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市场调查报告书
商品编码
1737203

全球晶圆代工厂服务市场：市场规模（按类型、应用和地区）、未来预测

Global Foundry Service Market Size By Type (8 Inches, 12 Inches), By Application (Communication, Electronics), By Geographic Scope And Forecast
出版日期: | 出版商: Verified Market Research | 英文 202 Pages | 商品交期: 2-3个工作天内

价格
简介目录

晶圆代工厂服务市场规模及预测

2024 年代晶圆代工厂服务市场规模为 1,313.9 亿美元，预计到 2032 年将达到 2,016.8 亿美元，2026 年至 2032 年的复合年增长率为 6.07%。

政府的利多倡议和日益增长的半导体晶片需求是推动市场扩张的两大因素。此外，通讯、电子和相关设备对晶圆代工厂服务的需求旺盛，预计将推动市场扩张。全球晶圆代工厂服务市场报告对市场进行了全面的评估，对关键细分市场、趋势、市场驱动因素、市场限制因素、竞争格局以及影响市场的关键因素进行了全面的分析。

定义全球晶圆代工厂服务市场

晶圆代工厂服务是指晶圆晶圆代工厂公司提供给第三方客户的半导体製造服务，用于生产半导体、积体电路和其他半导体材料。许多公司自行开发和製造积体电路，但这种做法并不划算。因此，许多公司委託积体电路的製造外包给第三方晶圆代工厂工厂。从长远来看，积体电路製造厂的开发和营运成本高昂。这些工厂需要保持接近运作运转，以免给管理它们的公司造成财务负担。

全球晶圆代工厂服务市场概况

晶圆代工厂服务的主要终端用户是通讯、运算、网路、消费性电子和汽车产业。在全球范围内，通讯和消费性电子设备消费的成长是全球晶圆代工厂服务市场的主要成长要素。由于越来越多的无厂半导体公司将晶片製造流程外包，预计预测期内全球晶圆代工厂服务市场将快速发展。

此外，晶圆代工厂越来越注重自动化、机器学习和分析技术。这些技术的优势，例如简化生产过程、在不牺牲品质的情况下提高产量比率，正在推动需求成长。产能的提升和价格的下降预计将鼓励供应商接受更大的生产合同，从而大幅增加供应，填补许多行业的缺口。

然而，尖端代晶圆代工厂的建设成本急剧上升，给该行业带来了压力。性能提升正在下降，使得专用晶片更具吸引力。一些有助于晶片普及的设计决策，对于某些运算活动而言，可能并非最佳选择。

目录

第一章 全球晶圆代工厂服务市场简介

  • 市场概览
  • 研究范围
  • 先决条件

第二章执行摘要

第三章：已验证的市场研究调查方法

  • 资料探勘
  • 验证
  • 第一手资料
  • 资料来源列表

第四章全球晶圆代工厂服务市场展望

  • 概述
  • 市场动态
    • 驱动程式
    • 限制因素
    • 机会
  • 波特五力模型
  • 价值链分析

第五章全球晶圆代工厂服务市场（按类型）

  • 概述
  • 8吋
  • 12英吋
  • 其他的

6. 全球晶圆代工厂服务市场（按应用）

  • 概述
  • 通讯设备
  • 电子产品
  • 其他的

7. 全球晶圆代工厂服务市场（按地区）

  • 概述
  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 法国
    • 其他欧洲国家
  • 亚太地区
    • 中国
    • 日本
    • 印度
    • 其他亚太地区
  • 其他地区 (ROW)
    • 拉丁美洲
    • 中东和非洲

第八章全球晶圆代工厂服务市场竞争格局

  • 概述
  • 各公司市场排名
  • 主要发展策略

第九章 公司简介

  • Vanguard International Semiconductor
  • Powerchip Technology
  • Shanghai Huahong Grace Semiconductor Manufacturing
  • Taiwan Semiconductor Manufacturing
  • Global Foundries
  • United Microelectronics
  • Samsung Semiconductor
  • TowerJazz Semiconductor
  • Semiconductor Manufacturing International
  • DB HiTek

第十章 附录

  • 相关分析
简介目录
Product Code: 58774

Foundry Service Market Size And Forecast

Foundry Service Market size was valued at USD 131.39 Billion in 2024 and is projected to reach USD 201.68 Billion by 2032, growing at a CAGR of 6.07% from 2026 to 2032.

Favorable government efforts and rising demand for semiconductor chips are two significant drivers driving the market's expansion. Furthermore, there is a high need for foundry services for communication, electronics, and linked devices, which is projected to boost market expansion. The Global Foundry Service Market report provides a holistic evaluation of the market. The report offers a comprehensive analysis of key segments, trends, drivers, restraints, competitive landscape, and factors that are playing a substantial role in the market.

