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市场调查报告书
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1446792

全球 AMB 基板市场 - 2024-2031

Global AMB Substrate Market - 2024-2031

出版日期: | 出版商: DataM Intelligence | 英文 181 Pages | 商品交期: 约2个工作天内

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简介目录

概述

2023年,全球AMB(活性金属焊焊)基板市场规模达13亿美元,预计2031年将达到19亿美元,2024-2031年预测期间CAGR为4.9%。

随着5G、物联网和电动车等新技术的出现,对具有特殊特性的陶瓷基板的需求将会更大,从而使活性金属焊焊陶瓷基板市场扩展到新的应用领域。 5G 网路的部署以及对更快无线通讯系统日益增长的需求,需要使用能够处理高频和功率密度的现代电气元件。

爱立信表示,预计2019年至2027年全球5G用户将快速成长,从超过1,200万人增加到超过40亿。预测使用者数量最多的地区包括东北亚、东南亚、印度、尼泊尔和不丹。 AMB 陶瓷基板具有良好的温度管理和电绝缘性,使其适用于基地台、天线和射频模组。

到2022年,北美预计将成为全球AMB基板市场的第二个主导地区,覆盖20%以上的市场份额。北美是医疗器材创新的中心。诊断设备、影像设备和穿戴式健康技术等医疗电子产品的进步有助于推动对 AMB 基板的需求。该地区以众多行业的大量研发活动而闻名。

动力学

陶瓷和焊焊合金的进步

具有改进导热性的先进陶瓷可以放入 AMB 基板中。它提高了基板散发电子元件产生的热量的能力,这对于维持高性能设备的最佳工作温度至关重要。陶瓷和焊焊合金的进步有助于製造具有更高机械强度和耐用性的基材。

它需要在製造和使用过程中支撑电子元件、保持结构完整性并承受机械负载。材料的进步有助于创建多层 AMB 基板,每层的品质都得到最佳化。它允许製造满足讯号完整性、热控制和结构支撑特定要求的基板。

对先进电子产品的需求不断增长

包括各种技术和小工具在内的先进电子产品越来越多地应用于日常生活和工业应用。 AMB 基板对于为当今的小型化和创新电子元件提供结构和电气支援至关重要。基板对于支援微型和轻型设备中包含的复杂电路和组件至关重要。

主要公司正在生产各种产品,以满足对先进电子产品日益增长的需求,创造了无数的市场前景。例如,2021 年 5 月,惠而浦公司与 VTEX(一家提供全球完全整合的端到端商务解决方案的全球科技企业)合作,在製定数位商务策略中发挥至关重要的作用。

有限的兼容性和环境问题

活性金属焊焊方法仅限于能够成功黏合在一起的陶瓷和金属的种类。它减少了可用材料组合的数量并影响市场的成长潜力。 AMB 陶瓷基板通常由低 CTE 陶瓷製成,例如氧化铝或氮化铝。

相较之下,AMB 程式中使用的金属焊焊合金(例如铜基或银基合金)具有更高的 CTE 值。活性金属焊焊涉及的生产方法可能会使用有害物质或产生必须妥善处置的废物。严格的环境规则可能会为企业带来合规难度和成本。

遵守製造商规范并与合格的 HVAC 专业人员合作可以提供重要的见解并确保遵循正确的维护实务。此外,发展中国家缺乏有利的报销方案和技术采用、对医疗器材征收过高的关税以及低收入和中等收入国家缺乏足够的基础设施预计将阻碍市场。

目录

第 1 章:方法与范围

  • 研究方法论
  • 报告的研究目的和范围

第 2 章:定义与概述

第 3 章:执行摘要

  • 按类型分類的片段
  • 按应用程式片段
  • 按地区分類的片段

第 4 章:动力学

  • 影响因素
    • 司机
      • 陶瓷和焊焊合金的进步
      • 对先进电子产品的需求不断增长
    • 限制
      • 有限的兼容性和环境问题
    • 机会
    • 影响分析

第 5 章:产业分析

  • 波特五力分析
  • 供应链分析
  • 定价分析
  • 监管分析
  • 俄乌战争影响分析
  • DMI 意见

第 6 章:COVID-19 分析

  • COVID-19 分析
    • 新冠疫情爆发前的情景
    • 新冠疫情期间的情景
    • 新冠疫情后的情景
  • COVID-19 期间的定价动态
  • 供需谱
  • 疫情期间政府与市场相关的倡议
  • 製造商策略倡议
  • 结论

