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市场调查报告书
商品编码
1473784

中介层和扇出 WLP 市场 - 按封装组件（中介层、FOWLP）、按应用、按封装类型（2.5D、3D）、按最终用户（消费电子、电信、工业、汽车、军事和航太）和预测, 2024 - 2032

Interposer and Fan-out WLP Market - By Packaging Component (Interposer, FOWLP), By Application, By Packaging Type (2.5D, 3D), By End-User (Consumer Electronics, Telecommunication, Industrial, Automotive, Military & Aerospace) & Forecast, 2024 - 2032
出版日期: | 出版商: Global Market Insights Inc. | 英文 250 Pages | 商品交期: 2-3个工作天内

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简介目录

在对异质整合和3D 封装的关注、对更高功能和更小外形尺寸的需求以及工业自动化和汽车电子的扩张的推动下，全球中介层和扇出WLP 市场在2024 年至2032 年期间将以12% 的复合年增长率成长。

随着消费者对平板电脑和智慧型手机等便携式电子设备的需求持续增长，製造商面临着提供更高性能、改进功能和更小外形尺寸的产品的压力。根据 Gitnux 的数据，到 2025 年，仅全球行动用户就可能达到 74.9 亿，而 2021 年为 71 亿。更时尚、更强大的设备的开发。此外，这些先进的封装解决方案允许实现异质整合。因此，製造商可以满足消费者对提供增强功能、更好连接性和更高能源效率的设备日益增长的需求，从而实现行业扩张。

中介层和扇出 WLP 市场根据最终用途、封装组件、封装类型、应用和区域进行分类。

随着中介层和扇出 WLP 技术在工业自动化、汽车电子、航空航太和国防系统中的广泛应用，到 2032 年，工业领域将获得不错的估值。在工业自动化中，中介层和扇出 WLP 能够将复杂的电子元件整合到紧凑且坚固的外形尺寸中，从而提高系统的可靠性和性能。同样，在汽车电子领域，这些封装技术促进了电子控制单元 (ECU) 的小型化，从而提高了车辆的安全性、效率和连接性。

到 2032 年，中介层细分市场将占据适度的中介层和扇出 WLP 市场份额，因为它支援高密度互连和异构整合。中介层用作中间基板，允许将不同的半导体装置（例如逻辑装置、记忆体和感测器）无缝整合到单一封装上。透过缩短互连长度并减少寄生效应，基于中介层的封装解决方案可提供卓越的电气性能和讯号完整性。

由于领先的半导体製造商、电子 OEM 和封装服务提供商的存在，亚太地区中介层和扇出 WLP 行业将在研究期间显着增长。中国、日本、韩国和台湾等国家处于半导体製造和创新的前沿，推动了中介层和扇出 WLP 技术的采用。此外，消费性电子产业的快速扩张，加上对5G基础设施和物联网技术的投资不断增加，预计将进一步推动该地区的市场成长。

目录

第 1 章：方法与范围

第 2 章：执行摘要

第 3 章：产业洞察

  • 产业生态系统分析
  • 利润率分析
  • 技术与创新格局
  • 专利分析
  • 重要新闻和倡议
  • 监管环境
  • 衝击力
    • 成长动力
      • 对电子设备小型化的需求不断增长推动了成长
      • 智慧型手机和穿戴式装置越来越多地采用先进封装解决方案
      • 半导体设计复杂性的增加增加了对中介层和扇出 WLP 的需求
      • 增加在资料中心的使用，以提高效能和能源效率
      • 对 5G 技术的日益关注刺激了对先进封装解决方案的需求
    • 产业陷阱与挑战
      • 热管理
      • 标准和相容性挑战
  • 成长潜力分析
  • 波特的分析
  • PESTEL分析