Global Foundry Service Market Definition

Foundry Services are semiconductor manufacturing services offered by a foundry corporation to third-party clients for the production of semiconductors, IC circuits, or other semiconductors. Many businesses develop and produce their own integrated circuits, which is not cost-effective. As a result, firms outsource the manufacture of integrated circuits to a third-party foundry facility. In the long term, IC circuit fabrication plants are costly to develop and operate. These factories should be kept nearly fully operational to avoid becoming a financial drain on the corporation that controls them.

Global Foundry Service Market Overview

The telecom, computing and networking, consumer electronics, and automotive sectors are the primary end-users of foundry services. Globally, the increasing consumption of communication and consumer electronic devices is the key development driver for the worldwide Foundry Service Market. The worldwide market for foundry services is expected to develop rapidly during the projected period, owing to an increase in the number of fabless firms that outsource their chip fabrication process.

The telecom, computing and networking, consumer electronics, and automotive sectors are the primary end-users of foundry services. Globally, the increasing consumption of communication and consumer electronic devices is the key development driver for the worldwide Foundry Service Market. The worldwide market for foundry services is expected to develop rapidly during the projected period, owing to an increase in the number of fabless firms that outsource their chip fabrication process.

Furthermore, Foundries are increasingly focused on automation, machine learning, and analytics. These technologies' benefits, such as streamlining the production process and improving yield without sacrificing quality, are fueling their demand. With increased production capacity and lower prices, vendors are projected to accept larger production contracts, resulting in considerably greater supply and filling shortfall gaps in numerous industries.

However, the cost of constructing cutting-edge foundries has risen dramatically, putting strain on the sector. Performance gains are decreasing, making specialist chips more appealing. Some design decisions that contribute to chip universality may be suboptimal for certain computer activities.

Global Foundry Service Market Segmentation Analysis

The Global Foundry Service Market is Segmented on the basis of Type, Application, And Geography.

Foundry Service Market, By Type

  • 8 Inches
  • 12 Inches
  • Others

Based on Type, The market is segmented into 8 Inches, 12 Inches, and Others. The 12 Inches model is projected to dominate the market in this sector. Some advantages are provided by 12-inch technology. They often employ copper for metal interconnects, whereas greater resistivity aluminum is used in previous technology, allowing for larger current densities and electromigration prevention.

  • The 12-inch technologies also offer a greater number of metal layers, which, when paired with the reduced transistor dimensions, allows for a rise in transistor and routing density, resulting in a decrease in die size or higher functionality for a given unit price. 8-inch wafers are commonly utilized for a wide range of power management and power discrete devices used in the automotive business, notably electric cars, as well as 5G smartphones and servers.

Foundry Service Market, By Application

  • Communication
  • Electronics
  • Others

Based on Application, The market is segmented into Communication, Electronics, and Others. Electronics is expected to dominate the market for smartphones and high-performance computing (HPC) devices such as PCs, tablets, gaming consoles, servers, and 5G base stations due to growing demand.

Foundry Service Market, By Geography

  • North America
  • Europe
  • Asia Pacific
  • Rest of the world
  • On the basis of Geography, The Global Foundry Service Market is classified into North America, Europe, Asia Pacific, and the Rest of the world. During the projected period, Asia Pacific is likely to lead the Foundry Service Market. As the Asia Pacific area has the largest proportion of semiconductor foundries in the world, with significant businesses like TSMC, Samsung Electronics, and others present. Taiwan, South Korea, Japan, and China are prominent players in the area, each with a sizable market share.

Key Players

The "Global Foundry Service Market" study report will provide a valuable insight with an emphasis on the global market including some of the major players such as Vanguard International Semiconductor, Powerchip Technology, Shanghai Huahong Grace Semiconductor Manufacturing, Taiwan Semiconductor Manufacturing, Global Foundries, United Microelectronics, Samsung Semiconductor, TowerJazz Semiconductor, Semiconductor Manufacturing International and DB HiTek.

Our market analysis also entails a section solely dedicated to such major players wherein our analysts provide an insight into the financial statements of all the major players, along with its product benchmarking and SWOT analysis. The competitive landscape section also includes key development strategies, market share, and market ranking analysis of the above-mentioned players globally.

