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半导体生产设备半导体製造设备

市场调查报告书

商品编码

1698590

半导体代工市场机会、成长动力、产业趋势分析及2025-2034年预测

Semiconductor Foundry Market Opportunity, Growth Drivers, Industry Trend Analysis, and Forecast 2025-2034

出版日期: 2025年02月14日 | 出版商:

Global Market Insights Inc. | 英文 210 Pages | 商品交期: 2-3个工作天内

价格

简介目录

2024 年全球半导体代工市场价值为 1,363 亿美元，预计到 2034 年将以 9.1% 的复合年增长率成长。市场扩张的动力来自于对人工智慧应用不断增长的需求以及封装技术的进步。基于人工智慧的应用需要高运算能力，从而推动了对 GPU、TPU 和人工智慧加速器等专用晶片的需求。云端运算、自主系统、医疗保健和金融技术中人工智慧的应用日益广泛，加剧了对先进半导体解决方案的需求。随着深度学习、自然语言处理和电脑视觉中的工作负载变得越来越复杂，半导体代工厂正在投资尖端製程节点，包括 5nm 及以下製程节点。随着企业寻求提高处理能力并优化能源使用，扩大高效能、节能晶片的製造能力仍是当务之急。

先进封装解决方案的创新正在进一步塑造产业成长。现代半导体设计面临着功率效率和性能方面的挑战，因为传统的单晶片结构难以满足不断发展的人工智慧和高效能运算需求。先进的封装方法，包括 2.5D/3D 整合和小晶片，可以实现更好的互连、更高的能源效率和卓越的运算能力。在国家计划和私营部门资金的支持下，对这些技术的投资增加正在推动对高性能半导体解决方案的需求。随着技术的发展，代工厂正专注于复杂的封装技术以维持产业竞争力。

市场范围
起始年份	2024
预测年份	2025-2034
起始值	1363亿美元
预测值	3211亿美元
复合年增长率	9.1%

汽车产业对半导体代工业务的成长做出了重大贡献。随着 ADAS、EV 技术和物联网车辆系统的融合，对高性能半导体元件的需求激增。现代汽车晶片确保无缝即时资料处理和连接，这对于增强车辆的安全性和自动化至关重要。汽车电子产品日益复杂，需要对 ADAS、电动传动系统和资讯娱乐系统的半导体製造进行投资，从而扩大该领域的代工机会。

按晶圆尺寸进行市场细分显示 450 毫米类别将快速扩张，预计复合年增长率为 10.5%。随着半导体装置变得越来越先进，公司正在转向更大的晶圆来提高生产效率和可扩展性。 300 毫米晶圆市场价值 633 亿美元，由于异构整合和 3D 堆迭等晶片架构的进步，该市场正在实现成长。同时，对于 5G 网路和智慧型手机中的 MEMS 和 RF 组件至关重要的 200 毫米晶圆，预计到 2034 年将超过 813 亿美元。

市场也按应用进行分类，消费性电子产品将在 2024 年占据 46.8% 的市场。物联网设备的采用率和人工智慧的整合不断提高，将继续推动这一领域的需求。在资料中心扩张和 5G 部署的推动下，通讯业预计将以 10.9% 的复合年增长率成长。汽车产业将在 2024 年占据 13.6% 的市场份额，继续推动对电动车和配备 ADAS 的汽车的半导体解决方案的需求。工业应用也在兴起，人工智慧驱动的自动化解决方案推动了对高阶半导体元件的需求。

从技术节点来看，7nm製程技术在高效能运算领域扮演着至关重要的角色，预计2024年价值将达到294亿美元。 10nm 节点的复合年增长率为 9.7%，以满足高阶行动处理器和计算设备的需求。在汽车和工业自动化应用的推动下，14nm 节点正在显着成长，预计到 2034 年收入将超过 480 亿美元。广泛应用于无线通讯基础设施的 22nm 製程节点预计将以 7.8% 的复合年增长率成长，而 OLED 显示器和网路解决方案对 28nm 节点的需求仍然很大。

从地区来看，北美引领全球市场，2024 年占 37.4% 的市占率。该地区的主导地位归功于强大的半导体製造能力、对先进晶片设计的投资以及对尖端半导体技术的早期采用。

产业生态系统分析
供应商矩阵
利润率分析
技术与创新格局
专利分析
重要新闻和倡议
监管格局
衝击力
- 成长动力
  - 人工智慧应用需求激增
  - 汽车产业的转型
  - 先进封装技术
  - 超大规模资料中心扩建
  - 采用5G技术
- 产业陷阱与挑战
  - 供应链中断
  - 高昂的研发和资本成本
成长潜力分析
波特的分析
PESTEL分析

