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1372588

全球 ESD 封装市场 - 2023-2030

Global ESD Packaging Market - 2023-2030

出版日期: 2023年10月18日 | 出版商:

DataM Intelligence | 英文 206 Pages | 商品交期: 约2个工作天内

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简介目录

概述

全球ESD封装市场在2022年达到22亿美元，预计2030年将达到34亿美元，2023-2030年预测期间复合年增长率为5.7%。

ESD（静电放电）封装市场预计将受到电子产业的重大进步和创新的推动。智慧型 ESD 解决方案已经出现，可以即时检测和中和静电，增强保护并提高效率。奈米技术正在利用奈米材料彻底改变 ESD 保护，在保持纤薄外形的同时提供卓越的保护。

此外，物联网整合允许在包装解决方案中使用智慧感测器，从而实现即时监控和警报，以确保元件始终处于安全的静电环境中。此外，先进的 ESD 材料越来越受到关注，提供卓越的保护和长期的耐用性。这些发展对于保护敏感电子元件和适应电子产业不断变化的需求至关重要，例如 Malaster 的 ESD 安全橡皮筋和先进 ESD 材料等产品。

在电子产业的扩张和发展的推动下，亚太地区的ESD封装市场一直在经历显着的成长。中国政府于2022年宣布到2023年将国内电子元件市场扩大至2.1兆元人民币（3,270亿美元）。其雄心勃勃的目标反映了电子产业的巨大成长潜力，而电子产业是ESD封装市场的主要驱动力。中国政府的目标是培育15家具有全球竞争力、年销售额100亿元以上的电子元件企业。它注重竞争力，需要严格的品质控制和 ESD 保护，从而推动 ESD 封装市场的发展。

动力学

半导体产业推动先进 ESD 封装的需求

ESD 封装市场预计将随着全球半导体封装产业的成长而受到推动。根据半导体产业协会预测，该产业预计将在 2024 年反弹，预计将成长 11.9%。电子元件变得越来越敏感，任何静电放电都可能导致无法修復的损坏。因此，半导体製造商和供应商正在转向先进的 ESD 封装解决方案，以在储存和运输过程中保护其产品。

此外，半导体产业的波动和对敏感电子元件的需求推动了透过专业封装解决方案提供有效 ESD 保护的需求。随着半导体市场的復苏和扩大，对ESD封装材料和解决方案的需求预计将同步成长，为ESD封装市场提供机会，以满足半导体产业不断变化的需求。

永续发展推动电子产业对环保 ESD 封装的需求

对永续性的日益重视正在推动电子产业对静电放电包装解决方案的需求激增。随着环境问题和企业永续发展目标成为焦点，製造商和供应商正在寻求符合环保实践的 ESD 包装选项。永续的 ESD 包装材料（通常是可生物降解或可回收的）越来越受到关注，因为它们减少了与传统的不可生物降解材料（如泡沫和塑胶）相关的环境影响。

科德宝高性能材料公司推出了 Evolon ESD，这是一种技术包装纺织品，旨在防止静电放电并保护敏感表面，特别是在汽车和工业领域。 Evolon ESD 为装饰线、仪表板、后视镜和方向盘等组件提供保护，同时还可以防止微刮痕和绒毛污染。这种可持续的解决方案有助于减少废物，经久耐用，并由再生聚酯製成。

日益增长的环境问题

随着日益增长的环境问题和消费者对环保包装的偏好，特别是包装中常用的 PET 等材料的环境影响，ESD 包装市场可能会受到重大影响。 PET 是一种塑料，常用于 ESD 包装，它不可生物降解，会造成塑料污染。 PET 和其他塑料分解后会形成微塑料，很容易扩散到海洋和其他水体。

此外，这些微塑胶被水生生物消耗，最终进入食物链，并可能透过海鲜消费到达人类。人们对环境的关注引发了有关 ESD 包装材料的可持续性和长期影响的问题，促使业界探索更环保的替代品来缓解这些环境挑战。

The ESD (Electrostatic Discharge) packaging market is expected to be driven with significant advancements and innovations in the electronics industry. Smart ESD solutions have emerged, offering real-time detection and neutralization of static charges, enhancing protection and improving efficiency. Nanotechnology is revolutionizing ESD protection with nanomaterials that provide superior protection while maintaining a slim profile.