Key Developments

  • In January 2022, - The acquisition of AUO's Fab L3B building and assets by VIS was finalized. These purchases willlet it to enhance its production capacity, with the business aiming for a monthly production capacity of 40,000 8-inch wafers. This enables the firm to meet the ever-increasing mid-and long-term demand for semiconductors.
  • In December 2021, TSMC launched the N4X process technology, which is optimized for the high-performance computing (HPC) workload. The N4X is the first of TSMC's HPC-focused technology products to reflect the 5 nm family's highest performance and maximum clock frequency. With these HPC characteristics, the N4X can outperform the N5 by up to 15% and the 1.2 volts quicker N4P by up to 4%. The N4X is expected to enter risk production in the first half of 2024, according to TSMC.

TABLE OF CONTENTS

1 INTRODUCTION OF GLOBAL FOUNDRY SERVICE MARKET

  • 1.1 Overview of the Market
  • 1.2 Scope of Report
  • 1.3 Assumptions

2 EXECUTIVE SUMMARY

3 RESEARCH METHODOLOGY OF VERIFIED MARKET RESEARCH

  • 3.1 Data Mining
  • 3.2 Validation
  • 3.3 Primary Interviews
  • 3.4 List of Data Sources

4 GLOBAL FOUNDRY SERVICE MARKET OUTLOOK

  • 4.1 Overview
  • 4.2 Market Dynamics
    • 4.2.1 Drivers
    • 4.2.2 Restraints
    • 4.2.3 Opportunities
  • 4.3 Porters Five Force Model
  • 4.4 Value Chain Analysis

5 GLOBAL FOUNDRY SERVICE MARKET, BY TYPE

  • 5.1 Overview
  • 5.2 8 inches
  • 5.312 inches
  • 5.4 Other

6 GLOBAL FOUNDRY SERVICE MARKET, BY APPLICATION

  • 6.1 Overview
  • 6.2 Communication
  • 6.3 Electronics
  • 6.4 Other

7 GLOBAL FOUNDRY SERVICE MARKET, BY GEOGRAPHY

  • 7.1 Overview
  • 7.2 North America
    • 7.2.1 U.S.
    • 7.2.2 Canada
    • 7.2.3 Mexico
  • 7.3 Europe
    • 7.3.1 Germany
    • 7.3.2 U.K.
    • 7.3.3 France
    • 7.3.4 Rest of Europe
  • 7.4 Asia Pacific
    • 7.4.1 China
    • 7.4.2 Japan
    • 7.4.3 India
    • 7.4.4 Rest of Asia Pacific
  • 7.5 Rest of the World
    • 7.5.1 Latin America
    • 7.5.2 Middle East and Africa

8 GLOBAL FOUNDRY SERVICE MARKET COMPETITIVE LANDSCAPE

  • 8.1 Overview
  • 8.2 Company Market Ranking
  • 8.3 Key Development Strategies

9 COMPANY PROFILES

  • 9.1 Vanguard International Semiconductor
    • 9.1.1 Overview
    • 9.1.2 Financial Performance
    • 9.1.3 Product Outlook
    • 9.1.4 Key Developments
  • 9.2 Powerchip Technology
    • 9.2.1 Overview
    • 9.2.2 Financial Performance
    • 9.2.3 Product Outlook
    • 9.2.4 Key Developments
  • 9.3 Shanghai Huahong Grace Semiconductor Manufacturing
    • 9.3.1 Overview
    • 9.3.2 Financial Performance
    • 9.3.3 Product Outlook
    • 9.3.4 Key Developments
  • 9.4 Taiwan Semiconductor Manufacturing
    • 9.4.1 Overview
    • 9.4.2 Financial Performance
    • 9.4.3 Product Outlook
    • 9.4.4 Key Developments
  • 9.5 Global Foundries
    • 9.5.1 Overview
    • 9.5.2 Financial Performance
    • 9.5.3 Product Outlook
    • 9.5.4 Key Developments
  • 9.6 United Microelectronics
    • 9.6.1 Overview
    • 9.6.2 Financial Performance
    • 9.6.3 Product Outlook
    • 9.6.4 Key Developments
  • 9.7 Samsung Semiconductor
    • 9.7.1 Overview
    • 9.7.2 Financial Performance
    • 9.7.3 Product Outlook
    • 9.7.4 Key Developments
  • 9.8 TowerJazz Semiconductor
    • 9.8.1 Overview
    • 9.8.2 Financial Performance
    • 9.8.3 Product Outlook
    • 9.8.4 Key Developments
  • 9.9 Semiconductor Manufacturing International
    • 9.9.1 Overview
    • 9.9.2 Financial Performance
    • 9.9.3 Product Outlook
    • 9.9.4 Key Developments
  • 9.10 DB HiTek
    • 9.10.1 Overview
    • 9.10.2 Financial Performance
    • 9.10.3 Product Outlook
    • 9.10.4 Key Developments

10 APPENDIX

  • 10.1 Related Research