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市场调查报告书
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1535579

下一代非挥发性记忆体市场 - 按产品(FeRAM、PCM、MRAM、ReRAM)、按应用(消费电子、医疗保健、汽车和运输、工业、企业)和预测,2024 年 - 2032 年

Next Generation Non Volatile Memory Market - By Product (FeRAM, PCM, MRAM, ReRAM), By Application (Consumer Electronics, Healthcare, Automotive & Transportation, Industrial, Enterprises) & Forecast, 2024 - 2032

出版日期: | 出版商: Global Market Insights Inc. | 英文 220 Pages | 商品交期: 2-3个工作天内

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简介目录

受高速资料存取需求增加以及资料安全性和可靠性需求增加的推动,全球下一代非挥发性记忆体市场将于 2024 年至 2032 年间以 8% 的复合年增长率扩张。由于人工智慧、云端运算和物联网等领域的应用需要快速且有效率的资料检索,先进的非挥发性记忆体解决方案至关重要。这些技术提供快速的存取速度,同时即使在电源中断期间也能确保资料的完整性和安全性。效能和可靠性的结合推动了下一代非挥发性记忆体解决方案在各行业的采用。

例如,富士通于 2023 年 8 月推出了“MB85RC512LY”,这是一款具有 I2C 介面的汽车级 512Kbit FeRAM,可在 125°C 下提供高密度和可靠性。此 FeRAM 可确保低电流消耗和高耐用性,非常适合 ADAS 等工业和汽车应用。该产品的低电流消耗和高耐用性可满足工业和汽车应用的关键要求,包括高级驾驶员辅助系统 (ADAS)。这项创新凸显了市场向更强大、更专业的记忆体解决方案发展的趋势,并强化了非挥发性内存在先进技术领域日益增长的作用。

下一代非挥发性记忆体产业根据产品、应用和地区进行划分。

到 2032 年,FeRAM 细分市场将显着成长,这归因于其相对于其他记忆体类型的独特优势。铁电 RAM (FeRAM) 提供高速资料存取、低功耗和出色的耐用性,使其成为需要快速、可靠的记忆体解决方案的应用的理想选择。它适用于医疗设备、汽车系统和工业设备,推动了其采用。随着这些行业对高效、强大的记忆体解决方案的需求日益增长,FeRAM 的卓越性能确保了其在市场中的突出地位。

由于先进电子设备在车辆中的整合度不断提高,到 2032 年,汽车和运输业将经历重大转型。随着车辆变得更加互联和自主,它们需要高性能、可靠的记忆体解决方案来进行资料储存和即时处理。非挥发性记忆体具有对于资讯娱乐系统、导航和高级驾驶员辅助系统 (ADAS) 等汽车应用至关重要的耐用性和快速存取速度。对复杂汽车技术不断增长的需求推动了该领域的可观增长。

在高度重视技术创新和先进电子产品的推动下,欧洲下一代非挥发性记忆体市场从 2024 年到 2032 年将录得显着的复合年增长率。该地区强劲的汽车和工业部门推动了对高性能记忆体解决方案的巨大需求。此外,欧洲在研发方面的大量投资,加上政府对技术创新的支持政策,增强了其产业影响力。欧洲在将先进储存技术融入各种应用方面占据主导地位,这巩固了其作为全球市场主要贡献者的地位。

目录

第 1 章:范围与方法

  • 市场范围和定义
  • 基本估计和计算
  • 预测参数
  • 数据来源
    • 基本的
    • 中学
      • 付费来源
      • 公共来源

第 2 章:执行摘要

第 3 章:产业洞察

  • 产业生态系统分析
  • 供应商矩阵
  • 技术与创新格局
  • 专利分析
  • 重要新闻和倡议
  • 监管环境
  • 衝击力
    • 成长动力
      • 资料储存需求不断增长
      • 技术进步
      • 物联网设备的使用不断成长
      • 边缘运算快速成长
      • 汽车电子对非挥发性记忆体的需求成长
    • 产业陷阱与挑战
      • 开发成本高
      • 製造挑战
  • 成长潜力分析
  • 波特的分析
  • PESTEL分析

