16.6.1. By Service
    • 16.6.2. By Application
  • 16.7. France Semiconductor Assembly and Test Services Market Analysis
    • 16.7.1. By Service
    • 16.7.2. By Application
  • 16.8. U.K. Semiconductor Assembly and Test Services Market Analysis
    • 16.8.1. By Service
    • 16.8.2. By Application
  • 16.9. Spain Semiconductor Assembly and Test Services Market Analysis
    • 16.9.1. By Service
    • 16.9.2. By Application
  • 16.10. BENELUX Semiconductor Assembly and Test Services Market Analysis
    • 16.10.1. By Service
    • 16.10.2. By Application
  • 16.11. Russia Semiconductor Assembly and Test Services Market Analysis
    • 16.11.1. By Service
    • 16.11.2. By Application
  • 16.12. Rest of Europe Semiconductor Assembly and Test Services Market Analysis
    • 16.12.1. By Service
    • 16.12.2. By Application
  • 16.13. China Semiconductor Assembly and Test Services Market Analysis
    • 16.13.1. By Service
    • 16.13.2. By Application
  • 16.14. Japan Semiconductor Assembly and Test Services Market Analysis
    • 16.14.1. By Service
    • 16.14.2. By Application
  • 16.15. South Korea Semiconductor Assembly and Test Services Market Analysis
    • 16.15.1. By Service
    • 16.15.2. By Application
  • 16.16. India Semiconductor Assembly and Test Services Market Analysis
    • 16.16.1. By Service
    • 16.16.2. By Application
  • 16.17. Malaysia Semiconductor Assembly and Test Services Market Analysis
    • 16.17.1. By Service
    • 16.17.2. By Application
  • 16.18. Indonesia Semiconductor Assembly and Test Services Market Analysis
    • 16.18.1. By Service
    • 16.18.2. By Application
  • 16.19. Singapore Semiconductor Assembly and Test Services Market Analysis
    • 16.19.1. By Service
    • 16.19.2. By Application
  • 16.20. Australia and New Zealand Semiconductor Assembly and Test Services Market Analysis
    • 16.20.1. By Service
    • 16.20.2. By Application
  • 16.21. GCC Countries Semiconductor Assembly and Test Services Market Analysis
    • 16.21.1. By Service
    • 16.21.2. By Application
  • 16.22. Turkey Semiconductor Assembly and Test Services Market Analysis
    • 16.22.1. By Service
    • 16.22.2. By Application
  • 16.23. South Africa Semiconductor Assembly and Test Services Market Analysis
    • 16.23.1. By Service
    • 16.23.2. By Application
  • 16.24. Rest of Middle East and Africa Semiconductor Assembly and Test Services Market Analysis
    • 16.24.1. By Service
    • 16.24.2. By Application

17. Market Structure Analysis

  • 17.1. Market Analysis by Tier of Companies
  • 17.2. Market Share Analysis of Top Players
  • 17.3. Market Presence Analysis

18. Competition Analysis

  • 18.1. Competition Dashboard
  • 18.2. Competition Benchmarking
  • 18.3. Competition Deep Dive
    • 18.3.1. ASE Group, Inc.
      • 18.3.1.1. .Business Overview
      • 18.3.1.2. Solution Portfolio
      • 18.3.1.3. Profitability by Market Segments (Business Segments/Region)
      • 18.3.1.4. Key Strategy & Developments
    • 18.3.2. Amkor Technology, Inc.
      • 18.3.2.1. Business Overview
      • 18.3.2.2. Solution Portfolio
      • 18.3.2.3. Profitability by Market Segments (Business Segments/Region)
      • 18.3.2.4. Key Strategy & Developments
    • 18.3.3. Siliconware Precision Industries Co., Ltd.
      • 18.3.3.1. Business Overview
      • 18.3.3.2. Solution Portfolio
      • 18.3.3.3. Profitability by Market Segments (Business Segments/Region)
      • 18.3.3.4. Key Strategy & Developments
    • 18.3.4. Powertech Technology, Inc.
      • 18.3.4.1. Business Overview
      • 18.3.4.2. Solution Portfolio
      • 18.3.4.3. Profitability by Market Segments (Business Segments/Region)
      • 18.3.4.4. Key Strategy & Developments
    • 18.3.5. United Test and Assembly Center Ltd.
      • 18.3.5.1. Business Overview
      • 18.3.5.2. Solution Portfolio
      • 18.3.5.3. Profitability by Market Segments (Business Segments/Region)
      • 18.3.5.4. Key Strategy & Developments
    • 18.3.6. JCET Group Co Ltd
      • 18.3.6.1. Business Overview
      • 18.3.6.2. Solution Portfolio
      • 18.3.6.3. Profitability by Market Segments (Business Segments/Region)
      • 18.3.6.4. Key Strategy & Developments
    • 18.3.7. Chips Technologies, Inc.
      • 18.3.7.1. Business Overview
      • 18.3.7.2. Solution Portfolio
      • 18.3.7.3. Profitability by Market Segments (Business Segments/Region)
      • 18.3.7.4. Key Strategy & Developments
    • 18.3.8. Chipbond Technology Corporation.
      • 18.3.8.1. Business Overview
      • 18.3.8.2. Solution Portfolio
      • 18.3.8.3. Profitability by Market Segments (Business Segments/Region)
      • 18.3.8.4. Key Strategy & Developments
    • 18.3.9. King Yuan Electronics Co Ltd
      • 18.3.9.1. Business Overview
      • 18.3.9.2. Solution Portfolio
      • 18.3.9.3. Profitability by Market Segments (Business Segments/Region)
      • 18.3.9.4. Key Strategy & Developments
    • 18.3.10. .Unisem
      • 18.3.10.1. Business Overview
      • 18.3.10.2. Solution Portfolio
      • 18.3.10.3. Profitability by Market Segments (Business Segments/Region)
      • 18.3.10.4. Key Strategy & Developments

19. Assumptions and Acronyms Used

20. Research Methodology