第四章：竞争格局

介绍
公司市占率分析
竞争定位矩阵
战略展望矩阵

第五章：市场估计与预测：按技术节点，2021 - 2032 年

主要趋势
7奈米
10奈米
14奈米
22奈米
28奈米
40奈米
65奈米
90奈米
其他的

第六章：市场估计与预测：按应用，2021 - 2032 年

主要趋势
消费性电子产品
沟通
汽车
工业的
其他的

第七章：市场预估与预测：依晶圆尺寸，2021 - 2032

主要趋势
200毫米
300毫米
450毫米

第八章：市场估计与预测：按地区，2021 - 2032 年

主要趋势
北美洲
- 我们
- 加拿大
欧洲
- 英国
- 德国
- 法国
- 义大利
- 西班牙
- 欧洲其他地区
亚太地区
- 中国
- 印度
- 日本
- 韩国
- 澳新银行
- 亚太其他地区
拉丁美洲
- 巴西
- 墨西哥
- 拉丁美洲其他地区
MEA
- 阿联酋
- 南非
- 沙乌地阿拉伯
- MEA 其余地区

第九章：公司简介

Dongbu Hitek Co. Ltd
Globalfoundries Inc.
Hua Hong Semiconductor Limited
Intel Corporation
Microchip Technologies Inc.
NXP Semiconductors NV
ON Semiconductor Corporation
Powerchip Technology Corporation
Renesas Electronics Corporation
Samsung Electronics Co. Ltd (Samsung Foundry)
Semiconductor Manufacturing International Corporation (SMIC)

9.12 意法半导体

德州仪器公司
塔尔半导体有限公司
台积电有限公司
联华电子（UMC）
万兆国际半导体公司
X-FAB硅晶圆代工厂

简介目录

Product Code: 9500

The Global Semiconductor Foundry Market, valued at USD 136.3 billion in 2024, is expected to grow at a 9.1% CAGR through 2034. Market expansion is driven by rising demand for AI applications and advancements in packaging technologies. AI-based applications require high-computing capabilities, fueling the demand for specialized chips like GPUs, TPUs, and AI accelerators. Increased adoption of AI in cloud computing, autonomous systems, healthcare, and financial technology has intensified the need for advanced semiconductor solutions. As workloads in deep learning, natural language processing, and computer vision become more complex, semiconductor foundries are investing in cutting-edge process nodes, including 5nm and below. Expanding manufacturing capacity for high-performance, energy-efficient chips remains a priority as companies seek to enhance processing power while optimizing energy use.

Innovations in advanced packaging solutions are further shaping industry growth. Modern semiconductor designs face challenges in power efficiency and performance as traditional monolithic structures struggle to meet evolving AI and HPC demands. Advanced packaging methods, including 2.5D/3D integration and chiplets, enable better interconnects, improved energy efficiency, and superior computing power. Increased investment in these technologies, backed by national programs and private sector funding, is driving demand for high-performance semiconductor solutions. As technology evolves, foundries are focusing on sophisticated packaging techniques to stay competitive in the industry.

Market Scope
Start Year	2024
Forecast Year	2025-2034
Start Value	$136.3 Billion
Forecast Value	$321.1 Billion
CAGR	9.1%

The automotive sector is significantly contributing to semiconductor foundry growth. With the integration of ADAS, EV technologies, and IoT-enabled vehicle systems, the need for high-performance semiconductor components has surged. Modern automotive chips ensure seamless real-time data processing and connectivity, which are essential for enhanced safety and automation in vehicles. The increasing complexity of automotive electronics necessitates investments in semiconductor manufacturing for ADAS, electric drivetrains, and infotainment systems, expanding foundry opportunities in this sector.

Market segmentation by wafer size indicates rapid expansion in the 450mm category, expected to grow at a 10.5% CAGR. As semiconductor devices become more advanced, companies are turning to larger wafers to increase production efficiency and scalability. The 300mm wafer segment, valued at USD 63.3 billion in 2024, is witnessing growth due to advancements in chip architectures like heterogeneous integration and 3D stacking. Meanwhile, 200mm wafers, essential for MEMS and RF components in 5G networks and smartphones, are projected to surpass USD 81.3 billion by 2034.