第 4 章:竞争格局

  • 公司市占率分析
  • 竞争定位矩阵
  • 战略展望矩阵

第 5 章:市场估计与预测:依产品分类,2021 - 2032 年

  • 主要趋势
  • 铁随机记忆体
  • 相变材料
  • 磁随机记忆体
  • 记忆体

第 6 章:市场估计与预测:依应用分类,2021 - 2032

  • 主要趋势
  • 消费性电子产品
  • 卫生保健
  • 汽车与运输
  • 工业的
  • 企业

第 7 章:市场估计与预测:按地区划分,2021 - 2032 年

  • 主要趋势
  • 北美洲
    • 我们
    • 加拿大
  • 欧洲
    • 英国
    • 德国
    • 法国
    • 义大利
    • 西班牙
    • 欧洲其他地区
  • 亚太地区
    • 中国
    • 印度
    • 日本
    • 韩国
    • 澳新银行
    • 亚太地区其他地区
  • 拉丁美洲
    • 巴西
    • 墨西哥
    • 拉丁美洲其他地区
  • MEA
    • 阿联酋
    • 沙乌地阿拉伯
    • 南非
    • MEA 的其余部分

第 8 章:公司简介

  • Adesto Technologies
  • Avalanche Technology, Inc.
  • Crossbar Inc.
  • Cypress Semiconductor Corporation
  • Everspin Technologies, Inc.
  • Fujitsu Ltd
  • IBM Corporation
  • Intel Corporation
  • Micron Technology, Inc.
  • Samsung Electronics Co. Ltd.
  • Sandisk Corporation
  • SK Hynix Inc
  • Toshiba Corporation
  • Winbond Electronics Corporation
简介目录
Product Code: 9734

Global Next Generation Non Volatile Memory Market will expand at an 8% CAGR between 2024 and 2032, fueled by the increased demand for high-speed data access and the heightened need for data security and reliability. As applications in sectors like AI, cloud computing, and IoT require rapid and efficient data retrieval, advanced non-volatile memory solutions are essential. These technologies provide fast access speeds while ensuring data integrity and security even during power interruptions. This combination of performance and reliability drives the adoption of next-generation non-volatile memory solutions across various industries.

For instance, in August 2023, Fujitsu introduced the "MB85RC512LY," an automotive-grade 512Kbit FeRAM with an I2C interface, offering high density and reliability at 125°C. This FeRAM ensures low current consumption and high endurance, ideal for industrial and automotive applications like ADAS. The product's low current consumption and high endurance address critical requirements for industrial and automotive applications, including Advanced Driver-Assistance Systems (ADAS). This innovation underscores the market trend towards more robust, specialized memory solutions and reinforces the growing role of non-volatile memory in advanced technology sectors.

The next-generation non-volatile memory industry is divided based on product, application, and region.

The FeRAM segment will witness a notable surge by 2032, attributed to its unique advantages over other memory types. Ferroelectric RAM (FeRAM) offers high-speed data access, low power consumption, and excellent endurance, making it ideal for applications requiring rapid, reliable memory solutions. Its suitability for use in medical devices, automotive systems, and industrial equipment drives its adoption. As these sectors increasingly demand efficient and robust memory solutions, FeRAM's superior performance ensures its prominent position in the market.

The automotive & transportation segment will undergo a significant transformation through 2032 due to the growing integration of advanced electronics in vehicles. As vehicles become more connected and autonomous, they require high-performance, reliable memory solutions for data storage and real-time processing. Non volatile memory offers durability and fast access speeds essential for automotive applications such as infotainment systems, navigation, and advanced driver-assistance systems (ADAS). This increasing demand for sophisticated automotive technology drives decent growth in this segment.

Europe next generation non volatile memory market will record a remarkable CAGR from 2024 to 2032, propelled by its strong emphasis on technological innovation and advanced electronics. The region's robust automotive and industrial sectors drive considerable demand for high-performance memory solutions. Additionally, Europe's substantial investments in research and development, coupled with supportive government policies for technological innovations, enhance its industry reach. Europe's dominance in incorporating advanced memory technologies across diverse applications reinforces its position as a key contributor to the global market.