第 4 章：竞争格局

  • 介绍
  • 公司市占率分析
  • 竞争定位矩阵
  • 战略展望矩阵

第 5 章：市场估计与预测：依封装组件，2018 - 2032 年

  • 主要趋势
  • 中介层
  • 晶圆级封装

第 6 章：市场估计与预测：按应用划分，2018 年 - 2032 年

  • 主要趋势
  • MEMS 或感测器
  • 成像与光电
  • 记忆
  • 逻辑IC
  • LED
  • 其他的

第 7 章：市场估计与预测：依封装类型，2018 年 - 2032 年

  • 主要趋势
  • 2.5D
  • 3D

第 8 章：市场估计与预测：按最终用户划分，2018 年 - 2032 年

  • 主要趋势
  • 消费性电子产品
  • 汽车
  • 工业领域
  • 电信
  • 军事与航空航太
  • 其他的

第 9 章：市场估计与预测：按地区划分，2018 年 - 2032 年

  • 主要趋势
  • 北美洲
    • 我们
    • 加拿大
  • 欧洲
    • 英国
    • 德国
    • 法国
    • 义大利
    • 西班牙
    • 俄罗斯
    • 欧洲其他地区
  • 亚太地区
    • 中国
    • 印度
    • 日本
    • 韩国
    • 澳新银行
    • 亚太地区其他地区
  • 拉丁美洲
    • 巴西
    • 墨西哥
    • 拉丁美洲其他地区
  • MEA
    • 阿联酋
    • 沙乌地阿拉伯
    • 南非
    • MEA 的其余部分

第 10 章：公司简介

  • ALLVIA, Inc.
  • AMETEK Inc.
  • Amkor Technology
  • ASE Technology Holding Co., Ltd.
  • ASTI Holdings Limited
  • Broadcom
  • Infineon Technologies AG
  • Intel Corporation
  • LAM RESEARCH CORPORATION
  • Murata Manufacturing Co., Ltd.
  • Powertech Technology Inc.
  • Qualcomm Technologies, Inc.
  • SAMSUNG
  • Siliconware Precision Industries Co.
  • STMicroelectronics
  • Taiwan Semiconductor Manufacturing Company Limited
  • Texas Instruments Incorporated
  • TOSHIBA CORPORATION
  • United Microelectronics Corporation
简介目录
Product Code: 8177

Global Interposer and Fan-out WLP Market will grow at 12% CAGR during 2024-2032, driven by a focus on heterogeneous integration and 3D packaging, the need for higher functionality and reduced form factors, and expansion of industrial automation and automotive electronics.

As consumer demand for portable electronic devices such as tablets and smartphones continues to rise, manufacturers are under pressure to deliver products with higher performance, improved functionality, and smaller form factors. The rising demand can be seen from the fact that, as per Gitnux, Global mobile users alone could reach 7.49 billion by 2025, up from 7.1 billion in 2021. Interposer and Fan-out WLP technologies enable the integration of multiple functions and components into compact packages, facilitating the development of sleeker, more powerful devices. Additionally, these advanced packaging solutions allow for the implementation of heterogeneous integration. As a result, manufacturers can meet the increasing demands of consumers for devices that offer enhanced features, better connectivity, and improved energy efficiency, thereby enabling industry expansion.

The Interposer and Fan-out WLP Market is classified based on end-use, packaging component, packaging type, application, and region.

The industrial sector segment will garner a decent valuation by 2032 as Interposer and Fan-out WLP technologies find extensive applications in industrial automation, automotive electronics, aerospace, and defense systems. In industrial automation, Interposer and Fan-out WLP enable the integration of complex electronic components in compact and ruggedized form factors, enhancing system reliability and performance. Similarly, in automotive electronics, these packaging technologies facilitate the miniaturization of electronic control units (ECUs), leading to improved vehicle safety, efficiency, and connectivity.

The interposer segment will capture a modest interposer and fan-out WLP market share by 2032, as it enables high-density interconnects and heterogeneous integration. Interposers serve as intermediate substrates that allow seamless integration of disparate semiconductor devices, such as logic, memory, and sensors, onto a single package. By enabling shorter interconnection lengths and reducing parasitic effects, interposer-based packaging solutions offer superior electrical performance and signal integrity.

Asia Pacific interposer and fan-out WLP industry will grow significantly during the study period, owing to the presence of leading semiconductor manufacturers, electronics OEMs, and packaging service providers. Countries like China, Japan, South Korea, and Taiwan are at the forefront of semiconductor manufacturing and innovation, fueling the adoption of Interposer and Fan-out WLP technologies. Moreover, the rapid expansion of the consumer electronics industry, coupled with increasing investments in 5G infrastructure and IoT technologies, is expected to further propel market growth in the region.