Furthermore, IoT integration allows for smart sensors in packaging solutions, enabling real-time monitoring and alerts to ensure components are always in a safe electrostatic environment. Additionally, advanced ESD materials are gaining traction, offering both superior protection and long-term durability. The developments, exemplified by products like Malaster's ESD Safe Rubber Bands and Advanced ESD Materials, are essential for safeguarding sensitive electronic components and adapting to the evolving needs of the electronics industry.

The ESD packaging market in the Asia-Pacific has been experiencing significant growth driven by the expansion and development of the electronics industry. The Chinese government in 2022 announced to expand the domestic market for electronic components to 2.1 trillion yuan (US$ 327 billion) by 2023. Its ambitious goal reflects the substantial growth potential in the electronics sector, which is a major driver of the ESD packaging market. The Chinese government aims to develop 15 globally competitive electronic components makers with annual sales of 10 billion yuan or more. It focusses on competitiveness requires stringent quality control and ESD protection, boosting the ESD packaging market.

Dynamics

Semiconductor Industry Drives Demand for Advanced ESD Packaging

The ESD packaging market is expected to be driven with the growing semiconductor packaging industry globally. According to the Semiconductor Industry Association, the industry is expected to rebound with a projected growth of 11.9% in 2024. Electronic components are becoming increasingly sensitive and any electrostatic discharge can lead to irreparable damage. As a result, semiconductor manufacturers and suppliers are turning to advanced ESD packaging solutions to safeguard their products during storage and transportation.

Furthermore, the semiconductor industry's fluctuations and demand for sensitive electronic components drive the need for effective ESD protection through specialized packaging solutions. As the semiconductor market recovers and expands, the demand for ESD packaging materials and solutions is expected to grow in tandem, providing opportunities for the ESD packaging market to cater to the evolving needs of the semiconductor sector.

Sustainability Drive Boosts Demand for Eco-Friendly ESD Packaging in Electronic

The increasing emphasis on sustainability is driving a surge in demand for electrostatic discharge packaging solutions in the electronics industry. As environmental concerns and corporate sustainability objectives take center stage, manufacturers and suppliers are seeking ESD packaging options that align with eco-friendly practices. Sustainable ESD packaging materials, often biodegradable or recyclable, are gaining traction as they reduce the environmental impact associated with traditional non-biodegradable materials like foam and plastics.

Freudenberg Performance Materials has introduced Evolon ESD, a technical packaging textile designed to prevent electrostatic discharge and safeguard sensitive surfaces, particularly in the automotive and industrial sectors. Evolon ESD offers protection for components like trim lines, dashboards, mirrors and steering wheels, while also preventing micro-scratches and lint contamination. The sustainable solution contributes to waste reduction, is long-lasting and is made from recycled polyester.

Growing Environmental Concerns

The ESD packaging market can be significantly impacted with growing environmental concerns and consumer preferences for eco-friendly packaging, particularly the environmental impact of materials like PET commonly used in packaging. PET which is a type of plastic, commonly used in ESD packaging, is not biodegradable and contributes to plastic pollution. PET and other plastics when break down, they form microplastics, which are easily spreadable in oceans and other water bodies.

Furthermore, these microplastics are consumed by aquatic life, eventually entering the food chain and potentially reaching humans through seafood consumption. It environmental concern raises questions about the sustainability and long-term impact of ESD packaging materials, prompting the industry to explore more eco-friendly alternatives to mitigate these environmental challenges.

Segment Analysis

The global ESD packaging market is segmented based on product, material, ESD classification, application, end-user and region.

ESD Bags Dominate the ESD Packaging Market with Crucial Role in Component Protection

In the ESD packaging market, bags hold the largest product type segment with a significant role in protecting sensitive electronic components and devices from electrostatic discharge. Many industries, including electronics, aerospace and medical devices, have strict ESD control requirements and standards. ESD bags are designed to meet these industry standards, ensuring compliance with regulations.