Table of Contents

Chapter 1 Scope & Methodology

  • 1.1 Market scope & definition
  • 1.2 Base estimates & calculations
  • 1.3 Forecast parameters
  • 1.4 Data sources
    • 1.4.1 Primary
    • 1.4.2 Secondary
      • 1.4.2.1 Paid sources
      • 1.4.2.2 Public sources

Chapter 2 Executive Summary

  • 2.1 Industry 360° synopsis, 2024 - 2032
  • 2.2 Business trends
    • 2.2.1 Total addressable market (TAM), 2024-2032

Chapter 3 Industry Insights

  • 3.1 Industry ecosystem analysis
  • 3.2 Vendor matrix
  • 3.3 Technology & innovation landscape
  • 3.4 Patent analysis
  • 3.5 Key news and initiatives
  • 3.6 Regulatory landscape
  • 3.7 Impact forces
    • 3.7.1 Growth drivers
      • 3.7.1.1 Increasing demand for data storage
      • 3.7.1.2 Technological advancement
      • 3.7.1.3 Growing usage of IoT devices
      • 3.7.1.4 Rapid growth of edge computing
      • 3.7.1.5 Rise in demand for non-volatile memory in automotive electronics
    • 3.7.2 Industry pitfalls & challenges
      • 3.7.2.1 High development costs
      • 3.7.2.2 Manufacturing challenges
  • 3.8 Growth potential analysis
  • 3.9 Porter's analysis
    • 3.9.1 Supplier power
    • 3.9.2 Buyer power
    • 3.9.3 Threat of new entrants
    • 3.9.4 Threat of substitutes
    • 3.9.5 Industry rivalry
  • 3.10 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

  • 4.1 Company market share analysis
  • 4.2 Competitive positioning matrix
  • 4.3 Strategic outlook matrix

Chapter 5 Market Estimates & Forecast, By Product, 2021 - 2032 (USD Million)

  • 5.1 Key trends
  • 5.2 FeRAM
  • 5.3 PCM
  • 5.4 MRAM
  • 5.5 ReRAM

Chapter 6 Market Estimates & Forecast, By Application, 2021 - 2032 (USD Million)

  • 6.1 Key trends
  • 6.2 Consumer electronics
  • 6.3 Healthcare
  • 6.4 Automotive & transportation
  • 6.5 Industrial
  • 6.6 Enterprises

Chapter 7 Market Estimates & Forecast, By Region, 2021 - 2032 (USD Million)

  • 7.1 Key trends
  • 7.2 North America
    • 7.2.1 U.S.
    • 7.2.2 Canada
  • 7.3 Europe
    • 7.3.1 UK
    • 7.3.2 Germany
    • 7.3.3 France
    • 7.3.4 Italy
    • 7.3.5 Spain
    • 7.3.6 Rest of Europe
  • 7.4 Asia Pacific
    • 7.4.1 China
    • 7.4.2 India
    • 7.4.3 Japan
    • 7.4.4 South Korea
    • 7.4.5 ANZ
    • 7.4.6 Rest of Asia Pacific
  • 7.5 Latin America
    • 7.5.1 Brazil
    • 7.5.2 Mexico
    • 7.5.3 Rest of Latin America
  • 7.6 MEA
    • 7.6.1 UAE
    • 7.6.2 Saudi Arabia
    • 7.6.3 South Africa
    • 7.6.4 Rest of MEA

Chapter 8 Company Profiles

  • 8.1 Adesto Technologies
  • 8.2 Avalanche Technology, Inc.
  • 8.3 Crossbar Inc.
  • 8.4 Cypress Semiconductor Corporation
  • 8.5 Everspin Technologies, Inc.
  • 8.6 Fujitsu Ltd
  • 8.7 IBM Corporation
  • 8.8 Intel Corporation
  • 8.9 Micron Technology, Inc.
  • 8.10 Samsung Electronics Co. Ltd.
  • 8.11 Sandisk Corporation
  • 8.12 SK Hynix Inc
  • 8.13 Toshiba Corporation
  • 8.14 Winbond Electronics Corporation