The market is also categorized by application, with consumer electronics dominating at 46.8% market share in 2024. Rising IoT device adoption and AI integration continue to drive demand in this segment. Communications is expected to grow at a 10.9% CAGR, propelled by data center expansions and 5G rollouts. The automotive sector, accounting for 13.6% of the market in 2024, continues to drive demand for semiconductor solutions in EVs and ADAS-equipped vehicles. Industrial applications are also on the rise, with AI-driven automation solutions fueling demand for high-grade semiconductor components.

In terms of technology nodes, 7nm process technology, valued at USD 29.4 billion in 2024, plays a crucial role in high-performance computing. The 10nm node is expanding at a 9.7% CAGR, catering to premium mobile processors and computing devices. The 14nm node is growing significantly, driven by applications in automotive and industrial automation, with projected revenues surpassing USD 48 billion by 2034. The 22nm process node, widely used in wireless communication infrastructure, is expected to grow at a 7.8% CAGR, while the 28nm node remains in demand for OLED displays and networking solutions.

Regionally, North America leads the global market, holding 37.4% market share in 2024. The region's dominance is attributed to strong semiconductor manufacturing capabilities, investments in advanced chip design, and early adoption of cutting-edge semiconductor technologies.

Chapter 1 Methodology & Scope

1.1 Market scope & definition
1.2 Base estimates & calculations
1.3 Forecast calculation
1.4 Data sources
- 1.4.1 Primary
- 1.4.2 Secondary
  - 1.4.2.1 Paid sources
  - 1.4.2.2 Public sources

Chapter 2 Executive Summary

2.1 Industry 360⁰ synopsis, 2021 - 2032
2.2 Business trends
- 2.2.1 Total addressable market (TAM), 2024-2032

Chapter 3 Industry Insights

3.1 Industry ecosystem analysis
3.2 Vendor matrix
3.3 Profit margin analysis
3.4 Technology & innovation landscape
3.5 Patent analysis
3.6 Key news and initiatives
3.7 Regulatory landscape
3.8 Impact forces
- 3.8.1 Growth drivers
  - 3.8.1.1 Surging demand for AI Applications
  - 3.8.1.2 Transformation in Automotive industry
  - 3.8.1.3 Advanced Packaging Technologies
  - 3.8.1.4 Expansion of Hyperscale Data Centre
  - 3.8.1.5 Adoption of 5G technologies
- 3.8.2 Industry pitfalls & challenges
  - 3.8.2.1 Supply Chain Disruptions
  - 3.8.2.2 High R&D and Capital Costs
3.9 Growth potential analysis
3.10 Porter's analysis
- 3.10.1 Supplier power
- 3.10.2 Buyer power
- 3.10.3 Threat of new entrants
- 3.10.4 Threat of substitutes
- 3.10.5 Industry rivalry
3.11 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

4.1 Introduction
4.2 Company market share analysis
4.3 Competitive positioning matrix
4.4 Strategic outlook matrix

Chapter 5 Market Estimates & Forecast, By Technology Node, 2021 - 2032 (USD Billion)

5.1 Key trends
5.2 7nm
5.3 10nm
5.4 14nm
5.5 22nm
5.6 28nm
5.7 40nm
5.8 65nm
5.9 90nm
5.10 Others

Chapter 6 Market Estimates & Forecast, By Application, 2021 - 2032 (USD Billion)

6.1 Key trends
6.2 Consumer electronics
6.3 Communication
6.4 Automotive
6.5 Industrial
6.6 Others

Chapter 7 Market Estimates & Forecast, By Wafer Size, 2021 - 2032 (USD Billion)

7.1 Key trends
7.2 200mm
7.3 300mm
7.4 450mm

Chapter 8 Market Estimates & Forecast, By Region, 2021 - 2032 (USD Billion)

8.1 Key trends
8.2 North America
- 8.2.1 U.S.
- 8.2.2 Canada
8.3 Europe
- 8.3.1 UK
- 8.3.2 Germany
- 8.3.3 France
- 8.3.4 Italy
- 8.3.5 Spain
- 8.3.6 Rest of Europe
8.4 Asia Pacific
- 8.4.1 China
- 8.4.2 India
- 8.4.3 Japan
- 8.4.4 South Korea
- 8.4.5 ANZ
- 8.4.6 Rest of Asia Pacific
8.5 Latin America
- 8.5.1 Brazil
- 8.5.2 Mexico
- 8.5.3 Rest of Latin America
8.6 MEA
- 8.6.1 UAE
- 8.6.2 South Africa
- 8.6.3 Saudi Arabia
- 8.6.4 Rest of MEA