第 7 章:按类型

  • Si3N4 AMB 基板
  • AlN AMB 基板

第 8 章:按应用

  • 汽车
  • 电子产品
  • 新能源及电网
  • 军事与航太
  • 工业的
  • 其他的

第 9 章:按地区

  • 北美洲
    • 我们
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 法国
    • 义大利
    • 俄罗斯
    • 欧洲其他地区
  • 南美洲
    • 巴西
    • 阿根廷
    • 南美洲其他地区
  • 亚太
    • 中国
    • 印度
    • 日本
    • 澳洲
    • 亚太其他地区
  • 中东和非洲

第 10 章:竞争格局

  • 竞争场景
  • 市场定位/份额分析
  • 併购分析

第 11 章:公司简介

  • Rogers Corporation
    • 公司简介
    • 产品组合和描述
    • 财务概览
    • 主要进展
  • Winning Imperatives
  • Heraeus Electronics
  • Kyocera
  • NGK Electronics Devices
  • Toshiba Materials
  • Denka
  • DOWA METALTECH
  • Ferrotec
  • BYD

第 12 章:附录

简介目录
Product Code: MA7960

Overview

Global AMB (Active Metal Brazed) Substrate Market reached US$ 1.3 billion in 2023 and is expected to reach US$ 1.9 billion by 2031, growing with a CAGR of 4.9% during the forecast period 2024-2031.

As new technologies arise, such as 5G, the Internet of Things and electric vehicles, there will be a greater need for ceramic substrates with specialised characteristics, allowing the active metal brazed ceramic substrate market to expand into new application areas. The deployment of 5G networks, as well as the growing need for faster wireless communication systems, necessitate the use of modern electrical components that can handle high frequencies and power densities.

In accordance with Ericsson, global 5G subscriptions are expected to increase rapidly between 2019 and 2027, from more than 12 million to over 4 billion. The regions with the highest predicted number of subscribers include North East Asia, South East Asia, India, Nepal and Bhutan. AMB ceramic substrates provide good temperature management and electrical insulation, making them appropriate for use in base stations, antennas and RF modules.

In 2022, North America is expected to hold the second-dominant region in the global AMB substrate market covering over 20% of the market. North America is a hub of medical device innovation. Advances in medical electronics, such as diagnostic equipment, imaging devices and wearable health technology, help to drive demand for AMB substrates. The region is distinguished by considerable R&D operations in numerous industries.

Dynamics

Advancements in Ceramics and Brazing Alloys

Advanced ceramics with improved heat conductivity can be put into AMB substrates. It increases the substrate's ability to dissipate heat generated by electronic components, which is critical for maintaining optimal operating temperatures in high-performance devices. Ceramic and brazing alloy advancements help to build substrates with greater mechanical strength and durability.

It is required to support electronic components, maintain structural integrity and withstand mechanical loads during manufacturing and use. Material advancements help to create multilayered AMB substrates with optimised qualities in each layer. It allows for the fabrication of substrates that meet specific requirements for signal integrity, thermal control and structural support.

Rising Demand for Advanced Electronics

Advanced electronics, which include a variety of technologies and gadgets, are increasingly being used in everyday life and industrial applications. AMB substrates are essential in providing structural and electrical support for today's miniaturised and innovative electronic components. The substrates are critical for supporting the sophisticated circuitry and components included in tiny and lightweight gadgets.

Key firms are producing a diverse range of products to fulfil the increasing demand for advanced electronics, creating a myriad of market prospects. For example, in May 2021, Whirlpool Corporation collaborated with VTEX, a globally tech business that offers global, fully integrated end-to-end commerce solutions, to play a vital role in developing digital commerce strategy.

Limited Compatibility and Environmental Concerns

Active metal brazing methods are limited in the sorts of ceramics and metals that can be successfully bonded together. It reduces the number of accessible material combinations and impact the market's growth potential. AMB ceramic substrates are typically built of low-CTE ceramics like alumina or aluminum nitride.

In contrast, metal brazing alloys utilised in AMB procedures, such as copper or silver-based alloys, have greater CTE values. The production methods involved in active metal brazing may employ hazardous substances or produce waste items that must be properly disposed of. Stringent environmental rules can make compliance difficult and costly for enterprises.

Adhering to manufacturer specifications and collaborating with qualified HVAC professionals can provide significant insights and ensure proper maintenance practices are followed. Furthermore, the absence of favourable reimbursement scenarios and technology adoption in developing nations, excessive customs tax imposed on medical devices and lack of sufficient infrastructure in low- and middle-income countries are expected to hamper the market.

Segment Analysis

The global AMB substrate market is segmented based type, application and region.

Rising Demand for AMB Substrate in Automotive

Automotive is expected to drive the market demand with a share of about 1/3rd of the global AMB substrate market in 2022. As a result of their superior thermal and mechanical capabilities, the automotive industry is increasingly using active metal brazed ceramic substrates into components such as power electronics modules, sensors and exhaust gas management devices. AMB ceramic substrates are utilised in EV power modules, motor drives and battery management systems to provide reliable thermal and electrical insulation.

