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半导体生产设备半导体製造设备

市场调查报告书

商品编码

1529050

半导体代工市场，依技术节点（7nm、10nm、14nm、22nm、28nm、40nm、65nm、90nm）、依应用（消费性电子、通讯、汽车、工业）、依晶圆尺寸（200mm、300mm、450mm）和预测, 2024 - 2032

Semiconductor Foundry Market, By Technology Node (7nm, 10nm, 14nm, 22nm, 28nm, 40nm, 65nm, 90nm), By Application (Consumer Electronics, Communication, Automotive, Industrial), By Wafer Size (200mm, 300mm, 450mm) & Forecast, 2024 - 2032

出版日期: 2024年05月15日 | 出版商:

Global Market Insights Inc. | 英文 200 Pages | 商品交期: 2-3个工作天内

价格

简介目录

在资料中心扩张和物联网 (IoT) 兴起的推动下，2024 年至 2032 年全球半导体代工市场将以 8.8% 的复合年增长率成长。随着资料中心激增以支援不断增长的资料处理和储存需求，对高效能半导体的需求不断增加。此外，物联网设备的激增需要半导体来实现连接和功能，这进一步刺激了市场需求。这些趋势凸显了对先进半导体製造能力的日益增长的需求，以支援不断扩大的数位基础设施和互连设备。

例如，2024年2月，印度政府批准了塔塔电子与台湾功率晶片半导体製造公司合作在古吉拉特邦多莱拉建造半导体工厂的计画。这一发展凸显了印度在半导体供应链中日益重要的作用，并表明印度将采取战略倡议来提高全球半导体产能。它可能会导致代工厂的区域分布更加平衡，降低供应链风险，并促进产业创新。

半导体代工产业根据技术节点、应用、晶圆尺寸和地区进行划分。

与较小的晶圆尺寸相比，300 毫米晶圆市场由于其卓越的效率和成本效益，到 2032 年将经历显着的改善。较大的晶圆直径允许每个晶圆生产更多的晶片，从而降低整体製造成本并增强规模经济。随着半导体技术的进步和对高性能晶片需求的增加，300mm 细分市场变得越来越重要。它支援复杂、高密度电路的能力推动了其在半导体代工市场的主导地位。

由于汽车中先进电子元件的需求不断增长，到 2032 年，通讯领域将占据显着的市场份额。现代汽车越来越依赖半导体来实现自动驾驶、高级驾驶辅助系统 (ADAS)、资讯娱乐和电动车 (EV) 技术等功能。随着产业朝向更智慧、更互联和电动化的方向发展，对高性能和可靠的半导体解决方案的需求不断增加。对复杂汽车电子产品的日益依赖极大地促进了市场的扩张。

在其强大的製造基础设施、大量技术投资以及不断增长的电子产品需求的推动下，亚太地区半导体代工产业将在 2024 年和 2032 年实现显着的复合年增长率。该地区是主要半导体生产商和快速发展的电子行业的所在地，这推动了代工服务的大幅增长。此外，中国、台湾和韩国等国家的有利政府政策和先进技术的不断采用进一步提振了市场。亚太地区的突出地位和进步使其成为全球半导体代工市场的关键贡献者。

产业生态系统分析
供应商矩阵
利润率分析
技术与创新格局
专利分析
重要新闻和倡议
监管环境
衝击力
- 成长动力
  - 各行业对半导体晶片的需求增加
  - 汽车和工业领域的扩张
  - 对客製化设计积体电路的需求不断增长
  - 智慧城市和基础设施的发展
  - 消费性电子产品和穿戴式装置的成长
- 产业陷阱与挑战
  - 激烈的竞争和定价压力
  - 技术过时和快速创新週期
成长潜力分析
波特的分析
PESTEL分析

第 4 章：竞争格局

介绍
公司市占率分析
竞争定位矩阵
战略展望矩阵

第 5 章：市场估计与预测：按技术节点，2021 - 2032

主要趋势
7奈米
10奈米
14奈米
22奈米
28奈米
40奈米
65奈米
90奈米
其他的

第 6 章：市场估计与预测：依应用分类，2021 - 2032

主要趋势
消费性电子产品
沟通
汽车
工业的
其他的

第 7 章：市场估计与预测：依晶圆尺寸，2021 - 2032 年

主要趋势
200毫米
300毫米
450毫米

第 8 章：市场估计与预测：按地区，2021 - 2032

主要趋势
北美洲
- 我们
- 加拿大
欧洲
- 英国
- 德国
- 法国
- 义大利
- 西班牙
- 欧洲其他地区
亚太地区
- 中国
- 印度
- 日本
- 韩国
- 澳新银行
- 亚太地区其他地区
拉丁美洲
- 巴西
- 墨西哥
- 拉丁美洲其他地区
MEA
- 阿联酋
- 南非
- 沙乌地阿拉伯
- MEA 的其余部分

第 9 章：公司简介

Dongbu Hitek Co. Ltd
Globalfoundries Inc.
Hua Hong Semiconductor Limited
Intel Corporation
Microchip Technologies Inc.
NXP Semiconductors NV
ON Semiconductor Corporation
Powerchip Technology Corporation
Renesas Electronics Corporation
Samsung Electronics Co. Ltd (Samsung Foundry)
Semiconductor Manufacturing International Corporation (SMIC)
Seoul Semiconductor Co., Ltd.
STMicroelectronics NV
Texas Instruments Inc.
Tower Semiconductor Ltd.
TSMC Limited
United Microelectronics Corporation (UMC)
Vanguard International Semiconductor Corporation
X-FAB Silicon Foundries

简介目录

Product Code: 9500

Global Semiconductor Foundry Market will expand at an 8.8% CAGR from 2024 to 2032, fueled by the expansion of data centers and the rise of the Internet of Things (IoT). As data centers proliferate to support increased data processing and storage needs, there is a heightened demand for high-performance semiconductors. Also, the proliferation of IoT devices, which require semiconductors for connectivity and functionality, further boosts market demand. These trends underscore the growing need for advanced semiconductor manufacturing capabilities to support the expanding digital infrastructure and interconnected devices.