Table of Contents

Chapter 1 Methodology & Scope

  • 1.1 Market scope & definitions
  • 1.2 Base estimates & calculations
  • 1.3 Forecast calculations
  • 1.4 Data sources
    • 1.4.1 Primary
    • 1.4.2 Secondary
      • 1.4.2.1 Paid sources
      • 1.4.2.2 Public sources

Chapter 2 Executive Summary

  • 2.1 Industry 360-degree synopsis, 2018 - 2032

Chapter 3 Industry Insights

  • 3.1 Industry ecosystem analysis
  • 3.2 Profit margin analysis
  • 3.3 Technology & innovation landscape
  • 3.4 Patent analysis
  • 3.5 Key news & initiatives
  • 3.6 Regulatory landscape
  • 3.7 Impact forces
    • 3.7.1 Growth drivers
      • 3.7.1.1 Increasing demand for miniaturization in electronic devices drives growth
      • 3.7.1.2 Growing adoption of advanced packaging solutions in smartphones and wearables
      • 3.7.1.3 Increasing complexity of semiconductor designs boosts demand for interposer and fan-out WLP
      • 3.7.1.4 Increasing use in data centers for improved performance and power efficiency
      • 3.7.1.5. Growing focus on 5 G technology stimulates demand for advanced packaging solutions
    • 3.7.2 Industry pitfalls & challenges
      • 3.7.2.1 Thermal management
      • 3.7.2.2 Standards and compatibility challenges
  • 3.8 Growth potential analysis
  • 3.9 Porter's analysis
    • 3.9.1 Supplier power
    • 3.9.2 Buyer power
    • 3.9.3 Threat of new entrants
    • 3.9.4 Threat of substitutes
    • 3.9.5 Industry rivalry
  • 3.10 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

  • 4.1 Introduction
  • 4.2 Company market share analysis
  • 4.3 Competitive positioning matrix
  • 4.4 Strategic outlook matrix

Chapter 5 Market Estimates & Forecast, By Packaging Component, 2018 - 2032 (USD Million)

  • 5.1 Key trends
  • 5.2 Interposer
  • 5.3 FOWLP

Chapter 6 Market Estimates & Forecast, By Application, 2018 - 2032 (USD Million)

  • 6.1 Key trends
  • 6.2 MEMS or sensors
  • 6.3 Imaging & optoelectronics
  • 6.4 Memory
  • 6.5 Logic ICs
  • 6.6 LEDs
  • 6.7 Others

Chapter 7 Market Estimates & Forecast, By Packaging Type, 2018 - 2032 (USD Million)

  • 7.1 Key trends
  • 7.2 2.5D
  • 7.3 3D

Chapter 8 Market Estimates & Forecast, By End-User, 2018 - 2032 (USD Million)

  • 8.1 Key trends
  • 8.2 Consumer electronics
  • 8.3 Automotive
  • 8.4 Industrial sector
  • 8.5 Telecommunications
  • 8.6 Military & aerospace
  • 8.7 Others

Chapter 9 Market Estimates & Forecast, By Region, 2018 - 2032 (USD Million)

  • 9.1 Key trends
  • 9.2 North America
    • 9.2.1 U.S.
    • 9.2.2 Canada
  • 9.3 Europe
    • 9.3.1 UK
    • 9.3.2 Germany
    • 9.3.3 France
    • 9.3.4 Italy
    • 9.3.5 Spain
    • 9.3.6 Russia
    • 9.3.7 Rest of Europe
  • 9.4 Asia Pacific
    • 9.4.1 China
    • 9.4.2 India
    • 9.4.3 Japan
    • 9.4.4 South Korea
    • 9.4.5 ANZ
    • 9.4.6 Rest of Asia Pacific
  • 9.5 Latin America
    • 9.5.1 Brazil
    • 9.5.2 Mexico
    • 9.5.3 Rest of Latin America
  • 9.6 MEA
    • 9.6.1 UAE
    • 9.6.2 Saudi Arabia
    • 9.6.3 South Africa
    • 9.6.4 Rest of MEA

Chapter 10 Company Profiles

  • 10.1 ALLVIA, Inc.
  • 10.2 AMETEK Inc.
  • 10.3 Amkor Technology
  • 10.4 ASE Technology Holding Co., Ltd.
  • 10.5 ASTI Holdings Limited
  • 10.6 Broadcom
  • 10.7 Infineon Technologies AG
  • 10.8 Intel Corporation
  • 10.9 LAM RESEARCH CORPORATION
  • 10.10 Murata Manufacturing Co., Ltd.
  • 10.11 Powertech Technology Inc.
  • 10.12 Qualcomm Technologies, Inc.
  • 10.13 SAMSUNG
  • 10.14 Siliconware Precision Industries Co.
  • 10.15 STMicroelectronics
  • 10.16 Taiwan Semiconductor Manufacturing Company Limited
  • 10.17 Texas Instruments Incorporated
  • 10.18 TOSHIBA CORPORATION
  • 10.19 United Microelectronics Corporation