According to the International Energy Agency, the electric car market is expanding at an exponential rate, with sales exceeding 10 million by 2022. In 2022, electric vehicles accounted for 14% of all new automobile sales, up from 9% in 2021 and less than 5% in 2020. According to the IEA Stated Policies Scenario, the global forecast for the percentage of electric car sales based on existing policies and business aims has climbed to 35% in 2031, up from less than 25% in the prior outlook. The increased acceptance and production of EVs globally will boost the segment's growth.

Geographical Penetration

Rising Adoption of Connected Devices in Asia-Pacific

During the forecast period, Asia-Pacific is expected to be the dominant region in global AMB substrate market with over 1/3rd of the market. The growing popularity of smart devices, such as smartphones, tablets, smartwatches and other connected devices, drives up demand for AMB substrates utilised in their manufacture. AMB substrates play an important part in the production of electronic components utilised in modern cars, which helps to drive market growth.

Strong market giants such as Oppo, Xiaomi and Vivo are headquartered in Asia-Pacific. According to GSMA, smartphone usage in the Asia-Pacific area reached 74% in 2021 and is expected to climb to 84% by 2025. Furthermore, it is estimated that 62% of mobile customers will be present in the same year. The smartphone adoption rate in the region is expected to reach 20% between 2019 and 2025.

Competitive Landscape

The major global players in the market include Rogers Corporation, Winning Imperatives, Heraeus Electronics, Kyocera, NGK Electronics Devices, Toshiba Materials, Denka, DOWA METALTECH, Ferrotec and BYD.

COVID-19 Impact Analysis

The pandemic disrupted global supply networks, disrupting the production and shipment of materials necessary to manufacture AMB substrates. Lockdowns, social distance and worker disruptions caused manufacturing delays and temporary shutdown of production facilities, affecting the output of AMB substrates. The AMB substrate market is strongly related to end-user sectors including automotive and telecoms.

During the pandemic, the picture for global EV sales was uncertain at the start of the year. However, 2020 proved to be a surprise positive year, with global EV sales increasing by 43% over 2019 and the global electric car industry market share reaching a record 4.6% in 2020. The slowdown in these industries during the epidemic influenced the demand for AMB substrates.

Russia-Ukraine War Impact

The conflict interrupted the supply chain for materials needed in AMB substrate manufacture. Closures, logistical issues or personnel interruptions have a direct influence on the region's industrial facilities, affecting AMB substrate production. Geopolitical developments cause economic uncertainty, influencing global markets.

Uncertainty may influence investment decisions and overall demand for technology components, particularly AMB substrates. Depending on the commodities received from the region, costs fluctuated owing to geopolitical tensions and supply chain interruptions. Companies in the AMB substrate market may consider diversifying their supply chains to reduce the risks associated with reliance on specific locations.

By Type

  • Si3N4 AMB Substrates
  • AlN AMB Substrates

By Application

  • Automotive
  • Electronics
  • New Energy & Power Grid
  • Military & Aerospace
  • Industrial
  • Others

By Region

  • North America
    • U.S.
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • France
    • Italy
    • Russia
    • Rest of Europe
  • South America
    • Brazil
    • Argentina
    • Rest of South America
  • Asia-Pacific
    • China
    • India
    • Japan
    • Australia
    • Rest of Asia-Pacific
  • Middle East and Africa

Key Developments

  • In November 2023, Tecdia Co. Ltd. recently announced a significant development by opening its newest office in Chengdu, China. Chengdu, the country's third largest city and known for its significant developments in telecommunications and high technology, represents an attractive market for Tecdia's main product, single-layer ceramic capacitors.
  • In May 2022, Heraeus Electronics introduced the Condura.ultra Ag-free AMB substrate. The metal substrate is well-suited for power electronics uses.
  • In July 2021, Daleba Electronics Ltd. recently created a new AMB ceramic substrate for power electronics solutions. The active metal brazing process allows for double-sided copper weighing on 0.25mm thin ceramic substrates.

Why Purchase the Report?

  • To visualize the global AMB substrate market segmentation based on type, application and region, as well as understand key commercial assets and players.
  • Identify commercial opportunities by analyzing trends and co-development.
  • Excel data sheet with numerous data points of AMB substrate market-level with all segments.
  • PDF report consists of a comprehensive analysis after exhaustive qualitative interviews and an in-depth study.
  • Product mapping available as excel consisting of key products of all the major players.

The global AMB substrate market report would provide approximately 49 tables, 41 figures and 181 pages.