For instance, in February 2024, the Indian government approved Tata Electronics' plan to build a semiconductor fab in Dholera, Gujarat, in collaboration with Taiwan's Power Chip Semiconductor Manufacturing Corporation. This development highlights India's growing role in the semiconductor supply chain and suggests a strategic move to enhance global semiconductor production capacity. It may lead to a more balanced regional distribution of foundries, reduce supply chain risks, and foster innovation in the industry.

The semiconductor foundry industry is divided based on technology node, application, wafer size, and region.

The 300mm wafer segment will undergo a notable upturn by 2032 due to its superior efficiency and cost-effectiveness compared to smaller wafer sizes. The larger wafer diameter allows for the production of more chips per wafer, reducing overall manufacturing costs and enhancing economies of scale. As semiconductor technology advances and demand for high-performance chips increases, the 300mm segment becomes increasingly vital. Its ability to support complex, high-density circuits drives its dominance in the semiconductor foundry market.

The communication segment will secure a noteworthy market presence by 2032, attributed to the escalating demand for advanced electronic components in vehicles. Modern automobiles increasingly rely on semiconductors for functions such as autonomous driving, advanced driver-assistance systems (ADAS), infotainment, and electric vehicle (EV) technologies. As the industry pushes towards smarter, more connected, and electrified vehicles, the need for high-performance and reliable semiconductor solutions intensifies. This growing reliance on sophisticated automotive electronics significantly contributes to the expansion of the market.

Asia Pacific semiconductor foundry industry will record a remarkable CAGR during 2024 and 2032, propelled by its robust manufacturing infrastructure, significant investments in technology, and growing demand for electronics. The region is home to major semiconductor producers and a rapidly expanding electronics industry, which drives substantial growth in foundry services. Additionally, favorable government policies and increasing adoption of advanced technologies in countries like China, Taiwan, and South Korea further bolster the market. Asia Pacific's prominence and advancements make it a key contributor to the global semiconductor foundry market.

Chapter 1 Methodology & Scope

1.1 Market scope & definition
1.2 Base estimates & calculations
1.3 Forecast calculation
1.4 Data sources
- 1.4.1 Primary
- 1.4.2 Secondary
  - 1.4.2.1 Paid sources
  - 1.4.2.2 Public sources

Chapter 2 Executive Summary

2.1 Semiconductor foundry industry 360° synopsis, 2021 - 2032
2.2 Business trends
- 2.2.1 Total addressable market (TAM), 2024-2032

Chapter 3 Industry Insights

3.1 Industry ecosystem analysis
3.2 Vendor matrix
3.3 Profit margin analysis
3.4 Technology & innovation landscape
3.5 Patent analysis
3.6 Key news and initiatives
3.7 Regulatory landscape
3.8 Impact forces
- 3.8.1 Growth drivers
  - 3.8.1.1 Increased demand for semiconductor chips in various industries
  - 3.8.1.2 Expansion of automotive and industrial sectors
  - 3.8.1.3 Rising demand for custom-designed integrated circuits
  - 3.8.1.4 Development of smart cities and infrastructure
  - 3.8.1.5 Growth in consumer electronics and wearables
- 3.8.2 Industry pitfalls & challenges
  - 3.8.2.1 Intense competition and pricing pressures
  - 3.8.2.2 Technological obsolescence and rapid innovation cycles
3.9 Growth potential analysis
3.10 Porter's analysis
- 3.10.1 Supplier power
- 3.10.2 Buyer power
- 3.10.3 Threat of new entrants
- 3.10.4 Threat of substitutes
- 3.10.5 Industry rivalry
3.11 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

4.1 Introduction
4.2 Company market share analysis
4.3 Competitive positioning matrix
4.4 Strategic outlook matrix

Chapter 5 Market Estimates & Forecast, By Technology Node, 2021 - 2032 (USD Billion)

5.1 Key trends
5.2 7nm
5.3 10nm
5.4 14nm
5.5 22nm
5.6 28nm
5.7 40nm
5.8 65nm
5.9 90nm
5.10 Others

Chapter 6 Market Estimates & Forecast, By Application, 2021 - 2032 (USD Billion)

6.1 Key trends
6.2 Consumer electronics
6.3 Communication
6.4 Automotive
6.5 Industrial
6.6 Others

Chapter 7 Market Estimates & Forecast, By Wafer Size, 2021 - 2032 (USD Billion)

7.1 Key trends
7.2 200mm
7.3 300mm
7.4 450mm

Chapter 8 Market Estimates & Forecast, By Region, 2021 - 2032 (USD Billion)

8.1 Key trends
8.2 North America
- 8.2.1 U.S.
- 8.2.2 Canada
8.3 Europe
- 8.3.1 UK
- 8.3.2 Germany
- 8.3.3 France
- 8.3.4 Italy
- 8.3.5 Spain
- 8.3.6 Rest of Europe
8.4 Asia Pacific
- 8.4.1 China
- 8.4.2 India
- 8.4.3 Japan
- 8.4.4 South Korea
- 8.4.5 ANZ
- 8.4.6 Rest of Asia Pacific
8.5 Latin America
- 8.5.1 Brazil
- 8.5.2 Mexico
- 8.5.3 Rest of Latin America
8.6 MEA
- 8.6.1 UAE
- 8.6.2 South Africa
- 8.6.3 Saudi Arabia
- 8.6.4 Rest of MEA