Furthermore, some ESD bags are designed to be reusable, reducing waste and environmental impact. It sustainability aspect is increasingly important in today's manufacturing and packaging practices. EcoCortec's Eco-Corr Film ESD represents a significant breakthrough in the realm of ESD packaging. It offers an eco-friendly alternative to conventional polyethylene electrostatic dissipating (ESD) films, aligning with the growing global emphasis on sustainability and reducing plastic waste.

Geographical Penetration

Asia-Pacific ESD Packaging Market Surges Alongside Electronics Industry Growth

The ESD packaging market in the Asia-Pacific has been experiencing significant growth, driven by the booming electronics industry. As per International Labour Organization report, China's electronics industry has been on a rapid growth trajectory. In 2020, the industry's value reached nearly US$ 350 billion, constituting about 25% of the global assembly value. It substantial industry size creates a strong demand for ESD packaging to protect sensitive electronic components and devices during manufacturing, storage and transportation.

Further, China consists of a substantial number of industrial enterprises in the electronics manufacturing sector. As of June 2020, there were 43,981 such enterprises in China, employing a total of 13.28 million workers. It extensive manufacturing base generates a continuous demand for ESD packaging materials and solutions to safeguard sensitive electronic products. Further more Make in India policy announced by government of India is also create=ing significant opportunities for the growth of ESD packaging market.

Competitive Landscape

The major global players in the market include: Nefab, Desco Industries, Inc., Protektive Pak, Conductive Containers, Inc., ACL Staticide, Teknis Limited, Statclean Technology (S) Pte Ltd, GWP Group, DS Smith plc and Sealed Air Corporation.

COVID-19 Impact Analysis:

The COVID-19 pandemic had a profound impact on the ESD packaging market, particularly on the electronics industry, bringing about significant changes and trends. As there was a surge in remote work, online education and increased time spent at home, people turned to electronic devices more than ever before which resulted in a booming electronics industry. Consumer habits shifted dramatically, with individuals spending increasingly more time online, which, in turn increases the demand for electronic devices.

However, there were also challenges, such as the rise of counterfeit electronics, disruptions in supply chains due to labor shortages and factory closures and the need for stringent quality control to maintain consumer trust. Despite these challenges, the electronics industry continues to thrive, with smartphones emerging as the dominating product, especially in initiatives related to COVID-19 contact tracing which the growth of ESD packaging demand at the times of pandemic.

Russia-Ukraine War Impact

The Russia-Ukraine war has a major impact on the ESD packaging market, particularly in the semiconductor sector. The immediate risk lies in the supply of specific raw materials used in semiconductor manufacturing, including neon and palladium. The materials are crucial for the production of semiconductor chips, which are integral to various electronic devices. The disruption in the semiconductor industry could significantly impact the ESD packaging market.

Furthermore, to mitigate potential supply chain disruptions, companies in the ESD packaging industry are constantly seeking alternative material sources, understanding their supply chains thoroughly, considering investments in recycling technologies and employing forward pricing strategies. The war's impact on the semiconductor supply chain underscores the importance of supply chain resilience in the industry.

By Product

Bags
Trays
Boxes & Containers
ESD Foam
ESD Films
Others

By Material

Conductive Plastics
Metal
Polyethylene (PE)
Polypropylene (PP)
Polyvinyl Chloride
Others

By ESD Classification

Anti-Static
Static Dissipative
Conductive

By Application

Electrical and Electronic Component
Equipment
Explosive Powder
Drugs

By End-User

Network and Telecommunication Industry
Consumer Electronics & Computer Peripheral
Automotive Industry
Military and Defense
Healthcare
Aerospace
Others