Target Audience 2024

  • Manufacturers/ Buyers
  • Industry Investors/Investment Bankers
  • Research Professionals
  • Emerging Companies

Table of Contents

1. Methodology and Scope

  • 1.1. Research Methodology
  • 1.2. Research Objective and Scope of the Report

2. Definition and Overview

3. Executive Summary

  • 3.1. Snippet by Type
  • 3.2. Snippet by Application
  • 3.3. Snippet by Region

4. Dynamics

  • 4.1. Impacting Factors
    • 4.1.1. Drivers
      • 4.1.1.1. Advancements in Ceramics and Brazing Alloys
      • 4.1.1.2. Rising Demand for Advanced Electronics
    • 4.1.2. Restraints
      • 4.1.2.1. Limited Compatibility and Environmental Concerns
    • 4.1.3. Opportunity
    • 4.1.4. Impact Analysis

5. Industry Analysis

  • 5.1. Porter's Five Force Analysis
  • 5.2. Supply Chain Analysis
  • 5.3. Pricing Analysis
  • 5.4. Regulatory Analysis
  • 5.5. Russia-Ukraine War Impact Analysis
  • 5.6. DMI Opinion

6. COVID-19 Analysis

  • 6.1. Analysis of COVID-19
    • 6.1.1. Scenario Before COVID
    • 6.1.2. Scenario During COVID
    • 6.1.3. Scenario Post COVID
  • 6.2. Pricing Dynamics Amid COVID-19
  • 6.3. Demand-Supply Spectrum
  • 6.4. Government Initiatives Related to the Market During Pandemic
  • 6.5. Manufacturers Strategic Initiatives
  • 6.6. Conclusion

7. By Type

  • 7.1. Introduction
    • 7.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 7.1.2. Market Attractiveness Index, By Type
  • 7.2. Si3N4 AMB Substrates*
    • 7.2.1. Introduction
    • 7.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  • 7.3. AlN AMB Substrates

8. By Application

  • 8.1. Introduction
    • 8.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 8.1.2. Market Attractiveness Index, By Application
  • 8.2. Automotive*
    • 8.2.1. Introduction
    • 8.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  • 8.3. Electronics
  • 8.4. New Energy & Power Grid
  • 8.5. Military & Aerospace
  • 8.6. Industrial
  • 8.7. Others

9. By Region

  • 9.1. Introduction
    • 9.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Region
    • 9.1.2. Market Attractiveness Index, By Region
  • 9.2. North America
    • 9.2.1. Introduction
    • 9.2.2. Key Region-Specific Dynamics
    • 9.2.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 9.2.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 9.2.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 9.2.5.1. U.S.
      • 9.2.5.2. Canada
      • 9.2.5.3. Mexico
  • 9.3. Europe
    • 9.3.1. Introduction
    • 9.3.2. Key Region-Specific Dynamics
    • 9.3.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 9.3.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 9.3.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 9.3.5.1. Germany
      • 9.3.5.2. UK
      • 9.3.5.3. France
      • 9.3.5.4. Italy
      • 9.3.5.5. Russia
      • 9.3.5.6. Rest of Europe
  • 9.4. South America
    • 9.4.1. Introduction
    • 9.4.2. Key Region-Specific Dynamics
    • 9.4.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 9.4.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 9.4.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 9.4.5.1. Brazil
      • 9.4.5.2. Argentina
      • 9.4.5.3. Rest of South America
  • 9.5. Asia-Pacific
    • 9.5.1. Introduction
    • 9.5.2. Key Region-Specific Dynamics
    • 9.5.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 9.5.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 9.5.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 9.5.5.1. China
      • 9.5.5.2. India
      • 9.5.5.3. Japan
      • 9.5.5.4. Australia
      • 9.5.5.5. Rest of Asia-Pacific
  • 9.6. Middle East and Africa
    • 9.6.1. Introduction
    • 9.6.2. Key Region-Specific Dynamics
    • 9.6.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 9.6.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application

10. Competitive Landscape

  • 10.1. Competitive Scenario
  • 10.2. Market Positioning/Share Analysis
  • 10.3. Mergers and Acquisitions Analysis

11. Company Profiles

  • 11.1. Rogers Corporation*
    • 11.1.1. Company Overview
    • 11.1.2. Product Portfolio and Description
    • 11.1.3. Financial Overview
    • 11.1.4. Key Developments
  • 11.2. Winning Imperatives
  • 11.3. Heraeus Electronics
  • 11.4. Kyocera
  • 11.5. NGK Electronics Devices
  • 11.6. Toshiba Materials
  • 11.7. Denka
  • 11.8. DOWA METALTECH
  • 11.9. Ferrotec
  • 11.10. BYD

LIST NOT EXHAUSTIVE

12. Appendix

  • 12.1. About Us and Services
  • 12.2. Contact Us