三星电子有限公司的 5G NR 数字 BBU CDU50

本报告对支持5G NR数字基带单元中5G NR gNodeB的分布式单元（DU）和集中单元（CU）功能的三星电子CDU50系统进行了全面分析，并描述了系统功能、高级机械分析、组件图等。

内容

执行摘要

• 主动/被动组件概览
• 重要提示

第 1 章三星 5G CDU

• 基带单元概述

第二章力学分析

• 底盘框架（SHELF）
• 底盘大樑后盖
• 空气过滤装置
• 直流电源母线单元

第 3 章风扇单元

• 独立风扇单元

第 4 章电源/信号背板分布 PCB (UCDB)

第五章 GMA1-A1A 管理卡

• 塑料防护罩
• 前面板
• GMA1-A1A 电路板
• GMA1-A1APCB顶级有源元件分析
• GMA1-A1APCB顶级被动元件分析
• GMA1-A1APCB底部有源元件分析
• GMA1-A1APCB底部无源元件分析

第 6 章 GCB1-C1A 信道调製解调器 PCB

• GCB1-C1A塑料屏蔽罩
• 前面板
• GCB1-C1A PCB
• GCB1-C1APCB顶部有源元件分析
• GCB1-C1APCB顶级被动元件分析
• GCB1-C1APCB底部有源元件分析
• GCB1-C1APCB底部无源元件分析

第 7 章 GMA1-A1AIC 散热片

第 8 章 GCB1-C1AIC 散热器

• 附录 A：成分分析
• 附录 B：按系统区域划分的组件
• 附录 C：供应商的有源元件
• 附录 D：供应商的无源组件

This report provides a comprehensive analysis for the Samsung Electronics CDU50 system. This product is a 5G NR digital baseband unit and supports the distributed unit (DU) and centralized unit (CU) functions of a 5G NR gNodeB.

Features

• System Functional Description

• System Level Block Diagrams

• High Level Mechanical Analysis
  • Heat Sink
  • Heat Fins

• High Level PCB Analysis

• Component Diagrams
  • Semiconductor/component locations on PCB

• High Level Bill of Materials
  • Semiconductor ICs (ASICs, FPGAs, memory, logic, power, etc.)
  • Passive/other components (Transformers, Power inductors, Power capacitors, power/datacom/optical connectors)
  • Complete Part Number/Marking
  • Component Manufacturer Identification
  • Function Component Description
  • Package Type

• Excludes analysis of passive chip resistors, capacitors, and inductors

• Total Pages: 135
• Total Exhibits: 138
• Total Tables: 22

TABLE OF CONTENTS

EXECUTIVE SUMMARY

• Active/Passive Component Summary
• Important Note:

CHAPTER 1: SAMSUNG 5G CDU

• Overview of Baseband Unit

CHAPTER 2: MECHANICAL ANALYSIS

• Chassis Frame (SHELF)
• Chassis Frame Back Cover
• Air Filter Unit
• DC Power Busbar Unit

CHAPTER 3: FAN UNIT

• Individual Fan Unit

CHAPTER 4: POWER/SIGNAL BACKPLANE DISTRIBUTION PCB (UCDB)

CHAPTER 5: GMA1-A1A MANAGEMENT CARD

• Plastic Shield
• Front Panel
• GMA1-A1A PCB
• GMA1-A1A PCB Top Active Component Analysis
• GMA1-A1A PCB Top Passive Component Analysis
• GMA1-A1A PCB Bottom Active Component Analysis
• GMA1-A1A PCB Bottom Passive Component Analysis

CHAPTER 6: GCB1-C1A CHANNEL MODEM PCB

• GCB1-C1A Plastic Shield
• Front Panel
• GCB1-C1A PCB
• GCB1-C1A PCB Top Active Component Analysis
• GCB1-C1A PCB Top Passive Component Analysis
• GCB1-C1A PCB Bottom Active Component Analysis
• GCB1-C1A PCB Bottom Passive Component Analysis

CHAPTER 7: GMA1-A1A IC HEAT SINKS

CHAPTER 8: GCB1-C1A IC HEAT SINKS

• APPENDIX A: COMPONENT ANALYSIS
• APPENDIX B: COMPONENTS BY SYSTEM AREA
• APPENDIX C: ACTIVE COMPONENTS BY SUPPLIER
• APPENDIX D: PASSIVE COMPONENTS BY SUPPLIER

TABLES

• Table 1: Environmental Data
• Table 2: DC Power Supply Requirements
• Table 3: Power Consumption
• Table 4: FANM-C4N Bill of Materials
• Table 5: Fan Unit Controller PCB Top, Bill of Materials
• Table 6: Fan Unit Controller PCB Bottom, Bill of Materials
• Table 7: Fan Unit DC Connector Pinout
• Table 8: UCDB PCB, Top Bill of Materials
• Table 9: UCDB PCB, Bottom Bill of Materials
• Table 10: GMA1-A1A Interface Port Functions
• Table 11: GMA1-A1A PCB Top Active Bill of Materials
• Table 12: GMA1-A1A PCB Top Active Bill of Materials (cont.)
• Table 13: GMA1-A1A PCB Top Passive Only Bill of Materials
• Table 14: GMA1-A1A PCB Bottom Passive Only Bill of Materials
• Table 15: GCB1-C1A Interface Port Functions
• Table 16: GCB1-C1A PCB Top Active Bill of Materials
• Table 17: GCB1-C1A PCB Top Active Bill of Materials (cont.)
• Table 18: GCB1-C1A PCB Top Passive Only Bill of Materials
• Table 19: GCB1-C1A PCB Bottom Passive Only Bill of Materials
• Table 20: CDU50 System Unit PCBs by Component Type
• Table 21: CDU50 System Unit PCBs by Active Component Vendor
• Table 22: CDU50 System Unit PCBs by Passive/Connector/Other Component Vendor