By Region

North America
- U.S.
- Canada
- Mexico

Europe
- Germany
- UK
- France
- Italy
- Russia
- Rest of Europe

South America
- Brazil
- Argentina
- Rest of South America

Asia-Pacific
- China
- India
- Japan
- Australia
- Rest of Asia-Pacific

Middle East and Africa

Key Developments

In September 2023, Alpha and Omega Semiconductor (AOS) has unveiled its MRigidCSP packaging technology, aimed at enhancing battery management applications. The technology is designed to reduce on-resistance while simultaneously increasing mechanical strength. Initially, AOS is offering MRigidCSP technology on its AOCR33105E, a 12V common-drain dual N-channel MOSFET. The packaging technology is well-suited for battery applications in devices like smartphones, tablets and ultra-thin notebooks.
In November 2022, Cortec has introduced a sustainable solution in the form of EcoSonic ESD-safe bags, addressing challenges in electronic product packaging. The bags provide ESD protection to prevent damage from static charges and incorporate bubble wrap for impact protection. What sets them apart is the integration of Nano VpCl lining, which releases corrosion-resistant compounds into the bag's internal atmosphere, forming a protective molecular-scale layer around the product. It protects against moisture and corrosion without affecting solderability.
In May 2023, Semtech has introduced its latest Transient Voltage Suppressors (TVS) product, the RClamp0822B, designed to offer high-performance electrostatic discharge (ESD) and surge protection. The versatile circuit protection platform aims to safeguard high-speed data interfaces across various circuit interfaces in industrial, data center and telecommunication applications. The RClamp0822B, with its very-low sub 1 picofarad loading capacitance, is ideal for protecting high-speed data lines from electrical transient threats. It also provides robust surge immunity and is packaged in a user-friendly SC-75 package, making it suitable for a wide range of industrial designs

Why Purchase the Report?

To visualize the global ESD packaging market segmentation based on product, material, ESD classification, application, end-user and region, as well as understand key commercial assets and players.
Identify commercial opportunities by analyzing trends and co-development.
Excel data sheet with numerous data points of microwave packaging market-level with all segments.
PDF report consists of a comprehensive analysis after exhaustive qualitative interviews and an in-depth study.
Product mapping available as excel consisting of key products of all the major players.

The global ESD packaging market report would provide approximately 60 tables, 65 figures and 206 Pages.

Target Audience 2023

Manufacturers/ Buyers
Industry Investors/Investment Bankers
Research Professionals
Emerging Companies

1. Methodology and Scope

1.1. Research Methodology
1.2. Research Objective and Scope of the Report

2. Definition and Overview

3. Executive Summary

3.1. Snippet By Product
3.2. Snippet By Material
3.3. Snippet By ESD Classification
3.4. Snippet By Application
3.5. Snippet By End-User
3.6. Snippet by Region

4. Dynamics

4.1. Impacting Factors
- 4.1.1. Drivers
  - 4.1.1.1. Semiconductor Industry Drives Demand for Advanced ESD Packaging
  - 4.1.1.2. Sustainability Drive Boosts Demand for Eco-Friendly ESD Packaging in Electronic
- 4.1.2. Restraints
  - 4.1.2.1. Growing Environmental Concerns
- 4.1.3. Opportunity
- 4.1.4. Impact Analysis

5. Industry Analysis

5.1. Porter's Five Force Analysis
5.2. Supply Chain Analysis
5.3. Pricing Analysis
5.4. Regulatory Analysis
5.5. Russia - Ukraine War Analysis
5.6. DMI Opinion

6. COVID-19 Analysis

6.1. Analysis of COVID-19
- 6.1.1. Scenario Before COVID
- 6.1.2. Scenario During COVID
- 6.1.3. Scenario Post COVID
6.2. Pricing Dynamics Amid COVID-19
6.3. Demand-Supply Spectrum
6.4. Government Initiatives Related to the Market During Pandemic
6.5. Manufacturers Strategic Initiatives
6.6. Conclusion

7. By Product

7.1. Introduction
- 7.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
- 7.1.2. Market Attractiveness Index, By Product
7.2. Bags*
- 7.2.1. Introduction
- 7.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
7.3. Trays
7.4. Boxes & Containers
7.5. ESD Foam
7.6. ESD Films
7.7. Others

8. By Material

8.1. Introduction
- 8.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Material
- 8.1.2. Market Attractiveness Index, By Material
8.2. Conductive Plastics*
- 8.2.1. Introduction
- 8.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
8.3. Metal
8.4. Polyethylene (PE)
8.5. Polypropylene (PP)
8.6. Polyvinyl Chloride
8.7. Others

9. By ESD Classification

9.1. Introduction
- 9.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By ESD Classification
- 9.1.2. Market Attractiveness Index, By ESD Classification
9.2. Anti-Static*
- 9.2.1. Introduction
- 9.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
9.3. Static Dissipative
9.4. Conductive

10. By Application

10.1. Introduction
- 10.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 10.1.2. Market Attractiveness Index, By Application
10.2. Electrical and Electronic Component*
- 10.2.1. Introduction
- 10.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
10.3. Equipment
10.4. Explosive Powder
10.5. Drugs

11. By End-User

11.1. Introduction
- 11.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 11.1.2. Market Attractiveness Index, By End-User
11.2. Network and Telecommunication Industry*
- 11.2.1. Introduction
- 11.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
11.3. Consumer Electronics & Computer Peripheral
11.4. Automotive Industry
11.5. Military and Defense
11.6. Healthcare
11.7. Aerospace
11.8. Others

12. By Region

12.1. Introduction
- 12.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Region
- 12.1.2. Market Attractiveness Index, By Region
12.2. North America
- 12.2.1. Introduction
- 12.2.2. Key Region-Specific Dynamics
- 12.2.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
- 12.2.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Material
- 12.2.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By ESD Classification
- 12.2.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 12.2.7. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 12.2.8. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 12.2.8.1. U.S.
  - 12.2.8.2. Canada
  - 12.2.8.3. Mexico
12.3. Europe
- 12.3.1. Introduction
- 12.3.2. Key Region-Specific Dynamics
- 12.3.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
- 12.3.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Material
- 12.3.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By ESD Classification
- 12.3.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 12.3.7. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 12.3.8. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 12.3.8.1. Germany
  - 12.3.8.2. UK
  - 12.3.8.3. France
  - 12.3.8.4. Italy
  - 12.3.8.5. Russia
  - 12.3.8.6. Rest of Europe
12.4. South America
- 12.4.1. Introduction
- 12.4.2. Key Region-Specific Dynamics
- 12.4.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
- 12.4.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Material
- 12.4.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By ESD Classification
- 12.4.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 12.4.7. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 12.4.8. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 12.4.8.1. Brazil
  - 12.4.8.2. Argentina
  - 12.4.8.3. Rest of South America
12.5. Asia-Pacific
- 12.5.1. Introduction
- 12.5.2. Key Region-Specific Dynamics
- 12.5.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
- 12.5.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Material
- 12.5.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By ESD Classification
- 12.5.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 12.5.7. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 12.5.8. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 12.5.8.1. China
  - 12.5.8.2. India
  - 12.5.8.3. Japan
  - 12.5.8.4. Australia
  - 12.5.8.5. Rest of Asia-Pacific
12.6. Middle East and Africa
- 12.6.1. Introduction
- 12.6.2. Key Region-Specific Dynamics
- 12.6.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
- 12.6.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Material
- 12.6.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By ESD Classification
- 12.6.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 12.6.7. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User

13. Competitive Landscape

13.1. Competitive Scenario
13.2. Market Positioning/Share Analysis
13.3. Mergers and Acquisitions Analysis

14. Company Profiles

14.1. Nefab*
- 14.1.1. Company Overview
- 14.1.2. Product Portfolio and Description
- 14.1.3. Financial Overview
- 14.1.4. Key Developments
14.2. Desco Industries, Inc.
14.3. Protektive Pak
14.4. Conductive Containers, Inc.
14.5. ACL Staticide
14.6. Teknis Limited
14.7. Statclean Technology (S) Pte Ltd
14.8. GWP Group
14.9. DS Smith plc
14.10. Sealed Air Corporation

LIST NOT EXHAUSTIVE

15. Appendix

15.1. About Us and Services
15.2. Contact Us

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